KR102047149B1 - 웨이퍼 형상의 물체의 표면을 처리하기 위한 프로세스 및 장치 - Google Patents

웨이퍼 형상의 물체의 표면을 처리하기 위한 프로세스 및 장치 Download PDF

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Publication number
KR102047149B1
KR102047149B1 KR1020147025387A KR20147025387A KR102047149B1 KR 102047149 B1 KR102047149 B1 KR 102047149B1 KR 1020147025387 A KR1020147025387 A KR 1020147025387A KR 20147025387 A KR20147025387 A KR 20147025387A KR 102047149 B1 KR102047149 B1 KR 102047149B1
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South Korea
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nozzles
liquid
array
wafer
nozzle
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Korean (ko)
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KR20140135978A (ko
Inventor
라이너 오브위거
마이클 브루거
프란츠 쿰니히
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램 리서치 아게
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid

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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020147025387A 2012-03-12 2013-02-28 웨이퍼 형상의 물체의 표면을 처리하기 위한 프로세스 및 장치 Active KR102047149B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/418,034 2012-03-12
US13/418,034 US20130233356A1 (en) 2012-03-12 2012-03-12 Process and apparatus for treating surfaces of wafer-shaped articles
PCT/IB2013/051603 WO2013136211A1 (en) 2012-03-12 2013-02-28 Process and apparatus for treating surfaces of wafer-shaped articles

Publications (2)

Publication Number Publication Date
KR20140135978A KR20140135978A (ko) 2014-11-27
KR102047149B1 true KR102047149B1 (ko) 2019-12-02

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KR1020147025387A Active KR102047149B1 (ko) 2012-03-12 2013-02-28 웨이퍼 형상의 물체의 표면을 처리하기 위한 프로세스 및 장치

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Country Link
US (1) US20130233356A1 (https=)
JP (1) JP6121458B2 (https=)
KR (1) KR102047149B1 (https=)
TW (1) TWI595591B (https=)
WO (1) WO2013136211A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6131162B2 (ja) 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9873940B2 (en) 2013-12-31 2018-01-23 Lam Research Corporation Coating system and method for coating interior fluid wetted surfaces of a component of a semiconductor substrate processing apparatus
DE102014016364A1 (de) * 2014-11-05 2016-05-12 Eisenmann Se Reinigungsverfahren und Reinigungsvorrichtung für ein oder mehrere Teile eines Applikationssystems
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7297664B2 (ja) * 2016-11-09 2023-06-26 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
JP7177069B2 (ja) 2017-01-27 2022-11-22 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 基板をプロセスチャンバ内で回転及び並進するためのシステム及び方法
JP7357625B2 (ja) 2018-02-19 2023-10-06 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 制御可能なビームサイズの処理噴霧を有する小型電子機器処理システム
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
DE102021121552A1 (de) * 2021-08-19 2023-02-23 Dürr Systems Ag Reinigungsgerät für eine Elektrodenanordnung eines Zerstäubers, zugehöriges Betriebsverfahren und entsprechende Elektrodenanordnung
JP7826078B2 (ja) * 2022-03-22 2026-03-09 キオクシア株式会社 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040100A1 (en) * 1998-02-12 2001-11-15 Hui Wang Plating apparatus and method
US20040020520A1 (en) * 2002-07-30 2004-02-05 Dong-Hyun Kim Apparatus for cleaning a wafer
US20040115567A1 (en) * 2002-12-16 2004-06-17 Mandal Robert P. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms

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JPH08261648A (ja) * 1995-03-28 1996-10-11 Hitachi Ltd 乾燥装置
JP3250090B2 (ja) * 1995-06-27 2002-01-28 東京エレクトロン株式会社 洗浄処理装置及び洗浄処理方法
JPH11165114A (ja) * 1997-12-05 1999-06-22 Dainippon Screen Mfg Co Ltd 枚葉式基板処理装置
US6688784B1 (en) * 2000-10-25 2004-02-10 Advanced Micro Devices, Inc. Parallel plate development with multiple holes in top plate for control of developer flow and pressure
TWI252791B (en) * 2002-01-18 2006-04-11 Promos Technologies Inc Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
JP2007251078A (ja) * 2006-03-20 2007-09-27 Nuflare Technology Inc 気相成長装置
KR101000944B1 (ko) * 2008-10-09 2010-12-13 세메스 주식회사 처리액 공급 유닛과 이를 이용한 기판 처리 장치 및 방법
JP2010103131A (ja) * 2008-10-21 2010-05-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US20100216373A1 (en) * 2009-02-25 2010-08-26 Araca, Inc. Method for cmp uniformity control
JP5391014B2 (ja) * 2009-09-28 2014-01-15 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040100A1 (en) * 1998-02-12 2001-11-15 Hui Wang Plating apparatus and method
US20040020520A1 (en) * 2002-07-30 2004-02-05 Dong-Hyun Kim Apparatus for cleaning a wafer
US20040115567A1 (en) * 2002-12-16 2004-06-17 Mandal Robert P. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms

Also Published As

Publication number Publication date
TW201401420A (zh) 2014-01-01
US20130233356A1 (en) 2013-09-12
WO2013136211A1 (en) 2013-09-19
JP2015516675A (ja) 2015-06-11
TWI595591B (zh) 2017-08-11
KR20140135978A (ko) 2014-11-27
JP6121458B2 (ja) 2017-04-26

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