KR102529415B1 - Polishing module and substrate polishing apparatus having the same - Google Patents

Abstract

A substrate polishing apparatus for supplying a slurry to a substrate through a polishing module is disclosed. A substrate polishing apparatus includes a polishing pad provided on a substrate and contacting the substrate to polish the substrate, a base member provided with the polishing pad on a lower side, a drive shaft provided on top of the base member, and a drive shaft provided on the drive shaft to perform the polishing. It is configured to include a fluid supply unit for supplying fluid to pressurize the polishing pad through a drive shaft, and a slurry supply unit for supplying slurry to a surface to be polished of the substrate through a flow path separate from the fluid supply unit in the drive shaft.

Description

Polishing module and substrate polishing apparatus having the same {POLISHING MODULE AND SUBSTRATE POLISHING APPARATUS HAVING THE SAME}

The following embodiments relate to a polishing module and a substrate polishing apparatus having the polishing module.

In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) operations including polishing, buffing, and cleaning are required. The semiconductor element is in the form of a multilayer structure, and a transistor element having a diffusion region is formed in a substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to transistor elements forming functional elements. As is known, the patterned conductive layer is insulated from other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the fabrication of additional metal layers becomes substantially more difficult because of the large variation in surface morphology. In addition, the metal line pattern is formed of an insulating material, and excess metal is removed through a substrate polishing operation.

A conventional substrate polishing device is a component for polishing, buffing, and cleaning one or both sides of a substrate, and includes a mechanical polishing member including a belt, polishing pad, or brush, and promotes polishing by chemical components in a slurry solution and strengthened.

On the other hand, in general, a substrate polishing apparatus supplies a slurry containing abrasive particles between a polishing pad attached to a polishing platen and a substrate mounted on a carrier head, and rotates the slurry in the same direction to move the surface between the polishing pad and the substrate. By the relative rotational speed of the substrate surface is flattened and polishing is performed.

The area of the substrate is gradually becoming larger, and in order to match the polishing uniformity during polishing of the large-area substrate, the substrate carrier is divided into several areas and a flexible film is provided to control the amount of polishing by applying different pressures to each area. method is known. However, even if the substrate carrier is divided in this way, there is a limit to constantly maintaining and controlling the uniformity of polishing of the substrate, so a new method of controlling the amount of polishing is required.

On the other hand, as the size of the substrate increases, it is difficult to load and unload the substrate to and from the substrate polishing apparatus and the substrate carrier, which may cause a lag time and lower throughput.

Also, when polishing the substrate, a slurry for polishing the substrate is supplied to the surface to be polished of the substrate. A conventional substrate polishing apparatus polishes a substrate as the polishing module rotates while pressurizing the substrate. In the case of a fluid port for pressurization provided in the conventional polishing module, a port for supplying slurry and a port for supplying air are integrally formed. Since it is formed, there is a problem in that the entire port must be replaced when damage occurs in one port.

In particular, in the case of a port for supplying slurry, since internal corrosion or clogging occurs due to the nature of the slurry, it is necessary to regularly replace the slurry supply part, and in this case, there is a problem of productivity degradation due to the shutdown of the device. Therefore, there is a need for a polishing device to solve the problem of replacing the slurry supply unit.

According to embodiments, a fluid port for pressurization and a slurry supply unit for slurry injection are independently connected, and an apparatus for polishing a substrate in which replacement of the slurry supply unit is easy is provided.

The tasks to be solved in the embodiments are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

According to embodiments for achieving the above object to be solved, the polishing module of the substrate polishing apparatus includes a polishing pad provided above a substrate and in contact with the substrate to polish the substrate, and a base provided with the polishing pad on the lower side. member, a drive shaft provided on the upper part of the base member, a fluid supply unit provided on the drive shaft and supplying fluid for pressurizing the polishing pad through the drive shaft, and a flow path separate from the fluid supply unit from the drive shaft to the substrate. It is configured to include a slurry supply unit for supplying slurry to the polishing surface.

On the other hand, according to embodiments for achieving the above object to be solved, a substrate polishing apparatus includes a substrate transfer unit for transferring a substrate, and a polishing pad provided with a polishing pad for polishing the substrate by contacting the polishing surface of the substrate on the lower side. module, a slurry supply unit provided on the drive shaft of the polishing module and supplying slurry to the polishing pad and the surface to be polished of the substrate through the drive shaft, and rotating the drive shaft to move the polishing module into a circle parallel to the substrate or It is composed of a driving unit that oscillates and rotates along an elliptical trajectory.

As described above, according to embodiments, the substrate is polished while the rectangular polishing pad rotates, and slurry is provided to the polishing pad and the surface to be polished of the substrate through the polishing module.

In addition, a fluid supply unit for pressurizing the polishing pad and a slurry supply unit for supplying slurry are independently connected, and the slurry supply unit can be easily replaced.

Effects of the polishing module and the substrate polishing apparatus having the polishing module according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

The following drawings attached to this specification illustrate a preferred embodiment of the present invention, and together with the detailed description of the present invention serve to further understand the technical idea of the present invention, the present invention is limited to those described in the drawings. It should not be construed as limiting.
1 is a perspective view of a substrate polishing apparatus according to an embodiment.
FIG. 2 is a cross-sectional view of the substrate polishing apparatus taken along line II-II in FIG. 1 .
Figure 3 is a partial enlarged cross-sectional view of the supply shaft and the fluid supply pipe body portion in FIG.
4 is a perspective view of a fluid supply pipe body in a polishing module according to an embodiment.
5 is a plan view of a distribution plate in a polishing module according to an embodiment.
6 is a plan view illustrating an operation of a polishing module according to an exemplary embodiment.
7 is a perspective view illustrating a main part of a driving unit of a polishing module according to an exemplary embodiment.

Hereinafter, embodiments will be described in detail through exemplary drawings. In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the embodiment, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment, the detailed description will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used in describing the components of the embodiment. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Hereinafter, a substrate polishing apparatus 10 according to embodiments will be described with reference to FIGS. 1 to 7 . For reference, FIG. 1 is a perspective view showing a part of a substrate polishing apparatus 10 according to an embodiment, and FIG. 2 is a cross-sectional view of the substrate polishing apparatus 10 taken along line II-II in FIG. 1 . 3 is a cross-sectional view showing an enlarged portion of the supply shaft 123a and the fluid supply pipe 124 in FIG. 2, and FIG. 4 is a perspective view of the fluid supply pipe 124 in the polishing module 12 according to an embodiment. . 5 is plan views of the distribution plate 220 in the polishing module 12 according to an embodiment. 6 is a plan view for explaining the operation of the polishing module 12 according to an embodiment, and FIG. 7 is a perspective view for explaining the configuration and operation of the driving unit 128 in the polishing module 12 according to an embodiment. am.

Referring to the drawings, a substrate polishing apparatus 10 includes a substrate transfer unit 11 for transferring a substrate 1 and a polishing module 12 having a polishing pad 121 for polishing the substrate 1. do.

The substrate 1 may be a transparent substrate including glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP). However, the substrate 1 is not limited thereto, and may be, for example, a silicon wafer for manufacturing a semiconductor device. In addition, although the substrate 1 is illustrated as having a rectangular shape in the drawings, this is only an example, and the shape and size of the substrate 1 are not limited by the drawings.

The substrate transfer unit 11 is formed to simultaneously and continuously transfer a plurality of substrates 1 . For example, the substrate transfer unit 11 has a belt or conveyor shape. The substrate transfer unit 11 may be formed to sequentially transfer at least one or more, preferably, a plurality of substrates 1 . However, this is only an example, and the size and shape of the substrate transfer unit 11 may be substantially changed in various ways without being limited by the drawings.

The polishing module 12 includes a base member 122 having a polishing pad 121 and a drive shaft 123 . And it is configured to include a slurry supply unit 126 for supplying slurry to the polishing pad 121 through the polishing module 12 and a fluid supply unit 127 for supplying a fluid for pressurizing the polishing module 12 .

The base member 122 has a flow path S1 for supplying slurry therein, and a plurality of distribution holes 221, 222, 223, see FIG. 4 to supply the slurry to the polishing pad 121 on the lower surface. The formed distribution plate 220 is provided.

For example, the base member 122 has a box shape in which a lower surface has a square or rectangular shape and a space or flow path S1 for supplying slurry is formed therein.

The distribution plate 220 forms the lower surface of the base member 122 and uniformly distributes the slurry supplied through the base member 122 to the polishing pad 121 . In addition, the distribution plate 220 serves as a plate to which the polishing pad 121 is attached. For example, referring to FIG. 5, the distribution plate 220 has a predetermined plate shape, and a plurality of spray holes 221, 222, and 223 are arranged in a row or a plurality of rows, or arranged in a zigzag form. placed in various forms. However, the arrangement and shape of the spray holes 221, 222, and 223 of the distribution plate 220 are not limited by the drawings.

The polishing pad 121 is provided on the lower side of the base member 122 facing the substrate 1 . The polishing pad 121 has a bar or rectangular shape having a predetermined length and width. In addition, the polishing pad 121 may have a rectangular shape corresponding to the length and/or width of the substrate 1 .

However, this is only an example, and the shape and size of the polishing pad 121 are not limited by the drawings and may have substantially various shapes and sizes. For example, the polishing pad 121 is not limited to a rectangular or square shape, and may be formed in a circular or elliptical shape. Alternatively, the polishing pad 121 may be formed of a plurality of sheets instead of one sheet.

According to an embodiment, since the size of the polishing pad 121 is smaller than that of the substrate 1, manufacturing and replacement of the polishing pad 121 are easy. In addition, the time required for maintenance/management for replacement of the polishing pad 121 is reduced, and thus the process time can also be shortened. In addition, even when the polishing module 12 and the polishing pad 121 are formed to be larger than the substrate 1, the substrate 1 can be uniformly polished and the polishing time can be shortened.

One or a plurality of driving shafts 123 are provided. In this embodiment, since the length of the polishing module 12 is relatively long, a plurality of drive shafts 123 are provided. In addition, among the plurality of drive shafts 123, a drive shaft (hereinafter referred to as 'supply shaft 123a') having a slurry tube 233 for supplying slurry to the polishing pad 121 and a drive unit 128 are connected to the polishing module (12) will be described separately as a drive shaft (hereinafter, referred to as a 'rotation shaft 123b') serving as a rotation shaft for rotating.

The supply shaft 123a may be located at the center of the polishing module 12, and the rotation shaft 123b may be disposed around the supply shaft 123a. However, this is only an example, and it is also possible that the rotation shaft 123b is provided at the center of the polishing module 12 and the supply shaft 123a is provided around the rotation shaft 123b. In addition, the position and number of the supply shaft 123a and the rotation shaft 123b may be variously changed.

Here, in this embodiment, three drive shafts 123 are formed in the polishing module 12, but this is only an example, and the number of drive shafts 123 may be substantially changed in various ways. In addition, although one or a part of the drive shaft 123 is a supply shaft 123a in which the slurry tube 233 is formed and the rest is a rotation shaft 123b, the slurry tube 233 is formed on all drive shafts 123 Thus, it is also possible to serve as both the supply shaft 123a and the rotation shaft 123b.

The supply shaft 123a passes through the center of the shaft body 231 and a slurry tube 233 passing through the supply shaft 123a in the longitudinal direction is formed. The slurry pipe 233 is a flow path for supplying the polishing pad 121 with slurry introduced through a slurry supply unit 126 described later. The slurry pipe 233 is formed to communicate from the upper end to the lower end of the supply shaft 123a, and the lower end communicates with the slurry supply passage S1 formed inside the base member 122.

In this embodiment, the fluid supplied through the fluid supply pipe 124 pressurizes the polishing module 12 and supplies the slurry through the slurry pipe 233. In addition, the slurry pipe 233 and the fluid supply pipe body 124 are formed independently of each other.

The slurry supply unit 160 is interchangeably connected to the polishing head and may supply the slurry to the polishing pad 121 . The slurry supply unit 160 may receive the slurry from the outside and deliver the slurry to the base member 122 to provide the slurry to a portion of the substrate to be polished by the polishing pad 121 . The slurry flows between the substrate and the polishing pad 121, polishing the substrate through mechanical friction caused by the slurry particles and the surface protrusions of the pad, and at the same time polishing the substrate surface through a chemical reaction by the composition constituting the slurry can do. The type of slurry supplied through the slurry supply unit 160 may vary depending on the type and characteristics of the substrate to be polished, but is not limited thereto.

The slurry supply unit 160 may be connected to an upper side of the polishing head. For example, the slurry supply unit 160 may be connected to the driving shaft 123 to supply the slurry to the base member 122 through the slurry pipe 233 .

According to this structure, the slurry supply unit 160 may be connected to the polishing head so as not to interfere with the connection portion of the fluid supply port 125 to the polishing head. Since the slurry supply unit 160 is interchangeably connected to the polishing head, for example, the drive shaft 123, only the slurry supply unit 160 can be separated independently without a separation process of the fluid supply port 125 for the polishing head. can

In general, in the case of the slurry supply unit 160, due to the nature of the slurry, the inside of the slurry supply unit 160 is corroded, causing a leak phenomenon in which the slurry leaks and clogging in which the pipe is clogged with the slurry. So, it needs to be replaced on a regular basis. Since the substrate polishing apparatus 1 according to an embodiment has a structure in which the slurry supply unit 160 and the fluid supply port 125 are independently separated from each other, the slurry supply unit 160 can be removed without separating the fluid supply port 125. ) can be simply replaced or repaired. Due to this, the time required for repairing the device is reduced, and productivity between substrate polishing processes can be improved.

A fluid supply pipe 124 is coupled to the outside of the supply shaft 123a, and a fluid supply port 125 and a fluid supply unit 127 are coupled to the fluid supply pipe 124. Here, the fluid may include de-ionized water or air.

Referring to FIG. 4 , the fluid supply pipe body 124 is provided to supply fluid independently of the slurry supply unit 126 and the slurry pipe 233 from the supply shaft 123a. The fluid supply pipe body 124 is provided coaxially with the supply shaft 123a and is formed in a tubular shape surrounding the outer circumference of the supply shaft 123a. The fluid supply pipe body 124 may include a housing 241 and a plurality of fluid pipes 242 .

A hollow 243 into which the supply shaft 123a is inserted is formed inside the housing 241 and may be formed in a cylindrical shape having a predetermined diameter. That is, as the supply shaft 123a is inserted into the hollow 243 of the housing 241, the fluid supply pipe body 124 is coupled to the housing 241 in a form surrounding the supply shaft 123a. In addition, although not shown, between the inner surface of the housing 241 and the outer surface of the supply shaft 123a, a bearing (not shown) for enabling relative rotation of the supply shaft 123a and reducing frictional force according to rotation may be provided.

The fluid pipe 242 is formed inside the housing 241 along the longitudinal direction of the housing 241 and provides a flow path for guiding the fluid introduced from the fluid supply port 125 to the base member 122 . The fluid pipe 242 includes an inlet 242a communicating with the fluid supply port 125 and an outlet 242b communicating with the base member 122, and the housing 241 extends from the inlet 242a to the outlet 242b. Forms a flow path communicating along the inside of the. The inlet 242a may be formed through an outer surface of the housing 241 and may be formed at different heights along the circumference of the housing 241 . The outlet 242b is formed through the lower surface of the housing 241 .

A plurality of fluid pipes 242 are formed. In addition, the fluid tubes 242 are spaced apart from each other by a predetermined distance along the circumference of the housing 241 so as not to interfere with each other. That is, the fluid pipe 242 may be formed such that the outlet 242b is spaced apart at regular intervals along the circumferential direction based on the center of the supply shaft 123a at a portion communicating with the base member 122 . Accordingly, the fluids injected through the plurality of fluid pipes 242 are radially supplied with respect to the center of the supply shaft 123a, and may be provided uniformly in all directions of the polishing pad 121.

The fluid supply port 125 is provided on the outside of the fluid supply pipe body 124 and supplies different or the same fluid to each fluid pipe 242 . For example, referring to FIGS. 2 and 3, the fluid supply port 125 has a tubular shape coupled coaxially with the housing 241 of the fluid supply pipe 124, and the fluid pipe 242 is formed from the inside. communicated with In addition, a plurality of fluid supply ports 125 may be provided, and the plurality of fluid supply ports 125 may be connected in a stacked manner along the longitudinal direction of the housing 241 .

Here, the fluid supply port 125 communicates with the fluid supply unit 127 on the outside and communicates with the fluid pipe 242 of the fluid supply pipe body 124 on the inside. In addition, the fluid supply port 125 may be configured to communicate with one fluid pipe 242 from the inside. Each fluid supply port 125 may communicate with each of the plurality of fluid pipes 242 formed on the outer surface of the housing 241 . Therefore, the fluid supplied through each fluid supply port 125 may be supplied to each part of the base member 122 through each fluid pipe 242 .

The rotating shaft 123b is provided with a driving unit 128 that orbitally rotates the polishing pad 121 along a circular or elliptical trajectory while in contact with the surface of the substrate 1 .

Here, 'orbit rotation' means that the trajectory along which the center point of the polishing module 12 moves forms a circle or an ellipse with a predetermined diameter. In the drawings, the trajectory along which the center C of the polishing module 12 moves is indicated by 'Tc'. The driving unit 128 polishes the substrate 1 by rotating the polishing module 12 at a predetermined speed along a circular or elliptical trajectory, that is, by oscillating the polishing module 12 .

Alternatively, the driving unit 128 may rotate the polishing module 12 as well as circular or elliptical orbital rotation. Here, the rotation of the polishing module 12 means rotation while the center of the polishing module 12 is fixed to the substrate 1 . In addition, the drive unit 128 may rotate within a predetermined range in one or both directions with the center of the polishing module 12 as a rotation axis, or rotate 360°.

However, this is only an example, and the operation of the polishing module 12 may be substantially changed in various ways. In addition, the driving unit 128 may rotate the polishing module 12 or orbitally rotate the polishing module 12, as well as reciprocate and linearly move the polishing module 12 in one or both directions of the x-axis or the y-axis. As described above, the polishing module 12 may polish the entire surface of the substrate 1 while rotating/moving according to any one of rotation, orbital rotation, and linear movement, or a combined operation.

The driving unit 128 may rotate the polishing module 12 at a constant speed or at a variable speed.

The driving unit 128 is connected to the rotating shaft 123b of the driving shaft 123 . An eccentric shaft 281 is provided at a position eccentric from the center of the rotating shaft 123b, and the driving unit 128 is connected to the eccentric shaft 281 and rotates to drive the polishing module 12 at a predetermined speed. can be rotated However, this is only an example, and the driving unit 128 may have various shapes capable of rotating the polishing module 12 in a circular orbit or an elliptical orbit.

As described above, although the embodiments have been described with limited examples and drawings, those skilled in the art can make various modifications and variations from the above description. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

1: substrate
10: substrate polishing device
11: substrate transfer unit
12: polishing module
121: polishing pad
122: base member
220: distribution plate
221, 222, 223: distribution hole
123, 123a, 123b: drive shaft
231: axis
233: slurry pipe
124: fluid supply pipe
241 housing
242: fluid supply pipe
243: hollow
125: fluid supply port
126: slurry supply unit
127: fluid supply
128: driving unit
281: eccentric shaft
S1: slurry flow path

Claims (25)

a plurality of polishing pads provided on a substrate and contacting the substrate to polish the substrate;
a base member provided with the polishing pad and the distribution plate on the lower side;
a drive shaft provided on an upper portion of the base member;
a fluid supply unit provided on the driving shaft and supplying a fluid that pressurizes the polishing pad through the driving shaft; and
a slurry supply unit supplying slurry to the surface to be polished of the substrate through a flow path separate from the fluid supply unit from the drive shaft;
including,
The distribution plate is a polishing module of a substrate polishing apparatus in which a plurality of injection holes for distributing the slurry supplied from the slurry supply unit are arranged in a line or a plurality of rows, or arranged in a zigzag form.
According to claim 1,
A slurry pipe is formed on the drive shaft to pass through from the upper end to the lower end of the drive shaft along the longitudinal direction of the drive shaft and supply slurry,
The polishing module of the substrate polishing apparatus wherein the slurry pipe has an upper end in communication with the slurry supply unit and a lower end in communication with the base member.
According to claim 2,
The slurry supply unit is a polishing module of a substrate polishing apparatus formed to be detachable from the slurry pipe.
According to claim 1,
The polishing module of the substrate polishing apparatus further comprising a fluid supply pipe body formed coaxially with the drive shaft to surround an outer circumference of the drive shaft to supply fluid to the polishing pad.
According to claim 4,
The fluid supply pipe,
a housing having a hollow into which the driving shaft is inserted; and
a fluid pipe formed inside the housing and providing a flow path for fluid to be supplied to the base member;
A polishing module of a substrate polishing apparatus comprising a.
According to claim 5,
The fluid pipe is formed in plurality,
The polishing module of the substrate polishing apparatus wherein the plurality of fluid pipes are arranged at regular intervals along the circumferential direction of the housing based on the center of the drive shaft.
According to claim 6,
The polishing module of the substrate polishing apparatus wherein the fluid pipe has an inlet formed on an outer circumferential surface of the housing and an outlet communicating with the base member.
According to claim 7,
The polishing module of the substrate polishing apparatus of the fluid pipe, wherein the inlets are formed at different heights from the outer circumferential surface of the housing.
According to claim 7,
The fluid pipe is a polishing module of a substrate polishing apparatus in which the outlet is formed at regular intervals along the circumferential direction of the housing based on the center of the drive shaft.
According to claim 7,
a fluid supply port for supplying fluid to the fluid supply pipe;
Including more,
The fluid supply port is a polishing module of the substrate polishing apparatus communicating with the inlet of the fluid pipe.
According to claim 10,
In the fluid pipe, the inlet is formed at different heights from the outer circumferential surface of the housing,
The polishing module of the substrate polishing apparatus in which a plurality of fluid supply ports are formed in communication with the inlet, respectively.
delete According to claim 1,
The polishing pad is a polishing module of a substrate polishing apparatus having any one of a shape of a rectangle, a square, a polygon, a circle, and an ellipse.
According to claim 1,
a driving unit driving the polishing pad to rotate while being in contact with the substrate;
Including more,
The polishing module of the substrate polishing apparatus, wherein the driving unit rotates the polishing pad in a circular orbit parallel to the substrate surface or in an elliptic orbit.
According to claim 14,
the driving unit,
an eccentric shaft provided at a position eccentric with the driving shaft;
The polishing module of the substrate polishing apparatus further comprising a.
a substrate transfer unit that transfers the substrate;
a polishing module provided with a plurality of polishing pads which polish the substrate by contacting the surface of the substrate to be polished;
a slurry supply unit provided on a drive shaft of the polishing module to supply slurry to the polishing pad and the surface to be polished of the substrate through the drive shaft; and
a driving unit for oscillating and rotating the polishing module along a circular or elliptical trajectory parallel to the substrate by rotating the driving shaft;
including,
The polishing module may include: a base member provided with the polishing pad and providing a space in which the slurry flows; and
a distribution plate provided on a lower side of the base member and having a plurality of spray holes for distributing the slurry in a line or a plurality of lines, or in a zigzag pattern;
Substrate polishing apparatus comprising a.
delete According to claim 16,
The polishing pad has a substrate polishing apparatus having any one of a shape of a rectangle, a square, a polygon, a circle, or an ellipse.
According to claim 16,
A slurry pipe for supplying slurry along the longitudinal direction of the drive shaft is formed inside the drive shaft,
The slurry pipe is formed to penetrate from the upper end to the lower end of the drive shaft, the upper end communicates with the slurry supply part and the lower end communicates with the base member.
According to claim 16,
a fluid supply pipe body provided coaxially with an outer circumferential surface of the drive shaft; and
a fluid supply port coupled to an outer circumferential surface of the drive shaft to supply fluid to the polishing pad through the fluid supply pipe;
Including more,
The fluid supply port is a substrate polishing apparatus connected to the fluid supply pipe body.
According to claim 20,
The fluid supply pipe,
a housing having a hollow formed coaxially with the drive shaft to surround an outer circumference of the drive shaft; and
a plurality of fluid pipes formed inside the housing and providing a fluid flow path;
including,
The substrate polishing apparatus wherein the fluid supply port is formed in plurality so as to communicate with each of the plurality of fluid pipes.
According to claim 21,
The plurality of fluid supply ports are coaxially provided on the outer circumference of the fluid supply pipe body, and are stacked along the longitudinal direction of the fluid supply pipe body.
The method of claim 22,
The fluid pipe has an inlet formed on an outer circumferential surface of the housing and an outlet communicating with the base member,
The inlet of the fluid pipe is formed at different heights from the outer circumferential surface of the housing so as to communicate with the plurality of fluid supply ports.
According to claim 23,
In the fluid pipe, the outlet is formed at regular intervals along the circumferential direction of the housing based on the center of the drive shaft,
The fluid pipe is a substrate polishing apparatus in which the outlet is formed inside the drive shaft to form a flow path independent of each other with a slurry pipe for supplying slurry.
According to claim 16,
the driving unit,
an eccentric shaft provided at a position eccentric with the driving shaft;
Substrate polishing apparatus further comprising a.

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