KR102102699B1 - 양자점-기반 색-변환형 발광 디바이스 및 이를 제조하기 위한 방법 - Google Patents
양자점-기반 색-변환형 발광 디바이스 및 이를 제조하기 위한 방법 Download PDFInfo
- Publication number
- KR102102699B1 KR102102699B1 KR1020180105689A KR20180105689A KR102102699B1 KR 102102699 B1 KR102102699 B1 KR 102102699B1 KR 1020180105689 A KR1020180105689 A KR 1020180105689A KR 20180105689 A KR20180105689 A KR 20180105689A KR 102102699 B1 KR102102699 B1 KR 102102699B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- light
- chip
- photoluminescent
- optically transparent
- Prior art date
Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 170
- 238000000034 method Methods 0.000 title claims description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 239000000463 material Substances 0.000 claims abstract description 244
- 239000004065 semiconductor Substances 0.000 claims abstract description 109
- 238000002955 isolation Methods 0.000 claims abstract description 45
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011159 matrix material Substances 0.000 claims description 80
- 229920000642 polymer Polymers 0.000 claims description 75
- 230000004888 barrier function Effects 0.000 claims description 41
- 125000006850 spacer group Chemical group 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 19
- 238000009792 diffusion process Methods 0.000 claims description 14
- XPIIDKFHGDPTIY-UHFFFAOYSA-N F.F.F.P Chemical compound F.F.F.P XPIIDKFHGDPTIY-UHFFFAOYSA-N 0.000 claims description 13
- 238000000149 argon plasma sintering Methods 0.000 claims description 12
- 238000001723 curing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052701 rubidium Inorganic materials 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 238000001029 thermal curing Methods 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910005793 GeO 2 Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 230000002829 reductive effect Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 193
- 230000008569 process Effects 0.000 description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- 229910052760 oxygen Inorganic materials 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 238000007539 photo-oxidation reaction Methods 0.000 description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 238000004806 packaging method and process Methods 0.000 description 10
- 229910052697 platinum Inorganic materials 0.000 description 10
- 229920001296 polysiloxane Polymers 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 230000005284 excitation Effects 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000000295 emission spectrum Methods 0.000 description 4
- 239000003574 free electron Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XRZCZVQJHOCRCR-UHFFFAOYSA-N [Si].[Pt] Chemical compound [Si].[Pt] XRZCZVQJHOCRCR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- -1 oxygen ions Chemical class 0.000 description 3
- 238000005424 photoluminescence Methods 0.000 description 3
- 238000000103 photoluminescence spectrum Methods 0.000 description 3
- 231100000572 poisoning Toxicity 0.000 description 3
- 230000000607 poisoning effect Effects 0.000 description 3
- 239000002491 polymer binding agent Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- SKJCKYVIQGBWTN-UHFFFAOYSA-N (4-hydroxyphenyl) methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=C(O)C=C1 SKJCKYVIQGBWTN-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- LQJIDIOGYJAQMF-UHFFFAOYSA-N lambda2-silanylidenetin Chemical compound [Si].[Sn] LQJIDIOGYJAQMF-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002707 nanocrystalline material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW106130827A TWI658610B (zh) | 2017-09-08 | 2017-09-08 | 應用量子點色彩轉換之發光裝置及其製造方法 |
TW106130827 | 2017-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR102102699B1 true KR102102699B1 (ko) | 2020-04-23 |
Family
ID=66177399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180105689A KR102102699B1 (ko) | 2017-09-08 | 2018-09-05 | 양자점-기반 색-변환형 발광 디바이스 및 이를 제조하기 위한 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6686081B2 (zh) |
KR (1) | KR102102699B1 (zh) |
TW (1) | TWI658610B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112133718B (zh) * | 2019-06-25 | 2024-02-20 | 成都辰显光电有限公司 | 显示面板、显示装置及显示面板的制备方法 |
WO2021081455A2 (en) * | 2019-10-23 | 2021-04-29 | Intematix Corporation | High color gamut photoluminescence wavelength converted white light emitting devices |
KR102287244B1 (ko) * | 2021-03-04 | 2021-08-06 | 에스케이씨하이테크앤마케팅(주) | 양자점과 유기 나노형광체의 복합 시트 및 이를 포함하는 디스플레이 장치 |
KR102287241B1 (ko) * | 2021-03-04 | 2021-08-06 | 에스케이씨하이테크앤마케팅(주) | 양자점과 유기 나노형광체의 복합 시트 및 이를 포함하는 디스플레이 장치 |
WO2023085010A1 (ja) * | 2021-11-12 | 2023-05-19 | ソニーグループ株式会社 | 発光デバイスおよび画像表示装置 |
CN114709319B (zh) * | 2022-04-11 | 2023-07-11 | 东莞市中麒光电技术有限公司 | 色转换结构制作方法、色转换结构、晶粒制作方法及晶粒 |
EP4180498B1 (en) | 2022-06-15 | 2024-06-05 | Avantama AG | A color conversion film comprising inorganic separation layer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120135999A (ko) * | 2011-06-08 | 2012-12-18 | 삼성전자주식회사 | 발광소자 패키지 |
KR20130017031A (ko) * | 2011-08-09 | 2013-02-19 | 한국과학기술연구원 | 백색 발광 다이오드 및 그 제조 방법 |
KR20160144567A (ko) * | 2015-06-08 | 2016-12-19 | 삼성전자주식회사 | 발광소자 패키지, 파장 변환 필름 및 그 제조 방법 |
KR20170093735A (ko) * | 2016-02-05 | 2017-08-16 | 마븐 옵트로닉스 씨오., 엘티디. | 빔 성형 구조를 가진 발광 디바이스 및 그 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5196711B2 (ja) * | 2005-07-26 | 2013-05-15 | 京セラ株式会社 | 発光装置およびそれを用いた照明装置 |
CN103597568B (zh) * | 2011-04-01 | 2016-08-17 | 纳晶科技股份有限公司 | 白光发光器件 |
KR20150004818A (ko) * | 2012-03-30 | 2015-01-13 | 코닌클리케 필립스 엔.브이. | 파장 변환 측면 코트를 갖는 발광 장치 |
WO2013171610A1 (en) * | 2012-05-14 | 2013-11-21 | Koninklijke Philips N.V. | Light emitting device with remote nanostructured phosphor |
KR20150119179A (ko) * | 2013-02-11 | 2015-10-23 | 코닌클리케 필립스 엔.브이. | 파장 변환 재료의 기밀 밀봉을 가지는 led 모듈 |
JP6104682B2 (ja) * | 2013-04-09 | 2017-03-29 | シチズン電子株式会社 | 照明装置 |
JP6428089B2 (ja) * | 2014-09-24 | 2018-11-28 | 日亜化学工業株式会社 | 発光装置 |
JP2016102999A (ja) * | 2014-11-14 | 2016-06-02 | 富士フイルム株式会社 | 波長変換部材及びそれを備えたバックライトユニット、液晶表示装置 |
JP6100831B2 (ja) * | 2015-05-26 | 2017-03-22 | シャープ株式会社 | 発光装置および画像表示装置 |
JP6020684B1 (ja) * | 2015-08-20 | 2016-11-02 | 大日本印刷株式会社 | 光波長変換シート、これを備えるバックライト装置、および画像表示装置 |
TWI677114B (zh) * | 2015-10-05 | 2019-11-11 | 行家光電股份有限公司 | 具導角反射結構的發光裝置 |
TWI598429B (zh) * | 2015-11-30 | 2017-09-11 | 隆達電子股份有限公司 | 波長轉換材料及其應用 |
-
2017
- 2017-09-08 TW TW106130827A patent/TWI658610B/zh active
-
2018
- 2018-08-24 JP JP2018156872A patent/JP6686081B2/ja active Active
- 2018-09-05 KR KR1020180105689A patent/KR102102699B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120135999A (ko) * | 2011-06-08 | 2012-12-18 | 삼성전자주식회사 | 발광소자 패키지 |
KR20130017031A (ko) * | 2011-08-09 | 2013-02-19 | 한국과학기술연구원 | 백색 발광 다이오드 및 그 제조 방법 |
KR20160144567A (ko) * | 2015-06-08 | 2016-12-19 | 삼성전자주식회사 | 발광소자 패키지, 파장 변환 필름 및 그 제조 방법 |
KR20170093735A (ko) * | 2016-02-05 | 2017-08-16 | 마븐 옵트로닉스 씨오., 엘티디. | 빔 성형 구조를 가진 발광 디바이스 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW201914060A (zh) | 2019-04-01 |
JP6686081B2 (ja) | 2020-04-22 |
TWI658610B (zh) | 2019-05-01 |
JP2019061230A (ja) | 2019-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10879434B2 (en) | Quantum dot-based color-converted light emitting device and method for manufacturing the same | |
KR102102699B1 (ko) | 양자점-기반 색-변환형 발광 디바이스 및 이를 제조하기 위한 방법 | |
US9053959B2 (en) | Semiconductor light converting construction | |
EP2837041B1 (en) | A light conversion assembly, a lamp and a luminaire | |
CN109494289B (zh) | 应用量子点色彩转换的发光装置及其制造方法 | |
US20160072026A1 (en) | Light emitting device utilizing semiconductor and manufacturing method of the same | |
KR20080064854A (ko) | 흡수 필터를 갖는 인광체-변환 전계발광 소자 | |
JP6493348B2 (ja) | 発光装置 | |
JP2011526075A (ja) | 光抽出器の作製方法 | |
US8348468B2 (en) | Light emitting device | |
WO2009158191A2 (en) | Semiconductor light converting construction | |
KR20160036489A (ko) | 발광 장치 | |
JP5475767B2 (ja) | 光変換構成体 | |
US11056621B2 (en) | Optoelectronic device | |
KR20120133062A (ko) | 양자점 필름 및 그 제조방법 | |
US9786823B2 (en) | Light-emitting device with sealing member comprising zinc sulfide particles | |
JP6741102B2 (ja) | 発光装置 | |
US20110101402A1 (en) | Semiconductor light converting construction | |
CN110361912B (zh) | 波长转换装置 | |
JP2018151610A (ja) | 波長変換部材及び発光デバイス | |
WO2018155167A1 (ja) | 発光デバイス及びその製造方法 | |
JP6848582B2 (ja) | 波長変換部材及び発光デバイス | |
WO2018163691A1 (ja) | 波長変換部材及び発光デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |