KR102066079B1 - Organic light emitting diode display device and method of manufacturing the same - Google Patents

Abstract

The present invention relates to an organic light emitting diode display and a method of manufacturing the same, which can improve reliability by preventing a crack of a protective film formed to cover the organic light emitting diode when the organic light emitting diode display is cut for each unit panel. An organic light emitting diode display device includes: a mother substrate having a plurality of unit panels including a plurality of organic light emitting diodes separated by a bank insulating layer; A first passivation layer, a second passivation layer, and a third passivation layer that are sequentially formed on the organic light emitting diodes and are formed in separate forms for each unit panel; And an encapsulation substrate formed on an entire surface of the mother substrate through an adhesive layer formed on an entire surface of the third protective layer, wherein the first protective layer is formed to surround an edge of the bank insulating layer on the outermost side of the unit panel to completely cover the unit panel. The third passivation layer completely covers the first and second passivation layers, and an edge of the third passivation layer is positioned in a scribing line separating the plurality of unit panels.

Description

Organic light emitting diode display and a method of manufacturing the same {ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to an organic light emitting diode display, and to an organic light emitting diode display having improved reliability and a method of manufacturing the same.

Video display devices that realize various information as screens are the core technologies of the information and communication era, and are developing in a direction of thinner, lighter, portable and high performance. Accordingly, the organic light emitting diode display which displays an image by controlling the amount of light emitted from the organic light emitting layer as a flat panel display that can reduce the weight and volume, which is a disadvantage of the cathode ray tube (CRT), has been in the spotlight.

The organic light emitting diode display includes an organic light emitting diode (OLED), which is a self-light emitting device using a thin light emitting layer between electrodes. The organic light emitting diode includes a first electrode as an anode, an emission layer (EML), and a second electrode as a cathode connected to a thin film transistor formed in each sub pixel region of the mother substrate.

In the organic light emitting diode as described above, when voltage is applied to the first and second electrodes, holes and electrons recombine in the emission layer to form excitons, and the excitons fall to the ground state and emit light. In addition, a protective film is formed on the organic light emitting diode to cover the organic light emitting diode as described above to prevent moisture and oxygen from flowing into the organic light emitting diode.

The organic light emitting diode display includes a plurality of organic light emitting diodes on a mother substrate, a unit panel having a display area and a pad area is formed, and the mother substrate is cut along a scribing line. Remove each unit panel. However, moisture and oxygen may flow into the unit panel during the scribing process.

1A and 1B are photographs in which a defect occurs in a unit panel. If a crack occurs in a protective film or the like during the scribing process, external moisture, oxygen, or the like flows into the organic light emitting diode along the crack, thereby reducing reliability.

The present invention is to solve the above problems, by differently designing the region of the plurality of protective film formed to cover the organic light emitting diode, to prevent the occurrence of cracks in the unit protective film during the scribing process and At the same time, an object of the present invention is to provide an organic light emitting diode display and a method of manufacturing the same, which can improve reliability by delaying the path of moisture introduced from the side surface.

According to an aspect of the present invention, there is provided an organic light emitting diode display device including: a mother substrate including a plurality of unit panels including a plurality of organic light emitting diodes separated by a bank insulating layer; A first passivation layer, a second passivation layer, and a third passivation layer that are sequentially formed on the organic light emitting diodes and are formed in separate forms for each unit panel; And an encapsulation substrate formed on an entire surface of the mother substrate through an adhesive layer formed on an entire surface of the third protective layer, wherein the first protective layer is formed to surround an edge of the bank insulating layer on the outermost side of the unit panel to completely cover the unit panel. The third passivation layer completely covers the first and second passivation layers, and an edge of the third passivation layer is positioned in a scribing line separating the plurality of unit panels.

In addition, a method of manufacturing the organic light emitting diode display device of the present invention to achieve the same object comprises the steps of preparing a mother substrate defined by a plurality of unit panels including a plurality of organic light emitting diodes separated by a bank insulating film; Sequentially forming a first passivation layer, a second passivation layer, and a third passivation layer on the organic light emitting diode in each unit panel; And forming an encapsulation substrate on the entire surface of the mother substrate through an adhesive layer formed on an entire surface of the third passivation layer, wherein an edge of the bank insulating layer on the outermost side of the unit panel is formed so that the first passivation layer completely covers the unit panel. And a third passivation layer completely covering the first and second passivation layers, and an edge of the third passivation layer is positioned inside a scribing line separating the plurality of unit panels.

The distance between the edge of the second passivation layer and the edge of the bank insulating film outermost of the unit panel is smaller than the distance between the edge of the first passivation film and the edge of the bank insulating film outermost of the unit panel, the third passivation film An edge of is connected with an edge of the first protective film.

The second passivation layer may be formed to completely cover an upper surface of the bank insulating layer on the outermost side of the unit panel.

The first and third protective films are formed of an inorganic film, and the second protective film is formed of an organic film.

Edges of the first, second and third passivation layers may be located inward from edges of the encapsulation substrate.

As described above, the organic light emitting diode display and the manufacturing method thereof according to the present invention may be formed so that the first inorganic layer and the second inorganic layer completely surround the organic layer, thereby completely blocking the inflow of moisture and oxygen. In addition, the edge of the organic layer may be formed to cover the edge of the bank insulating layer on the outermost side of the unit panel, thereby preventing moisture and oxygen introduced through the second inorganic layer from directly entering the bank insulating layer through the first inorganic layer. Therefore, the organic light emitting diode display of the present invention is improved in reliability.

1A and 1B are photographs in which a defect occurs in a unit panel.
2A is a plan view illustrating a plurality of unit panels and scribing lines formed on a mother substrate.
FIG. 2B is a cross-sectional view taken along the line II ′ of FIG. 2A.
FIG. 2C is an enlarged view of area A of FIG. 2B.
3A to 3G are cross-sectional views illustrating a method of manufacturing the OLED display device of the present invention.
4A is a plan view of a mask forming a protective film of a general organic light emitting diode display.
4B is a plan view of a mask forming a protective film of the organic light emitting diode display of the present invention.

Hereinafter, an organic light emitting diode display according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2A is a plan view illustrating a plurality of unit panels and scribing lines formed on a mother substrate, and FIG. 2B is a cross-sectional view taken along the line II ′ of FIG. 2A.

As shown in FIG. 2A, a plurality of unit panels are formed on the mother substrate 100, and the plurality of unit panels are cut along a scribing line. The unit panel includes a plurality of organic light emitting diodes separated by a bank insulating layer.

Specifically, as shown in FIG. 2B, in the organic light emitting diode display of the present invention, a gate line (not shown) and a data line (not shown) cross each other on the mother substrate 100 to form a plurality of sub pixel regions in a matrix form. Is defined. A thin film transistor (not shown) is formed in each sub pixel region, and an organic light emitting diode including a first electrode 110a, a light emitting layer 110b, and a second electrode 110c, which are sequentially connected to the thin film transistor, are stacked. Is formed.

In this case, the first electrode 110a is an anode, and tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc are used. It is formed of a transparent conductive material such as oxide (Indium Tin Zinc Oxide (ITZO)). A bank insulating layer 120 exposing a portion of the first electrode 110a is formed on the entire mother substrate. The bank insulating layer 120 distinguishes a plurality of organic light emitting diodes formed in the unit panel, and defines a light emitting area of the unit panel.

The organic emission layer 110b and the second electrode 110c are sequentially formed on the first electrode 110a exposed by the bank insulating layer 120. The light emitting layer 110b may also be formed in the non-light emitting region, and in the drawing, only the first electrode 110a is illustrated. The light emitting layer 110b may be formed of a material emitting red (R), green (G), blue (B), or white (W) light in each sub pixel area, or may be formed of only a material emitting white light. In particular, when the light emitting layer 110b is formed of only a material that emits white light, R, G, and B color filters are formed in each sub pixel region, and white light emitted from the light emitting layer 110b passes through the color filter. Color light can be realized.

The second electrode 110c on which the light emitting layer 110b is formed is formed of a reflective metal material such as aluminum (Al) as a cathode, and reflects light emitted from the light emitting layer 110b toward the first electrode 110a. . On the contrary, when the second electrode 110c is formed of a transparent conductive material, the first electrode 110a is formed of a reflective metal to reflect the light emitted from the light emitting layer 110b in the direction of the second electrode 110c.

As described above, the organic light emitting diode including the first electrode 110a, the light emitting layer 110b, and the second electrode 110c, which are sequentially stacked, may be formed by applying a voltage to the first and second electrodes 110a and 110c. The electrons recombine in the emission layer 110b to form excitons, and the excitons fall to the ground state and emit light.

Although not shown, a hole injection layer and a hole transport layer may be further formed between the first electrode 110a and the light emitting layer 110b, and the hole injection layer and the hole transport layer are used to inject holes into the light emitting layer 110b. . In addition, an electron injection layer and an electron transporting layer may be further formed between the light emitting layer 110b and the second electrode 110c, and the electron injection layer and the electron transporting layer are used to inject electrons into the light emitting layer 110b.

In addition, since the organic light emitting diode as described above is very vulnerable to moisture and oxygen, a protective film is formed to cover the organic light emitting diode in order to prevent external moisture and oxygen from entering. At this time, at least one inorganic film made of at least one selected from SiOx, SiNx, SiC, SiON, SiOC, SiONC and aC (Amorphous Cabon) and at least one organic film selected from acrylate, epoxy polymer, imide polymer, etc. Structure.

However, when the scribing line for separating the unit panel overlaps with the protective film, a crack occurs in the protective film during the scribing process, and external moisture, oxygen, etc. flows along the crack, thereby deteriorating reliability. Occurs. Therefore, in the organic light emitting diode display of the present invention, the width of the protective film is adjusted so that the edges of the protective film are positioned in the scribing line and the encapsulation substrate, thereby preventing the reliability of the organic light emitting diode display from deteriorating.

The passivation layer of the organic light emitting diode display according to the present invention has a structure in which the first inorganic layer 130a, the organic layer 130b, and the second inorganic layer 130c are sequentially stacked. The inorganic films 130a and 130c block external moisture and oxygen, and the organic film 130b compensates for a step caused by foreign matter mixed in the protective film and increases a path of penetration of moisture and oxygen.

FIG. 2C is an enlarged view of area A of FIG. 2B.

As illustrated in FIG. 2C, the first inorganic layer 130a formed in a separate form for each unit panel is formed to completely cover the edge of the bank insulating layer 120. The organic film 130b is formed on the first inorganic film 130a. In this case, the organic layer 130b formed on the first inorganic layer 130a may be formed to completely cover the upper surface of the outermost bank insulating layer 120 of the unit panel.

That is, the edge of the organic layer 130b is positioned outside the edge of the bank insulating layer 120. Therefore, even if foreign matters are mixed during the process, the organic layer 130b may planarize the upper surface of the foreign matter so that moisture and oxygen introduced through the second inorganic layer 130c directly flow into the bank insulating layer 120 through the foreign matters. Can be prevented.

Table 1 shows a defective rate when the edge of the organic film is located inside the edge of the bank insulating film, and Table 2 shows a defective rate when the edge of the organic film is located outside the edge of the bank insulating film. The protective film of the unit panel of Table 1 and Table 2 has the structure which the 1st inorganic film, the organic film, and the 2nd inorganic film were laminated | stacked one by one, and a unit panel was made into 100hrs, 200hrs, 300hrs, 400hrs in the high temperature, high humidity (85 degreeC, 85%) state. , For 500hrs.

In a unit panel of a general organic light emitting diode display, the edge of the organic layer is positioned inside the edge of the bank insulating layer. Therefore, when foreign matter is mixed during the process, the organic film cannot cover it. As a result, moisture and oxygen introduced through the second inorganic film flow directly into the bank insulating film through the foreign matter. Therefore, as shown in Table 1, as time passes, failure occurs in 20% to 34% of all unit panels, and reliability decreases.

However, the unit panel of the organic light emitting diode display of the present invention is formed so that the organic film completely covers the edge of the bank insulating film. Therefore, even if foreign matters are mixed during the process, the organic film can flatten the upper surface by the foreign matters. That is, moisture and oxygen introduced through the second inorganic film are prevented from advancing to the first inorganic film and the bank insulating film by foreign matter. Accordingly, as shown in Table 2, even if time passes, the defective rate is 10% or less.

The gap D1 between the edge of the organic film 130b and the edge of the bank insulating film 120 is smaller than the gap D2 between the edge of the first inorganic film 130a and the edge of the bank insulating film 120. This is because the second inorganic film 130c formed on the organic film 130b and the first inorganic film 130a formed under the organic film 130b are contacted at the edges so as to completely surround the organic film 130b. This is to completely block the inflow of.

The distance D3 between the edge of the second inorganic film 130c and the edge of the bank insulating film 120 is wider than the distance D2 between the edge of the first inorganic film 130a and the edge of the bank insulating film 120, At the same time, it is narrower than the distance D4 between the edge of the bank insulating film 120 and the scribing line.

For example, the distance D1 between the edge of the organic film 130b and the edge of the bank insulating film 120 is 200 μm to 500 μm, and the edge of the first inorganic film 130a and the edge of the bank insulating film 120 are provided. It is preferable that the space | interval D2 between them is 400 micrometers-700 micrometers. In addition, the distance D3 between the edge of the second inorganic film 130c and the edge of the bank insulating film 120 is 800 μm to 1100 μm, and the distance D4 between the edge of the bank insulating film 120 and the scribing line. ) Is preferably 1100 µm to 1300 µm. The interval can be changed.

That is, since the edges of the first inorganic film 130a, the organic film 130b, and the second inorganic film 130c are all located inside the scribing line, the cracks are formed in the passivation films 130a, 130b, and 130c during the scribing process. This can be prevented from occurring. At the same time, the organic layer 130b may be formed to cover the bank insulating layer 120, thereby preventing oxygen and moisture introduced through the foreign material from entering the bank insulating layer 120. Furthermore, the second inorganic film 130c and the first inorganic film 130a formed under the organic film 130b are contacted at the edges so as to completely surround the organic film 130b so that moisture and oxygen are introduced from the side. You can block.

The encapsulation substrate 150 formed of glass or plastic is attached to the entire surface of the passivation layers 130a, 130b, and 130c through the adhesive layer 140. The encapsulation substrate 150 is for protecting the organic light emitting diode from external moisture, oxygen, and the like. The adhesive layer 140 may be formed of an acrylic resin or a silicone resin, or may be formed of a sealant.

Hereinafter, a method of manufacturing the organic light emitting diode display of the present invention will be described in detail.

3A to 3G are cross-sectional views illustrating a method of manufacturing the OLED display device of the present invention.

Although not illustrated, the gate lines and the data lines cross each other on the mother substrate to define a plurality of sub pixel regions in a matrix form, and thin film transistors are formed in each sub pixel region. 3A, the first electrode 110a is formed on the mother substrate 100. The first electrode 110a is formed in each sub pixel region and connected to the thin film transistor.

Specifically, tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (Indium Tin Zinc Oxide) on the entire surface of the mother substrate 100 : Transparent conductive material such as ITZO). The first electrode 110a is formed by patterning the transparent conductive material to correspond to each sub pixel area.

Next, as shown in FIG. 3B, a bank insulating layer 120 exposing a portion of the first electrode 110a is formed on the entire surface of the mother substrate 100. The bank insulating layer 120 is coated with an organic insulating material such as an acrylic resin on the entire surface of the mother substrate 100 including the first electrode 110a formed in each sub-pixel area, and then the organic insulating material by a photolithography process and an etching process. It is formed by patterning. As described above, the bank insulating layer 120 distinguishes a plurality of organic light emitting diodes formed in the unit panel, and defines a light emitting area of the unit panel.

3C, the light emitting layer 110b is formed on the first electrode 110a exposed by the bank insulating layer 120. In this case, the light emitting layer 110b may also be formed in the non-light emitting region. The light emitting layer 110b may be formed of a material emitting red (R), green (G), blue (B), or white (W) light, or may be formed of a material emitting white light. When the light emitting layer 110b is formed of a material that emits white light, R, G, and B color filters are formed in each sub pixel region, and white light emitted from the light emitting layer 110b passes through the color filter and has various colors. Can implement light.

The second electrode 110c is formed to cover the light emitting layer 110b. The second electrode 110c is formed of a reflective metal material such as aluminum (Al) as a cathode, and reflects light emitted from the light emitting layer 110b toward the first electrode 110a. In particular, when the second electrode 110c is formed of a transparent conductive material, the first electrode 110a is formed of a reflective metal to reflect light emitted from the light emitting layer 110b in the direction of the second electrode 110c.

In the drawing, the second electrode 110c is formed only on the light emitting layer 110b and is separated for each sub-pixel. However, the second electrode 110c extends to the upper surface of the bank insulating layer 120 and is separated for each unit panel. It may be formed in the form.

As described above, the organic light emitting diode including the first electrode 110a, the light emitting layer 110b, and the second electrode 110c, which are sequentially stacked, may be formed by applying a voltage to the first and second electrodes 110a and 110c. The electrons recombine in the emission layer 110b to form an exciton, and the exciton falls to a ground state and emits light.

As shown in FIG. 3D, the first inorganic layer 130a having a separate form is formed for each unit panel to cover the plurality of organic light emitting diodes. In this case, the first inorganic layer 130a is formed to completely cover the edge of the bank insulating layer 120 at the outermost portion of the unit panel.

4A is a plan view of a mask for forming a protective film of a general organic light emitting diode display, and FIG. 4B is a plan view of a mask for forming a protective film of an organic light emitting diode display of the present invention.

As shown in FIG. 4A, a mask for forming a protective film of a general organic light emitting diode display uses a mask having an opening region corresponding to a plurality of unit panels, for example, an opening region exposing all of the unit panels corresponding to the same row. . Therefore, the passivation layer of the general organic light emitting diode display is formed in a region corresponding to the scribing line, so that a crack occurs in the passivation layer during the scribing process, and the side surface of the passivation layer is exposed to the outside.

However, as shown in FIG. 4B, the mask for forming the protective film, for example, the first inorganic film, of the organic light emitting diode display of the present invention has an opening region corresponding to each unit panel. Therefore, the first and second inorganic layers are not formed in the region corresponding to the scribing line.

Subsequently, as illustrated in FIG. 3E, the organic layer 130b is formed on the first inorganic layer 130a. In this case, the organic layer 130b is preferably formed so that the organic layer 130b completely covers the upper surface of the outermost bank insulating layer 120 of the unit panel. This is formed so that the organic film covers the foreign matter which may occur during the process, and the upper surface including the foreign matter is flattened by the organic film. Therefore, it is possible to prevent the moisture and oxygen introduced from the outside into the bank insulating film 120 through the foreign matter.

In particular, the distance D1 (see FIG. 2C) between the edge of the organic film 130b and the edge of the bank insulating film 120 is the distance D2 between the edge of the first inorganic film 130a and the edge of the bank insulating film 120. ; See FIG. 2C).

3F, the second inorganic film 130c is formed to completely cover the first inorganic film 130a and the organic film 130b. At this time, the distance D3 between the edge of the second inorganic film 130c and the edge of the bank insulating film 120 (see FIG. 2C) is the distance D1 between the edge of the organic film 130b and the edge of the bank insulating film 120. 2C) and the gap between the edge of the first inorganic film 130a and the edge of the bank insulating film 120 (D2; see FIG. 2C), so that the second inorganic film 130c may be formed of the first inorganic film and the organic film. It is formed to cover completely. Therefore, the second inorganic film 130c formed on the organic film 130b and the first inorganic film 130a formed on the organic film 130b are overlapped at the edges so as to completely surround the organic film 130b. It can completely block the inflow of oxygen.

The gap D3 (see FIG. 2C) between the edge of the second inorganic film 130c and the edge of the bank insulating film 120 is the distance D4 between the edge of the bank insulating film 120 and the scribing line (FIG. 2C). Narrower, the second inorganic layer 130c is also formed inside the scribing line.

For example, the distance D1 between the edge of the organic film 130b and the edge of the bank insulating film 120 is 200 μm to 500 μm, and the edge of the first inorganic film 130a and the edge of the bank insulating film 120 are provided. It is preferable that the space | interval D2 between them is 400 micrometers-700 micrometers. In addition, the distance D3 between the edge of the second inorganic film 130c and the edge of the bank insulating film 120 is 800 μm to 1100 μm, and the distance D4 between the edge of the bank insulating film 120 and the scribing line. ) Is preferably 1100 µm to 1300 µm. The interval can be changed.

That is, since the edges of the first inorganic film 130a, the organic film 130b, and the second inorganic film 130c are all located inside the scribing line, the cracks are formed in the passivation films 130a, 130b, and 130c during the scribing process. This can be prevented from occurring. At the same time, the edge of the organic layer 130b is formed to be located outside the edge of the bank insulating layer 120 to prevent oxygen and moisture introduced through the second inorganic layer 130c from entering the bank insulating layer 120. Can be. In addition, the second inorganic film 130c and the first inorganic film 130a formed under the organic film 130b may contact each other at the edges to completely cover the organic film 130b, thereby completely blocking the inflow of moisture and oxygen. .

Subsequently, as illustrated in FIG. 3G, an encapsulation substrate 150 formed of glass or plastic is formed on the entire surface of the mother substrate 100 through the adhesive layer 140 formed on the entire surface of the third passivation layer 130c. The encapsulation substrate 150 is for protecting the organic light emitting diode from external moisture, oxygen, and the like. The adhesive layer 140 may be formed of an acrylic resin or a silicone resin, or may be formed of a sealant. Although not shown, the encapsulation substrate 150 and the mother substrate 100 are cut along the scribing line and separated into a plurality of unit panels.

In particular, the encapsulation substrate 150 is formed to completely cover the mother substrate 100 so that edges of the first inorganic layer 130a, the organic layer 130b, and the second inorganic layer 130c are formed by the adhesive layer 140. Fully enclosed, edges of the first inorganic film 130a, the organic film 130b, and the second inorganic film 130c are positioned inside the edge of the encapsulation substrate 150. Accordingly, it is possible to prevent the first inorganic film 130a, the organic film 130b, and the second inorganic film 130c from being damaged from external damage.

Accordingly, the organic light emitting diode display of the present invention as described above improves reliability by controlling the formation regions of the protective layers 130a, 130b, and 130c to prevent moisture and oxygen from flowing into the organic light emitting diode during the scribing process. Can be.

On the other hand, the present invention described above is not limited to the above-described embodiment and the accompanying drawings, it is possible that various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention It will be apparent to those of ordinary skill in Esau.

100: mother substrate 110a: first electrode
110b: light emitting layer 110c: second electrode
120: bank insulating film 130a: first inorganic film
130b: organic film 130c: second inorganic film
140: adhesion layer 150: sealing substrate

Claims (10)

A mother substrate including a plurality of organic light emitting diodes separated by a bank insulating film, the mother substrate being defined by a scribing line;
First passivation layers covering organic light emitting diodes and a bank insulating layer of each unit panel and spaced apart from the scribing line;
Second passivation layers positioned on each first passivation layer and having edges positioned on the first passivation layer;
Third passivation layers covering the first passivation layers and the second passivation layers and spaced apart from the scribing line; And
An encapsulation substrate disposed on the third passivation layers and attached to the front surface of the mother substrate through an adhesive layer contacting the mother substrate between the third passivation layers,
Each organic light emitting diode includes a first electrode, an organic light emitting layer, and a second electrode separated by a bank insulating film of a corresponding unit panel.
The space between the third passivation layers and the encapsulation substrate is completely filled with only the adhesive layer,
The adhesive layer and the encapsulation substrate include a region overlapping the scribing line,
Each first passivation layer surrounds an edge of the bank insulating layer located on the outermost side of the unit panel.
Each second passivation layer completely covers the upper surface of the bank insulating layer located on the outermost side of the unit panel.
The edge of each first protective film is in contact with the corresponding third protective film,
And an interval between an edge of each first passivation layer and an edge of the third passivation layer is greater than an interval between an edge of the first passivation layer and an edge of the second passivation layer. The method of claim 1,
An organic light emitting diode display device, wherein an interval between the edge of the bank insulating layer positioned at the outermost side of each unit panel and the scribing line is 1100 μm to 1300 μm. delete The method of claim 1,
The first passivation layers and the third passivation layers are inorganic layers, and the second passivation layers are organic layers. delete Preparing a mother substrate defined by a scribing line by unit panels including a plurality of organic light emitting diodes separated by a bank insulating film;
Forming first passivation layers covering organic light emitting diodes and a bank insulating layer of each unit panel and spaced apart from the scribing line;
Forming, on each first passivation film, second passivation films whose edges are positioned on the first passivation film;
Forming third passivation layers covering the first passivation layers and the second passivation layers and spaced apart from the scribing line;
Attaching an encapsulation substrate to an entire surface of the mother substrate on which the third passivation layers are formed using only an adhesive layer; And
Cutting the mother substrate, the adhesive layer, and the encapsulation substrate along the scribing line, and separating the mother substrate into a plurality of unit panels.
Each organic light emitting diode includes a first electrode, an organic light emitting layer, and a second electrode separated by a bank insulating film of a corresponding unit panel,
The adhesive layer and the encapsulation substrate are formed to cover the scribing line between the third passivation layers.
Each first passivation layer is formed to surround the edge of the bank insulating layer positioned at the outermost portion of the unit panel.
Each second passivation layer is formed to completely cover an upper surface of the bank insulating layer positioned at the outermost portion of the unit panel.
Each third passivation layer is formed to contact the edge of the first passivation layer,
The gap between the edge of each of the first passivation layers and the edge of the third passivation layer is greater than the gap between the edge of the first passivation layer and the edge of the second passivation layer. Way. The method of claim 6,
A method of manufacturing an organic light emitting diode display device, wherein an interval between an edge of a bank insulating film positioned at the outermost side of each unit panel and a scribing line is 1100 μm to 1300 μm. delete The method of claim 6,
The first passivation layer and the third passivation layer are formed of an inorganic layer, and the second passivation layer is formed of an organic layer. delete

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