KR102042774B1 - Substrate polishing appartus - Google Patents

Abstract

A substrate polishing apparatus is disclosed. The substrate polishing apparatus includes a substrate transfer part for continuously transferring a plurality of substrates with a to-be-polished surface facing upwards, a polishing module provided on an upper portion of the substrate transfer part, and having a polishing pad for polishing the substrate; It is provided in the lower portion of the substrate transfer portion, and comprises a substrate support for supporting the substrate on the rear surface of the substrate with the substrate transfer portion therebetween.

Description

Substrate Polishing Device {SUBSTRATE POLISHING APPARTUS}

The following embodiment relates to a substrate polishing apparatus including a substrate transfer unit for continuously transferring a substrate.

In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) operations including polishing, buffing and cleaning are required. The semiconductor device has a multilayer structure, and a transistor device having a diffusion region is formed in the substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming the functional elements. As is known, the patterned conductive layer is insulated from other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers is substantially more difficult due to the large variations in surface morphology. In addition, the metal line pattern is formed of an insulating material, the excess metal material is removed through a substrate polishing operation.

Conventional substrate polishing apparatus is a component for polishing, buffing and cleaning one or both surfaces of a substrate, and includes a mechanical polishing member including a belt, a polishing pad or a brush, and promotes polishing by chemical components in a slurry solution. And strengthen.

On the other hand, in general, the substrate polishing apparatus rotates in the same direction while supplying a slurry containing abrasive particles between the polishing pad attached to the polishing platen and the substrate mounted on the carrier head, thereby rotating between the polishing pad and the substrate. The surface of the substrate is flattened and polished by the relative rotational speed of.

The area of the substrate is gradually becoming a large area. In order to match the polishing uniformity during the polishing of the large area substrate, the substrate carrier is divided into several areas and a flexible film is provided to control the amount of polishing by applying different pressures to each area. The method is known. However, even if the substrate carrier is divided in this way, there is a limit in maintaining and controlling the polishing uniformity of the substrate constantly. Therefore, a new polishing amount control is required.

On the other hand, as the size of the substrate becomes larger, it is difficult to load and unload the substrate into the substrate polishing apparatus and the substrate carrier, which may result in a lag time resulting in lower throughput.

According to embodiments, it is easy to transfer and load / unload a substrate, and to provide a substrate polishing apparatus for continuously transferring a plurality of substrates.

Problems to be solved in the embodiments are not limited to the above-mentioned problems, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

According to embodiments for achieving the above-described problem, the substrate is provided with a belt or conveyor form, and as the substrate is polished while continuously transferring a plurality of substrates, the transfer and loading / unloading of the substrate is It is easy and polishing is easy.

In addition, the polishing of the substrate is performed while the polishing module having the polishing pad having an area smaller than the area of the substrate moves linearly and orbitally with respect to the surface of the substrate.

As seen above, according to the embodiments, since the plurality of substrates are continuously transferred in a belt or conveyor manner, the transfer and loading / unloading of the substrates are simple and efficient.

In addition, since the polishing pad having an area smaller than that of the substrate, the polishing pad can be easily manufactured and replaced.

The following drawings attached to this specification are illustrative of the preferred embodiment of the present invention, and together with the detailed description of the present invention serves to further understand the technical spirit of the present invention, the present invention is only to those described in such drawings It should not be construed as limited.
1 is a perspective view of a substrate polishing apparatus according to an embodiment.
FIG. 2 is a side view illustrating a part of a surrounding of a polishing module in the substrate polishing apparatus of FIG. 1.
3 is a perspective view of a substrate carrier according to one embodiment.
4A to 4C are plan views illustrating an operation of a polishing module according to an embodiment.
5 is a perspective view of a substrate support according to an embodiment.
6 is a plan view illustrating an operation of a substrate supporter according to an exemplary embodiment.
7 is a side view illustrating a substrate supporter according to another exemplary embodiment.
8 is a side view illustrating a substrate supporter according to another exemplary embodiment.
9 is a perspective view of a substrate polishing apparatus for explaining a substrate transfer unit according to another exemplary embodiment.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. In adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible even if they are shown in different drawings. In addition, in describing the embodiment, when it is determined that the detailed description of the related well-known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms. If a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected or connected to that other component, but between components It will be understood that may be "connected", "coupled" or "connected".

Hereinafter, the substrate polishing apparatus 10 according to the embodiments will be described with reference to FIGS. 1 to 9.

For reference, FIG. 1 is a perspective view of a substrate polishing apparatus 10 according to an exemplary embodiment, and FIG. 2 is a side view illustrating a portion of the substrate polishing apparatus 10 in the substrate polishing apparatus 10 of FIG. 1.

1 and 2, the substrate polishing apparatus 10 includes a substrate carrier 11 on which the substrate 1 is seated, a polishing module 12 having a polishing pad 121, and a substrate carrier 11. The board | substrate conveyance part 13 which conveys and the board | substrate support part 14 which support the board | substrate 1 are comprised.

The substrate 1 may be a transparent substrate including glass for a flat panel display device (FPD), such as a liquid crystal display (LCD) and a plasma display panel (PDP). However, the substrate 1 is not limited thereto, and may be, for example, a silicon wafer for manufacturing a semiconductor device. In addition, in the drawings, the substrate 1 is illustrated as having a rectangular shape, but this is only an example, and the shape and size of the substrate 1 are not limited by the drawings.

The substrate carrier 11 is formed such that one substrate 1 is seated, and the substrate 1 is seated so that the surface to be polished of the substrate 1 faces upward. For example, the substrate carrier 11 has a rectangular shape having a size larger than that of the substrate 1. Here, the size and thickness of the substrate carrier 11 is only one example, the shape and size of the substrate carrier 11 is not limited by the drawings.

The polishing module 12 is provided with a polishing pad 121 for polishing the substrate 1 on the lower surface of the polishing module 12. The polishing module 12 has a bar or square shape having a predetermined length and width. For example, the polishing module 12 may have a quadrangular shape corresponding to the length and / or width of the substrate 1. However, this is only an example, and the shape and size of the polishing module 12 are not limited by the drawings and may have various shapes and sizes. For example, the polishing module 12 may be formed in a size smaller than the substrate 1 in the y-axis direction, and may be formed in a size smaller than the substrate 1 in the x-axis direction. In addition, the polishing module 12 is not limited to a quadrangle, and may be formed in a circular or elliptical shape. Of course, even in this case, the polishing module 12 may be formed to have a smaller size than the substrate 1.

According to one embodiment, since the polishing module 12 and the polishing pad 121 are smaller in size than the substrate 1, the polishing pad 121 may be easily manufactured and replaced. In addition, the time required for maintenance / management for the replacement of the polishing pad 121 is less, and thus the process time can be shortened. In addition, even when the polishing module 12 and the polishing pad 121 are larger than the substrate 1, the substrate 1 may be uniformly polished and the polishing time may be shortened.

The substrate transfer part 13 is formed to transfer the plurality of substrates 1 simultaneously and continuously. The substrate transfer part 13 has a belt or conveyor form, for example. In addition, the substrate transfer unit 13 has a horizontal transfer section for transferring the substrate carrier 11 horizontally with respect to the polishing module 12 so as to be in contact with the polishing module 12 in a horizontal direction, when viewed from the side It may have an elliptic orbit. And as the board | substrate conveyance part 13 rotates continuously along an elliptical track | orbit, the some board | substrate carrier 11 is conveyed continuously. Here, reference numerals 131 and 132 denote a pair of driving rollers 131 and 132 for driving the substrate transfer part 13.

At least one substrate transfer part 13 is preferably formed to have a size such that a plurality of substrate carriers 11 are sequentially loaded and continuously transferred. As an example, as shown in FIG. 1, three substrate carriers 11 may be mounted on the substrate transfer part 13. However, this is merely an example, and the size of the substrate carrier 11 is not limited by the drawings and may be changed in various ways.

According to the embodiment, since the substrate transfer portion 13 has a belt or conveyor form, loading and unloading the substrate 1 onto the substrate transfer portion 13 is simple and efficient. In addition, throughput can be improved by shortening the lag time generated due to the loading / unloading of the substrate 1.

The substrate support part 14 is provided below the substrate transfer part 13, and is provided to support the substrate support part 13 from the rear surface of the substrate carrier 11 with the substrate transfer part 13 therebetween. In the drawing, reference numeral 140 denotes a driver 140 that supports and drives the substrate support 14.

The upper side of the substrate transfer unit 13 is provided with a slurry supply unit 15 for supplying a slurry to the substrate (1). The slurry supply part 15 is provided in front of the polishing module 12 along the moving direction of the substrate 1. For example, the slurry supply part 15 may be a slit nozzle having a length corresponding to the width direction of the substrate 1. However, this is merely an example, and the slurry supply unit 15 may have substantially various shapes capable of supplying the slurry to the substrate 1, and the position thereof may also be changed in various ways.

3 is a perspective view of the substrate carrier 11 according to one embodiment.

Referring to FIG. 3, the substrate carrier 11 may have a guide 110 on which a substrate 1 is seated. For example, the guide 110 may have a groove having a size corresponding to the substrate 1.

However, this is merely an example, and the structure of holding or fixing the substrate 1 in the substrate carrier 11 may be substantially changed. For example, the substrate carrier 11 may have an adsorption structure that grips the substrate by providing a vacuum or suction force to the substrate 1. Here, the substrate carrier 11 may have a structure in which a suction structure is formed in the groove of the guide 110 or a hole is formed in the sidewall surface 112 of the groove to provide suction force to the substrate 1. . Alternatively, the substrate carrier 11 has a structure in which a frictional force is generated on the bottom surface 111 of the guide 110 so that the substrate 1 does not slip, or the substrate carrier 11 is formed on the bottom surface 111 of the guide 110. A separate adsorption pad may be provided to prevent slippage. Alternatively, the substrate carrier 11 may have a protruding structure that supports at least a part of the edge of the substrate 1. Here, the substrate carrier 11 may have a configuration in which two or more of the above structures are combined, or may have various forms in which the substrate 1 is held in addition to the above-described structures.

4A to 4C are plan views illustrating the operation of the polishing module 12 according to an embodiment.

Referring to the drawings, the polishing module 12 is a reciprocating linear movement in one or both directions of the x-axis or y-axis direction on the surface of the substrate 1, or orbital motion parallel to the surface of the substrate 1 ) Or any two or more operations may be mixed and driven. Here, the orbital rotation of the polishing module 12 may be a circular orbital rotation or an elliptic orbital rotation. In the figure, a part of the trajectory in which the polishing module 12 moves is illustrated by a dotted line.

For example, as shown in FIG. 4A, the polishing module 12 is reciprocally linearly moved along the x-axis and / or y-axis at the surface of the substrate 1. When the polishing module 12 is linearly moved as described above, the polishing module 12 is polished while moving reciprocally with respect to the front surface of the substrate 1, so that the linear movement of the polishing module 12 appears in a zigzag form with respect to the surface of the substrate 1 as a result. do.

Alternatively, as shown in FIG. 4B, the polishing module 12 operates to rotate along a circular orbit, i.e., yaw rotation or rotation, about a rotation axis in the z-axis direction passing through the center of the substrate 1. can do. In addition, the polishing module 12 operates to reciprocate in a range within a predetermined angle in both directions about the rotation axis. Alternatively, the polishing module 12 may be operated to rotate 360 ° in one direction or ± 360 ° in both directions.

Alternatively, as illustrated in FIG. 4C, the polishing module 12 may operate to perform a circular orbital rotation about an axis of rotation in the z-axis direction or a rotation along an elliptic orbit having a predetermined long and short diameters. In this case, by continuously rotating in one direction or in both directions along the circular or elliptic orbit of the polishing module 12, a region within a predetermined range can be polished at the corresponding position of the polishing module 12. That is, the polishing module 12 oscillates at a predetermined speed along a circular or elliptic orbit on the surface of the substrate 1. Here, the rotational speed of the polishing module 12 may be changed in various ways.

4A to 4C are merely examples, and the operation of the polishing module 12 may be changed in various ways. In addition, the polishing module 12 may polish the substrate 1 by simultaneously moving linearly while yaw rotation or circular orbit rotation or elliptical orbit rotation.

Hereinafter, the configuration and operation of the substrate support 14 will be described with reference to FIGS. 5 to 8.

5 is a perspective view of the substrate support 14 according to one embodiment.

Referring to FIG. 5, the substrate support 14 is formed by the interior of the housing 141 divided into a plurality of regions to form a pressure chamber 143, and different pressures are applied to the pressure chamber 143 to thereby provide a substrate 1. Polishing uniformity of can be controlled. An open upper surface of the housing 141 is provided with a membrane 142 of a flexible material to transfer the pressure inside the pressure chamber 143 to the substrate 1. In addition, the membrane 142 may be provided with a plurality of holes (not shown) for transmitting air pressure in the pressure chamber 143.

In the substrate support 14, a plurality of pressure chambers 143 may be partitioned along a width direction or a length direction of the substrate. For example, the substrate support 14 may be formed in parallel with the pressure chamber 143 along the width direction (y-axis direction) of the substrate 1. In addition, the pressure chamber 143 may be formed in the same size or different sizes. However, this is only an example, and the substrate support 14 and the pressure chamber 143 may have various shapes that can support the substrate 1, and the number of the pressure chambers 143 may vary substantially. can be changed.

6 is a plan view illustrating an operation of the substrate support 14 according to an embodiment, FIG. 7 is a side view illustrating the substrate support 14 according to another embodiment, and FIG. 8 according to another embodiment. It is a side view for demonstrating the board | substrate support part 14.

The board | substrate support part 14 is provided so that the board | substrate 1 and the board | substrate conveyance part 13 can move up and down. In addition, the substrate support 14 may be provided at a fixed position relative to the polishing module 12, or may be provided to be movable along the movement of the substrate 1.

Referring to FIG. 6, the substrate support part 14 may be provided to reciprocally linearly move within a range of a predetermined distance in the x-axis or y-axis direction with respect to the substrate 1.

Alternatively, referring to FIG. 7, the substrate support 14 is provided to move along the moving direction of the substrate 1. Here, the substrate support 14 may be a substrate 1 between a first position where the substrate carrier 11 is mounted on the substrate transfer portion 13 and a second position where the substrate carrier 11 is separated from the substrate transfer portion 13. Move along, and reciprocate between the first and second positions.

In addition, the substrate support 14 may be formed to have a size corresponding to the substrate carrier 11 or smaller than the substrate carrier 11. In addition, one substrate support 14 may be provided, or a plurality of substrate support units 14 may be provided.

For example, one substrate support 14 is provided with a size corresponding to the substrate carrier 11, and supports one substrate carrier 11. Alternatively, the substrate support 14 may have a size corresponding to that of the substrate carrier 11, and a plurality of substrate supports 14 may be disposed at predetermined intervals along the transport direction of the substrate 1.

Alternatively, the substrate support 14 may be formed to have a smaller size than the substrate carrier 11, and thus a plurality of substrate support units 14 may be provided at positions corresponding to the polishing module 12. For example, as illustrated in FIG. 8, a plurality of substrates 410, 420, and 430 may be provided to support the outside and the center of the substrate carrier 11. However, this is only an example, and the size and arrangement of the substrate support 14 are not limited by the drawings.

9 is a perspective view of a substrate polishing apparatus 10 for explaining a substrate transfer unit according to another embodiment.

Referring to FIG. 9, in the substrate polishing apparatus 10, the substrate carrier 11 may be omitted, and the substrate 1 may be directly seated on the substrate transfer part 13. A mounting portion 310 on which the substrate 1 is mounted may be formed on a surface of the substrate transfer part 13. For example, the substrate transfer part 13 may be provided with a structure or a separate friction pad (or sheet) that generates friction force so that the substrate 1 does not slip on the surface of the substrate transfer part 13. Alternatively, a groove having a size and a depth corresponding to the substrate 1 may be formed on the surface of the substrate transfer part 13 to insert the substrate 1. Alternatively, the substrate transfer part 13 may have a protruding structure for supporting at least a part of the edge of the substrate 1. but. This is merely an example, and the substrate transfer part 13 may have a configuration in which one or a plurality of structures are combined, or may have various shapes in which the substrate 1 is seated and fixed.

Although the above embodiments have been described with reference to the limited embodiments and the drawings, those skilled in the art may make various modifications and variations from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different form than the described method, or other components. Or even if replaced or substituted by equivalents, an appropriate result can be achieved.

Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims that follow.

1: substrate
10: substrate polishing apparatus
11: substrate carrier
110: seating part
111: bottom
112: side wall surface
12: polishing module
121: polishing pad
13: substrate transfer part
131, 132: drive roller
14: substrate support
140: driving portion of the substrate support
141: housing
142: membrane
143: pressure chamber
15: slurry supply

Claims (27)

A substrate transfer part having a belt or conveyor shape so as to continuously transfer a plurality of substrates with a to-be-polished surface facing upwards;
It is provided on the substrate transfer portion, the lower surface facing the substrate is provided with a polishing pad for polishing the substrate, the shape of the lower surface (bar) or square shape corresponding to the length or width of the substrate A polishing module having a size smaller than that of the substrate; And
A substrate support part provided below the substrate transfer part and supporting the substrate on a rear surface of the substrate with the substrate transfer part therebetween;
Including,
The polishing module reciprocates linearly in the x- and y-axis directions to move zigzag on the surface of the substrate, and rotates or ellipses parallel to the surface of the substrate to oscillate along a circular or elliptic orbit. A substrate polishing apparatus in which any one or two motions of an orbital motion including an orbital rotation are mixed and driven.
delete delete delete The method of claim 1,
And a seating portion on which the substrate is mounted is formed on a surface of the substrate transfer portion.
The method of claim 5,
The seating unit may include a structure in which any one or two or more of a structure in which a frictional force is generated to prevent the substrate from slipping on the surface of the substrate transfer unit, a groove into which the substrate is inserted, and a protrusion structure supporting at least a portion of the edge of the substrate is combined. Having a substrate polishing apparatus formed.
The method of claim 1,
Further provided is a substrate carrier on which the substrate is seated,
The substrate carrier is formed so that a single substrate is seated and the substrate polishing apparatus is formed as a separate object from the substrate transfer portion.
The method of claim 7, wherein
The substrate carrier is formed with a guide on which the substrate is seated,
The guide may support at least a portion of an adsorption structure for providing a vacuum or suction force to the substrate to hold the substrate, a friction force to prevent the substrate from slipping, a groove formed on the surface of the substrate carrier, and an edge of the substrate. A substrate polishing apparatus formed having a configuration in which any one or two or more of the protruding structures are combined.
The method of claim 1,
And the substrate support part is provided to reciprocate linearly move in an x-axis or y-axis direction along a moving direction of the substrate.
The method of claim 1,
And the substrate support portion is provided to reciprocate in the vertical direction with respect to the substrate.
The method of claim 1,
And the substrate support part is fixed to a position corresponding to the polishing module.
The method of claim 1,
The substrate support is provided to be movable along the movement of the substrate,
And the substrate is reciprocated between a first position at which the substrate is mounted on the substrate transfer portion and a second position at which the substrate is separated from the substrate transfer portion.
The method of claim 1,
Substrate polishing apparatus is provided with one or a plurality of substrate support.
The method of claim 7, wherein
And the substrate support part is divided into a plurality of regions, and different pressures are applied to the plurality of regions.
The method of claim 14,
The substrate support portion,
A housing having a shape in which a plurality of pressure chambers are formed in the interior to form a plurality of pressure chambers, and an upper surface of which is open toward the substrate carrier; And
A flexible membrane provided on an upper surface of the housing;
Substrate polishing apparatus comprising a.
The method of claim 15,
And the plurality of pressure chambers are partitioned along the width direction of the substrate, and different pressures are applied along the width direction of the substrate.
The method of claim 1,
An upper portion of the substrate transfer unit is provided with a slurry supply unit for supplying a slurry for polishing on the substrate,
And the slurry supply part is provided in front of the polishing module along a transfer direction of the substrate.
A plurality of substrate carriers on which one substrate is seated and seated such that the surface to be polished of the substrate faces upward;
A substrate transfer part on which the substrate carrier is seated, and having a belt or a conveyor to continuously transfer a plurality of substrates;
It is provided on the substrate transfer portion, the lower surface facing the substrate is provided with a polishing pad for polishing the substrate, the shape of the lower surface (bar) or square shape corresponding to the length or width of the substrate A polishing module having a size smaller than that of the substrate; And
It is provided at a position corresponding to the polishing module in the lower portion of the substrate transfer portion, and supports the substrate on the back surface of the substrate with the substrate transfer portion therebetween, provided in a fixed position or along the direction of movement of the substrate or x-axis or a substrate support provided to reciprocate linearly move in the y-axis direction;
Including,
The polishing module includes a reciprocating linear movement in the x-axis and y-axis directions to move zigzag on the surface of the substrate, and rotation of a circular orbit parallel to the surface of the substrate to oscillate along a circular or elliptic orbit. An orbital motion comprising an elliptic orbit rotation, or a substrate polishing apparatus in which one or two motions are mixed and driven.
delete The method of claim 18,
The substrate carrier is formed with a guide on which the substrate is seated,
The guide may support at least a portion of an adsorption structure for providing a vacuum or suction force to the substrate to hold the substrate, a friction force to prevent the substrate from slipping, a groove formed on the surface of the substrate carrier, and an edge of the substrate. A substrate polishing apparatus formed having a configuration in which any one or two or more of the protruding structures are combined.
delete The method of claim 18,
And the substrate transfer part has a structure in which any one or two or more of a structure in which a frictional force is generated to prevent the substrate carrier from slipping on a surface thereof, and a structure in which a suction force is provided to the substrate carrier and held therein are combined.
delete The method of claim 18,
And the substrate support portion is provided to reciprocate in the vertical direction with respect to the substrate.
delete The method of claim 18,
Substrate polishing apparatus is provided with one or a plurality of substrate support.
The method of claim 18,
And the substrate support part is divided into a plurality of regions, and different pressures are applied to the plurality of regions.

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