KR102649202B1 - Organic Light Emitting Display device having an organic light emitting layer extending a non-display area - Google Patents

Abstract

An organic light emitting display device is provided. The organic light emitting display device includes a light emitting structure located on a display area and a separation structure located on a non-display area outside the display area. The light emitting structure includes an organic light emitting layer extending over the separation structure. The organic light emitting layer exposes a side of the separation structure.

Description

Organic light emitting display device having an organic light emitting layer extending a non-display area}

The present invention relates to an organic light emitting display device in which an organic light emitting layer located between a lower electrode and an upper electrode extends onto a non-display area located close to an edge of the lower substrate.

In general, electronic devices such as monitors, TVs, laptops, digital cameras, etc. include display devices for displaying images. For example, the display device may include a liquid crystal display device and an organic light emitting display device.

The organic light emitting display device may include a light emitting structure located on a display area. For example, the light emitting structure may include a lower electrode, an upper electrode located on the lower electrode, and an organic light emitting layer located between the lower electrode and the upper electrode.

Since the organic light-emitting layer is very vulnerable to moisture, the method of manufacturing the organic light-emitting display may include an encapsulation process to prevent external moisture from penetrating into the organic light-emitting layer. For example, the method of manufacturing the organic light emitting display device includes forming a protective film covering the light emitting structure by depositing an inorganic material, forming an adhesive layer on the protective film, and forming an upper substrate on the adhesive layer. It can be included.

The organic light-emitting layer may be formed through a deposition process using a mask. In the deposition process using the mask, deposition shadows may be generated due to deformation of the deposition object and/or the mask positioned on the deposition object. In the deposition process using the mask, the length of the deposition shadow may be proportional to the area of the deposition object. For example, as the area of the organic light emitting display device becomes larger, the tail portion of the organic light emitting layer caused by the deposition shadow may extend onto the non-display area located closer to the edge of the substrate.

However, as the tail portion of the organic light-emitting layer approaches the edge of the substrate, external moisture becomes more likely to penetrate, so there is a problem in that the organic light-emitting layer deteriorates rapidly and the lifespan of the light-emitting structure is reduced. Additionally, if the area of the non-display area is increased to delay moisture infiltration from the outside, there is a problem in that the display area of the organic light emitting display device is relatively reduced.

The problem to be solved by the present invention is to provide an organic light emitting display device that can prevent deterioration of the light emitting structure due to deposition shadows.

Another problem to be solved by the present invention is to provide an organic light emitting display device that can prevent moisture from penetrating through a tail portion of an organic light emitting layer extending onto a non-display area.

Another problem to be solved by the present invention is to provide an organic light emitting display device that can reduce the area of the non-display area located outside the display area without reducing the lifespan of the light emitting structure.

The problems to be solved by the present invention are not limited to the problems mentioned above. Problems not mentioned herein will become clear to those skilled in the art from the description below.

An organic light emitting display device according to the technical idea of the present invention to achieve the above-described problem includes a lower substrate including a display area and a non-display area located outside the display area; an upper electrode located on the display area of the lower substrate; a lower electrode positioned between the lower substrate and the upper electrode; an organic light emitting layer located between the lower electrode and the upper electrode and extending onto the non-display area of the lower substrate; and a separation structure positioned between the lower substrate and the organic light emitting layer on the non-display area of the lower substrate. The organic light emitting layer exposes a side of the separation structure.

The organic light emitting display device may further include a protective film located on the upper electrode and extending onto the non-display area of the lower substrate. The protective film may surround a side of the separation structure.

The protective film may directly contact the side of the separation structure exposed by the organic light-emitting layer.

The thickness of the separation structure may be greater than the thickness of the organic emission layer.

The separation structure may be a stacked structure of inorganic films.

The organic light emitting display device may further include a color filter positioned between the lower substrate and the lower electrode. One of the inorganic films may include the same material as the color filter.

The organic light emitting display device may further include a thin film transistor located between the lower substrate and the lower electrode and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. At least one of the inorganic layers may include the same material as one of the semiconductor layer, the gate electrode, the source electrode, and the drain electrode.

The thin film transistor may further include a gate insulating film positioned between the semiconductor layer and the gate electrode. One of the inorganic layers may include the same material as the gate insulating layer.

An organic light emitting display device according to the technical idea of the present invention for achieving the above-described other problems includes a lower substrate including a first area located close to an edge and a second area located adjacent to the first area; a separation structure located on the first region of the lower substrate; and a light emitting structure located on the second region of the lower substrate and including an organic light emitting layer. The organic light-emitting layer includes a first organic tail portion located on the upper surface of the separation structure and a second organic tail portion located on the first region of the lower substrate and separated from the first organic tail portion.

The horizontal width of the separation structure may increase as the distance from the lower substrate increases.

The second organic tail portion of the organic emission layer may be spaced apart from the separation structure.

The organic light emitting display device may further include a protective film covering the light emitting structure and the separation structure. The space between the second organic tail portion of the organic emission layer and the separation structure may be filled with the protective film.

The upper electrode may extend onto the first area of the lower substrate. The upper electrode may cover the first organic tail portion and the second organic tail portion on the first region of the lower substrate.

The upper electrode may include a first electrode tail portion covering the first organic tail portion and a second electrode tail portion covering the second organic tail portion. The second electrode tail portion may be separated from the first electrode tail portion.

The second electrode tail portion may be spaced apart from the separation structure.

The organic light emitting display device according to the technical idea of the present invention can prevent moisture from penetrating through the tail portion of the organic light emitting layer extending onto the non-display area by using a separation structure located on the non-display area. Accordingly, in the organic light emitting display device according to the technical idea of the present invention, deterioration and lifespan of the light emitting structure due to deposition shadows can be prevented. Therefore, in the organic light emitting display device according to the technical idea of the present invention, the area of the non-display area located close to the edge of the substrate can be reduced without reducing the lifespan of the light emitting structure.

1 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.
FIG. 2A is an enlarged view of area P1 in FIG. 1.
2B and 2C are diagrams showing partial areas of an organic light emitting display device according to another embodiment of the present invention, respectively.
Figure 3 is a cross-sectional view of an organic light emitting display device according to another embodiment of the present invention.
FIG. 4 is an enlarged view of area P2 in FIG. 3.
Figure 5 is a cross-sectional view of an organic light emitting display device according to another embodiment of the present invention.

Details regarding the above-mentioned purpose, technical configuration, and effects thereof of the present invention will be more clearly understood through the following detailed description with reference to the drawings showing embodiments of the present invention. Here, since the embodiments of the present invention are provided so that the technical idea of the present invention can be sufficiently conveyed to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

In addition, parts indicated with the same reference numerals throughout the specification refer to the same components, and the length and thickness of a layer or region in the drawings may be exaggerated for convenience. Additionally, when a first component is described as being “on” a second component, it does not only mean that the first component is located above and in direct contact with the second component, but also that the first component and the It also includes cases where a third component is located between second components.

Here, the terms first, second, etc. are used to describe various components and are used for the purpose of distinguishing one component from other components. However, without departing from the technical spirit of the present invention, the first component and the second component may be arbitrarily named according to the convenience of those skilled in the art.

The terms used in the specification of the present invention are only used to describe specific embodiments and are not intended to limit the present invention. For example, an element expressed in the singular includes plural elements unless the context clearly indicates only the singular. In addition, in the specification of the present invention, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are intended to indicate the presence of one or It should be understood that this does not preclude the existence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the specification of the present invention, they should not be taken in an idealistic or excessively formal sense. It is not interpreted.

(Example)

1 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention. FIG. 2A is an enlarged view of area P1 in FIG. 1.

Referring to FIGS. 1 and 2A, the organic light emitting display device according to an embodiment of the present invention includes a lower substrate 100, an upper substrate 200, a thin film transistor 300, a first planarization film 410, and a second planarization film. 420, a color filter 425, a light emitting structure 500, a bank insulating film 600, a separation structure 710, a protective film 800, and an adhesive layer 900 may be included.

The lower substrate 100 may support the light emitting structure 500 and the separation structure 710. The lower substrate 100 may include a display area (AA) and a non-display area (NA) located adjacent to each other. The non-display area (NA) may be located outside the display area (AA). For example, the non-display area NA may be located close to the edge 100e of the lower substrate 100.

The lower substrate 100 may include an insulating material. The lower substrate 100 may include a transparent material. For example, the lower substrate 100 may include glass or plastic.

The upper substrate 200 may be located on the lower substrate 100. The upper substrate 200 may vertically overlap the display area AA and the non-display area NA of the lower substrate 100. The upper substrate 200 may have a smaller area than the lower substrate 100. For example, the upper substrate 200 may not cover a portion of the non-display area NA of the lower substrate 100 located close to the edge 100e.

The upper substrate 200 may include a metal material. For example, the upper substrate 200 may include aluminum or copper.

The thin film transistor 300 may be located between the lower substrate 100 and the upper substrate 200. For example, the thin film transistor 300 may be located between the lower substrate 100 and the upper substrate 200 on the display area AA of the lower substrate 100.

The organic light emitting display device according to an embodiment of the present invention is described in that the thin film transistor 300 is in direct contact with the lower substrate 100. However, in an organic light emitting display device according to another embodiment of the present invention, a buffer layer may be located between the lower substrate 100 and the thin film transistor 300. The buffer layer may include an insulating material. For example, the buffer layer may be an inorganic insulating film containing silicon oxide and/or silicon nitride.

The thin film transistor 300 includes a semiconductor layer 310 including a source region, a drain region, and a channel region, a gate electrode 320 vertically overlapping the channel region of the semiconductor layer 310, and the semiconductor layer 310. and a gate insulating film 330 located between the gate electrode 320, a drain electrode 340 connected to the drain region of the semiconductor layer 310, and a source connected to the source region of the semiconductor layer 310. It may include an electrode 350 and an interlayer insulating film 360 that insulates between the gate electrode 320, the drain electrode 340, and the source electrode 350.

The semiconductor layer 310 may include a semiconductor material. For example, the semiconductor layer 310 may include amorphous silicon or polycrystalline silicon.

The gate electrode 320, the drain electrode 340, and the source electrode 350 may include a conductive material. For example, the gate electrode 320, the drain electrode 340, and the source electrode 350 may include metal. The source electrode 350 may include the same material as the drain electrode 340. The gate electrode 320 may include a material different from the drain electrode 340 and the source electrode 350.

The gate insulating layer 330 and the interlayer insulating layer 360 may include an insulating material. A side surface of the gate insulating layer 330 may be vertically aligned with a side surface of the gate electrode 320. The interlayer insulating film 360 may entirely cover the display area AA of the lower substrate 100 .

An organic light emitting display device according to an embodiment of the present invention is described in which the thin film transistor 300 includes a gate electrode 320 located on the upper surface of the semiconductor layer 310. However, in an organic light emitting display device according to another embodiment of the present invention, the thin film transistor 300 may have a structure in which the semiconductor layer 310 is located on the gate electrode 320.

The first planarization film 410 and the second planarization film 420 may remove a step caused by the thin film transistor 300 on the display area AA of the lower substrate 100. The first planarization film 410 may cover the thin film transistor 300. The second planarization film 420 may be positioned on the first planarization film 410. For example, the upper surface of the second planarization film 420 may be parallel to the surface of the lower substrate 100.

The first planarization film 410 and the second planarization film 420 may include an insulating material. The second planarization film 420 may include the same material as the first planarization film 410. For example, the first planarization film 410 and the second planarization film 420 may include silicon oxide.

The color filter 425 can allow light passing through to implement a specific color. For example, light passing through the color filter 425 may implement one of red, green, and blue.

The color filter 425 may be located on the display area AA of the lower substrate 100. The color filter 425 may be positioned between the first planarization film 410 and the second planarization film 420. For example, the color filter 425 may be located on the first planarization film 410. The level difference caused by the color filter 425 can be removed by the second planarization film 420.

The color filter 425 may not vertically overlap the thin film transistor 300. For example, light passing through the color filter 425 may proceed to the lower substrate 100.

The light emitting structure 500 can generate light that implements a specific color. For example, the light emitting structure 500 may include a lower electrode 510, an organic light emitting layer 520, and an upper electrode 530 stacked in that order.

The lower electrode 510 may be located on the display area AA of the lower substrate 100. The lower electrode 510 may be located on the second planarization film 420 . For example, the lower electrode 510 may directly contact the upper surface of the second planarization film 420.

The lower electrode 510 may be electrically connected to the thin film transistor 300. For example, the lower electrode 510 may be connected to the drain electrode 340 of the thin film transistor 300. The lower electrode 510 may vertically overlap a portion of the thin film transistor 300. For example, the first planarization film 410 and the second planarization film 420 may include a contact hole exposing the drain electrode 340.

The lower electrode 510 may extend onto the color filter 425 . The color filter 425 may vertically overlap the lower electrode 510. The lower electrode 510 may be separated from adjacent pixel areas. For example, the lower electrode 510 may include a side surface located on the second planarization film 420 . The side of the lower electrode 510 may be covered by the bank insulating film 600. The bank insulating film 600 may include an insulating material.

The lower electrode 510 may include a conductive material. The lower electrode 510 may include a transparent material. For example, the lower electrode 510 may include ITO or IZO.

The organic light emitting layer 520 may be located between the lower electrode 510 and the upper electrode 530. The organic light-emitting layer 520 may implement a specific color with luminance corresponding to the voltage difference between the lower electrode 510 and the upper electrode 530. The organic emission layer 520 may be connected in adjacent pixel areas. For example, the organic light emitting layer 520 may extend onto the bank insulating layer 600. The organic light-emitting layer 520 may be white.

The organic light-emitting layer 520 may include an emitting material layer containing an organic light-emitting material. The organic light emitting layer 520 may have a multilayer structure. For example, the organic light-emitting layer 520 includes a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer to increase luminous efficiency. It may further include at least one of (electron injection layer; EIL).

The upper electrode 530 may be located on the organic light emitting layer 520. The upper electrode 530 may be connected in adjacent pixel areas. For example, the upper electrode 530 may extend onto the bank insulating layer 600. The upper surface of the organic emission layer 520 on the display area AA of the lower substrate 100 may be covered by the upper electrode 530.

The upper electrode 530 may include a conductive material. The upper electrode 530 may include a material with high reflectivity. For example, the upper electrode 530 may include aluminum.

The separation structure 710 may be located on the non-display area (NA) of the lower substrate 100. The separation structure 710 may include a material that can prevent moisture from penetrating. For example, the separation structure 710 includes a first inorganic layer 711, a second inorganic layer 712, a third inorganic layer 713, a fourth inorganic layer 714, and a fifth inorganic layer stacked in that order. It may include a film 715 and a sixth inorganic film 716.

The first inorganic layer 711 may be located close to the lower substrate 100. For example, the first inorganic layer 711 may directly contact the lower substrate 100. The first inorganic layer 711 may include the same material as the semiconductor layer 310. For example, the thickness of the first inorganic layer 711 may be the same as the thickness of the semiconductor layer 310.

The first inorganic layer 711 may be formed simultaneously with the semiconductor layer 310. For example, the process of forming the semiconductor layer 310 and the first inorganic layer 711 may include forming a layer containing a semiconductor material on the lower substrate 100, a layer containing the semiconductor material, A process of forming a photoresist pattern covering the area where the semiconductor layer 310 will be formed and the area where the first inorganic layer 7110 will be formed, and a layer containing the semiconductor material using the photoresist pattern as an etch mask. It may include a process of etching.

The second inorganic layer 712 may be located on the first inorganic layer 711. For example, the second inorganic layer 712 may directly contact the upper surface of the first inorganic layer 711. The second inorganic layer 712 may include the same material as the gate insulating layer 330. For example, the thickness of the second inorganic layer 712 may be the same as the thickness of the gate insulating layer 330.

The third inorganic layer 713 may be located on the second inorganic layer 712. For example, the third inorganic layer 713 may directly contact the upper surface of the second inorganic layer 712. The third inorganic layer 713 may include the same material as the gate electrode 320. For example, the thickness of the third inorganic layer 713 may be the same as the thickness of the gate electrode 320. The third inorganic layer 713 may be formed simultaneously with the gate electrode 320.

In an organic light emitting display device according to an embodiment of the present invention, the gate insulating film 330 may expose the source region and drain region of the semiconductor layer 310. For example, in an organic light emitting display device according to an embodiment of the present invention, the second inorganic layer 712 and the gate insulating layer 330 use an etch mask to protect the third inorganic layer 713 and the gate electrode 320. It can be formed by an etching process using .

The fourth inorganic layer 714 may be located on the third inorganic layer 713. For example, the fourth inorganic layer 714 may directly contact the upper surface of the third inorganic layer 713. The fourth inorganic layer 714 may include the same material as the source electrode 350 and the drain electrode 340. For example, the source electrode 350, the drain electrode 340, and the fourth inorganic layer 714 may be formed simultaneously. The thickness of the fourth inorganic layer 714 may be the same as the thickness of the source electrode 350 and the drain electrode 340.

The fifth inorganic layer 715 may be located on the fourth inorganic layer 714. For example, the fifth inorganic layer 715 may directly contact the upper surface of the fourth inorganic layer 714. The fifth inorganic layer 715 may include the same material as the color filter 425. For example, the thickness of the fifth inorganic layer 715 may be the same as the thickness of the color filter 425. The fifth inorganic layer 715 may be formed simultaneously with the color filter 425.

The sixth inorganic layer 716 may be located on the fifth inorganic layer 715. For example, the sixth inorganic layer 716 may directly contact the upper surface of the fifth inorganic layer 715. The sixth inorganic layer 716 may include the same material as the lower electrode 510. For example, the thickness of the sixth inorganic layer 716 may be the same as the thickness of the lower electrode 510. The sixth inorganic layer 716 may be formed simultaneously with the lower electrode 510.

The organic light emitting display device according to an embodiment of the present invention uses components formed by an etching process among the components located on the display area AA of the lower substrate 100 to reduce the ratio of the lower substrate 100. A separation structure 710 may be formed on the display area NA. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, the separation structure 710 can be formed without adding a separate process. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, the separation structure 710 can be formed without reducing process time and production efficiency.

Additionally, the organic light emitting display device according to an embodiment of the present invention may include inorganic films in which the separation structure 710 is stacked. Therefore, in the organic light emitting display device according to an embodiment of the present invention, moisture penetration through the separation structure 710 can be prevented.

In the organic light emitting display device according to an embodiment of the present invention, the inorganic films of the separation structure 710 are formed simultaneously with one of the components formed on the display area AA of the lower substrate 100 through an etching process. You can. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, the inorganic layers 711 - 716 of the separation structure 710 undergo more etching processes as they are located closer to the lower substrate 100 . Therefore, in the organic light emitting display device according to an embodiment of the present invention, the horizontal width of the separation structure 710 may increase as the distance from the lower substrate 100 increases.

The organic light emitting display device according to another embodiment of the present invention may form the separation structure 710 by stacking only some of the components formed through an etching process. For example, as shown in FIG. 2B, an organic light emitting display device according to another embodiment of the present invention includes a first inorganic layer 721 including the same material as the gate electrode 320, a drain electrode 340, and A second inorganic layer 722 containing the same material as the source electrode 350, a third inorganic layer 723 containing the same material as the color filter 425, and a first inorganic layer 723 containing the same material as the lower electrode 510. It may include a separation structure 720 in which four inorganic films 724 are sequentially stacked.

Additionally, an organic light emitting display device according to another embodiment of the present invention may include at least one inorganic layer including the same material as the separation structure that is not formed by an etching process. For example, as shown in FIG. 2C, an organic light emitting display device according to another embodiment of the present invention includes a first inorganic layer 731 containing the same material as the semiconductor layer 310, a gate insulating layer 330, and A second inorganic layer 732 containing the same material as the gate electrode 320, a third inorganic layer 733 containing the same material as the interlayer insulating layer 360, and a fourth inorganic layer 734 containing the same material as the interlayer insulating layer 360. , a fifth inorganic layer 735 containing the same material as the drain electrode 340 and the source electrode 350, a sixth inorganic layer 736 containing the same material as the color filter 425, and the lower electrode 510. It may include a separation structure 730 in which a seventh inorganic layer 737 containing the same material is sequentially stacked.

In the organic light emitting display device according to an embodiment of the present invention, the organic light emitting layer 520 may extend onto the non-display area (NA) of the lower substrate 100. For example, in an organic light emitting display device according to an embodiment of the present invention, the organic light emitting layer 520 may be formed through a deposition process using a mask. In the organic light emitting display device according to an embodiment of the present invention, the organic light emitting layer 520 located on the non-display area (NA) of the lower substrate 100 may be caused by a deposition shadow.

The thickness of the separation structure 710 may be thicker than the thickness of the organic light emitting layer 520. Accordingly, the organic light emitting layer 520 formed on the non-display area (NA) of the lower substrate 100 by deposition shadow may be partially broken by the separation structure 710. For example, the organic light emitting layer 520 on the non-display area (NA) of the lower substrate 100 includes the first organic tail portion 521 located on the upper surface of the separation structure 710 and the It may include a second organic tail portion 522 that is separated from the first organic tail portion 521. The second organic tail portion 522 may directly contact the non-display area (NA) of the lower substrate 100 . The organic light emitting layer 520 including the first organic tail portion 521 and the second organic tail portion 522 may expose a side surface of the separation structure 710 .

In the organic light emitting display device according to an embodiment of the present invention, the separation structure 710 located on the non-display area (NA) of the lower substrate 100 may separate a partial area of the organic light emitting layer 520. That is, in the organic light emitting display device according to an embodiment of the present invention, the organic light emitting layer 520 is spaced apart from the remaining areas by the separation structure 710 on the non-display area (NA) of the lower substrate 100. It may include a certain area. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, external light penetrates into the light emitting structure 500 through the organic light emitting layer 520 located on the non-display area (NA) of the lower substrate 100. Moisture may be blocked by the separation structure 710. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, a decrease in the lifespan of the light emitting structure 500 due to deposition shadows can be prevented.

The protective film 800 can prevent external moisture from penetrating into the light emitting structure 500. For example, the protective film 800 may include an inorganic material that has a high moisture barrier effect.

The protective film 800 may cover the light emitting structure 500. For example, the upper surface of the upper electrode 530 may be covered by the protective film 800. The protective film 800 may extend onto the non-display area (NA) of the lower substrate 100 . For example, the protective film 800 may surround the side of the separation structure 710. The protective film 800 may cover the first organic tail portion 521. The protective film 800 may directly contact the side surface of the separation structure 710 exposed by the first organic tail portion 521 and the second organic tail portion 522.

In the organic light emitting display device according to an embodiment of the present invention, a protective film 800 may cover the separation structure 710. Therefore, in the organic light emitting display device according to an embodiment of the present invention, the connection between the first organic tail portion 521 and the second organic tail portion 522 located on the non-display area (NA) of the lower substrate 100 is secure. can be separated.

The second organic tail portion 522 may be spaced apart from the separation structure 710. The space between the second organic tail portion 522 and the separation structure 710 may be filled with the protective film 800.

In the organic light emitting display device according to an embodiment of the present invention, a protective film 800 may be positioned between the second organic tail portion 522 and the separation structure 710. Therefore, in the organic light emitting display device according to an embodiment of the present invention, a moisture permeation path is formed by the first organic tail portion 521 and the second organic tail portion 522 located on the non-display area (NA) of the lower substrate 100. can definitely be blocked.

The upper electrode 530 may extend onto the non-display area (NA) of the lower substrate 100 . The upper electrode 530 may cover the first organic tail portion 521 and the second organic tail portion 522.

In the organic light emitting display device according to an embodiment of the present invention, the first organic tail portion 521 and the second organic tail portion 522 located on the non-display area (NA) of the lower substrate 100 include a conductive material. It may be covered by the upper electrode 530. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, external moisture can be prevented from penetrating into the first organic tail portion 521 and the second organic tail portion 522.

The upper electrode 530 may include a first electrode tail portion 531 and a second electrode tail portion 532. The first electrode tail portion 531 may cover the first organic tail portion 521. The second electrode tail portion 532 may cover the second organic tail portion 522.

The thickness of the separation structure 710 may be greater than the sum of the thicknesses of the organic light emitting layer 520 and the upper electrode 530. The second electrode tail portion 532 may be separated from the first electrode tail portion 531. The second electrode tail portion 532 may be spaced apart from the separation structure 710. The space between the second electrode tail portion 532 and the separation structure 710 may be filled with the protective film 800.

The organic light emitting display device according to an embodiment of the present invention includes a first electrode tail portion 531 covering the first organic tail portion 521 located on the non-display area (NA) of the lower substrate 100 and a second organic electrode tail portion 531. The second electrode tail portion 532 covering the tail portion 522 may be separated. Additionally, in the organic light emitting display device according to an embodiment of the present invention, a protective film 800 may be positioned between the second electrode tail portion 532 and the separation structure 710. Accordingly, in the organic light emitting display device according to an embodiment of the present invention, moisture infiltration can be prevented by the first organic tail portion 521 and the second organic tail portion 522.

The organic light emitting display device according to an embodiment of the present invention is described as having the side surface of the separation structure 710 exposed by the first electrode tail portion 531 and the second electrode tail portion 532. However, in the organic light emitting display device according to another embodiment of the present invention, the side of the separation structure 710 exposed by the first organic tail portion 521 and the second organic tail portion 522 is the upper electrode 530. can be covered by

As a result, the organic light-emitting display device according to an embodiment of the present invention uses the separation structure 710 to cut the organic light-emitting layer 520 extending to the non-display area (NA) of the lower substrate 100, thereby reducing the amount of damage caused by deposition shadows. Prevents deterioration and reduced lifespan of light-emitting structures. Accordingly, the organic light emitting display device according to an embodiment of the present invention can reduce the area of the non-display area (NA) without deteriorating the light emitting structure and reducing its lifespan.

The organic light emitting display device according to an embodiment of the present invention is described as being a bottom emission type in which the color filter 425 is located below the lower substrate 510. However, as shown in FIG. 3, the organic light emitting display device according to another embodiment of the present invention has a color filter 210 and a black matrix 220 on the surface of the upper substrate 200 facing the lower substrate 100. It may be a top emission method where is located. In this case, as shown in FIG. 4, the organic light emitting display device according to another embodiment of the present invention includes a first inorganic layer 741 containing the same material as the semiconductor layer 310 and the same material as the gate insulating layer 330. A second inorganic layer 742 containing a material, a third inorganic layer 743 containing the same material as the gate electrode 320, and a fourth inorganic layer containing the same material as the drain electrode 340 and the source electrode 350. The separation structure 740 may include an inorganic layer 744 and a fifth inorganic layer 745 including the same material as the lower electrode 510, which are sequentially stacked.

Additionally, as shown in FIG. 5, an organic light emitting display device according to another embodiment of the present invention may not include a color filter. In this case, the organic light emitting layer 520 may implement different colors in adjacent pixel areas. For example, in an organic light emitting display device according to another embodiment of the present invention, a red organic light emitting layer, a green organic light emitting layer, and a blue organic light emitting layer may be alternately arranged.

100: lower substrate 200: upper substrate
300: thin film transistor 500: light emitting structure
520: Organic light-emitting layer 521: First organic tail portion
522: second organic tail portion 710: separation structure
800: Shield

Claims (15)

a lower substrate including a display area and a non-display area located outside the display area;
an upper electrode located on the display area of the lower substrate;
a lower electrode positioned between the lower substrate and the upper electrode;
an organic light emitting layer located between the lower electrode and the upper electrode and extending onto the non-display area of the lower substrate;
a separation structure positioned between the lower substrate and the organic light emitting layer on the non-display area of the lower substrate; and
A protective film located on the upper electrode and surrounding the side of the separation structure,
On the non-display area of the lower substrate, the organic light emitting layer includes a certain area spaced apart from the remaining areas by the separation structure,
The side of the separation structure exposed by the organic light-emitting layer is in contact with the protective film,
An organic light emitting display device wherein the protective film includes an inorganic material. According to claim 1,
an adhesive layer located on the protective film; and
An organic light emitting display device further comprising an upper substrate positioned on the adhesive layer. According to claim 2,
The adhesive layer is in contact with the non-display area of the lower substrate outside the protective film. According to claim 1,
An organic light emitting display device wherein the separation structure has a thickness greater than the thickness of the organic light emitting layer. According to claim 1,
The separation structure is an organic light emitting display device having a stacked structure of inorganic films. According to claim 5,
Further comprising a color filter located between the lower substrate and the lower electrode,
An organic light emitting display device wherein one of the inorganic layers includes the same material as the color filter. According to claim 5,
It further includes a thin film transistor located between the lower substrate and the lower electrode and including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode,
At least one of the inorganic layers includes the same material as one of the semiconductor layer, the gate electrode, the source electrode, and the drain electrode. According to claim 7,
The thin film transistor further includes a gate insulating film positioned between the semiconductor layer and the gate electrode,
An organic light emitting display device wherein one of the inorganic layers includes the same material as the gate insulating layer. a lower substrate including a first region positioned close to an edge and a second region positioned adjacent to the first region;
a separation structure located on the first region of the lower substrate;
a light emitting structure located on the second region of the lower substrate and including an organic light emitting layer located between a lower electrode and an upper electrode; and
It is located on the light emitting structure and includes a protective film covering the separation structure,
The organic light emitting layer includes a first organic tail portion located on the upper surface of the separation structure and a second organic tail portion located on the first region of the lower substrate and separated from the first organic tail portion,
The space between the second organic tail portion and the separation structure is filled by the protective film,
An organic light emitting display device wherein the protective film includes an inorganic material. According to clause 9,
An organic light emitting display device in which the horizontal width of the separation structure increases as the distance from the lower substrate increases. According to clause 9,
The second organic tail portion is in contact with the first region of the lower substrate. According to claim 11,
The protective film is in contact with the first region of the lower substrate outside the second organic tail portion. According to clause 9,
The upper electrode extends onto the first area of the lower substrate,
The upper electrode covers the first organic tail portion and the second organic tail portion on the first region of the lower substrate. According to claim 13,
The upper electrode includes a first electrode tail portion covering the first organic tail portion and a second electrode tail portion covering the second organic tail portion,
The organic light emitting display device wherein the second electrode tail portion is separated from the first electrode tail portion. According to claim 14,
The second electrode tail portion is spaced apart from the separation structure.

Images