KR102127645B1 - 화학 증폭형 레지스트 조성물을 위한 요오드-함유 폴리머 - Google Patents
화학 증폭형 레지스트 조성물을 위한 요오드-함유 폴리머 Download PDFInfo
- Publication number
- KR102127645B1 KR102127645B1 KR1020180063303A KR20180063303A KR102127645B1 KR 102127645 B1 KR102127645 B1 KR 102127645B1 KR 1020180063303 A KR1020180063303 A KR 1020180063303A KR 20180063303 A KR20180063303 A KR 20180063303A KR 102127645 B1 KR102127645 B1 KR 102127645B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- substituted
- unsubstituted
- formula
- photoresist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
- C07C69/78—Benzoic acid esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
- C07C69/84—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
- C08F16/14—Monomers containing only one unsaturated aliphatic radical
- C08F16/24—Monomers containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/10—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing bromine or iodine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L73/00—Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08L59/00 - C08L71/00; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/08—Polysulfonates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- H01L21/0273—
-
- H01L21/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/623,892 | 2017-06-15 | ||
| US15/623,892 US10495968B2 (en) | 2017-06-15 | 2017-06-15 | Iodine-containing polymers for chemically amplified resist compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180136887A KR20180136887A (ko) | 2018-12-26 |
| KR102127645B1 true KR102127645B1 (ko) | 2020-06-29 |
Family
ID=64656848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020180063303A Active KR102127645B1 (ko) | 2017-06-15 | 2018-06-01 | 화학 증폭형 레지스트 조성물을 위한 요오드-함유 폴리머 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10495968B2 (https=) |
| JP (1) | JP6913055B2 (https=) |
| KR (1) | KR102127645B1 (https=) |
| CN (1) | CN109134263A (https=) |
| TW (1) | TWI751336B (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745445B (zh) * | 2016-10-05 | 2021-11-11 | 日商東京應化工業股份有限公司 | 光阻組成物及光阻圖型形成方法、高分子化合物,及共聚物 |
| JP6963979B2 (ja) * | 2016-12-14 | 2021-11-10 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP7044011B2 (ja) * | 2017-09-13 | 2022-03-30 | 信越化学工業株式会社 | 重合性単量体、重合体、レジスト材料、及びパターン形成方法 |
| JP7264020B2 (ja) * | 2018-12-27 | 2023-04-25 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| JP7351256B2 (ja) * | 2019-06-17 | 2023-09-27 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| TWI837443B (zh) * | 2019-12-31 | 2024-04-01 | 南韓商羅門哈斯電子材料韓國公司 | 塗料組成物、經塗覆的基底及形成電子裝置的方法 |
| JP7509071B2 (ja) * | 2020-04-28 | 2024-07-02 | 信越化学工業株式会社 | ヨウ素化芳香族カルボン酸型ペンダント基含有ポリマー、レジスト材料及びパターン形成方法 |
| US12085855B2 (en) * | 2020-04-30 | 2024-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Resin, photoresist composition, and method of manufacturing semiconductor device |
| TWI772001B (zh) | 2020-04-30 | 2022-07-21 | 台灣積體電路製造股份有限公司 | 樹脂、光阻組成物和半導體裝置的製造方法 |
| WO2021230300A1 (ja) * | 2020-05-15 | 2021-11-18 | 三菱瓦斯化学株式会社 | 化合物、(共)重合体、組成物、レジストパターン形成方法、並びに化合物及び(共)重合体の製造方法 |
| US12510821B2 (en) | 2020-05-21 | 2025-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist composition and method of forming photoresist pattern |
| JP7789494B2 (ja) * | 2020-06-01 | 2025-12-22 | 住友化学株式会社 | 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法 |
| TWI849314B (zh) * | 2020-06-01 | 2024-07-21 | 日商住友化學股份有限公司 | 化合物、樹脂、抗蝕劑組成物及抗蝕劑圖案的製造方法 |
| JP2022008152A (ja) * | 2020-06-25 | 2022-01-13 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| US12276910B2 (en) | 2020-07-15 | 2025-04-15 | Dupont Electronic Materials International, Llc | Photoresist compositions and pattern formation methods |
| JP7351268B2 (ja) | 2020-07-17 | 2023-09-27 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP7375697B2 (ja) | 2020-07-17 | 2023-11-08 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP7696243B2 (ja) * | 2020-07-21 | 2025-06-20 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7728113B2 (ja) * | 2020-07-21 | 2025-08-22 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7691872B2 (ja) * | 2020-07-28 | 2025-06-12 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7691871B2 (ja) * | 2020-07-28 | 2025-06-12 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7686480B2 (ja) * | 2020-07-28 | 2025-06-02 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7686481B2 (ja) * | 2020-07-28 | 2025-06-02 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| KR102734637B1 (ko) * | 2021-08-26 | 2024-11-27 | 미쯔이가가꾸가부시끼가이샤 | 펠리클막, 펠리클, 노광 원판, 노광 장치 및 펠리클막의 제조 방법 |
| US20230103685A1 (en) * | 2021-09-30 | 2023-04-06 | Rohm And Haas Electronic Materials Llc | Iodine-containing acid cleavable compounds, polymers derived therefrom, and photoresist compositions |
| US12572076B2 (en) | 2022-11-28 | 2026-03-10 | Rohm And Haas Electronic Materials Korea Ltd | Photoresist underlayer composition |
| KR20240087381A (ko) * | 2022-12-12 | 2024-06-19 | 삼성전자주식회사 | 포토레지스트 상층막용 조성물 및 이를 이용한 패턴형성방법 |
| WO2024142556A1 (ja) * | 2022-12-26 | 2024-07-04 | Jsr株式会社 | 感放射線性樹脂組成物及びパターン形成方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008527125A (ja) * | 2005-01-14 | 2008-07-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 放射線不透過性シアノアクリレート組成物 |
| US20090311192A1 (en) * | 2005-04-05 | 2009-12-17 | Bar-Ilan University | Core and core-shell nanoparticles containing iodine for x-ray imaging |
| JP2013538262A (ja) * | 2010-08-06 | 2013-10-10 | エンドゥーシェイプ インコーポレイテッド | 医療デバイス用放射線不透過性形状記憶ポリマー |
| JP2015161823A (ja) * | 2014-02-27 | 2015-09-07 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、及び、電子デバイス、並びに、感活性光線性又は感放射線性樹脂組成物、及び、レジスト膜 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617314A (ja) * | 1984-06-20 | 1986-01-14 | Kureha Chem Ind Co Ltd | 高屈折率レンズ |
| GB9410578D0 (en) | 1994-05-26 | 1994-07-13 | London Hospital Med Coll | Novel (meth)acrylate monomers and denture base compositions prepared therefrom |
| DE4419386C2 (de) * | 1994-05-30 | 1996-09-19 | Ivoclar Ag | Röntgenopake Ester und Amide iodsubstituierter Benzoesäure sowie deren Verwendung zur Herstellung von Dentalmaterialien |
| US5679710A (en) | 1994-11-01 | 1997-10-21 | London Hospital Medical College | High refractive index and/or radio-opaque resins systems |
| WO2008054204A1 (en) | 2006-10-31 | 2008-05-08 | Universiteit Maastricht | Two component bone cement composition for vertebroplasty |
| JP2016508536A (ja) * | 2013-02-08 | 2016-03-22 | エンドゥーシェイプ インコーポレイテッド | 医療機器のための放射線不透過性ポリマー |
-
2017
- 2017-06-15 US US15/623,892 patent/US10495968B2/en active Active
-
2018
- 2018-05-17 TW TW107116738A patent/TWI751336B/zh active
- 2018-05-25 JP JP2018101052A patent/JP6913055B2/ja active Active
- 2018-05-31 CN CN201810553627.8A patent/CN109134263A/zh active Pending
- 2018-06-01 KR KR1020180063303A patent/KR102127645B1/ko active Active
-
2019
- 2019-11-12 US US16/681,142 patent/US10901316B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008527125A (ja) * | 2005-01-14 | 2008-07-24 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 放射線不透過性シアノアクリレート組成物 |
| US20090311192A1 (en) * | 2005-04-05 | 2009-12-17 | Bar-Ilan University | Core and core-shell nanoparticles containing iodine for x-ray imaging |
| JP2013538262A (ja) * | 2010-08-06 | 2013-10-10 | エンドゥーシェイプ インコーポレイテッド | 医療デバイス用放射線不透過性形状記憶ポリマー |
| JP2015161823A (ja) * | 2014-02-27 | 2015-09-07 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、及び、電子デバイス、並びに、感活性光線性又は感放射線性樹脂組成物、及び、レジスト膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180362752A1 (en) | 2018-12-20 |
| TW201904928A (zh) | 2019-02-01 |
| KR20180136887A (ko) | 2018-12-26 |
| JP6913055B2 (ja) | 2021-08-04 |
| CN109134263A (zh) | 2019-01-04 |
| TWI751336B (zh) | 2022-01-01 |
| US10901316B2 (en) | 2021-01-26 |
| US10495968B2 (en) | 2019-12-03 |
| JP2019001997A (ja) | 2019-01-10 |
| US20200218149A1 (en) | 2020-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102127645B1 (ko) | 화학 증폭형 레지스트 조성물을 위한 요오드-함유 폴리머 | |
| KR102162032B1 (ko) | 산-절단가능 모노머 및 이를 포함하는 폴리머 | |
| KR102220781B1 (ko) | 요오드-함유 광산 발생제 및 이를 포함하는 조성물 | |
| JP5387601B2 (ja) | アセタール化合物、高分子化合物、レジスト材料及びパターン形成方法 | |
| KR101670312B1 (ko) | 광산 발생제, 포토레지스트, 코팅된 기판 및 전자 디바이스의 형성 방법 | |
| JP5961458B2 (ja) | ポリマー組成物およびこれを含むフォトレジスト | |
| KR102208137B1 (ko) | 광산-발생 모노머, 상기 모노머로부터 유도된 폴리머, 상기 폴리머를 포함하는 포토레지스트 조성물, 및 상기 포토레지스트 조성물을 사용하여 포토레지스트 릴리프 이미지를 형성하는 방법 | |
| CN109791359B (zh) | 抗蚀剂组合物及抗蚀剂图案形成方法、高分子化合物及共聚物 | |
| TW201725450A (zh) | 光致抗蝕劑組合物、包含光致抗蝕劑組合物的經塗佈基板及形成電子裝置的方法 | |
| TWI629562B (zh) | 酸不穩定超支化共聚物及相關聯的光致抗蝕劑組合物以及形成電子器件之方法 | |
| CN112011008A (zh) | 抗蚀剂组合物、其制造方法及包含其的制品 | |
| JP5644788B2 (ja) | 単量体、高分子化合物、レジスト材料及びパターン形成方法 | |
| JP2019053133A (ja) | レジスト組成物及びレジストパターン形成方法、並びに、共重合体 | |
| KR20260047466A (ko) | 레지스트 조성물, 적층체 및 패턴 형성 방법 | |
| JP2026046918A (ja) | レジスト組成物、積層体及びパターン形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |