KR102057783B1 - 증발원 장치 및 그 제어 방법 - Google Patents

증발원 장치 및 그 제어 방법 Download PDF

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Publication number
KR102057783B1
KR102057783B1 KR1020180074487A KR20180074487A KR102057783B1 KR 102057783 B1 KR102057783 B1 KR 102057783B1 KR 1020180074487 A KR1020180074487 A KR 1020180074487A KR 20180074487 A KR20180074487 A KR 20180074487A KR 102057783 B1 KR102057783 B1 KR 102057783B1
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KR
South Korea
Prior art keywords
heating
container
deposition material
temperature
control
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KR1020180074487A
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English (en)
Korean (ko)
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KR20190015993A (ko
Inventor
요시나리 콘도
요시아키 카자마
마사히로 야마자키
Original Assignee
캐논 톡키 가부시키가이샤
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Publication of KR20190015993A publication Critical patent/KR20190015993A/ko
Application granted granted Critical
Publication of KR102057783B1 publication Critical patent/KR102057783B1/ko

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • H01L51/001
    • H01L51/56
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020180074487A 2017-08-07 2018-06-28 증발원 장치 및 그 제어 방법 KR102057783B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017152488A JP6436544B1 (ja) 2017-08-07 2017-08-07 蒸発源装置およびその制御方法
JPJP-P-2017-152488 2017-08-07

Publications (2)

Publication Number Publication Date
KR20190015993A KR20190015993A (ko) 2019-02-15
KR102057783B1 true KR102057783B1 (ko) 2019-12-19

Family

ID=64655835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180074487A KR102057783B1 (ko) 2017-08-07 2018-06-28 증발원 장치 및 그 제어 방법

Country Status (3)

Country Link
JP (1) JP6436544B1 (zh)
KR (1) KR102057783B1 (zh)
CN (1) CN109385605B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109868452B (zh) * 2019-03-19 2021-01-01 武汉华星光电半导体显示技术有限公司 冷却板和真空蒸镀装置
JP6961161B2 (ja) * 2019-05-14 2021-11-05 日本エア・リキード合同会社 固体材料容器用キャビネット
JP7241603B2 (ja) * 2019-05-28 2023-03-17 キヤノントッキ株式会社 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法
JP7202971B2 (ja) 2019-05-28 2023-01-12 キヤノントッキ株式会社 蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法
JP7241604B2 (ja) * 2019-05-28 2023-03-17 キヤノントッキ株式会社 加熱装置、蒸発源装置、成膜装置、成膜方法および電子デバイスの製造方法
KR102319130B1 (ko) * 2020-03-11 2021-10-29 티오에스주식회사 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원
JP7162639B2 (ja) 2020-05-20 2022-10-28 キヤノントッキ株式会社 蒸発源装置、蒸着装置、及び蒸発源装置の制御方法
JP7444843B2 (ja) * 2021-12-02 2024-03-06 キヤノントッキ株式会社 蒸着用坩堝及び蒸着装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3508484B2 (ja) * 1997-07-14 2004-03-22 松下電器産業株式会社 機能性薄膜の形成方法及び形成装置
JP4688857B2 (ja) * 2000-10-26 2011-05-25 株式会社半導体エネルギー研究所 成膜装置および成膜方法
KR100711886B1 (ko) * 2005-08-31 2007-04-25 삼성에스디아이 주식회사 무기 증착원 및 이의 가열원 제어방법
CN202246836U (zh) * 2011-07-22 2012-05-30 上海奕瑞光电子科技有限公司 电阻加热式蒸发源
JP6223675B2 (ja) * 2012-11-29 2017-11-01 株式会社オプトラン 真空蒸着源及びそれを用いた真空蒸着方法

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Publication number Publication date
JP6436544B1 (ja) 2018-12-12
CN109385605B (zh) 2022-04-26
KR20190015993A (ko) 2019-02-15
CN109385605A (zh) 2019-02-26
JP2019031705A (ja) 2019-02-28

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