KR102045725B1 - 고밀도 프린트헤드의 프린트헤드 구조체 제조에서 간극 에폭시 접착제 결합 방법 - Google Patents

고밀도 프린트헤드의 프린트헤드 구조체 제조에서 간극 에폭시 접착제 결합 방법 Download PDF

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Publication number
KR102045725B1
KR102045725B1 KR1020140049176A KR20140049176A KR102045725B1 KR 102045725 B1 KR102045725 B1 KR 102045725B1 KR 1020140049176 A KR1020140049176 A KR 1020140049176A KR 20140049176 A KR20140049176 A KR 20140049176A KR 102045725 B1 KR102045725 B1 KR 102045725B1
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South Korea
Prior art keywords
substrate
adhesive
epoxy adhesive
psi
temperature
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Expired - Fee Related
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KR1020140049176A
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English (en)
Korean (ko)
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KR20140134603A (ko
Inventor
카넌고 만다키니
자오 홍
쭤 옌치아
에스. 바데샤 산토크
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제록스 코포레이션
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14403—Structure thereof only for on-demand ink jet heads including a filter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/19—Assembling head units

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
KR1020140049176A 2013-05-14 2014-04-24 고밀도 프린트헤드의 프린트헤드 구조체 제조에서 간극 에폭시 접착제 결합 방법 Expired - Fee Related KR102045725B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/893,523 2013-05-14
US13/893,523 US9050807B2 (en) 2013-05-14 2013-05-14 Process for bonding interstitial epoxy adhesive for fabrication of printhead structures in high density printheads

Publications (2)

Publication Number Publication Date
KR20140134603A KR20140134603A (ko) 2014-11-24
KR102045725B1 true KR102045725B1 (ko) 2019-11-18

Family

ID=51875210

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140049176A Expired - Fee Related KR102045725B1 (ko) 2013-05-14 2014-04-24 고밀도 프린트헤드의 프린트헤드 구조체 제조에서 간극 에폭시 접착제 결합 방법

Country Status (4)

Country Link
US (1) US9050807B2 (enExample)
JP (1) JP6247589B2 (enExample)
KR (1) KR102045725B1 (enExample)
CN (1) CN104149507B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9623660B2 (en) 2013-05-14 2017-04-18 Xerox Corporation B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet
US9206341B2 (en) * 2014-04-15 2015-12-08 Xerox Corporation Solvent system enabling thin film deposition of epoxy adhesives for high density piezo printhead interstitial bonding
CN105015167B (zh) * 2014-04-29 2018-02-23 施乐公司 一种用于形成用于水性喷墨的喷墨打印头的方法
US9890306B2 (en) * 2014-05-28 2018-02-13 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
US10150898B2 (en) 2014-05-28 2018-12-11 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads
CN107856416B (zh) * 2016-09-21 2020-09-15 精工爱普生株式会社 液体喷射头、液体喷射装置以及液体喷射头的制造方法
CN108511596B (zh) * 2018-03-30 2020-10-02 同济大学 一种管道用压电纤维复合材料微驱动器及其制备方法
KR20220055073A (ko) 2020-10-26 2022-05-03 이현오 반지형 nfc

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6266872B1 (en) 1996-12-12 2001-07-31 Tessera, Inc. Method for making a connection component for a semiconductor chip package
JP2002254660A (ja) 2000-12-28 2002-09-11 Canon Inc インクジェットヘッドの製造方法およびその製造方法によるインクジェットヘッド
JP2004268397A (ja) 2003-03-07 2004-09-30 Seiko Epson Corp 液体噴射ヘッドの製造方法及び接合装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506371A (en) * 1983-05-05 1985-03-19 Cross Gregory L Underwater thermometer and method of making
JP2788155B2 (ja) * 1992-07-15 1998-08-20 株式会社クボタ 複合パネルの製造方法
JPH06134995A (ja) * 1992-08-27 1994-05-17 Rohm Co Ltd インクジェットヘッドの製造方法
JPH09123466A (ja) * 1995-11-07 1997-05-13 Tec Corp インクジェットプリンタヘッドの製造方法
JPH11179924A (ja) * 1997-12-19 1999-07-06 Canon Inc インクジェットヘッド及びその製造法
JP2001010071A (ja) * 1999-06-25 2001-01-16 Hitachi Koki Co Ltd インクジェットヘッドの製造方法
JP2001113696A (ja) * 1999-10-15 2001-04-24 Ricoh Co Ltd インクジェットヘッドおよびその製造方法
JP2003154666A (ja) * 2001-11-21 2003-05-27 Sharp Corp インク吐出装置の製造方法
JP4548169B2 (ja) * 2005-03-23 2010-09-22 ブラザー工業株式会社 インクジェットヘッドの製造方法
KR20090062012A (ko) * 2007-12-12 2009-06-17 삼성전자주식회사 잉크젯 헤드 및 그 제조방법
JP2011523383A (ja) * 2008-05-23 2011-08-11 富士フイルム株式会社 基板を接合する方法及び装置
JP2010005993A (ja) * 2008-06-30 2010-01-14 Fujifilm Corp 基板接合方法、基板接合体、インクジェットヘッド、及び画像形成装置
JP2011224785A (ja) * 2010-04-15 2011-11-10 Seiko Epson Corp 液体噴射ヘッドの製造方法
JP5599680B2 (ja) * 2010-08-27 2014-10-01 富士フイルム株式会社 導電接合構造、実装構造体及び導電接合方法
JP5849552B2 (ja) * 2011-05-20 2016-01-27 株式会社リコー インクジェットヘッド及びその製造方法、並びに画像形成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6266872B1 (en) 1996-12-12 2001-07-31 Tessera, Inc. Method for making a connection component for a semiconductor chip package
JP2002254660A (ja) 2000-12-28 2002-09-11 Canon Inc インクジェットヘッドの製造方法およびその製造方法によるインクジェットヘッド
JP2004268397A (ja) 2003-03-07 2004-09-30 Seiko Epson Corp 液体噴射ヘッドの製造方法及び接合装置

Also Published As

Publication number Publication date
CN104149507A (zh) 2014-11-19
KR20140134603A (ko) 2014-11-24
JP2014223802A (ja) 2014-12-04
US20140338833A1 (en) 2014-11-20
CN104149507B (zh) 2017-06-13
JP6247589B2 (ja) 2017-12-13
US9050807B2 (en) 2015-06-09

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