KR102017271B1 - Chemical mechanical polishing apparatus for substrate - Google Patents

Abstract

Disclosed is a substrate polishing apparatus having a pad conditioner for supplying a slurry in a polishing apparatus of a substrate using a belt polishing pad and conditioning the polishing pad. The substrate polishing apparatus includes a pair of driving rollers, a polishing pad wound around the driving roller, a substrate carrier on which a substrate is seated, and an upper portion of the polishing pad, and the substrate is disposed on the polishing pad when the substrate is polished. It provides a slurry for polishing, and when conditioning the polishing pad comprises a pad conditioner for conditioning the polishing pad.

Description

Substrate Polishing Equipment {CHEMICAL MECHANICAL POLISHING APPARATUS FOR SUBSTRATE}

The present invention relates to a substrate polishing apparatus having a pad conditioner for supplying a slurry for polishing a substrate to a polishing pad and conditioning the polishing pad.

In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) operations including polishing, buffing and cleaning are required. The semiconductor device has a multilayer structure, and a transistor device having a diffusion region is formed in the substrate layer. In the substrate layer, the connecting metal line is patterned and electrically connected to the transistor element forming the functional element. As is known, the patterned conductive layer is insulated from other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers is substantially more difficult due to the large variations in surface morphology. In addition, the metal line pattern is formed of an insulating material, the metal substrate polishing operation is to remove the excess metal.

The substrate polishing apparatus is a component for polishing, buffing and cleaning one or both surfaces of a substrate, and includes a polishing pad having a belt, a pad, or a brush. Abrasives are used to accelerate and enhance substrate polishing operations.

Background Art A belt-type substrate polishing apparatus is known, which is composed of a belt-type polishing pad mounted on two drums of an existing substrate polishing apparatus. In the belt-type substrate polishing apparatus, the substrate is mounted on the carrier, the carrier moves linearly in one direction, and the belt-type polishing pad rotates in a clockwise or counterclockwise direction so that the substrate is in close contact with a predetermined force applied to the polishing. Is performed.

On the other hand, a substrate polishing apparatus using a belt type polishing pad requires a new type of conditioning method and a pad conditioner for conditioning the belt type polishing pad.

In general, a conventional substrate polishing apparatus includes a pad conditioning apparatus and a slurry providing apparatus. Existing slurry providing apparatus provides the slurry in the form of line contact. As the area of the substrate increases, the length of the slurry providing apparatus must be lengthened, and the supply amount of the slurry becomes nonuniform, resulting in unbalanced polishing. In addition, the use of the existing slurry providing apparatus is also greatly increased the consumption of the slurry. In addition, the conventional pad conditioning apparatus conditioned the surface of the polishing pad by rotating and sweeping a disk having hard particles including circular diamonds. When the conventional pad conditioning apparatus is used, the disk is smaller in size than the entire polishing pad, so that a load is generated on the disk and the polishing pad, and the conditioning of the polishing pad is performed unevenly, resulting in poor substrate polishing rate. do.

According to embodiments of the present invention provides a substrate polishing apparatus having a pad conditioner for supplying a slurry for polishing a substrate in a belt type polishing pad and conditioning the polishing pad.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to embodiments of the present invention for achieving the above object of the present invention, a substrate polishing apparatus includes a pair of driving rollers, a polishing pad wound around the driving roller, a substrate carrier on which a substrate is seated, and the polishing pad And a pad conditioner configured to provide a slurry for polishing the substrate to the polishing pad when the substrate is polished, and to condition the polishing pad when the polishing pad is conditioned.

According to one side, the pad conditioner is configured to include a housing and a brush provided on the lower surface of the housing. A plurality of slurry supply holes for supplying a slurry are formed in a lower surface of the housing, and the brush is provided between the slurry supply holes so that a slurry provided through the slurry supply hole is applied to the polishing pad through the brush. Can be.

According to one side, the brush may be formed in the same length so that the end is in contact with the polishing pad on the same plane. Alternatively, the brush may be formed in at least two lengths such that ends thereof contact the polishing pad on different planes.

According to one side, the housing may have a length corresponding to the width direction of the polishing pad. In addition, the housing may be formed to have a lower surface facing the polishing pad.

According to one side, the pad conditioner may perform a sweep operation to linearly move in the front and rear direction with respect to the rotation direction of the polishing pad. In addition, the pad conditioner may perform a rocking motion of rotating in the forward and reverse directions within a predetermined angle about an axis perpendicular to the polishing pad surface.

According to one side, the polishing pad inside may be provided with a polishing pad support for supporting the inner peripheral surface of the polishing pad. The polishing pad supporter may include a first supporter at a lower portion of the polishing pad to correspond to the substrate, and a second supporter at an upper portion of the polishing pad to correspond to the pad conditioner. The pad conditioner may be provided at a position corresponding to the second support part.

According to one side, the substrate carrier, the substrate to be placed in a state that the surface to be polished to the upper surface can be moved in the horizontal direction below the polishing pad. The substrate carrier may be formed of an inflexible material.

Various embodiments of the present disclosure may have one or more of the following effects.

As described above, according to the embodiments of the present invention, the polishing pad may be conditioned at the same time as supplying the slurry for polishing the substrate in the brush pad conditioner.

In addition, the slurry can be supplied in a constant amount, and the slurry can be supplied at the minimum flow rate, so that the slurry can be uniformly provided, the slurry can be uniformly provided in a large area, and the slurry can be provided at the minimum flow rate.

In addition, it is possible to condition a large area of the polishing pad to improve the conditioning speed and efficiency.

In addition, the slurry supply and pad conditioning can be performed in one apparatus, so that the configuration of the apparatus can be simply configured.

1 is a side view of a substrate polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of the substrate polishing apparatus of FIG. 1.
FIG. 3 is a side view illustrating main parts of an operation of the pad conditioner in the substrate polishing apparatus of FIG. 1.
4 and 5 are views illustrating main parts of the pad conditioner in FIG. 3.

Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible even if they are shown in different drawings. In addition, in describing the embodiments of the present invention, when it is determined that a detailed description of a related well-known configuration or function disturbs the understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the components from other components, and the nature, order or order of the components are not limited by the terms. If a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected or connected to that other component, but between components It will be understood that may be "connected", "coupled" or "connected".

Hereinafter, the pad conditioner 15 and the substrate polishing apparatus 10 having the same will be described in detail with reference to FIGS. 1 to 5.

For reference, FIG. 1 is a side view of a substrate polishing apparatus 10 according to an embodiment of the present invention, FIG. 2 is a plan view of the substrate polishing apparatus 10 of FIG. 1, and FIG. 3 is a substrate polishing apparatus of FIG. 1. A main part side view of the pad conditioner 15 at 10. 4 and 5 are views illustrating main parts of the pad conditioner 15 in FIG. 3.

In the substrate polishing apparatus 10 according to the present embodiment, polishing is performed by contacting the substrate 1 to the lower portion of the polishing pad 12 in a state in which the to-be-polished surface of the substrate 1 faces upward. The polishing is performed in a face up manner in which the surface to be polished of the substrate 1 faces upward. In the following description, for convenience of description, a 'front and rear' direction is defined on the basis of the moving direction of the substrate 1, and the front end of the front or rear surface of the substrate 1 or the polishing pad 12 is moved. It is called 'before' direction and the latter is called 'after' direction. In addition, the direction in which the polishing pad 12 perpendicularly crosses the front-back direction is referred to as the "width direction".

Referring to the drawings, the substrate polishing apparatus 10 includes a substrate carrier 11, a polishing pad 12, a drive roller 13, a polishing pad support 14, and a pad conditioner 15. .

In the substrate polishing apparatus 10, the substrate 1 is brought into contact with the lower portion of the polishing pad 12 in a state in which the surface to be polished of the substrate 1 faces upward, and polishing is performed. The polishing of the substrate 1 is performed. Polishing is performed in a face up manner with the face facing up.

The substrate 1 is a transparent substrate including a glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) and a plasma display panel (PDP), and may be rectangular. However, the substrate 1 of the present invention is not limited thereto, and may be a silicon wafer for manufacturing a semiconductor device. In addition, the size of the board | substrate 1 is not limited by drawing.

The substrate carrier 11 is mounted on the substrate 1 horizontally. For example, the substrate carrier 11 is seated and supported horizontally with the surface to be polished of the substrate 1 facing upwards. In addition, the substrate carrier 11 moves linearly with respect to the polishing pad 12, and moves, for example, so that the surface to be polished of the substrate 1 comes into contact with the lower portion of the polishing pad 12. However, the present invention is not limited thereto, and the substrate carrier 11 is not limited to moving horizontally of the substrate 1.

The substrate carrier 11 is formed of an inflexible material on a surface on which the substrate 1 is seated, and is formed of a material having a hardness / strength such that the surface thereof does not damage the substrate 1. According to the present embodiment, the substrate carrier 11 is formed of a non-flexible material, and thus, the substrate carrier 11 is resistant to vibration generated when the substrate 1 is polished, and the vertical displacement due to the vibration does not occur so that the substrate 1 may be broken and polished. Defects can be prevented. Here, the substrate carrier 11 may be configured to include a flexible membrane.

The drive rollers 13 are formed in a pair, and are spaced apart at regular intervals so that their rotation axes are parallel to each other. The driving roller 13 has its axis of rotation perpendicular to the direction of movement of the substrate 1. However, the present invention is not limited thereto, and the driving roller 13 may have its axis arranged side by side with respect to the moving direction of the substrate 1.

The drive roller 13 is formed in a cylindrical shape having a predetermined diameter to rotate the polishing pad 12. The drive roller 13 has a length longer than the width of the polishing pad 12 and the substrate 1, and is formed such that the length of contact with the substrate 1 is at least equal to or longer than the substrate 1.

The polishing pad 12 has a predetermined width, and a polishing surface for polishing the substrate 1 is formed on the outer circumferential surface thereof, and is wound around the outer circumferential surface of the pair of drive rollers 13 under a predetermined tension to form a closed loop. do. In addition, as the driving roller 13 rotates, the polishing pad 12 is continuously rotated like an endless track.

The polishing pad 12 is formed with a linear section where the area between the pair of drive rollers 13 is flat. Polishing of the substrate 1 is performed by contacting the substrate 1 at the lower portion of the linear section of the polishing pad 12, and the pad conditioner 15 is provided at the upper portion of the linear section to condition the polishing pad 12. Is performed.

The polishing pad 12 is rotated such that the rotational direction in the lower portion in contact with the substrate 1 is the same as the movement direction of the substrate 1. Then, the polishing of the substrate 1 is performed by the difference between the movement speed of the polishing pad 12 and the movement speed of the substrate 1 at the portion where the polishing pad 12 and the substrate 1 are in contact with each other. However, the present invention is not limited thereto, and the polishing pad 12 may rotate in a direction opposite to that of the substrate 1 in the moving direction of the linear section.

Meanwhile, in the present exemplary embodiment, the polishing pad 12 is exemplarily rotated in parallel with the moving direction of the substrate 1. Alternatively, the polishing pad 12 is rotated so as to cross perpendicularly to the moving direction of the substrate 1. It is also possible. That is, the driving roller 13 is arranged in parallel with the moving direction of the substrate 1, and the rotation direction of the polishing pad 12 is perpendicular to the moving direction of the substrate 1.

The polishing pad supporter 14 is provided inside the polishing pad 12 to support the inner circumferential surface of the polishing pad 12. The polishing pad supporter 14 is provided between the driving rollers 13 to prevent the polishing pads 12 from sagging between the driving rollers 13 and the polishing pads 12 at a predetermined pressure with respect to the substrate 1. In addition to pressure contact, the polishing pad 12 is brought into pressure contact with the pad conditioner 16. In addition, the polishing pad support 14 is formed to have a length that is at least equal to or longer than the width of the polishing pad 12 so as to press the both ends of the polishing pad 12.

In detail, the inner lower portion of the polishing pad 12 is provided with a first support part 141 that presses the inner circumferential surface of the polishing pad 12 downward against the substrate 1. In addition, the inner upper portion of the polishing pad 12 is provided at a position symmetrical with the first support part 141, and presses the inner circumferential surface of the polishing pad 12 upward to apply the polishing pad 12 to the pad conditioner 16. The second support part 142 may be provided.

The pad conditioner 15 is provided on the polishing pad 12 to provide the slurry S to the polishing pad 12 when polishing the substrate 1, and when the conditioning of the polishing pad 12 is required, the polishing pad ( The cutting pad 12 is minutely cut to condition the polishing pad 12. The pad conditioner 15 may be provided at a position corresponding to the second support part 142, and may press the polishing pad 12 to a predetermined pressure against the second support part 142 when the pad conditioner 15 operates. However, the present invention is not limited thereto, and the position of the pad conditioner 15 may be changed in various ways on the polishing pad 12.

The pad conditioner 15 includes a housing 151 forming an appearance, and a brush 152 provided on a lower surface of the housing 151, that is, a portion in contact with the polishing pad 12, and on one side of the pad conditioner 15. ) Is supplied with a slurry supply unit 153 for supplying a slurry (S).

The pad conditioner 15 is formed to be in contact with the polishing pad 12 in a large area. For example, the housing 151 has a substantially rectangular or rectangular parallelepiped shape having a predetermined area and is formed to have a corresponding length along the width direction of the polishing pad 12. That is, since the pad conditioner 15 is in surface contact with the polishing pad 12 in an area corresponding to that of the lower surface of the housing 151, the area in contact with the polishing pad 12 is increased, and both edges of the polishing pad 12 are increased. Evenly contact. Accordingly, the pad conditioner 15 may not only uniformly apply the slurry S to the polishing pad 12 in a large area, but also improve the conditioning efficiency of the polishing pad 12 and reduce the time. However, the present invention is not limited thereto, and the shape of the pad conditioner 15 and the housing 151 may be changed in various ways.

The brush 152 includes a plurality of brush hairs 521 and 522 provided to contact the polishing pad 12. A plurality of slurry supply holes 512 may be formed in the lower surface 511 of the housing 151, and brush hairs 521 and 522 may be formed between the slurry supply holes 512 in the lower surface 511. have. For example, as shown in FIG. 4, the brush bristle 521 may be formed to have a predetermined length. Alternatively, as shown in FIG. 5, the bristles 522 may be formed to have different lengths.

The brush 152 applies the slurry S to a uniform thickness on the polishing pad 12, and controls the polishing pad 12 by friction between the brush bristles 521 and 522 and the polishing pad 12. do. That is, as shown in Figure 4 and 5, since the slurry (S) is stored to some extent between the brush hairs (521, 522), the slurry (S) may be applied to the polishing pad 12 to a predetermined thickness. The slurry S can be applied at the minimum flow rate.

The brush hairs 521 and 522 are formed of a material that does not react with the slurry, and may be formed of, for example, Teflon or peaks.

However, the present invention is not limited by the drawings, and the shape of the brush hairs 521 and 522 and the shape of the slurry supply hole 512 may be changed in various ways. For example, the slurry supply holes 512 are uniformly distributed at regular intervals on the lower surface 511 of the housing 151, and the brush hairs 521 and 522 are uniformly and uniformly disposed between the slurry supply holes 512. Can be. Alternatively, the slurry supply hole 512 may be partially formed at the lower surface 511 of the housing 151 at a position where slurry supply is necessary.

The pad conditioner 15 provides a slurry to the polishing pad 12 when polishing the substrate 1. In particular, since the pad conditioner 15 is provided with a brush 152, a certain amount of slurry S is provided as if the polishing pad 12 is applied. Here, since the polishing pad 12 rotates at a constant speed during polishing of the substrate 1, the pad conditioner 15 is fixed because the polishing pad 12 is relatively moved relative to the pad conditioner 15 at a constant speed. Only slurry S can be fed in position. Alternatively, the slurry S may be applied while the pad conditioner 15 performs a sweep operation that reciprocates or vibrates within a predetermined distance in the front-rear direction with respect to the direction in which the polishing pad 12 moves.

In addition, the pad conditioner 15 sweeps in the front-rear direction with respect to the direction in which the polishing pad 12 moves on the polishing pad 12 when the polishing pad 12 is conditioned. The brush 152 and the polishing pad 12 The surface of the polishing pad 12 is minutely cut and conditioned by friction between the pads. In addition, even when conditioning the polishing pad 12, in order to increase the conditioning efficiency, a predetermined slurry or abrasive for conditioning may be used. In this case, the pad conditioner 15 may provide conditioning abrasive through the brush 152 while the brush 152 may be conditioned by friction with the polishing pad 12. Alternatively, the pad conditioner 15 may oscillate reciprocally on the polishing pad 12 within a predetermined angle. The sweep and rocking operations of the pad conditioner 15 are performed simultaneously or sequentially, and may be changed in various ways for conditioning the polishing pad 12.

According to the present embodiments, the pad conditioner 15 may provide a slurry when polishing the substrate 1 and may perform conditioning of the polishing pad 12, thereby simplifying the configuration of the apparatus. In addition, since the pad conditioner 15 applies the slurry S to the polishing pad 12 through the brush 152, the pad conditioner 15 may provide the slurry at the minimum flow rate, reduce the consumption of the slurry S, and provide the uniformity. can do. In addition, the slurry S may be uniformly provided to the polishing pad 12 through the brush 152, and the slurry S may be uniformly provided in a large area. In addition, since the pad conditioner 15 is in contact with the polishing pad 12 in a large area, the pad conditioner 15 can condition a large area of the polishing pad 12 and improve the conditioning speed and efficiency.

Although the above embodiments have been described with reference to the limited embodiments and the drawings, those skilled in the art may make various modifications and variations from the above description. For example, the described techniques may be performed in a different order than the described method, and / or components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different form than the described method, or other components. Or even if replaced or substituted by equivalents, an appropriate result can be achieved.

Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims that follow.

1: substrate
10: substrate polishing apparatus
11: substrate carrier
12: polishing pad
13, 131, 132: drive roller
14, 141, 142: polishing pad support
15: pad conditioner
151: housing
511: plate
512: slurry supply hole
152: brush
521, 522: brush hair
153: slurry supply unit
S: slurry

Claims (14)

A pair of drive rollers;
A polishing pad wound around the driving roller and rotating;
A substrate carrier on which the substrate is seated; And
A brush provided on the polishing pad and in contact with the polishing pad, applying a slurry for polishing the substrate to the substrate through the brush, and the brush and the polishing pad when conditioning the polishing pad. A pad conditioner for conditioning the polishing pad by friction between pads;
Including,
And the brush is formed in the same length so that the end is in contact with the polishing pad on the same plane, or the brush is formed in at least two lengths so that the end is in contact with the polishing pad on different planes.
The method of claim 1,
The pad conditioner comprises a housing,
The brush is provided on the lower surface of the housing substrate polishing apparatus.
The method of claim 2,
The lower surface of the housing is formed with a plurality of slurry supply holes for supplying a slurry,
The brush is provided between the slurry supply holes, the slurry provided through the slurry supply hole is applied to the polishing pad through the brush.
delete delete The method of claim 2,
And the housing has a length corresponding to the width direction of the polishing pad.
The method of claim 2,
The housing is a substrate polishing apparatus having a flat bottom surface facing the polishing pad.
The method of claim 1,
The pad conditioner is a substrate polishing apparatus for performing a sweep operation to linearly move in the front and rear direction with respect to the rotation direction of the polishing pad.
The method of claim 1,
And the pad conditioner rotates in a forward and reverse direction within a predetermined angle about an axis perpendicular to the polishing pad surface.
The method of claim 1,
And a polishing pad support portion inside the polishing pad to support an inner circumferential surface of the polishing pad.
The method of claim 10,
The polishing pad supporter includes a first support part at a lower portion of the polishing pad to correspond to the substrate, and a second support portion at the upper portion of the polishing pad to correspond to the pad conditioner.
The method of claim 11,
And the pad conditioner is provided at a position corresponding to the second support part.
The method of claim 1,
The substrate carrier is a substrate polishing apparatus is moved to the horizontal direction under the polishing pad is seated on the substrate with the surface to be polished of the substrate facing upwards.
The method of claim 13,
And the substrate carrier is formed of an inflexible material.

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