KR102039337B1 - Manufacturing method of Smart-card and the Smart-card using the same - Google Patents

Manufacturing method of Smart-card and the Smart-card using the same Download PDF

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Publication number
KR102039337B1
KR102039337B1 KR1020130163802A KR20130163802A KR102039337B1 KR 102039337 B1 KR102039337 B1 KR 102039337B1 KR 1020130163802 A KR1020130163802 A KR 1020130163802A KR 20130163802 A KR20130163802 A KR 20130163802A KR 102039337 B1 KR102039337 B1 KR 102039337B1
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South Korea
Prior art keywords
smart card
film
chip module
inlay
buffer film
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KR1020130163802A
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Korean (ko)
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KR20150075636A (en
Inventor
류진호
조영희
채종훈
이세현
김현미
박병훈
유선기
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한국조폐공사
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The present invention relates to a smart card manufacturing method and a smart card manufactured using the same, the smart card manufacturing method according to an embodiment of the present invention, the smart card manufacturing method according to the present invention, a smart card mounted with a contactless chip module In the manufacturing method, the step of attaching the first buffer film to the one side surface of the inlay substrate having the through portion formed, the first buffer to the through portion of the inlay substrate opposite the first buffer film, the first buffer Fixing the chip module to be in contact with the film, forming an antenna coil and an antenna terminal on the other surface of the inlay substrate, attaching a second buffer film to cover the dam portion of the chip module, and the inlay substrate and the Stacking the thickness control layer provided with the opening tool on the top of the chip module may include forming a smart card inlay, this Use can be made of smart cards to improve the durability and operating stability is ensured.

Description

Smart card manufacturing method and smart card manufactured using the same {Manufacturing method of Smart-card and the Smart-card using the same}

The present invention relates to the manufacture of smart cards, and more particularly, to a smart card manufacturing method and a smart card manufactured using the RF contactless chip module is mounted stably.

In general, smart cards are made of transparent or opaque synthetic resin sheets such as PVC, ABS, PC, PETG, PET, and the lower protective layer, lower printed layer, upper printed layer, and upper protective layer of the card are sequentially stacked from the bottom to the top. Contact type contactless and contactless structure having a structure in which a contact IC card having a structure, a lower protective layer, a lower printed layer, an antenna coil insertion layer in which an antenna coil is positioned, an upper printed layer, and a card upper protective layer are sequentially stacked from the bottom to the top There is a combi card.

Specifically, as a type of smart card, a contactless IC card (integrated circuit card) for transmitting and receiving data through a contact exposed on the surface and a non-contact RF card for transmitting and receiving data wirelessly using a built-in antenna coil (Radio frequency non) -contact card).

The smart card including the conventional non-contact RF chip module, as shown in Figures 1 and 2, after completing the inlay laminated laminate including a non-contact chip module, to complete the inlay laminate through a pre-laminating process, Subsequently, the lower inlay lamination layer 10 ', the lower card laser sensitive layer 20', and the lower printing layer 30 'are placed on the completed inlay laminate, and the upper print layer 30 and the upper card are placed from the top of the inlay laminate. After laminating the laser sensitive layer 20 and the upper protective layer 10 of the card in sequence, the card body is constructed by applying heat and pressure appropriately to form one laminate.

In this case, Korean Patent No. 10-0746703 discloses a method of preventing dimple formation using an epoxy-based filler to prevent dimples in upper and lower portions of an RF chip module. However, although smart cards manufactured in this manner are prevented from forming dimples, cracks may occur due to epoxy-based fillers filled in the upper and lower portions of the RF chip module, thereby causing problems of durability and malfunction.

Therefore, there is a demand for development of a method for stably mounting an RF chip module in a smart card to prevent surface dimple formation and to prevent durability and malfunction.

1. Republic of Korea Patent No. 10-0746703

An object of the present invention is to cover the upper and lower portions of the chip module with a heat-resistant film during the manufacturing of the inlay of the smart card, to prevent dimples generated during the manufacturing of the chip module embedded smart card, and at the same time, the manufactured smart card is weak in durability due to heat Termination is to provide a smart card manufacturing method that can solve the problem.

Another object of the present invention is to provide a method for manufacturing a smart card in a simplified process by omitting the pre-lamination process and the formation of a transparent protective layer for inlays when manufacturing the smart card inlay.

Still another object of the present invention is to provide a method for manufacturing a smart card having a thinner thickness by replacing the role of a transparent protective layer for inlays with a heat resistant film in manufacturing an inlay of a smart card.

In the smart card manufacturing method according to the present invention, in the smart card manufacturing method in which the non-contact chip module is mounted, attaching a first buffer film to cover the through portion on one surface of the inlay substrate having a through portion, the first buffer Fixing a chip module to contact the first buffer film with the through portion of the inlay substrate on the opposite side to which the film is attached; forming an antenna coil and an antenna terminal on the other surface of the inlay substrate; And attaching a second buffer film to cover the upper dam, and forming a smart card inlay by stacking a thickness control layer having openings on top of the inlay substrate and the chip module.

In the smart card manufacturing method according to the invention, in the step of fixing the chip module, it can be fixed so that the lower end of the first buffer film and the chip module terminal portion.

In the smart card manufacturing method according to the invention, in the step of attaching the second buffer film, the second buffer film may be formed to extend to cover the dam upper surface, the dam side and the terminal upper surface of the chip module. .

In the smart card manufacturing method according to the present invention, in the step of forming the smart card inlay by stacking the thickness control layer, the thickness control layer is the dam top surface and the second buffer film of the chip module through the opening; It may be stacked to be exposed to the outside.

In the smart card manufacturing method according to the invention, after the step of forming the smart card inlay by stacking the thickness control layer, the upper side of the smart card inlay from the top of the smart card inlay, the upper printed layer, the upper laser sensitive layer and Forming a smart card body by sequentially connecting an upper transparent protective layer and sequentially connecting a lower printing layer, a lower laser sensitive layer, and a lower transparent protective layer from a lower side of the smart card inlay to a lower side of the smart card inlay. It may further include.

In the smart card manufacturing method according to the present invention, the step of forming the smart card body is the sequentially connected upper transparent protective layer, upper laser sensitive layer, upper printed layer, smart card inlay, lower printed layer, lower laser sensitive The method may further include thermocompressing the layer and the lower transparent protective layer.

In the smart card manufacturing method according to the invention, the first buffer film or the second buffer film, respectively, PP (polypropylene) film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, It can be selected from PI (polyimide) film, PC (polycarbonate) film, PA (polyamide) film.

In the smart card manufacturing method according to the invention, the first buffer film or the second buffer film may be 10 to 30㎛.

On the other hand, it is possible to manufacture a smart card according to the smart card manufacturing method of the present invention, the smart card is a smart card mounted with a non-contact chip module, a through portion for arranging the chip module is formed, the antenna coil and antenna terminal The inlay substrate is provided, the first buffer film covering one side of the through portion, the chip module is inserted into the through portion, the lower terminal portion is disposed so as to contact the first buffer film, the second buffer covering the dam portion of the chip module film; And a thickness control layer stacked on the inlay substrate and the chip module and disposed so that the top surface of the chip module is exposed to the outside through a through hole.

In the smart card according to the present invention, the first buffer film or the second buffer film may be a heat resistant film.

In the smart card according to the present invention, the first buffer film or the second buffer film is a PP (polypropylene) film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, PI ( Polyimide) film, PC (polycarbonate) film, PA (polyamide) film.

In the smart card according to the present invention, the first buffer film or the second buffer film may be 10 to 30㎛.

In the smart card according to the present invention, the second buffer film may be extended to cover the dam top surface, the dam side and the terminal top surface of the chip module.

In the smart card according to the present invention, an upper printing layer, an upper laser sensitive layer, and an upper transparent protective layer are sequentially connected to an upper side of the smart card inlay from an upper end of the smart card inlay, and the smart card is disposed below the smart card inlay. The lower printed layer, lower laser sensitive layer and lower transparent protective layer may be sequentially connected from the bottom of the card inlay.

Smart card manufacturing method of the present invention, the upper and lower parts of the chip module when manufacturing the inlay of the smart card to prevent dimples generated during the chip module embedded smart card manufacturing, and at the same time produced smart card by heat There is an effect that can solve the problem of weak durability.

The smart card manufacturing method of the present invention can omit the formation of the pre-lamination process and the transparent protective layer for inlay when manufacturing the smart card inlay, there is an advantage that the smart card can be manufactured in a simplified process.

The smart card manufacturing method of the present invention has an advantage in that a smart card having a thinner thickness can be manufactured by replacing the role of the transparent protective layer for inlays with a heat resistant film when manufacturing the smart card inlay.

In addition, a smart card manufactured by the smart card manufacturing method having such an effect can provide a smart card with improved durability while having a thin thickness.

1 is a view schematically showing a smart card inlay equipped with a conventional non-contact chip module according to a manufacturing process,
2 is a schematic cross-sectional view of a conventional smart card including a smart card inlay manufactured according to the process of FIG.
3 is a view schematically showing a smart card inlay equipped with a non-contact chip module of the present invention according to the manufacturing process,
4 is a detailed process diagram for showing the actual process of Figure 3,
5 is a schematic cross-sectional view of a smart card of the present invention including a smart card inlay manufactured according to the process of FIGS. 3 and 4.

Hereinafter, a smart card manufacturing method and a smart card manufactured using the present invention will be described in detail with reference to the accompanying drawings. The drawings introduced below are provided by way of example so that the spirit of the invention to those skilled in the art can fully convey. Accordingly, the present invention is not limited to the drawings presented below and may be embodied in other forms, and the drawings presented below may be exaggerated to clarify the spirit of the present invention. At this time, if there is no other definition in the technical terms and scientific terms used, it has a meaning commonly understood by those of ordinary skill in the art to which the present invention belongs, the gist of the present invention in the following description and the accompanying drawings Descriptions of well-known functions and configurations that may be unnecessarily blurred are omitted.

Conventionally, in order to prevent dimple formation of a contactless chip module embedded smart card, an epoxy-based filler (FIG. 1; 59) has been used on the top of the chip module. However, the conventional smart card manufactured in this way, even if the dimple formation is prevented, rather, due to the epoxy-based fillers filled in the upper and lower RF chip module portion due to heat cracks, such as durability or malfunction occurs, etc. Has been caused.

The present invention relates to a smart card manufacturing method for improving the above problems, and more particularly, to a smart card manufacturing method and a smart card manufactured using the RF contactless chip module is mounted stably using a heat-resistant film. It is about.

In the smart card manufacturing method of the present invention, in the smart card manufacturing method in which the non-contact chip module is mounted, attaching the first buffer film 520 to one surface of the inlay substrate 510 having the through part 511 formed thereon (S1). ), Fixing the chip module to the through part 511 of the inlay substrate 510 on the opposite side to which the first buffer film 520 is attached (S2), and the antenna coil 540 on the inlay substrate 510. ) And forming an antenna terminal 550 (S3), attaching a second buffer film 560 on the chip module 530 (S4) and the inlay substrate 510 and the chip module 530. The step (S5) of forming a smart card inlay 500 by stacking the thickness control layer 570 on the top).

Referring to the smart card manufacturing method of the present invention in detail, first, the first buffer film 520 is attached to the surface of one side of the inlay substrate 510, the through portion 511 is formed as shown in Figs. Here, the through part 511 formed on the inlay substrate 510 corresponds to a part for inserting and mounting the chip module 530 of the smart card. In this case, the first buffer film 520 may be attached to cover one side of the inlay substrate 510 by covering the through part 511.

In addition, one side of the first buffer film 520 is coated with an adhesive material, it may not need a separate fixing means or adhesive means when attached to the inlay substrate 510. Herein, the adhesive material is not particularly limited as long as the adhesive material does not deform the smart card manufacturing material, but it may be desirable to treat the strong spray adhesive as an example for ensuring the adhesion without excessively increasing the thickness.

Subsequently, the chip module 530 is fixed to the penetrating portion 511 of the inlay substrate 510 on which the first buffer film 520 is attached. In this case, the first buffer film 520 and the chip module 530 may be fixed. (S2) Specifically, the first buffer film 520 may be fixed to contact the lower end of the terminal portion 532 of the chip module 530. In this case, the fixing of the first buffer film 520 and the chip module 530 may be easily performed by the adhesive material previously processed on the first buffer film 520.

Next, the antenna coil 540 and the antenna terminal 550 is formed on the inlay substrate 510. (S3) At this time, the antenna coil 540 and the antenna terminal 550 is a chip module fixed to the inlay substrate 510. It may be formed over the top of the (530). In detail, the antenna coil 540 is formed to be disposed at the periphery of the chip module 530, and the at least one antenna terminal 550 extending from the antenna coil 540 may be formed to be connected to the chip module 530. have. Herein, the antenna terminal 550 may be connected to the terminal portion 532 of the chip module 530.

Next, the second buffer film 560 is attached to cover the upper side of the chip module 530. (S4) At this time, the upper side of the chip module 530 is a protruding dam portion of the chip module 530 (S4). 531) and the upper surface of the terminal 532 of the chip module 530. In detail, the second buffer film 560 may extend to cover all of the top surface of the dam portion 531 and the top surface of the dam portion 531 of the chip module 530.

In this case, an adhesive material is applied to one side of the second buffer film 560 similarly to the first buffer film 520, so that a separate fixing means or an adhesive means may not be required when attaching to the upper side of the chip module 530. . Herein, the adhesive material is not particularly limited as long as the adhesive material does not deform the smart card manufacturing material, but it may be desirable to treat the strong spray adhesive as an example for ensuring the adhesion without excessively increasing the thickness.

Subsequently, the smart card inlay 500 is formed by stacking the thickness control layer 570 on the inlay substrate 510 and the chip module 530 to which the second buffer film 560 is attached. The adjustment layer 570 is provided with openings 571, the stacking of the thickness control layer 570 is the dam portion of the chip module 530 is attached to the second buffer film 560 through the opening 557. The top surface may be disposed to be stacked to be exposed to the outside.

In the above-described process, the first buffer film 520 or the second buffer film 560 is a heat resistant film, and as a specific example, the first buffer film 520 or the second buffer film 560 is PP (poly). Propylene) film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, PI (polyimide) film, PC (polycarbonate) film, PA (polyamide) film. Here, the first buffer film 520 or the second buffer film 560 may be the same or different.

In addition, the first buffer film 520 or the second buffer film 560 may be 10 to 30㎛. In this case, when the thickness of the films 520 and 560 is less than 10 μm, the thickness of the films may be insufficient to effectively perform a buffering role. When the thickness of the films 520 and 560 is more than 30 μm, the thickness of the film may be It may not effectively reduce the thickness of the smart card manufactured excessively, or the chip module mounting portion of the smart card by the attached film is excessively thicker than the peripheral portion may cause an appearance or touch discomfort.

The smart card inlay 500 is completed through the above-described process, and the smart card inlay 500 manufactured as described above has an advantage that it can be added to an additional process without undergoing a pre-laminating process after performing a point bonding process.

Specifically, the upper printed layer 300, the upper laser sensitive layer 200 and the upper transparent protective layer 100 from the top of the smart card inlay 500 manufactured in accordance with the present invention described above. The lower surface of the smart card inlay 500 is sequentially connected to the lower printed layer 300 ', the lower laser sensitive layer 200' and the lower transparent protective layer 100 'from the lower end of the smart card inlay 500. ) May be sequentially connected directly without going through a pre-laminating process, thereby forming a smart card body as shown in FIG. 5.

Here, the smart card body is sequentially connected to the upper transparent protective layer 100, the upper laser sensitive layer 200, the upper printed layer 300, the smart card inlay 500, the lower printed layer (300 '), the lower laser. The sensitive layer 200 'and the lower transparent protective layer 100' may be formed by thermocompression bonding. In this case, the thermocompression process is not particularly limited, but for example, the thermocompression process may be performed by thermocompression by heat and pressure from the uppermost and lowermost sides of the smart card body to the center direction.

On the other hand, it is possible to manufacture a smart card by the method described above.

Specifically, in the smart card according to the present invention, in the smart card mounted with the non-contact chip module, a through part 511 for arranging the chip module 530 is formed, and the antenna coil 540 and the antenna terminal 550 are formed. The inlay substrate 510 is provided, the first buffer film 520 covering one side of the through part 511, and is inserted into the through part 511. The lower end of the terminal part 532 is the first buffer film 520. The chip module 530 disposed to contact the second buffer film 560, the second buffer film 560 covering the dam part 531 of the chip module 530, and the inlay substrate 510 and the chip module 530. The smart card inlay 500 includes a thickness control layer 570 disposed to expose the upper end of the chip module 530 to the outside through the opening 557.

In this case, the first buffer film 520 or the second buffer film 560 is a heat-resistant film, in a specific example, the first buffer film 520 or the second buffer film 560, respectively, PP (polypropylene) Film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, PI (polyimide) film, PC (polycarbonate) film, PA (polyamide) film can be selected. Here, the first buffer film 520 or the second buffer film 560 may be the same or different.

In addition, the first buffer film 520 or the second buffer film 560 may be 10 to 30㎛. In this case, when the thickness of the films 520 and 560 is less than 10 μm, the thickness of the films may be insufficient to effectively perform a buffering role. When the thickness of the films 520 and 560 is more than 30 μm, the thickness of the film may be It may not effectively reduce the thickness of the smart card manufactured excessively, or the chip module mounting portion of the smart card by the attached film is excessively thicker than the peripheral portion may cause an appearance or touch discomfort.

Here, the second buffer film 560 extends to cover not only the dam 531 upper end surface and the dam 531 side surface of the chip module 530 but also the upper end surface of the terminal unit 532 of the chip module 530. 3 and 5, the thickness adjusting layer 570 and the second buffer film 560 are connected to each other to form the first buffer film 520, the inlay substrate 510, and the like. The chip module 530 may be completely wrapped and sealed by the second buffer film 560 and the thickness control layer 570. By such a sealing form, it is possible to achieve stable mounting of the smart card chip module 530, thereby further improving the effects of reducing durability and preventing malfunction.

In addition, the upper print layer 300, the upper laser sensitive layer 200 and the upper transparent protective layer 100 sequentially from the top surface of the smart card inlay 500 is configured above the smart card inlay 500 configured as described above. And a lower printed layer 300 ', a lower laser sensitive layer 200', and a lower transparent protective layer 100 'from a lower surface of the smart card inlay 500 at a lower side of the smart card inlay 500. Of course, they are sequentially connected to form a smart card body as shown in FIG.

Smart card manufacturing method of the present invention, the upper and lower parts of the chip module when manufacturing the inlay of the smart card to prevent dimples generated during the chip module embedded smart card manufacturing, and at the same time produced smart card by heat There is an effect that can solve the problem of weak durability.

The smart card manufacturing method of the present invention can omit the formation of the pre-lamination process and the transparent protective layer for inlay when manufacturing the smart card inlay, there is an advantage that the smart card can be manufactured in a simplified process.

The smart card manufacturing method of the present invention has an advantage in that a smart card having a thinner thickness can be manufactured by replacing the role of the transparent protective layer for inlays with a heat resistant film when manufacturing the smart card inlay. Specifically, in the manufacture of a conventional smart card inlay, a transparent protective layer for inlays having a thickness of about 30 μm to 50 μm has been stacked above and below the RF chip module part. In the present invention, the smart protective layer does not use the transparent protective layer for inlays. There is an advantage that can reduce the thickness of the card about 60㎛ ~ 100㎛.

In addition, a smart card manufactured by the smart card manufacturing method having such an effect can provide a smart card with improved durability while having a thin thickness.

In the present invention as described above has been described by specific embodiments and limited embodiments and drawings, but this is only provided to help a more general understanding of the present invention, the present invention is not limited to the above embodiments, the present invention Those skilled in the art can make various modifications and variations from this description.

Therefore, the spirit of the present invention should not be limited to the described embodiments, and all of the equivalents or equivalents of the claims as well as the claims to be described later belong to the scope of the present invention. .

10: upper transparent protective layer 10 ': lower transparent protective layer
20: upper laser sensitive layer 20 ': lower laser sensitive layer
30: upper printed layer 30 ': lower printed layer
50: inlay 51: inlay substrate
53: chip module 54: antenna coil
55: antenna terminal 57: thickness control layer
59: Filler 80: Transparent protective layer for the upper inlay
80 ′: Transparent protective layer for bottom inlay
100: upper transparent protective layer 100 ': lower transparent protective layer
200: upper laser sensitive layer 200 ': lower laser sensitive layer
300: upper printed layer 300 ': lower printed layer
500: inlay 510: inlay substrate
511: through part 520: first buffer film
530: chip module 531: chip module dam
532: chip module terminal 540: antenna coil
550: antenna terminal 560: second buffer film
570: thickness control layer 571: thickness control layer opening

Claims (14)

In the smart card manufacturing method in which the contactless chip module is mounted,
Attaching a first buffer film to one surface of an inlay substrate having a through portion formed to cover the through portion;
Fixing a chip module to the first buffering film so as to contact the first buffering film through the inlay substrate on the opposite side to which the first buffering film is attached;
Forming an antenna coil and an antenna terminal on the other surface of the inlay substrate;
A second buffering film is attached to cover the upper side of the chip module, and the second buffering film extends to cover all of the top surface of the protruding dam portion of the chip module, the side surface of the dam portion, and the top surface of the terminal portion of the chip module. Attaching; And
Stacking the thickness control layer provided with the opening tool on the top of the inlay substrate and the chip module, by laminating the thickness control layer on the second buffer film provided on the upper surface of the terminal portion of the chip module smart card inlay Forming; including;
The first buffer film and the second buffer film is a smart card manufacturing method having a thickness of 10 to 30 ㎛. The method of claim 1,
In the step of fixing the chip module,
Smart card manufacturing method for fixing the first buffer film and the lower end of the chip module terminal contact. delete The method of claim 1,
In the step of stacking the thickness control layer to form a smart card inlay,
The thickness control layer is a smart card manufacturing method is laminated so that the dam top surface and the second buffer film of the chip module exposed through the opening. The method of claim 1,
After stacking the thickness control layer to form a smart card inlay,
The upper printed layer, the upper laser sensitive layer and the upper transparent protective layer are sequentially connected to the upper side of the smart card inlay from the top of the smart card inlay,
And a lower printing layer, a lower laser sensitive layer, and a lower transparent protective layer are sequentially connected to a lower side of the smart card inlay from a lower end of the smart card inlay to form a smart card body. The method of claim 5,
Forming the smart card body is
Smart card manufacturing method further comprising the step of thermally pressing the upper transparent protective layer, the upper laser sensitive layer, the upper printed layer, the smart card inlay, the lower printed layer, the lower laser sensitive layer and the lower transparent protective layer connected in sequence. The method of claim 1,
The first buffer film or the second buffer film
Smart selected from PP (polypropylene) film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, PI (polyimide) film, PC (polycarbonate) film, PA (polyamide) film How to make a card. delete In a smart card mounted with a contactless chip module,
An inlay substrate having a through portion for arranging the chip module and having an antenna coil and an antenna terminal;
A first buffer film covering one side of the through part;
A chip module inserted into the through part and disposed such that a lower end of the terminal part is in contact with the first buffer film;
A second buffer film covering both an upper end surface of the protruding dam part of the chip module, a side surface of the dam part, and an upper end surface of the terminal part of the chip module; And
And a through hole, stacked on the inlay substrate and the chip module, and having a thickness control layer disposed to expose the top surface of the chip module to the outside through the through hole.
The thickness control layer is laminated on the second buffer film provided on the upper surface of the terminal portion of the chip module,
The first buffer film and the second buffer film is a smart card having a smart card inlay having a thickness of 10 to 30 ㎛. The method of claim 9,
The first buffer film or the second buffer film is a heat-resistant film smart card. The method of claim 10,
The first buffer film or the second buffer film
Smart selected from PP (polypropylene) film, PET (polyethylene terephthalate) film, PBT (polybutylene terephthalate) film, PI (polyimide) film, PC (polycarbonate) film, PA (polyamide) film, respectively Card. delete delete The method of claim 9,
The upper printed layer, the upper laser sensitive layer and the upper transparent protective layer are sequentially connected to the upper side of the smart card inlay from the top of the smart card inlay,
The smart card in the lower side of the smart card inlay is sequentially connected to the lower printed layer, the lower laser sensitive layer and the lower transparent protective layer from the bottom of the smart card inlay.
KR1020130163802A 2013-12-26 2013-12-26 Manufacturing method of Smart-card and the Smart-card using the same KR102039337B1 (en)

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KR102107795B1 (en) 2018-11-22 2020-05-28 주식회사 엔에이블 Smart card manufacturing method using flexible substrate
KR102085105B1 (en) 2019-05-20 2020-03-05 주식회사 엔에이블 Smart card for electronics passport capable of thinner
KR102223098B1 (en) * 2020-08-20 2021-03-04 주식회사 링크플러스온 Chip package, smart card using the same and manufacturing method thereof

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