KR102096672B1 - 웨이퍼 형상 물품의 액체 처리를 위한 방법 및 장치 - Google Patents

웨이퍼 형상 물품의 액체 처리를 위한 방법 및 장치 Download PDF

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Publication number
KR102096672B1
KR102096672B1 KR1020130100716A KR20130100716A KR102096672B1 KR 102096672 B1 KR102096672 B1 KR 102096672B1 KR 1020130100716 A KR1020130100716 A KR 1020130100716A KR 20130100716 A KR20130100716 A KR 20130100716A KR 102096672 B1 KR102096672 B1 KR 102096672B1
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South Korea
Prior art keywords
housing
wafer
gas
shaped article
spin chuck
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KR1020130100716A
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English (en)
Korean (ko)
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KR20140026307A (ko
Inventor
카를-헤인츠 호웬바르터
비제이 바담
크리스토프 세멜락
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램 리서치 아게
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130100716A 2012-08-23 2013-08-23 웨이퍼 형상 물품의 액체 처리를 위한 방법 및 장치 Active KR102096672B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/593,264 2012-08-23
US13/593,264 US9316443B2 (en) 2012-08-23 2012-08-23 Method and apparatus for liquid treatment of wafer shaped articles

Publications (2)

Publication Number Publication Date
KR20140026307A KR20140026307A (ko) 2014-03-05
KR102096672B1 true KR102096672B1 (ko) 2020-04-03

Family

ID=50147082

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130100716A Active KR102096672B1 (ko) 2012-08-23 2013-08-23 웨이퍼 형상 물품의 액체 처리를 위한 방법 및 장치

Country Status (4)

Country Link
US (1) US9316443B2 (https=)
JP (1) JP6285125B2 (https=)
KR (1) KR102096672B1 (https=)
TW (1) TWI622100B (https=)

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* Cited by examiner, † Cited by third party
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US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
US9245777B2 (en) 2013-05-15 2016-01-26 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US9972514B2 (en) * 2016-03-07 2018-05-15 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US10720343B2 (en) 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
CN109308986A (zh) * 2017-07-26 2019-02-05 北京中科信电子装备有限公司 一种离子注入机晶片冷却装置
KR102615845B1 (ko) * 2020-11-19 2023-12-22 세메스 주식회사 지지 유닛 및 기판 처리 장치
KR102683732B1 (ko) 2021-04-01 2024-07-12 세메스 주식회사 지지 유닛 및 기판 처리 장치

Citations (2)

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JP2003174008A (ja) * 2001-12-07 2003-06-20 Shibaura Mechatronics Corp スピン処理装置及び処理方法
US20060066193A1 (en) 2004-09-27 2006-03-30 Applied Materials, Inc. Lamp array for thermal processing exhibiting improved radial uniformity

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JPS592318A (ja) * 1982-06-28 1984-01-07 Toshiba Mach Co Ltd 半導体気相成長装置
JPS6146023A (ja) * 1984-08-10 1986-03-06 Ushio Inc 超高圧水銀灯による半導体ウエハ−材料の露光方法
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0213958A (ja) * 1988-06-30 1990-01-18 Mitsubishi Electric Corp レジスト現像装置
JPH05299350A (ja) * 1992-04-20 1993-11-12 Nec Corp 基板加熱機構
GB9412918D0 (en) * 1994-06-28 1994-08-17 Baxendine Alar R Apparatus for uniformly heating a substrate
TW386235B (en) 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
US6198074B1 (en) * 1996-09-06 2001-03-06 Mattson Technology, Inc. System and method for rapid thermal processing with transitional heater
US5965047A (en) * 1997-10-24 1999-10-12 Steag Ast Rapid thermal processing (RTP) system with rotating substrate
JP2000334397A (ja) 1999-05-31 2000-12-05 Kokusai Electric Co Ltd 板状試料の流体処理装置及び板状試料の流体処理方法
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JP4680044B2 (ja) * 2005-11-24 2011-05-11 東京エレクトロン株式会社 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
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US9093482B2 (en) * 2012-10-12 2015-07-28 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003174008A (ja) * 2001-12-07 2003-06-20 Shibaura Mechatronics Corp スピン処理装置及び処理方法
US20060066193A1 (en) 2004-09-27 2006-03-30 Applied Materials, Inc. Lamp array for thermal processing exhibiting improved radial uniformity

Also Published As

Publication number Publication date
TW201426873A (zh) 2014-07-01
US9316443B2 (en) 2016-04-19
JP2014042027A (ja) 2014-03-06
TWI622100B (zh) 2018-04-21
JP6285125B2 (ja) 2018-02-28
US20140054280A1 (en) 2014-02-27
KR20140026307A (ko) 2014-03-05

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