KR102057783B1 - 증발원 장치 및 그 제어 방법 - Google Patents
증발원 장치 및 그 제어 방법 Download PDFInfo
- Publication number
- KR102057783B1 KR102057783B1 KR1020180074487A KR20180074487A KR102057783B1 KR 102057783 B1 KR102057783 B1 KR 102057783B1 KR 1020180074487 A KR1020180074487 A KR 1020180074487A KR 20180074487 A KR20180074487 A KR 20180074487A KR 102057783 B1 KR102057783 B1 KR 102057783B1
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- South Korea
- Prior art keywords
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- container
- deposition material
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- 238000000034 method Methods 0.000 title claims description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 246
- 239000000463 material Substances 0.000 claims abstract description 187
- 238000001704 evaporation Methods 0.000 claims abstract description 114
- 230000008020 evaporation Effects 0.000 claims abstract description 113
- 238000007740 vapor deposition Methods 0.000 claims abstract description 104
- 230000008021 deposition Effects 0.000 claims abstract description 64
- 239000011810 insulating material Substances 0.000 claims description 14
- 238000000151 deposition Methods 0.000 description 51
- 239000000758 substrate Substances 0.000 description 43
- 239000010410 layer Substances 0.000 description 41
- 239000010408 film Substances 0.000 description 29
- 239000007789 gas Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000005525 hole transport Effects 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H01L51/001—
-
- H01L51/56—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017152488A JP6436544B1 (ja) | 2017-08-07 | 2017-08-07 | 蒸発源装置およびその制御方法 |
JPJP-P-2017-152488 | 2017-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190015993A KR20190015993A (ko) | 2019-02-15 |
KR102057783B1 true KR102057783B1 (ko) | 2019-12-19 |
Family
ID=64655835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180074487A KR102057783B1 (ko) | 2017-08-07 | 2018-06-28 | 증발원 장치 및 그 제어 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6436544B1 (zh) |
KR (1) | KR102057783B1 (zh) |
CN (1) | CN109385605B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109868452B (zh) * | 2019-03-19 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 冷却板和真空蒸镀装置 |
JP6961161B2 (ja) * | 2019-05-14 | 2021-11-05 | 日本エア・リキード合同会社 | 固体材料容器用キャビネット |
JP7241603B2 (ja) * | 2019-05-28 | 2023-03-17 | キヤノントッキ株式会社 | 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 |
JP7202971B2 (ja) | 2019-05-28 | 2023-01-12 | キヤノントッキ株式会社 | 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 |
JP7241604B2 (ja) * | 2019-05-28 | 2023-03-17 | キヤノントッキ株式会社 | 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法 |
KR102319130B1 (ko) * | 2020-03-11 | 2021-10-29 | 티오에스주식회사 | 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원 |
JP7162639B2 (ja) | 2020-05-20 | 2022-10-28 | キヤノントッキ株式会社 | 蒸発源装置、蒸着装置、及び蒸発源装置の制御方法 |
JP7444843B2 (ja) * | 2021-12-02 | 2024-03-06 | キヤノントッキ株式会社 | 蒸着用坩堝及び蒸着装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3508484B2 (ja) * | 1997-07-14 | 2004-03-22 | 松下電器産業株式会社 | 機能性薄膜の形成方法及び形成装置 |
JP4688857B2 (ja) * | 2000-10-26 | 2011-05-25 | 株式会社半導体エネルギー研究所 | 成膜装置および成膜方法 |
KR100711886B1 (ko) * | 2005-08-31 | 2007-04-25 | 삼성에스디아이 주식회사 | 무기 증착원 및 이의 가열원 제어방법 |
CN202246836U (zh) * | 2011-07-22 | 2012-05-30 | 上海奕瑞光电子科技有限公司 | 电阻加热式蒸发源 |
JP6223675B2 (ja) * | 2012-11-29 | 2017-11-01 | 株式会社オプトラン | 真空蒸着源及びそれを用いた真空蒸着方法 |
-
2017
- 2017-08-07 JP JP2017152488A patent/JP6436544B1/ja active Active
-
2018
- 2018-06-28 KR KR1020180074487A patent/KR102057783B1/ko active IP Right Grant
- 2018-08-07 CN CN201810887800.8A patent/CN109385605B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP6436544B1 (ja) | 2018-12-12 |
CN109385605B (zh) | 2022-04-26 |
KR20190015993A (ko) | 2019-02-15 |
CN109385605A (zh) | 2019-02-26 |
JP2019031705A (ja) | 2019-02-28 |
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