KR102035955B1 - Stress distributing film, optical member, and electronic member - Google Patents

Stress distributing film, optical member, and electronic member Download PDF

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KR102035955B1
KR102035955B1 KR1020187022747A KR20187022747A KR102035955B1 KR 102035955 B1 KR102035955 B1 KR 102035955B1 KR 1020187022747 A KR1020187022747 A KR 1020187022747A KR 20187022747 A KR20187022747 A KR 20187022747A KR 102035955 B1 KR102035955 B1 KR 102035955B1
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sensitive adhesive
pressure
adhesive layer
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KR20180091962A (en
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쇼고 사사키
소야 조
고지 시타라
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닛토덴코 가부시키가이샤
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    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
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    • C09J7/241Polyolefin, e.g.rubber
    • C09J7/243Ethylene or propylene polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245Vinyl resins, e.g. polyvinyl chloride [PVC]
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    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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  • Laminated Bodies (AREA)

Abstract

우수한 응력 분산성을 갖는 응력 분산 필름을 제공한다. 또한, 그러한 응력 분산 필름을 구비한 광학 부재나 전자 부재를 제공한다. 본 발명의 응력 분산 필름은, 플라스틱 필름과 점착제층의 적층체를 포함하는 응력 분산 필름이며, 해당 적층체의 플라스틱 필름측으로부터 해당 적층체와 수직 방향으로 하중을 가했을 때의 압입 에너지가 260μJ 이상이다.It provides a stress dispersion film having excellent stress dispersibility. Moreover, the optical member and electronic member provided with such a stress dispersion film are provided. The stress-dispersion film of this invention is a stress-dispersion film containing the laminated body of a plastic film and an adhesive layer, and the indentation energy at the time of applying the load in the perpendicular direction with the said laminated body from the plastic film side of the said laminated body is 260 microJ or more. .

Description

응력 분산 필름, 광학 부재 및 전자 부재{STRESS DISTRIBUTING FILM, OPTICAL MEMBER, AND ELECTRONIC MEMBER}STRESS DISTRIBUTING FILM, OPTICAL MEMBER, AND ELECTRONIC MEMBER}

본 발명은 응력 분산 필름, 해당 응력 분산 필름을 구비한 광학 부재나 전자 부재에 관한 것이다.The present invention relates to a stress dispersion film, an optical member and an electronic member provided with the stress dispersion film.

LCD를 사용한 터치 패널, 카메라의 렌즈부, 전자 기기 등의 광학 부재나 전자 부재에는, 강성이나 내충격성을 부여하기 위해서, 노출면측에 점착성 필름이 접착되어 있는 경우가 있다(예를 들어, 특허문헌 1). 이러한 점착성 필름은, 통상 기재층과 점착제층을 갖는다.In order to provide rigidity or impact resistance, optical films, such as a touch panel using LCD, a lens part of a camera, and an electronic device, an adhesive film may be adhere | attached on the exposed surface side (for example, a patent document One). Such an adhesive film has a base material layer and an adhesive layer normally.

상기와 같은 광학 부재나 전자 부재에는, 조립시, 가공시, 수송시, 사용시 등의 각종 상황에서, 압입력에 의한 부하가 걸리는 경우가 있어, 이러한 부하에 의해 광학 부재나 전자 부재가 파손되어 버린다는 문제가 발생한다.The optical member and the electronic member as described above may be subjected to a load due to a pressing force in various situations such as assembly, processing, transportation, and use, and the optical member and the electronic member are damaged by such a load. Causes a problem.

일본 특허 공개 제2014-234460호 공보Japanese Patent Publication No. 2014-234460

본 발명의 과제는, 우수한 응력 분산성을 갖는 응력 분산 필름을 제공하는 데 있다. 또한, 그러한 응력 분산 필름을 구비한 광학 부재나 전자 부재를 제공하는 데 있다.An object of the present invention is to provide a stress dispersing film having excellent stress dispersibility. Moreover, it is providing the optical member and electronic member provided with such a stress dispersion film.

본 발명의 응력 분산 필름은,The stress dispersing film of the present invention,

플라스틱 필름과 점착제층의 적층체를 포함하는 응력 분산 필름이며,It is a stress dispersion film containing the laminated body of a plastic film and an adhesive layer,

해당 적층체의 플라스틱 필름측으로부터 해당 적층체와 수직 방향으로 하중을 가했을 때의 압입 에너지가 260μJ 이상이다.The indentation energy when the load is applied in the direction perpendicular to the laminate from the plastic film side of the laminate is 260 µJ or more.

하나의 실시 형태에서는, 상기 플라스틱 필름의 두께가 4㎛ 내지 500㎛이다.In one embodiment, the thickness of the said plastic film is 4 micrometers-500 micrometers.

하나의 실시 형태에서는, 상기 점착제층의 두께가 1㎛ 내지 300㎛이다.In one embodiment, the thickness of the said adhesive layer is 1 micrometer-300 micrometers.

하나의 실시 형태에서는, 상기 점착제층이 점착제 조성물로 형성되고, 해당 점착제 조성물이, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)와 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)를 갖는 중합체(A)를 포함한다.In one embodiment, the said adhesive layer is formed from an adhesive composition, and this adhesive composition has OH in the monomeric unit (I) derived from (meth) acrylic-acid alkylester which has a C1-C20 alkyl group as an alkylester part, and a molecule | numerator Polymer (A) which has monomeric unit (II) derived from the (meth) acrylic acid ester which has group and / or COOH group.

하나의 실시 형태에서는, 상기 점착제 조성물 중의 NCO기의 몰 함유 비율을 [NCO]로 하고, 해당 점착제 조성물 중의 에폭시기의 몰 함유 비율을 [에폭시]로 하고, 해당 점착제 조성물 중의 OH기의 몰 함유 비율을 [OH]로 하고, 해당 점착제 조성물 중의 COOH기의 몰 함유 비율을 [COOH]로 했을 때, ([NCO]+[에폭시])/([OH]+[COOH])<0.05이다.In one embodiment, the molar content rate of the NCO group in the said adhesive composition is set to [NCO], the molar content rate of the epoxy group in the said adhesive composition is set to [epoxy], and the molar content rate of the OH group in this adhesive composition is made into It is ([NCO] + [epoxy]) / ([OH] + [COOH]) <0.05, when it is set as [OH] and the molar content rate of the COOH group in this adhesive composition is [COOH].

하나의 실시 형태에서는, 상기 점착제 조성물이 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함한다.In one embodiment, the said adhesive composition contains a bifunctional or more organic polyisocyanate type crosslinking agent and / or an epoxy type crosslinking agent.

하나의 실시 형태에서는, 상기 점착제 조성물이, 화학식 (1)로 표현되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위를 갖는, 중량 평균 분자량이 1000 이상 30000 미만인 중합체(B)를 포함한다.In one embodiment, the said adhesive composition contains the polymer (B) whose weight average molecular weights which have a monomeric unit derived from an alicyclic structure containing (meth) acrylic acid ester represented by General formula (1) are 1000 or more and less than 30000.

CH2=C(R1)COOR2 … (1)CH 2 = C (R 1 ) COOR 2 ... (One)

(화학식 (1) 중, R1은 수소 원자 또는 메틸기이며, R2는 지환식 구조를 갖는 탄화수소기임)(In Formula (1), R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group having an alicyclic structure.)

하나의 실시 형태에서는, 상기 점착제층의, -40℃ 내지 150℃의 전체 온도 영역에서의 손실 정접 tanδ가 0.10 이상이다.In one embodiment, the loss tangent tan-delta in the whole temperature range of -40 degreeC-150 degreeC of the said adhesive layer is 0.10 or more.

본 발명의 광학 부재는 상기 응력 분산 필름을 구비한다.The optical member of the present invention includes the stress dispersion film.

본 발명의 전자 부재는 상기 응력 분산 필름을 구비한다.The electronic member of this invention is equipped with the said stress dispersion film.

본 발명에 따르면, 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다. 또한, 그러한 응력 분산 필름을 구비한 광학 부재나 전자 부재를 제공할 수 있다.According to the present invention, it is possible to provide a stress dispersing film having excellent stress dispersibility. Moreover, the optical member or electronic member provided with such a stress dispersion film can be provided.

도 1은 본 발명의 하나의 실시 형태에 의한 응력 분산 필름의 개략 단면도이다.
도 2는 본 발명의 다른 하나의 실시 형태에 의한 응력 분산 필름의 개략 단면도이다.
1 is a schematic cross-sectional view of a stress dispersion film according to one embodiment of the present invention.
2 is a schematic cross-sectional view of a stress dispersing film according to another embodiment of the present invention.

본 명세서 중에서 「(메트)아크릴」이라는 표현이 있을 경우에는, 「아크릴 및/또는 메타크릴」을 의미하고, 「(메트)아크릴레이트」라는 표현이 있을 경우에는, 「아크릴레이트 및/또는 메타크릴레이트」를 의미한다. 또한, 본 명세서 중에서 「중량」이라는 표현이 있을 경우에는, 무게를 나타내는 SI계 단위로서 관용되고 있는 「질량」으로 대체해도 된다.In this specification, when there exists an expression of "(meth) acryl", it means "acryl and / or methacryl", and when there is an expression of "(meth) acrylate", it is "acrylate and / or methacryl" Rate ”. In addition, when there is an expression "weight" in this specification, you may replace with the "mass" commonly used as SI type unit which shows weight.

본 명세서 중에서 「(a)유래의 단량체 단위(A)」라는 표현이 있을 경우에는, 단량체 단위(A)는 단량체(a)가 갖는 불포화 이중 결합이 중합에 의해 개열해서 형성되는 구조 단위이다. 또한, 불포화 이중 결합이 중합에 의해 개열해서 형성되는 구조 단위란, 「RpRqC=CRrRs」의 구조(Rp, Rq, Rr, Rs는, 탄소 원자와 단결합으로 결합하는 임의의 적절한 기)의 불포화 이중 결합 「C=C」가 중합에 의해 개열해서 형성되는 「-RpRqC-CRrRs-」의 구조 단위이다.In this specification, when there exists the expression "(a) monomeric unit (A)", monomeric unit (A) is a structural unit in which the unsaturated double bond which monomer (a) has cleaved by superposition | polymerization, and is formed. In addition, the structural unit in which an unsaturated double bond cleaves by superposition | polymerization is formed and unsaturated double of the structure of "RpRqC = CRrRs" (Rp, Rq, Rr, Rs is arbitrary appropriate group couple | bonded with a carbon atom by a single bond) Bond "C = C" is a structural unit of "-RpRqC-CRrRs-" formed by cleavage by superposition | polymerization.

본 명세서 중에서, 중합체 중의 단량체 단위의 함유 비율은, 예를 들어 해당 중합체의 각종 구조 해석(예를 들어, NMR 등)에 의해 알 수 있다. 또한, 상기와 같은 각종 구조 해석을 행하지 않아도, 중합체를 제조할 때 사용하는 각종 단량체의 사용량에 기초하여 산출되는 해당 각종 단량체 유래의 단량체 단위의 함유 비율을 중합체 중의 단량체 단위의 함유 비율로 해도 된다. 즉, 중합체를 제조할 때 사용하는 전체 단량체 성분 중의, 어떤 단량체(m)의 함유 비율을, 해당 중합체 중의 단량체(m) 유래의 단량체 단위의 함유 비율로서 취급해도 된다.In this specification, the content rate of the monomeric unit in a polymer can be known, for example by various structural analysis (for example, NMR etc.) of the said polymer. Moreover, even if it does not perform the above various structural analysis, you may make content rate of the monomeric unit derived from the said various monomer calculated based on the usage-amount of the various monomers used when manufacturing a polymer as a content rate of the monomeric unit in a polymer. That is, you may handle the content rate of any monomer (m) in the all monomer components used when manufacturing a polymer as content rate of the monomeric unit derived from the monomer (m) in the said polymer.

≪≪A. 응력 분산 필름≫≫≪≪A. Stress Dispersion Film≫≫

본 발명의 응력 분산 필름은, 플라스틱 필름과 점착제층의 적층체를 포함한다. 플라스틱 필름은 1층이어도 되고, 2층 이상이어도 된다. 점착제층은 1층이어도 되고, 2층 이상이어도 된다.The stress dispersion film of this invention contains the laminated body of a plastic film and an adhesive layer. One layer may be sufficient as a plastic film, and two or more layers may be sufficient as it. One layer may be sufficient as an adhesive layer, and two or more layers may be sufficient as it.

도 1은, 본 발명의 하나의 실시 형태에 의한 응력 분산 필름의 개략 단면도이다. 도 1에서, 본 발명의 응력 분산 필름(100)은, 플라스틱 필름(10)과 점착제층(20)의 적층체로 이루어진다. 도 1에는 도시되지 않지만, 점착제층(20)의 표면에는, 임의의 적절한 강 접착층이 설치되어 있어도 된다.1 is a schematic cross-sectional view of a stress dispersing film according to one embodiment of the present invention. In FIG. 1, the stress dispersion film 100 of this invention consists of a laminated body of the plastic film 10 and the adhesive layer 20. As shown in FIG. Although not shown in FIG. 1, any suitable steel adhesive layer may be provided on the surface of the pressure-sensitive adhesive layer 20.

도 2는, 본 발명의 다른 하나의 실시 형태에 의한 응력 분산 필름의 개략 단면도이다. 도 2에서, 본 발명의 응력 분산 필름(100)은, 점착제층(20)과 플라스틱 필름(10)과 점착제층(20)으로 이루어지고, 점착제층(20)과 플라스틱 필름(10)과 점착제층(20)을 이 순서대로 갖는다. 즉, 도 2에서, 본 발명의 응력 분산 필름(100)은, 점착제층(20)과, 플라스틱 필름(10)과 점착제층(20)의 적층체로 이루어진다. 도 2에는 도시되지 않지만, 편측 또는 양측의 점착제층(20)의 표면에는, 임의의 적절한 강 접착층이 설치되어 있어도 된다.2 is a schematic cross-sectional view of a stress dispersing film according to another embodiment of the present invention. In FIG. 2, the stress dispersion film 100 of this invention consists of an adhesive layer 20, the plastic film 10, and the adhesive layer 20, and the adhesive layer 20, the plastic film 10, and the adhesive layer Have (20) in this order. That is, in FIG. 2, the stress dispersion film 100 of this invention consists of a laminated body of the adhesive layer 20, the plastic film 10, and the adhesive layer 20. As shown in FIG. Although not shown in FIG. 2, any suitable steel adhesive layer may be provided on the surface of the pressure-sensitive adhesive layer 20 on one side or both sides.

점착제층이 최외층으로서 노출되는 형태의 경우에는, 해당 노출면측에 임의의 적절한 세퍼레이터(박리 시트)를 설치해도 된다.In the case of the form which an adhesive layer exposes as an outermost layer, you may provide arbitrary appropriate separators (peel sheet) on the said exposure surface side.

본 발명의 응력 분산 필름은, 플라스틱 필름과 점착제층의 적층체의 플라스틱 필름측으로부터 해당 적층체와 수직 방향으로 하중을 가했을 때의 압입 에너지가 260μJ 이상이다. 상기 압입 에너지의 측정 방법에 대해서는 후술한다. 상기 압입 에너지는, 바람직하게는 260μJ 내지 10000μJ이며, 보다 바람직하게는 270μJ 내지 9000μJ이며, 더욱 바람직하게는 280μJ 내지 8000μJ이며, 특히 바람직하게는 290μJ 내지 7000μJ이다. 상기 압입 에너지가 상기 범위 내에 있음으로써, 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.In the stress dispersion film of the present invention, the indentation energy when a load is applied in the direction perpendicular to the laminate from the plastic film side of the laminate of the plastic film and the pressure-sensitive adhesive layer is 260 µJ or more. The measuring method of the said indentation energy is mentioned later. The indentation energy is preferably 260 µJ to 10000 µJ, more preferably 270 µJ to 9000 µJ, still more preferably 280 µJ to 8000 µJ, and particularly preferably 290 µJ to 7000 µJ. By the indentation energy being in the above range, it is possible to provide a stress dispersion film having excellent stress dispersibility.

플라스틱 필름의 두께는, 바람직하게는 4㎛ 내지 500㎛이며, 보다 바람직하게는 10㎛ 내지 400㎛이며, 더욱 바람직하게는 15㎛ 내지 350㎛이며, 특히 바람직하게는 20㎛ 내지 300㎛이다. 플라스틱 필름의 두께가 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The thickness of the plastic film is preferably 4 µm to 500 µm, more preferably 10 µm to 400 µm, still more preferably 15 µm to 350 µm, and particularly preferably 20 µm to 300 µm. By the thickness of a plastic film being in the said range, the stress dispersing film which has more excellent stress dispersibility can be provided.

점착제층의 두께는, 바람직하게는 1㎛ 내지 300㎛이며, 보다 바람직하게는 2㎛ 내지 250㎛이며, 더욱 바람직하게는 4㎛ 내지 200㎛이며, 특히 바람직하게는 5㎛ 내지 150㎛이다. 점착제층의 두께가 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The thickness of an adhesive layer becomes like this. Preferably it is 1 micrometer-300 micrometers, More preferably, it is 2 micrometers-250 micrometers, More preferably, it is 4 micrometers-200 micrometers, Especially preferably, it is 5 micrometers-150 micrometers. By the thickness of an adhesive layer being in the said range, the stress dispersion film which has more excellent stress dispersibility can be provided.

플라스틱 필름으로서는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 플라스틱 필름을 채용할 수 있다. 이러한 플라스틱 필름은, 예를 들어 그의 ASTM D695에서의 압축 강도가, 바람직하게는 100Kg/cm2 내지 3000Kg/cm2이며, 보다 바람직하게는 200Kg/cm2 내지 2900Kg/cm2이며, 더욱 바람직하게는 300Kg/cm2 내지 2800Kg/cm2이며, 특히 바람직하게는 400Kg/cm2 내지 2700Kg/cm2이다. 이러한 플라스틱 필름으로서는, 구체적으로는, 예를 들어 폴리에스테르계 수지, 폴리올레핀계 수지, 폴리아미드계 수지, 폴리이미드계 수지 등을 들 수 있다. 폴리에스테르계 수지로서는, 예를 들어 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리에틸렌나프탈레이트 등을 들 수 있다. 폴리올레핀계 수지로서는, 예를 들어 올레핀 단량체의 단독 중합체, 올레핀 단량체의 공중합체 등을 들 수 있다. 폴리올레핀계 수지로서는, 구체적으로는, 예를 들어 호모 폴리프로필렌; 에틸렌 성분을 공중합 성분으로 하는 블록계, 랜덤계, 그래프트계 등의 프로필렌계 공중합체; 리액터 TPO; 저밀도, 고밀도, 리니어 저밀도, 초저밀도 등의 에틸렌계 중합체; 에틸렌·프로필렌 공중합체, 에틸렌·아세트산비닐 공중합체, 에틸렌·아크릴산메틸 공중합체, 에틸렌·아크릴산에틸 공중합체, 에틸렌·아크릴산부틸 공중합체, 에틸렌·메타크릴산 공중합체, 에틸렌·메타크릴산메틸 공중합체 등의 에틸렌계 공중합체; 등을 들 수 있다.As a plastic film, arbitrary appropriate plastic films can be employ | adopted in the range which does not impair the effect of this invention. These plastic films are, for example, its compressive strength in ASTM D695, preferably 100Kg / cm 2 to about 3000Kg / cm 2, preferably in the 200Kg / cm 2 to about 2900Kg / cm 2 more, and more preferably 300 Kg / cm 2 to 2800 Kg / cm 2 , particularly preferably 400 Kg / cm 2 to 2700 Kg / cm 2 . Specific examples of such plastic films include polyester resins, polyolefin resins, polyamide resins, polyimide resins, and the like. Examples of the polyester resins include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and the like. As polyolefin resin, the homopolymer of an olefin monomer, the copolymer of an olefin monomer, etc. are mentioned, for example. Specifically as polyolefin resin, For example, Homo polypropylene; Propylene copolymers such as block-based, random-based, and graft-based copolymers having an ethylene component as a copolymerization component; Reactor TPO; Ethylene polymers such as low density, high density, linear low density and ultra low density; Ethylene propylene copolymer, ethylene vinyl acetate copolymer, ethylene methyl acrylate copolymer, ethylene ethyl acrylate copolymer, ethylene butyl acrylate copolymer, ethylene methacrylic acid copolymer, ethylene methyl methacrylate copolymer Ethylenic copolymers such as these; Etc. can be mentioned.

플라스틱 필름은, 필요에 따라 임의의 적절한 첨가제를 함유할 수 있다. 플라스틱 필름에 함유될 수 있는 첨가제로서는, 예를 들어 산화 방지제, 자외선 흡수제, 광안정제, 대전 방지제, 충전제, 안료 등을 들 수 있다. 플라스틱 필름에 함유될 수 있는 첨가제의 종류, 수, 양은, 목적에 따라서 적절하게 설정될 수 있다.The plastic film may contain any suitable additive as needed. As an additive which may be contained in a plastic film, antioxidant, a ultraviolet absorber, a light stabilizer, an antistatic agent, a filler, a pigment, etc. are mentioned, for example. The kind, number, and amount of additives that may be contained in the plastic film may be appropriately set according to the purpose.

점착제층으로서는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 점착제층을 채용할 수 있다. 이러한 점착제층으로서는, 예를 들어 아크릴계 점착제로 형성되는 점착제층, 고무계 점착제로 형성되는 점착제층, 실리콘계 점착제로 형성되는 점착제층, 우레탄계 점착제로 형성되는 점착제층 등을 들 수 있다.As an adhesive layer, arbitrary appropriate adhesive layers can be employ | adopted in the range which does not impair the effect of this invention. As such an adhesive layer, the adhesive layer formed from an acrylic adhesive, the adhesive layer formed from a rubber adhesive, the adhesive layer formed from a silicone adhesive, the adhesive layer formed from a urethane type adhesive, etc. are mentioned, for example.

점착제층은, 바람직하게는 점착제 조성물로 형성된다.The pressure-sensitive adhesive layer is preferably formed of a pressure-sensitive adhesive composition.

점착제층은, 예를 들어 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조하여, 기재 상에 점착제층을 형성한다. 그 후, 기재를 박리하면, 점착제층이 얻어진다. 또한, 예를 들어 점착제 조성물을 임의의 적절한 플라스틱 필름 상에 도포하고, 필요에 따라 건조하여, 플라스틱 필름 상에 점착제층을 형성하고, 플라스틱 필름을 그대로 남김으로써, 점착제층과 플라스틱 필름을 포함하는 응력 분산 필름이 얻어진다. 또한, 예를 들어 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조하여, 기재 상에 점착제층을 형성하고, 기재를 박리해서 얻어지는 점착제층을 플라스틱 필름에 적재함으로써, 점착제층과 플라스틱 필름을 포함하는 응력 분산 필름이 얻어진다. 또한, 예를 들어 점착제 조성물을 임의의 적절한 기재 상에 도포하고, 필요에 따라 건조하여, 기재 상에 점착제층을 형성하고, 기재 상에 형성된 점착제층을 플라스틱 필름에 전사함으로써 점착제층과 플라스틱 필름을 포함하는 응력 분산 필름이 얻어진다.An adhesive layer apply | coats an adhesive composition on arbitrary suitable base materials, for example, it dries as needed, and forms an adhesive layer on a base material. Then, when a base material is peeled off, an adhesive layer is obtained. In addition, for example, the pressure-sensitive adhesive layer and the plastic film are stressed by applying the pressure-sensitive adhesive composition on any suitable plastic film, drying as necessary to form the pressure-sensitive adhesive layer on the plastic film, and leaving the plastic film as it is. A dispersion film is obtained. Moreover, an adhesive layer and a plastics are apply | coated, for example by apply | coating an adhesive composition on arbitrary appropriate base materials, drying as needed, forming an adhesive layer on a base material, and loading the adhesive layer obtained by peeling a base material to a plastic film. A stress dispersing film comprising a film is obtained. Further, for example, the pressure-sensitive adhesive composition and the plastic film are applied by applying the pressure-sensitive adhesive composition on any suitable substrate, drying as necessary to form an adhesive layer on the substrate, and transferring the pressure-sensitive adhesive layer formed on the substrate to the plastic film. The stress-dispersing film containing is obtained.

점착제 조성물의 도포 방법으로서는, 예를 들어, 롤 코트, 그라비아 코트, 리버스 코트, 롤 브러시, 스프레이 코트, 에어 나이프 코팅법, 다이 코터 등에 의한 압출 코트 등을 들 수 있다.As a coating method of an adhesive composition, the extrusion coat by a roll coat, a gravure coat, a reverse coat, a roll brush, a spray coat, an air knife coating method, a die coater, etc. are mentioned, for example.

이러한 점착제 조성물은, 바람직하게는 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)와 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)를 갖는 중합체(A)를 포함한다.Such a pressure-sensitive adhesive composition is preferably derived from a (meth) acrylic acid ester having a monomer unit (I) derived from a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester portion and an OH group and / or a COOH group in a molecule thereof. The polymer (A) which has a monomeric unit (II) of is included.

점착제 조성물 중의 상기 중합체(A)의 함유 비율은, 바람직하게는 80중량% 내지 100중량%이며, 보다 바람직하게는 85중량% 내지 100중량%이며, 더욱 바람직하게는 90중량% 내지 100중량%이며, 특히 바람직하게는 92.5중량% 내지 100중량%이며, 가장 바람직하게는 95중량% 내지 100중량%이다. 점착제 조성물 중의 상기 중합체(A)의 함유 비율이 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The content rate of the said polymer (A) in an adhesive composition becomes like this. Preferably it is 80 weight%-100 weight%, More preferably, it is 85 weight%-100 weight%, More preferably, it is 90 weight%-100 weight% Especially preferably, they are 92.5 weight%-100 weight%, Most preferably, they are 95 weight%-100 weight%. When the content rate of the said polymer (A) in an adhesive composition exists in the said range, the stress dispersion film which has more excellent stress dispersibility can be provided.

중합체(A)는, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)를 갖는다. 중합체(A) 중의, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)는 1종만이어도 되고, 2종 이상이어도 된다.The polymer (A) has a monomer unit (I) derived from a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester moiety. 1 type may be sufficient as the monomer unit (I) derived from the (meth) acrylic-acid alkylester which has a C1-C20 alkyl group as an alkyl ester part in a polymer (A), and may be 2 or more types.

중합체(A) 중의, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)의 함유 비율은, 바람직하게는 90중량% 내지 99.5중량%이며, 보다 바람직하게는 91중량% 내지 99중량%이며, 더욱 바람직하게는 92중량% 내지 98.5중량%이며, 특히 바람직하게는 93중량% 내지 98.2중량%이며, 가장 바람직하게는 94중량% 내지 98중량%이다. 중합체(A) 중의, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)의 함유 비율이 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The content rate of the monomer unit (I) derived from the (meth) acrylic-acid alkylester which has a C1-C20 alkyl group as an alkyl ester part in a polymer (A) becomes like this. Preferably it is 90 to 99.5 weight%, More preferably, it is more preferable. Preferably it is 91 to 99 weight%, More preferably, it is 92 to 98.5 weight%, Especially preferably, it is 93 to 98.2 weight%, Most preferably, it is 94 to 98 weight%. Stress dispersion | distribution which has more excellent stress dispersibility by the content rate of the monomeric unit (I) derived from the (meth) acrylic-acid alkylester which has a C1-C20 alkyl group as an alkyl ester part in a polymer (A) exists in the said range. Films may be provided.

탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르로서는, 예를 들어 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, n-부틸(메트)아크릴레이트, s-부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, 헥실(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 이소옥틸(메트)아크릴레이트, n-노닐(메트)아크릴레이트, 이소노닐(메트)아크릴레이트, n-데실(메트)아크릴레이트, 이소데실(메트)아크릴레이트, n-도데실(메트)아크릴레이트, n-트리데실(메트)아크릴레이트, n-테트라데실(메트)아크릴레이트 등을 들 수 있다.As a (meth) acrylic-acid alkylester which has a C1-C20 alkyl group as an alkyl ester part, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, s-butyl ( Meth) acrylate, t-butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (Meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) acrylate, n-tetradecyl (meth) acrylate, etc. are mentioned.

중합체(A)는, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)를 갖는다. 중합체(A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)는 1종만이어도 되고, 2종 이상이어도 된다. 중합체(A)가 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)를 가짐으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.Polymer (A) has monomeric unit (II) derived from (meth) acrylic acid ester which has OH group and / or COOH group in a molecule | numerator. 1 type of monomeric units (II) derived from the (meth) acrylic acid ester which has an OH group and / or a COOH group in a molecule | numerator in a polymer (A) may be sufficient, and 2 or more types may be sufficient as it. When the polymer (A) has a monomer unit (II) derived from (meth) acrylic acid ester having an OH group and / or a COOH group in a molecule, a stress dispersion film having more excellent stress dispersibility can be provided.

중합체(A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)의 함유 비율은, 바람직하게는 0.5중량% 내지 10중량%이며, 보다 바람직하게는 1중량% 내지 9중량%이며, 더욱 바람직하게는 1.5중량% 내지 8중량%이며, 특히 바람직하게는 1.8중량% 내지 7중량%이며, 가장 바람직하게는 2중량% 내지 6중량%이다. 중합체(A) 중의, 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)의 함유 비율이 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The content ratio of the monomer unit (II) derived from the (meth) acrylic acid ester having an OH group and / or a COOH group in the molecule in the polymer (A) is preferably 0.5% by weight to 10% by weight, more preferably 1 It is weight%-9 weight%, More preferably, it is 1.5 weight%-8 weight%, Especially preferably, it is 1.8 weight%-7 weight%, Most preferably, they are 2 weight%-6 weight%. Since the content rate of the monomeric unit (II) derived from the (meth) acrylic acid ester which has OH group and / or COOH group in a molecule | numerator in a polymer (A) exists in the said range, the stress dispersion film which has more excellent stress dispersibility is provided. can do.

분자 내에 OH기를 갖는 (메트)아크릴산에스테르로서는, 예를 들어 2-히드록시에틸(메트)아크릴레이트, 2-히드록시프로필(메트)아크릴레이트, 4-히드록시부틸(메트)아크릴레이트, 6-히드록시헥실(메트)아크릴레이트, 8-히드록시옥틸(메트)아크릴레이트, 10-히드록시데실(메트)아크릴레이트, 12-히드록시라우릴(메트)아크릴레이트, (4-히드록시메틸시클로헥실)메틸아크릴레이트, N-메틸올(메트)아크릴아미드, 비닐알코올, 알릴알코올, 2-히드록시에틸비닐에테르, 4-히드록시부틸비닐에테르, 디에틸렌글리콜모노비닐에테르 등을 들 수 있다.As a (meth) acrylic acid ester which has an OH group in a molecule | numerator, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6- Hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclo Hexyl) methyl acrylate, N-methylol (meth) acrylamide, vinyl alcohol, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, etc. are mentioned.

분자 내에 COOH기를 갖는 (메트)아크릴산에스테르로서는, 예를 들어 (메트)아크릴산, 카르복시에틸(메트)아크릴레이트, 카르복시펜틸(메트)아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산, 이소크로톤산 등을 들 수 있다.As a (meth) acrylic acid ester which has a COOH group in a molecule | numerator, it is (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, for example. Etc. can be mentioned.

중합체(A)는, 그 밖의 단량체 유래의 단량체 단위(III)를 갖고 있어도 된다. 중합체(A) 중의, 그 밖의 단량체 유래의 단량체 단위(III)는 1종만이어도 되고, 2종 이상이어도 된다.The polymer (A) may have a monomer unit (III) derived from another monomer. 1 type of monomeric units (III) derived from another monomer in a polymer (A) may be sufficient, and 2 or more types may be sufficient as it.

그 밖의 단량체로서는, 예를 들어 시아노기 함유 단량체, 비닐에스테르 단량체, 방향족 비닐 단량체, 아미드기 함유 단량체, 이미드기 함유 단량체, 아미노기 함유 단량체, 에폭시기 함유 단량체, 비닐에테르 단량체, N-아크릴로일모르폴린, 술포기 함유 단량체, 인산기 함유 단량체, 산 무수물 기 함유 단량체 등을 들 수 있다.As another monomer, a cyano group containing monomer, a vinyl ester monomer, an aromatic vinyl monomer, an amide group containing monomer, an imide group containing monomer, an amino group containing monomer, an epoxy group containing monomer, a vinyl ether monomer, N-acryloyl morpholine , Sulfo group-containing monomers, phosphoric acid group-containing monomers, acid anhydride group-containing monomers, and the like.

점착제 조성물은, 해당 점착제 조성물 중의 NCO기의 몰 함유 비율을 [NCO]로 하고, 해당 점착제 조성물 중의 에폭시기의 몰 함유 비율을 [에폭시]로 하고, 해당 점착제 조성물 중의 OH기의 몰 함유 비율을 [OH]로 하고, 해당 점착제 조성물 중의 COOH기의 몰 함유 비율을 [COOH]로 했을 때, ([NCO]+[에폭시])/([OH]+[COOH])<0.05이다. ([NCO]+[에폭시])/([OH]+[COOH])가 상기 범위에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다. 또한, 점착제 조성물 중에 NCO기가 존재하지 않는 경우에는 [NCO]=0이며, 점착제 조성물 중에 에폭시기가 존재하지 않는 경우에는 [에폭시]=0이다. 즉, ([NCO]+[에폭시])/([OH]+[COOH])의 하한값은 0이다.The pressure sensitive adhesive composition has a molar content ratio of NCO groups in the pressure sensitive adhesive composition as [NCO], a molar content ratio of epoxy groups in the pressure sensitive adhesive composition as [epoxy], and a molar content rate of OH groups in the pressure sensitive adhesive composition as [OH]. ], And it is ([NCO] + [epoxy]) / ([OH] + [COOH]) <0.05, when the molar content rate of COOH group in this adhesive composition is [COOH]. When ([NCO] + [epoxy]) / ([OH] + [COOH]) is in the above range, a stress dispersing film having more excellent stress dispersibility can be provided. In addition, when there is no NCO group in an adhesive composition, [NCO] = 0, and when there is no epoxy group in an adhesive composition, [epoxy] = 0. In other words, the lower limit of ([NCO] + [epoxy]) / ([OH] + [COOH]) is zero.

점착제 조성물은, 바람직하게는 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함한다. 본 발명의 점착제 조성물에 포함될 수 있는 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제는, 1종만이어도 되고, 2종 이상이어도 된다.The pressure-sensitive adhesive composition preferably contains a bifunctional or higher organic polyisocyanate crosslinking agent and / or an epoxy crosslinking agent. 1 type may be sufficient as 2 or more types of organic polyisocyanate type crosslinking agents and / or epoxy type crosslinking agents which may be contained in the adhesive composition of this invention, and may be 2 or more types.

점착제 조성물 중의, 상기 2관능 이상의 유기 폴리이소시아네이트계 가교제 및 에폭시계 가교제의 합계 함유 비율은, 중합체(A) 100중량부에 대하여 바람직하게는 0.001중량부 내지 0.4중량부이며, 보다 바람직하게는 0.0025중량부 내지 0.3중량부이며, 더욱 바람직하게는 0.005중량부 내지 0.2중량부이며, 특히 바람직하게는 0.0075중량부 내지 0.15중량부이며, 가장 바람직하게는 0.01중량부 내지 0.1중량부이다. 본 발명의 점착제 조성물 중의 상기 2관능 이상의 유기 폴리이소시아네이트계 가교제 및 에폭시계 가교제의 합계 함유 비율이 중합체(A) 100중량부에 대하여 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The total content of the bifunctional or higher organic polyisocyanate crosslinking agent and the epoxy crosslinking agent in the pressure sensitive adhesive composition is preferably 0.001 part by weight to 0.4 part by weight, more preferably 0.0025 part by weight based on 100 parts by weight of the polymer (A). To 0.3 part by weight, more preferably 0.005 to 0.2 part by weight, particularly preferably 0.0075 to 0.15 part by weight, most preferably 0.01 to 0.1 part by weight. Since the total content ratio of the said bifunctional or more organic polyisocyanate type crosslinking agent and the epoxy type crosslinking agent in the adhesive composition of this invention exists in the said range with respect to 100 weight part of polymers (A), the stress dispersion film which has more excellent stress dispersibility is obtained. Can provide.

2관능 이상의 유기 폴리이소시아네이트계 가교제로서는, 예를 들어 부틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트 등의 저급 지방족 폴리이소시아네이트류; 시클로펜틸렌디이소시아네이트, 시클로헥실렌디이소시아네이트, 이소포론디이소시아네이트 등의 지환족 이소시아네이트류; 2,4-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 크실릴렌디이소시아네이트 등의 방향족 이소시아네이트류; 트리메틸올프로판/톨릴렌디이소시아네이트 삼량체 부가물(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 L」), 트리메틸올프로판/헥사메틸렌디이소시아네이트 삼량체 부가물(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 HL」), 헥사메틸렌디이소시아네이트의 이소시아누레이트체(예를 들어, 닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 HX」) 등의 이소시아네이트 부가물; 등을 들 수 있다.As a bifunctional or more organic polyisocyanate type crosslinking agent, For example, Lower aliphatic polyisocyanates, such as butylene diisocyanate and hexamethylene diisocyanate; Alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; Aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate and xylylene diisocyanate; Trimethylolpropane / tolylene diisocyanate trimer adduct (for example, Nippon Polyurethane Co., Ltd. make, brand name "coronate L"), trimethylolpropane / hexamethylene diisocyanate trimer adduct (for example, Nippon Poly Isocyanate adducts, such as the urethane high school company make, brand names "coronate HL", and the isocyanurate body of hexamethylene diisocyanate (for example, the Nippon Polyurethane high school company make, brand name "coronate HX"); Etc. can be mentioned.

에폭시계 가교제로서는, 예를 들어 비스페놀 A, 에피클로로히드린형의 에폭시계 수지, 에틸렌글리시딜에테르, 폴리에틸렌글리콜디글리시딜에테르, 글리세린디글리시딜에테르, 글리세린트리글리시딜에테르, 1,6-헥산디올글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 디글리시딜아닐린, 디아민글리시딜아민, N,N,N',N'-테트라글리시딜-m-크실렌디아민(예를 들어, 미쓰비시 가스 가가꾸사 제조, 상품명 「TETRAD-X」), 1,3-비스(N,N-디글리시딜아미노메틸)시클로헥산(예를 들어, 미쓰비시 가스 가가꾸사 제조, 상품명 「TETRAD-C」) 등을 들 수 있다.As an epoxy type crosslinking agent, for example, bisphenol A, an epoxy resin of an epichlorohydrin type, ethylene glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1, 6-hexanediolglycidyl ether, trimethylolpropanetriglycidyl ether, diglycidyl aniline, diamineglycidylamine, N, N, N ', N'-tetraglycidyl-m-xylenediamine (e.g. For example, Mitsubishi Gas Chemical Co., Ltd. brand name "TETRAD-X", 1, 3-bis (N, N- diglycidyl aminomethyl) cyclohexane (for example, Mitsubishi Gas Chemical Co., Ltd. make, brand name) "TETRAD-C") etc. are mentioned.

점착제 조성물은, 화학식 (1)로 표현되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위를 갖는 중량 평균 분자량이 1000 이상 30000 미만인 중합체(B)를 포함하고 있어도 된다.The adhesive composition may contain the polymer (B) whose weight average molecular weight which has a monomeric unit derived from an alicyclic structure containing (meth) acrylic acid ester represented by General formula (1) is 1000 or more and less than 30000.

CH2=C(R1)COOR2 … (1)CH 2 = C (R 1 ) COOR 2 ... (One)

(화학식 (1) 중, R1은 수소 원자 또는 메틸기이며, R2는 지환식 구조를 갖는 탄화수소기임)(In Formula (1), R 1 is a hydrogen atom or a methyl group, and R 2 is a hydrocarbon group having an alicyclic structure.)

중합체(B)는 1종만이어도 되고, 2종 이상이어도 된다.1 type of polymers (B) may be sufficient, and 2 or more types may be sufficient as it.

중합체(B)의 중량 평균 분자량은, 바람직하게는 1000 내지 30000이며, 보다 바람직하게는 1250 내지 25000이며, 더욱 바람직하게는 1500 내지 20000이며, 특히 바람직하게는 1750 내지 15000이며, 가장 바람직하게는 2000 내지 10000이다. 중합체(B)의 중량 평균 분자량이 상기 범위 내에 있음으로써, 가교제의 양을 증가시켜도, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The weight average molecular weight of the polymer (B) is preferably 1000 to 30000, more preferably 1250 to 25000, still more preferably 1500 to 20000, particularly preferably 1750 to 15000, most preferably 2000 To 10000. When the weight average molecular weight of a polymer (B) exists in the said range, even if the amount of a crosslinking agent is increased, the stress dispersion film which has more excellent stress dispersibility can be provided.

점착제 조성물 중의 중합체(B)의 함유 비율은, 중합체(A) 100중량부에 대하여 바람직하게는 0.5중량부 내지 50중량부이며, 보다 바람직하게는 1중량부 내지 45중량부이며, 더욱 바람직하게는 2중량부 내지 40중량부이며, 특히 바람직하게는 3중량부 내지 35중량부이며, 가장 바람직하게는 4중량부 내지 30중량부이다. 점착제 조성물 중의 중합체(B)의 함유 비율이 중합체(A) 100중량부에 대하여 상기 범위 내에 있음으로써, 가교제의 양을 증가시켜도, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The content ratio of the polymer (B) in the pressure-sensitive adhesive composition is preferably 0.5 parts by weight to 50 parts by weight, more preferably 1 part by weight to 45 parts by weight, and more preferably 100 parts by weight of the polymer (A). 2 to 40 parts by weight, particularly preferably 3 to 35 parts by weight, most preferably 4 to 30 parts by weight. By the content rate of the polymer (B) in an adhesive composition being in the said range with respect to 100 weight part of polymers (A), even if the amount of a crosslinking agent is increased, the stress dispersion film which has more excellent stress dispersibility can be provided.

중합체(B) 중의, 화학식 (1)로 표현되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위의 함유 비율은, 바람직하게는 40중량% 내지 99.5중량%이며, 보다 바람직하게는 42.5중량% 내지 99중량%이며, 더욱 바람직하게는 45중량% 내지 98.5중량%이며, 특히 바람직하게는 47.5중량% 내지 98중량%이며, 가장 바람직하게는 50중량% 내지 97.5중량%이다. 중합체(B) 중의, 화학식 (1)로 표현되는 지환식 구조 함유 (메트)아크릴산에스테르 유래의 단량체 단위의 함유 비율이 상기 범위 내에 있음으로써, 가교제의 양을 증가시켜도, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The content rate of the monomeric unit derived from an alicyclic structure containing (meth) acrylic acid ester represented by General formula (1) in a polymer (B) becomes like this. Preferably it is 40 to 99.5 weight%, More preferably, it is 42.5 weight% To 99% by weight, more preferably 45% to 98.5% by weight, particularly preferably 47.5% to 98% by weight, most preferably 50% to 97.5% by weight. Since the content rate of the monomeric unit derived from an alicyclic structure containing (meth) acrylic acid ester represented by General formula (1) in a polymer (B) exists in the said range, even if the quantity of a crosslinking agent is increased, it has more excellent stress dispersibility. A stress dispersion film can be provided.

상기 화학식 (1)로 표현되는 지환식 구조 함유 (메트)아크릴산에스테르로서는, 예를 들어 시클로헥실(메트)아크릴레이트, 디시클로펜타닐(메트)아크릴레이트, 디시클로펜타닐옥시에틸메타크릴레이트, 디시클로펜타닐옥시에틸아크릴레이트, 트리시클로펜타닐메타크릴레이트, 트리시클로펜타닐아크릴레이트, 1-아다만틸메타크릴레이트, 1-아다만틸아크릴레이트, 2-메틸-2-아다만틸메타크릴레이트, 2-메틸-2-아다만틸아크릴레이트, 2-에틸-2-아다만틸메타크릴레이트, 2-에틸-2-아다만틸아크릴레이트 등을 들 수 있다.As an alicyclic structure containing (meth) acrylic acid ester represented by the said General formula (1), for example, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentanyloxyethyl methacrylate, dicyclo Fentanyloxyethyl acrylate, tricyclopentanyl methacrylate, tricyclopentanyl acrylate, 1-adamantyl methacrylate, 1-adamantyl acrylate, 2-methyl-2-adamantyl methacrylate, 2 -Methyl-2-adamantyl acrylate, 2-ethyl-2-adamantyl methacrylate, 2-ethyl-2-adamantyl acrylate, and the like.

중합체(B)는, 그 밖의 단량체 유래의 단량체 단위(IV)를 갖고 있어도 된다. 중합체(B) 중의, 그 밖의 단량체 유래의 단량체 단위(IV)는 1종만이어도 되고, 2종 이상이어도 된다.The polymer (B) may have a monomer unit (IV) derived from another monomer. 1 type of monomeric units (IV) derived from another monomer in a polymer (B) may be sufficient, and 2 or more types may be sufficient as it.

중합체(B)에 포함될 수 있는 그 밖의 단량체로서는, 예를 들어 메틸(메트)아크릴레이트, 에틸(메트)아크릴레이트, n-부틸(메트)아크릴레이트, s-부틸(메트)아크릴레이트, t-부틸(메트)아크릴레이트, 이소부틸(메트)아크릴레이트, 헥실(메트)아크릴레이트, 2-에틸헥실(메트)아크릴레이트, n-옥틸(메트)아크릴레이트, 이소옥틸(메트)아크릴레이트, n-노닐(메트)아크릴레이트, 이소노닐(메트)아크릴레이트, n-데실(메트)아크릴레이트, 이소데실(메트)아크릴레이트, n-도데실(메트)아크릴레이트, n-트리데실(메트)아크릴레이트, n-테트라데실(메트)아크릴레이트, 아크릴산, 메타크릴산, 카르복시에틸아크릴레이트, 카르복시펜틸아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산, 이소크로톤산 등을 들 수 있다.As another monomer which can be contained in a polymer (B), for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, s-butyl (meth) acrylate, t- Butyl (meth) acrylate, isobutyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, n Nonyl (meth) acrylate, isononyl (meth) acrylate, n-decyl (meth) acrylate, isodecyl (meth) acrylate, n-dodecyl (meth) acrylate, n-tridecyl (meth) Acrylate, n-tetradecyl (meth) acrylate, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid and the like.

중합체(A), 중합체(B)는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 방법에 의해 제조할 수 있다. 이러한 제조 방법으로서는, 예를 들어, 용액 중합, 유화 중합, 괴상 중합, 현탁 중합, 광 중합(활성 에너지선 중합) 등을 들 수 있다. 이러한 제조 방법 중에서도, 비용이나 생산성의 관점에서, 바람직하게는 용액 중합이다. 얻어지는 중합체(A)는, 랜덤 공중합체, 블록 공중합체, 교호 공중합체, 그래프트 공중합체 등 어느 것이어도 된다. 얻어지는 중합체(B)는, 랜덤 공중합체, 블록 공중합체, 교호 공중합체, 그래프트 공중합체 등 어느 것이어도 된다.A polymer (A) and a polymer (B) can be manufactured by arbitrary appropriate methods in the range which does not impair the effect of this invention. As such a manufacturing method, solution polymerization, emulsion polymerization, block polymerization, suspension polymerization, photopolymerization (active energy ray polymerization), etc. are mentioned, for example. Among these manufacturing methods, from the viewpoint of cost and productivity, solution polymerization is preferable. The polymer (A) obtained may be any of a random copolymer, a block copolymer, an alternating copolymer, a graft copolymer, and the like. The polymer (B) obtained may be any of a random copolymer, a block copolymer, an alternating copolymer, a graft copolymer, and the like.

용액 중합의 방법으로서는, 예를 들어, 단량체 성분이나 중합 개시제 등을 용제에 용해하고, 가열해서 중합하여, 중합체 용액을 얻는 방법 등을 들 수 있다.As a method of solution polymerization, the method of melt | dissolving a monomer component, a polymerization initiator, etc. in a solvent, heating and superposing | polymerizing, and obtaining a polymer solution etc. are mentioned, for example.

용액 중합에서의, 가열해서 중합할 때의 가열 온도로서는, 예를 들어 50℃ 내지 90℃를 들 수 있다. 용액 중합에서의 가열 시간으로서는, 예를 들어 1시간 내지 24시간을 들 수 있다.As heating temperature at the time of heating and superposing | polymerizing in solution polymerization, 50 degreeC-90 degreeC is mentioned, for example. As heating time in solution polymerization, 1 hour-24 hours are mentioned, for example.

용액 중합에 사용되는 용제로서는, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 용제를 사용할 수 있다. 이러한 용제로서는, 예를 들어 톨루엔, 벤젠, 크실렌 등의 방향족 탄화수소류; 아세트산에틸, 아세트산n-부틸 등의 에스테르류; n-헥산, n-헵탄 등의 지방족 탄화수소류; 시클로헥산, 메틸시클로헥산 등의 지환식 탄화수소류; 메틸에틸케톤, 메틸이소부틸케톤 등의 케톤류; 등의 유기 용제 등을 들 수 있다. 용제는, 1종만이어도 되고, 2종 이상이어도 된다.As a solvent used for solution polymerization, arbitrary appropriate solvent can be used in the range which does not impair the effect of this invention. As such a solvent, For example, aromatic hydrocarbons, such as toluene, benzene, and xylene; Esters such as ethyl acetate and n-butyl acetate; aliphatic hydrocarbons such as n-hexane and n-heptane; Alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; Ketones such as methyl ethyl ketone and methyl isobutyl ketone; Organic solvents, such as these, are mentioned. 1 type of solvents may be sufficient as it, and 2 or more types may be sufficient as it.

중합체(A), 중합체(B)의 제조에서는, 중합 개시제를 사용할 수 있다. 이러한 중합 개시제는, 1종만이어도 되고, 2종 이상이어도 된다. 이러한 중합 개시제로서는, 예를 들어 2,2'-아조비스이소부티로니트릴, 2,2'-아조비스(2-아미디노프로판)디히드로클로라이드, 2,2'-아조비스[2-(5-메틸-2-이미다졸린-2-일)프로판]디히드로클로라이드, 2,2'-아조비스(2-메틸프로피온아미딘)이황산염, 2,2'-아조비스(N,N'-디메틸렌이소부틸아미딘), 2,2'-아조비스[N-(2-카르복시에틸)-2-메틸프로피온아미딘]하이드레이트(와코준야쿠사 제조, VA-057) 등의 아조계 개시제; 과황산칼륨, 과황산암모늄 등의 과황산염; 디(2-에틸헥실)퍼옥시디카르보네이트, 디(4-t-부틸시클로헥실)퍼옥시디카르보네이트, 디-sec-부틸퍼옥시디카르보네이트, t-부틸퍼옥시네오데카노에이트, t-헥실퍼옥시피발레이트, t-부틸퍼옥시피발레이트, 디라우로일퍼옥시드, 디-n-옥타노일퍼옥시드, 1,1,3,3-테트라메틸부틸퍼옥시-2-에틸헥사노에이트, 디(4-메틸벤조일)퍼옥시드, 디벤조일퍼옥시드, t-부틸퍼옥시이소부티레이트, 1,1-디(t-헥실퍼옥시)시클로헥산, t-부틸히드로퍼옥시드, 과산화수소 등의 과산화물계 개시제; 과황산염과 아황산수소나트륨의 조합, 과산화물과 아스코르브산나트륨의 조합 등의, 과산화물과 환원제를 조합한 레독스계 개시제; 등을 들 수 있다.In manufacture of a polymer (A) and a polymer (B), a polymerization initiator can be used. 1 type may be sufficient as such a polymerization initiator, and 2 or more types may be sufficient as it. As such a polymerization initiator, for example, 2,2'- azobisisobutyronitrile, 2,2'- azobis (2-amidinopropane) dihydrochloride, 2,2'- azobis [2- (5 -Methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2'-azobis (2-methylpropionamidine) sulfate, 2,2'-azobis (N, N'- Azo initiators such as dimethylene isobutyl amidine) and 2,2'-azobis [N- (2-carboxyethyl) -2-methylpropionamidine] hydrate (available from Wako Pure Chemical Industries, Ltd., VA-057); Persulfates such as potassium persulfate and ammonium persulfate; Di (2-ethylhexyl) peroxydicarbonate, di (4-t-butylcyclohexyl) peroxydicarbonate, di-sec-butylperoxydicarbonate, t-butylperoxy neodecanoate, t-hexyl peroxy pivalate, t-butyl peroxy pivalate, dilauroyl peroxide, di-n-octanoyl peroxide, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexa Noate, di (4-methylbenzoyl) peroxide, dibenzoylperoxide, t-butylperoxyisobutyrate, 1,1-di (t-hexylperoxy) cyclohexane, t-butylhydroperoxide, hydrogen peroxide, etc. Peroxide initiators; Redox-based initiators in combination with a peroxide and a reducing agent such as a combination of persulfate and sodium bisulfite, and a combination of peroxide and sodium ascorbate; Etc. can be mentioned.

중합 개시제의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어 단량체 성분 100중량부에 대하여, 바람직하게는 0.01중량부 내지 5중량부이다.Any appropriate amount of the polymerization initiator can be employed as long as the effect of the present invention is not impaired. As such a usage-amount, it is 0.01 weight part-5 weight part preferably with respect to 100 weight part of monomer components, for example.

중합체(A), 중합체(B)의 제조에서는, 연쇄 이동제를 사용할 수 있다. 이러한 연쇄 이동제는, 1종만이어도 되고, 2종 이상이어도 된다. 이러한 연쇄 이동제로서는, 예를 들어 라우릴머캅탄, 글리시딜머캅탄, 머캅토아세트산, 2-머캅토에탄올, 티오글리콜산, 티오글리콜산메틸, 티오글리콜산2-에틸헥실, 2,3-디머캅토-1-프로판올 등을 들 수 있다.In manufacture of a polymer (A) and a polymer (B), a chain transfer agent can be used. 1 type of these chain transfer agents may be sufficient, and 2 or more types may be sufficient as it. As such a chain transfer agent, for example, lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-mercaptoethanol, thioglycolic acid, methyl thioglycolate, 2-ethylhexyl 2-thiohexyl, 2,3-dimer Capto-1-propanol etc. are mentioned.

연쇄 이동제의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어 단량체 성분 100중량부에 대하여, 바람직하게는 0.01중량부 내지 5중량부이다.The amount of chain transfer agent used may be any appropriate amount used within the scope of not impairing the effects of the present invention. As such a usage-amount, it is 0.01 weight part-5 weight part preferably with respect to 100 weight part of monomer components, for example.

중합체(A), 중합체(B)의 제조에서는, 일반적으로 중합 반응에 사용할 수 있는 그 밖의 임의의 적절한 첨가제를 사용할 수 있다.In the production of the polymer (A) and the polymer (B), generally any other suitable additive that can be used for the polymerization reaction can be used.

본 발명의 점착제 조성물은, 가교 촉매를 포함하고 있어도 된다. 가교 촉매로서는, 본 발명의 효과를 손상시키지 않는 범위에서 임의의 적절한 가교 촉매를 채용할 수 있다. 이러한 가교 촉매로서는, 예를 들어 테트라-n-부틸티타네이트, 테트라이소프로필티타네이트, 나셈 제2철, 부틸주석옥시드, 디옥틸주석디라우레이트 등의 금속계 가교 촉매(특히 주석계 가교 촉매) 등을 들 수 있다. 가교 촉매는, 1종만이어도 되고, 2종 이상이어도 된다.The adhesive composition of this invention may contain the crosslinking catalyst. As a crosslinking catalyst, arbitrary appropriate crosslinking catalysts can be employ | adopted in the range which does not impair the effect of this invention. Examples of such a crosslinking catalyst include metal-based crosslinking catalysts (especially tin-based crosslinking catalysts) such as tetra-n-butyl titanate, tetraisopropyl titanate, nase ferric iron, butyltin oxide and dioctyltin dilaurate. Can be mentioned. 1 type of crosslinking catalysts may be sufficient, and 2 or more types may be sufficient as it.

가교 촉매의 사용량은, 본 발명의 효과를 손상시키지 않는 범위에서, 임의의 적절한 사용량을 채용할 수 있다. 이러한 사용량으로서는, 예를 들어 단량체 성분 100중량부에 대하여, 바람직하게는 0.001중량부 내지 0.05중량부이다.The amount of the crosslinking catalyst used may be any appropriate amount used within the range that does not impair the effects of the present invention. As such an amount used, for example, it is preferably 0.001 part by weight to 0.05 part by weight based on 100 parts by weight of the monomer component.

점착제 조성물은, 본 발명의 효과를 손상시키지 않는 범위에서 임의의 적절한 그 밖의 첨가제를 함유하고 있어도 된다. 이러한 그 밖의 첨가제로서는, 예를 들어 실란 커플링제, 가교 지연제, 유화제, 착색제, 안료 등의 분체, 염료, 계면 활성제, 가소제, 점착성 부여제, 표면 윤활제, 레벨링제, 연화제, 산화 방지제, 노화 방지제, 광 안정제, 자외선 흡수제, 중합 금지제, 무기 충전제, 유기 충전제, 금속분, 입자상, 박상물 등을 들 수 있다. 이러한 그 밖의 첨가제는, 1종만이어도 되고, 2종 이상이어도 된다.The pressure-sensitive adhesive composition may contain any appropriate other additives within a range that does not impair the effects of the present invention. As such other additives, for example, a silane coupling agent, a crosslinking retardant, an emulsifier, a coloring agent, a powder such as a pigment, a dye, a surfactant, a plasticizer, a tackifier, a surface lubricant, a leveling agent, a softener, an antioxidant, and an antioxidant , Light stabilizers, ultraviolet absorbers, polymerization inhibitors, inorganic fillers, organic fillers, metal powders, particulates, thin substances and the like. 1 type may be sufficient as such another additive, and 2 or more types may be sufficient as it.

점착제층은, -40℃ 내지 150℃의 전체 온도 영역에서의 손실 정접 tanδ가, 바람직하게는 0.10 이상이다. 점착제층의 -40℃ 내지 150℃의 전체 온도 영역에서의 상기 손실 정접 tanδ가 0.10 이상임으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다. 또한, 상기 손실 정접 tanδ의 측정 방법에 대해서는 후술한다.The loss tangent tan-delta in the whole temperature range of -40 degreeC-150 degreeC of an adhesive layer becomes like this. Preferably it is 0.10 or more. When the said loss tangent tan-delta in the whole temperature range of -40 degreeC-150 degreeC of an adhesive layer is 0.10 or more, a stress dispersion film which has more excellent stress dispersibility can be provided. In addition, the measuring method of the said loss tangent tan-delta is mentioned later.

점착제층의 -40℃ 내지 150℃의 전체 온도 영역에서의 상기 손실 정접 tanδ의 상한은, 바람직하게는 2.40 이하이고, 보다 바람직하게는 2.20 이하이고, 더욱 바람직하게는 2.00 이하이고, 특히 바람직하게는 1.80 이하이다. 상기 손실 정접 tanδ의 상한이 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The upper limit of the loss tangent tan δ in the entire temperature range of -40 ° C to 150 ° C of the pressure-sensitive adhesive layer is preferably 2.40 or less, more preferably 2.20 or less, still more preferably 2.00 or less, particularly preferably 1.80 or less. When the upper limit of the said loss tangent tan-delta exists in the said range, the stress dispersion film which has more excellent stress dispersibility can be provided.

점착제층의 -40℃ 내지 150℃의 전체 온도 영역에서의 상기 손실 정접 tanδ의 하한은, 바람직하게는 0.12 이상이며, 보다 바람직하게는 0.14 이상이며, 더욱 바람직하게는 0.16 이상이며, 특히 바람직하게는 0.18 이상이다. 상기 손실 정접 tanδ의 하한이 상기 범위 내에 있음으로써, 보다 우수한 응력 분산성을 갖는 응력 분산 필름을 제공할 수 있다.The lower limit of the loss tangent tan δ in the entire temperature range of −40 ° C. to 150 ° C. of the pressure sensitive adhesive layer is preferably 0.12 or more, more preferably 0.14 or more, still more preferably 0.16 or more, and particularly preferably 0.18 or more. When the lower limit of the loss tangent tan δ is in the above range, a stress dispersing film having more excellent stress dispersibility can be provided.

≪≪C. 광학 부재, 전자 부재≫≫≪≪C. Optical member, electronic member≫≫

본 발명의 응력 분산 필름은, 우수한 응력 분산성을 갖는다. 이 때문에, 광학 부재나 전자 부재를 외부로부터의 충격으로부터 지키는 것 등을 목적으로 하는 보호재로서 적합하게 사용할 수 있다. 즉, 본 발명의 광학 부재는, 본 발명의 응력 분산 필름을 구비한다. 또한, 본 발명의 전자 부재는, 본 발명의 응력 분산 필름을 구비한다.The stress dispersing film of the present invention has excellent stress dispersibility. For this reason, it can use suitably as a protective material for the purpose of protecting an optical member or an electronic member from the impact from the exterior. That is, the optical member of this invention is equipped with the stress dispersion film of this invention. Moreover, the electronic member of this invention is equipped with the stress dispersion film of this invention.

실시예Example

이하, 실시예에 의해 본 발명을 구체적으로 설명하는데, 본 발명은 이들 실시예에 전혀 한정되는 것은 아니다. 또한, 실시예 등에서의 시험 및 평가 방법은 이하와 같다. 또한, 「부」라고 기재되어 있는 경우에는, 특기 사항이 없는 한 「중량부」를 의미하고,「%」라고 기재되어 있는 경우에는, 특기 사항이 없는 한 「중량%」를 의미한다.Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples at all. In addition, the test and evaluation method in an Example etc. are as follows. In addition, when it describes as "part", unless there is a special matter, it means "weight part", and when it describes as "%", it means "weight%" unless there is a special matter.

<중량 평균 분자량의 측정><Measurement of weight average molecular weight>

중합체의 중량 평균 분자량(Mw)은, 도소 가부시키가이샤 제조 GPC 장치(HLC-8220GPC)를 사용하여 측정을 행하였다. 또한, 중량 평균 분자량(Mw)은 폴리스티렌 환산값으로 구하였다.The weight average molecular weight (Mw) of the polymer was measured using the Tosoh Corporation GPC apparatus (HLC-8220GPC). In addition, the weight average molecular weight (Mw) was calculated | required in polystyrene conversion value.

측정 조건은 하기와 같다.Measurement conditions are as follows.

샘플 농도: 0.2중량%(THF 용액)Sample concentration: 0.2 wt% (THF solution)

샘플 주입량: 10μl 용리액Sample injection volume: 10 μl eluent

THF 유속: 0.6ml/minTHF flow rate: 0.6ml / min

측정 온도: 40℃Measuring temperature: 40 ℃

샘플 칼럼: TSKguardcolumn SuperHZ-H(1개)+TSKgel SuperHZM-H(2개)Sample column: TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2)

레퍼런스 칼럼: TSKgel SuperH-RC(1개)Reference column: TSKgel SuperH-RC (x1)

검출기: 시차 굴절계(RI)Detector: Differential Refractometer (RI)

<점착 시트(A)의 제작><Production of Adhesive Sheet (A)>

(실시예 1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 26, 비교예 1, 3, 5, 7)(Examples 1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 26, Comparative Examples 1, 3, 5, 7)

얻어진 점착제 조성물을, 폴리에스테르 수지로 이루어지는 기재 「루미러 S10」(두께 50㎛, 도레이사 제조)에 파운틴 롤로 건조 후의 두께가 10um로 되도록 도포하고, 건조 온도 130℃, 건조 시간 30초의 조건에서 큐어해서 건조하였다. 이와 같이 하여, 기재 상에 점착제층을 제작하였다. 계속해서, 점착제층의 표면에, 한쪽 면에 실리콘 처리를 실시한 두께 25㎛의 폴리에스테르 수지를 포함하는 기재의 실리콘 처리면을 접합하여, 점착 시트(A)를 얻었다.The obtained adhesive composition is apply | coated to the base material "lumirror S10" (thickness 50 micrometers, Toray Corporation) which consists of a polyester resin so that thickness after drying may be set to 10um, and it is cured on condition of drying temperature 130 degreeC, and drying time 30 second. Dried. In this way, an adhesive layer was produced on the substrate. Subsequently, the siliconized surface of the base material which consists of a polyester resin with a thickness of 25 micrometers which performed siliconization on one surface was bonded to the surface of an adhesive layer, and the adhesive sheet (A) was obtained.

(실시예 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 비교예 2, 4, 6, 8)(Examples 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, Comparative Examples 2, 4, 6, 8)

얻어진 점착제 조성물을, 폴리에스테르 수지로 이루어지는 기재 「루미러 S10」(두께 38um, 도레이사 제조)에 파운틴 롤로 건조 후의 두께가 22㎛로 되도록 도포하고, 건조 온도 130℃, 건조 시간 30초의 조건에서 큐어해서 건조하였다. 이와 같이 하여, 기재 상에 점착제층을 제작하였다. 계속해서, 점착제층의 표면에, 한쪽 면에 실리콘 처리를 실시한 두께 25㎛의 폴리에스테르 수지를 포함하는 기재의 실리콘 처리면을 접합하여, 점착 시트(A)를 얻었다.The obtained adhesive composition is apply | coated to the base material "lumirror S10" (thickness 38um, Toray Corporation) which consists of a polyester resin so that thickness after drying may be 22 micrometers, and it is cured on condition of drying temperature of 130 degreeC, and drying time of 30 seconds. Dried. In this way, an adhesive layer was produced on the substrate. Subsequently, the siliconized surface of the base material which consists of a polyester resin with a thickness of 25 micrometers which performed siliconization on one surface was bonded to the surface of an adhesive layer, and the adhesive sheet (A) was obtained.

<압입 에너지의 측정><Measurement of indentation energy>

다이플라 윈테스사 제조의 「SAICAS DN-20형」을 사용하여, 측정 온도: 25℃, 압입 속도: 5㎛/sec로, 하기 수순에 따라 압입 에너지를 산출하였다.The indentation energy was computed according to the following procedure using the "SAICAS DN-20 type | mold by the Daipla Wintes company" at measurement temperature: 25 degreeC and indentation rate: 5 micrometers / sec.

(수순 1)(Step 1)

얻어진 점착 시트(A)의 점착제층측을 플랫 압자(하중 검출측)에 부착하고, 상기 플랫 압자에 부착한 점착 시트(A)의 기재측을 구형 압자에 압입하여, 20N의 하중이 검출되었을 때의 압입 깊이(㎛)를 산출하였다.When the pressure-sensitive adhesive layer side of the obtained pressure-sensitive adhesive sheet (A) is attached to a flat indenter (load detection side), the base material side of the pressure-sensitive adhesive sheet (A) attached to the flat indenter is pressed into a spherical indenter, and a load of 20 N is detected. Indentation depth (μm) was calculated.

(수순 2)(Step 2)

얻어진 점착 시트(A)의 점착제층측을 슬라이드 글래스에 부착하고, 상기 슬라이드 글래스에 부착한 점착 시트(A)의 기재측(하중 검출측)으로부터 구형 압자로 압입하여, 수순 1에서 구한 압입 깊이까지 압입하였다.The pressure-sensitive adhesive layer side of the obtained pressure-sensitive adhesive sheet (A) was attached to the slide glass, press-fitted into the spherical indenter from the base material side (load detection side) of the pressure-sensitive adhesive sheet (A) attached to the slide glass, and press-fitted to the indentation depth determined in Step 1. It was.

구형 압자에 걸리는 수직 하중 y=f(x)(x: 압입 깊이)로 했을 때, 점착 시트(A)의 점착제층측에 20N이 가해질 때까지의 압입 에너지(W)(μJ)를 하기식에 의해 산출했다(r은 점착 시트(A)의 점착제층측에 20N의 하중이 가해질 때의 압입 깊이).When the vertical load y = f (x) (x: indentation depth) applied to a spherical indenter is set, the indentation energy W (μJ) until 20 N is applied to the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet A is expressed by the following equation. It calculated (r is the indentation depth when the load of 20N is applied to the adhesive layer side of the adhesive sheet (A)).

Figure 112018077958223-pat00001
Figure 112018077958223-pat00001

<점착 시트(B)의 제작><Production of Adhesive Sheet (B)>

얻어진 점착제 조성물을, 편면을 실리콘으로 박리 처리한 두께 38㎛의 폴리에스테르 필름(상품명: MRF, 미쯔비시 가가꾸 폴리에스테르 가부시키가이샤 제조)의 박리 처리면에 파운틴 롤로 건조 후의 두께가 50㎛로 되도록 도포하고, 건조 온도 130℃, 건조 시간 3분의 조건에서 큐어해서 건조하였다. 이와 같이 하여, 기재 상에 점착제층을 제작하였다. 계속해서, 점착제층의 표면에, 편면을 실리콘으로 박리 처리한 두께 38㎛의 폴리에스테르 필름(상품명: MRF, 미쯔비시 가가꾸 폴리에스테르 가부시키가이샤 제조)을, 당해 필름의 박리 처리면이 점착제층측이 되도록 해서 피복하였다. 이와 같이 하여, 점착 시트(B)를 제작하였다.Applying the obtained pressure-sensitive adhesive composition to a peeling treatment surface of a 38-micrometer-thick polyester film (trade name: MRF, manufactured by Mitsubishi Chemical Co., Ltd.), in which one side was peeled off with silicon so as to have a thickness of 50 µm after drying with a fountain roll. And it cured on the conditions of drying temperature 130 degreeC, and drying time 3 minutes, and dried. In this way, an adhesive layer was produced on the substrate. Subsequently, a 38-micrometer-thick polyester film (brand name: MRF, Mitsubishi Chemical Co., Ltd. product) which peeled one side | surface with the silicone on the surface of an adhesive layer, and the peeling process surface of the said film has an adhesive layer side The coating was made as possible. In this way, an adhesive sheet (B) was produced.

<유리 전이 온도(Tg), 저장 탄성률, 손실 탄성률, tanδ(손실 정접)의 측정><Measurement of glass transition temperature (Tg), storage modulus, loss modulus, and tanδ (loss tangent)>

동적 점탄성 측정 장치(레오메트릭스사 제조, ARES)를 사용하여, 하기의 방법에 의해 구하였다.It calculated | required by the following method using the dynamic-viscoelasticity measuring apparatus (ARES made from Leometrics company).

얻어진 점착 시트(B)로부터 점착제층만을 취출하고, 적층해서 약 2mm의 두께로 해서, 이것을 φ7.9mm로 펀칭하여, 원기둥 형상의 펠릿을 제작해서 측정용 샘플로 하였다. 상기 측정 샘플을 φ7.9mm 패러렐 플레이트의 지그에 고정하고, 상기 동적 점탄성 측정 장치에 의해, 저장 탄성률(G'), 손실 탄성률(G")의 온도 의존성을 측정하여, tanδ=G"/G'로서, tnaδ를 산출하였다. 또한, 얻어진 tanδ 커브가 극대가 되는 온도를 유리 전이 온도(Tg)(℃)로 하였다.Only the adhesive layer was taken out from the obtained adhesive sheet (B), it was laminated | stacked, it was made into thickness of about 2 mm, it punched at phi 7.9 mm, the cylindrical pellet was produced, and it was set as the sample for a measurement. The measurement sample was fixed to a jig of a φ7.9 mm parallel plate, and the temperature dependence of storage modulus (G ') and loss modulus (G ") was measured by the dynamic viscoelasticity measuring device, and tan δ = G ″ / G' As a calculation, tnaδ was calculated. In addition, the temperature which the obtained tan-delta curve becomes the maximum was made into glass transition temperature (Tg) (degreeC).

측정 조건은 하기와 같다.Measurement conditions are as follows.

측정: 전단 모드,Measurement: shear mode,

온도 범위: -70℃ 내지 150℃Temperature range: -70 ° C to 150 ° C

승온 속도: 5℃/minTemperature rise rate: 5 ℃ / min

주파수: 1HzFrequency: 1 Hz

〔제조예 1〕: (메트)아크릴계 중합체(1)Production Example 1 (meth) acrylic polymer (1)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 2-에틸헥실아크릴레이트(닛폰 쇼쿠바이사 제조): 100중량부, 2-히드록시에틸아크릴레이트(도아 고세사 제조): 4중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 완만하게 교반하면서 질소 가스를 도입하여, 플라스크 내의 액온을 65℃ 부근으로 유지해서 6시간 중합 반응을 행하여, 중량 평균 분자량 55만의 (메트)아크릴계 중합체(1)의 용액(40중량%)을 제조하였다.2-ethylhexyl acrylate (made by Nippon Shokubai Co., Ltd.): 100 parts by weight, 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.) in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a cooler. : 4 parts by weight of 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.2 parts by weight and ethyl acetate: 156 parts by weight, nitrogen gas was introduced with gentle stirring The polymerization was carried out for 6 hours while maintaining the liquid temperature in the flask at around 65 ° C to prepare a solution (40% by weight) of the (meth) acrylic polymer (1) having a weight average molecular weight of 550,000.

〔제조예 2〕: (메트)아크릴계 중합체(2)Production Example 2 (meth) acrylic polymer (2)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 2-에틸헥실아크릴레이트(닛폰 쇼쿠바이사 제조): 100중량부, 4-히드록시부틸아크릴레이트(오사까 유끼 가가꾸 고교사 제조): 10중량부, 아크릴산(도아 고세사 제조): 0.02중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 완만하게 교반하면서 질소 가스를 도입하여, 플라스크 내의 액온을 65℃ 부근으로 유지해서 6시간 중합 반응을 행하여, 중량 평균 분자량 54만의 (메트)아크릴계 중합체(2)의 용액(40중량%)을 제조하였다.2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 100 parts by weight, 4-hydroxybutyl acrylate (Osaka Yuki) in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a cooler. Teacher manufacture): 10 weight part, acrylic acid (made by Toagosei Co., Ltd.): 0.02 weight part, 2,2'- azobisisobutyronitrile (made by Wako Pure Chemical Industries Ltd.): 0.2 weight part, ethyl acetate as a polymerization initiator: 156 parts by weight was added thereto, nitrogen gas was introduced with gentle stirring, the liquid temperature in the flask was maintained at around 65 ° C, and the polymerization reaction was carried out for 6 hours to give a solution of the (meth) acrylic polymer (2) having a weight average molecular weight of 540,000 (40). Wt%) was prepared.

〔제조예 3〕: (메트)아크릴계 중합체(3)[Manufacture example 3]: (meth) acrylic-type polymer (3)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛폰 쇼쿠바이사 제조): 99중량부, 4-히드록시부틸아크릴레이트(오사까 유끼 가가꾸 고교사 제조): 1중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 1중량부, 아세트산에틸: 156중량부를 투입하고, 완만하게 교반하면서 질소 가스를 도입하여, 플라스크 내의 액온을 60℃ 부근으로 유지해서 7시간 중합 반응을 행하여, 중량 평균 분자량 160만의 (메트)아크릴계 중합체(3)의 용액(39중량%)을 제조하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a cooler, butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 99 parts by weight, 4-hydroxybutyl acrylate (manufactured by Osaka Yuki Chemical Co., Ltd.) : 1 part by weight and 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 1 part by weight and ethyl acetate: 156 parts by weight, nitrogen gas was introduced while gently stirring The liquid temperature in the flask was maintained at around 60 ° C to carry out a polymerization reaction for 7 hours to prepare a solution (39% by weight) of the (meth) acrylic polymer (3) having a weight average molecular weight of 1.6 million.

〔제조예 4〕: (메트)아크릴계 중합체(4)[Manufacture example 4]: (meth) acrylic-type polymer (4)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛폰 쇼쿠바이사 제조): 92중량부, N-아크릴로일모르폴린(고우진사 제조): 5중량부, 아크릴산(도아 고세사 제조): 2.9중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.1중량부, 아세트산에틸: 200중량부를 투입하고, 완만하게 교반하면서 질소 가스를 도입하여, 플라스크 내의 액온을 55℃ 부근으로 유지해서 8시간 중합 반응을 행하여, 중량 평균 분자량 180만의 (메트)아크릴계 중합체(4)의 용액(33중량%)을 제조하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a cooler, butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 92 parts by weight, and N-acryloyl morpholine (manufactured by Goujin Co., Ltd.): 5 parts by weight Acrylic acid (manufactured by Toagosei Co., Ltd.): 2.9 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.1 part by weight and 200 parts by weight of ethyl acetate were added slowly. Nitrogen gas was introduce | transduced with stirring, the liquid temperature in the flask was maintained at 55 degreeC, and polymerization reaction was performed for 8 hours, and the solution (33 weight%) of the (meth) acrylic-type polymer (4) of the weight average molecular weight 1.8 million was manufactured.

〔제조예 5〕: (메트)아크릴계 중합체(5)[Manufacture example 5]: (meth) acrylic-type polymer (5)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기를 구비한 4구 플라스크에, 부틸아크릴레이트(닛폰 쇼쿠바이사 제조): 95중량부, 아크릴산(도아 고세사 제조): 5중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴(와코 쥰야꾸 고교사 제조): 0.2중량부, 아세트산에틸: 156중량부를 투입하고, 완만하게 교반하면서 질소 가스를 도입하여, 플라스크 내의 액온을 63℃ 부근으로 유지해서 10시간 중합 반응을 행하여, 중량 평균 분자량 70만의 (메트)아크릴계 중합체(5)의 용액(40중량%)을 제조하였다.In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a cooler, butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 95 parts by weight, acrylic acid (manufactured by Toagosei Co., Ltd.): 5 parts by weight, 2 as a polymerization initiator. , 2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.2 parts by weight, ethyl acetate: 156 parts by weight, nitrogen gas was introduced with gentle stirring, and the liquid temperature in the flask was about 63 ° C. The polymerization reaction was carried out for 10 hours to prepare a solution (40% by weight) of the (meth) acrylic polymer (5) having a weight average molecular weight of 700,000.

〔제조예 6〕: 지환식 구조 함유 (메트)아크릴계 중합체(6)[Manufacture example 6]: Alicyclic structure containing (meth) acrylic-type polymer (6)

단량체 성분으로서 메타크릴산시클로헥실[단독 중합체(폴리메타크릴산시클로헥실)의 유리 전이 온도: 66℃]: 95중량부, 아크릴산: 5중량부, 연쇄 이동제로서 2-머캅토에탄올: 3중량부, 중합 개시제로서 2,2'-아조비스이소부티로니트릴: 0.2중량부 및 중합 용매로서 톨루엔: 103.2중량부를, 세퍼러블 플라스크에 투입하고, 질소 가스를 도입하면서, 1시간 교반하였다. 이와 같이 하여, 중합계 내의 산소를 제거한 후, 70℃로 승온하여, 3시간 반응시키고, 또한 75℃에서 2시간 반응시켜, 중량 평균 분자량 4000의 (메트)아크릴계 중합체(6)의 용액(50중량%)을 얻었다.Cyclohexyl methacrylate [glass transition temperature of single polymer (cyclohexyl polymethacrylate): 66 degreeC] as a monomer component: 95 weight part, acrylic acid: 5 weight part, 2-mercaptoethanol as a chain transfer agent: 3 weight part 0.2 part by weight of 2,2'-azobisisobutyronitrile as a polymerization initiator and 103.2 part by weight of toluene as a polymerization solvent were charged into a separable flask and stirred for 1 hour while introducing nitrogen gas. Thus, after removing oxygen in a polymerization system, it heated up at 70 degreeC, made it react for 3 hours, and made it react at 75 degreeC for 2 hours, and the solution (50 weight weight) of the (meth) acrylic-type polymer (6) of the weight average molecular weight 4000 %) Was obtained.

〔제조예 6〕: 지환식 구조 함유 (메트)아크릴계 중합체(7)[Manufacture example 6]: Alicyclic structure containing (meth) acrylic-type polymer (7)

교반 블레이드, 온도계, 질소 가스 도입관, 냉각기, 적하 깔때기를 구비한 4구 플라스크에, 톨루엔: 100중량부, 디시클로펜타닐메타크릴레이트(DCPMA)(상품명: FA-513M, 히타치 가세이 고교사 제조): 60중량부, 메틸메타크릴레이트(MMA): 40중량부 및 연쇄 이동제로서 티오글리콜산메틸: 3.5중량부를 투입하였다. 그리고, 70℃에서 질소 분위기 하에서 1시간 교반한 후, 중합 개시제로서 2,2'-아조비스이소부티로니트릴: 0.2중량부를 투입하여, 70℃에서 2시간 반응시키고, 계속해서 80℃에서 4시간 반응시킨 후에, 90℃에서 1시간 반응시켜, 중량 평균 분자량 4000의 (메트)아크릴계 중합체(7)의 용액(51중량%)을 얻었다.Toluene: 100 parts by weight, dicyclopentanyl methacrylate (DCPMA) (brand name: FA-513M, manufactured by Hitachi Kasei Kogyo Co., Ltd.) in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, a cooler, and a dropping funnel. : 60 parts by weight, methyl methacrylate (MMA): 40 parts by weight and methyl thioglycolate: 3.5 parts by weight as a chain transfer agent. After stirring for 1 hour at 70 ° C. under a nitrogen atmosphere, 0.2 part by weight of 2,2′-azobisisobutyronitrile was added as a polymerization initiator, followed by reaction at 70 ° C. for 2 hours, and then at 80 ° C. for 4 hours. After making it react, it was made to react at 90 degreeC for 1 hour, and the solution (51 weight%) of the (meth) acrylic-type polymer (7) of weight average molecular weight 4000 was obtained.

〔실시예 1, 2〕[Examples 1 and 2]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(1)을 얻었다. 결과를 표 1에 나타냈다.To 100 parts by weight of the solids of the solution of the (meth) acrylic polymer (1) to the solution of the (meth) acrylic polymer (1), the total solids were diluted with ethyl acetate and stirred with a disper And the adhesive composition (1) containing acrylic resin were obtained. The results are shown in Table 1.

〔실시예 3, 4〕[Examples 3 and 4]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.01중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(2)을 얻었다. 결과를 표 1에 나타냈다.0.01 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) to the solution of the (meth) acrylic-type polymer (1) in solid content conversion. As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. The adhesive composition (2) containing was obtained. The results are shown in Table 1.

〔실시예 5, 6〕[Examples 5 and 6]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(3)을 얻었다. 결과를 표 1에 나타냈다.0.1 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) to the solution of the (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. The adhesive composition (3) containing was obtained. The results are shown in Table 1.

〔실시예 7, 8〕[Examples 7, 8]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.05중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(6)의 용액을 고형분 환산으로 5중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(4)을 얻었다. 결과를 표 1에 나타냈다.0.05 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) in the solution of the (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 5 parts by weight of a solution of the (meth) acrylic polymer (6) was added in terms of solid content. It diluted with ethyl acetate so that it might be% and stirred with the disper, and obtained the adhesive composition (4) containing acrylic resin. The results are shown in Table 1.

〔실시예 9, 10〕[Examples 9 and 10]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(6)의 용액을 고형분 환산으로 5중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(5)을 얻었다. 결과를 표 1에 나타냈다.0.1 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) to the solution of the (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 5 parts by weight of a solution of the (meth) acrylic polymer (6) was added in terms of solid content. It diluted with ethyl acetate so that it might be% and stirred with the disper, and obtained the adhesive composition (5) containing acrylic resin. The results are shown in Table 1.

〔실시예 11, 12〕[Examples 11 and 12]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(6)의 용액을 고형분 환산으로 5중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(6)을 얻었다. 결과를 표 1에 나타냈다.0.3 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of (meth) acrylic-type polymer (1) to the solution of (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 5 parts by weight of a solution of the (meth) acrylic polymer (6) was added in terms of solid content. It diluted with ethyl acetate so that it might be% and stirred with the disper, and obtained the adhesive composition (6) containing acrylic resin. The results are shown in Table 1.

〔실시예 13, 14〕[Examples 13 and 14]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(7)의 용액을 고형분 환산으로 5중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(7)을 얻었다. 결과를 표 1에 나타냈다.0.1 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) to the solution of the (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nihon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 5 parts by weight of a solution of the (meth) acrylic polymer (7) was added in terms of solid content. It diluted with ethyl acetate so that it might become% and stirred with the disper, and obtained the adhesive composition (7) containing acrylic resin. The results are shown in Table 1.

〔실시예 15, 16〕[Examples 15 and 16]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(7)의 용액을 고형분 환산으로 5중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(8)을 얻었다. 결과를 표 1에 나타냈다.0.3 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of (meth) acrylic-type polymer (1) to the solution of (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nihon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 5 parts by weight of a solution of the (meth) acrylic polymer (7) was added in terms of solid content. It diluted with ethyl acetate so that it might be% and stirred with the disper, and obtained the adhesive composition (8) containing acrylic resin. The results are shown in Table 1.

〔실시예 17, 18〕[Examples 17 and 18]

(메트)아크릴계 중합체(2)의 용액에, (메트)아크릴계 중합체(2)의 용액의 고형분 100중량부에 대하여, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(9)을 얻었다. 결과를 표 2에 나타냈다.To 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (2) in the solution of the (meth) acrylic polymer (2), the total solid content was diluted with ethyl acetate and stirred with a disper And the adhesive composition (9) containing acrylic resin were obtained. The results are shown in Table 2.

〔실시예 19, 20〕[Examples 19 and 20]

(메트)아크릴계 중합체(2)의 용액에, (메트)아크릴계 중합체(2)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.1중량부, TETRAD-C(미쓰비시 가스 가가꾸사 제조)를 고형분 환산으로 0.05중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(10)을 얻었다. 결과를 표 2에 나타냈다.0.1 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (2) to the solution of the (meth) acrylic-type polymer (2) , 0.05 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solids content, 0.005 parts by weight of fermented Nasemite (manufactured by Nihon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst, and a total solid content of 25 It diluted with ethyl acetate so that it might become weight%, it stirred with the disper, and obtained the adhesive composition (10) containing acrylic resin. The results are shown in Table 2.

〔실시예 21, 22〕[Examples 21 and 22]

(메트)아크릴계 중합체(3)의 용액에, (메트)아크릴계 중합체(3)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.02중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(11)을 얻었다. 결과를 표 2에 나타냈다.0.02 part by weight of coronate L (manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent to 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (3) in the solution of the (meth) acrylic polymer (3) As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. The adhesive composition 11 containing was obtained. The results are shown in Table 2.

〔실시예 23, 24〕[Examples 23 and 24]

(메트)아크릴계 중합체(5)의 용액에, (메트)아크릴계 중합체(5)의 용액의 고형분 100중량부에 대하여, 가교제로서 TETRAD-C(미쓰비시 가스 가가꾸사 제조)를 고형분 환산으로 0.075중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(12)을 얻었다. 결과를 표 2에 나타냈다.To the solution of the (meth) acrylic polymer (5), 0.075 part by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a solid content relative to 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (5) As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. The adhesive composition 12 containing was obtained. The results are shown in Table 2.

〔실시예 25〕EXAMPLE 25

하이브라 5125(쿠라레 제조) 100중량부에 대하여, 전체의 고형분이 25중량%가 되도록 톨루엔으로 희석하여, 고무계 수지를 포함하는 점착제 조성물(13)을 얻었다. 결과를 표 2에 나타냈다.To 100 parts by weight of Hibra 5125 (Kuraray Co., Ltd.), the total solid content was diluted with toluene so as to obtain a pressure-sensitive adhesive composition (13) containing a rubber-based resin. The results are shown in Table 2.

〔실시예 26〕EXAMPLE 26

하이브라 5127(쿠라레 제조) 100중량부에 대하여, 전체의 고형분이 25중량%가 되도록 톨루엔으로 희석하여, 고무계 수지를 포함하는 점착제 조성물(14)을 얻었다. 결과를 표 2에 나타냈다.To 100 parts by weight of Hibra 5127 (manufactured by Kuraray), the total solid content was diluted with toluene so that the total solid content was 25% by weight to obtain an adhesive composition (14) containing a rubber-based resin. The results are shown in Table 2.

〔비교예 1, 2〕[Comparative Examples 1 and 2]

(메트)아크릴계 중합체(1)의 용액에, (메트)아크릴계 중합체(1)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.5중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(C1)을 얻었다. 결과를 표 2에 나타냈다.0.5 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (1) to the solution of the (meth) acrylic-type polymer (1) As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. An adhesive composition (C1) was obtained. The results are shown in Table 2.

〔비교예 3, 4〕[Comparative Examples 3 and 4]

(메트)아크릴계 중합체(2)의 용액에, (메트)아크릴계 중합체(2)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.45중량부, TETRAD-C(미쓰비시 가스 가가꾸사 제조)를 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(C2)을 얻었다. 결과를 표 2에 나타냈다.0.45 parts by weight of coronate L (manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent with respect to 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (2) in the solution of the (meth) acrylic polymer (2) 0.3 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in terms of solids content, 0.005 parts by weight of fermented Nasemite (manufactured by Nihon Kagaku Sangyo Co., Ltd.) as a crosslinking catalyst, and the total solids was 25 It diluted with ethyl acetate so that it might become weight%, it stirred with the disper, and obtained the adhesive composition (C2) containing acrylic resin. The results are shown in Table 2.

〔비교예 5, 6〕(Comparative Examples 5 and 6)

(메트)아크릴계 중합체(4)의 용액에, (메트)아크릴계 중합체(4)의 용액의 고형분 100중량부에 대하여, 가교제로서 코로네이트 L(닛본 폴리우레탄 고교사 제조)을 고형분 환산으로 0.3중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(C3)을 얻었다. 결과를 표 2에 나타냈다.0.3 weight part of coronate L (made by Nippon Polyurethane Co., Ltd.) in solid content conversion as a crosslinking agent with respect to 100 weight part of solids of the solution of the (meth) acrylic-type polymer (4) to the solution of the (meth) acrylic-type polymer (4). As a crosslinking catalyst, 0.005 parts by weight of ferrous Nasemite (manufactured by Nippon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to prepare an acrylic resin. An adhesive composition (C3) was obtained. The results are shown in Table 2.

〔비교예 7, 8〕(Comparative Examples 7, 8)

(메트)아크릴계 중합체(5)의 용액에, (메트)아크릴계 중합체(5)의 용액의 고형분 100중량부에 대하여, 가교제로서 TETRAD-C(미쓰비시 가스 가가꾸사 제조)를 고형분 환산으로 0.075중량부, 가교 촉매로서 나셈 제2철(니혼 가가쿠 산교사 제조)을 고형분 환산으로 0.005중량부, (메트)아크릴계 중합체(6)의 용액을 고형분 환산으로 20중량부를 첨가해서, 전체의 고형분이 25중량%가 되도록 아세트산에틸로 희석하고, 디스퍼로 교반하여, 아크릴계 수지를 포함하는 점착제 조성물(C4)을 얻었다. 결과를 표 2에 나타냈다.To the solution of the (meth) acrylic polymer (5), 0.075 part by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a solid content relative to 100 parts by weight of the solid content of the solution of the (meth) acrylic polymer (5) As a crosslinking catalyst, 0.005 parts by weight of Nasem ferric iron (manufactured by Nihon Kagaku Sangyo Co., Ltd.) was added in terms of solid content, and 20 parts by weight of a solution of the (meth) acrylic polymer (6) was added in terms of solid content, and the total solid content was 25 weight parts. It diluted with ethyl acetate so that it might be% and stirred with the disper, and obtained the adhesive composition (C4) containing acrylic resin. The results are shown in Table 2.

Figure 112018077958223-pat00002
Figure 112018077958223-pat00002

Figure 112018077958223-pat00003
Figure 112018077958223-pat00003

〔실시예 27〕[Example 27]

실시예 1, 2에서 얻어진 점착제 조성물(1)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (1) obtained in Examples 1 and 2, the polyester film is peeled off from one side, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 28〕EXAMPLE 28

실시예 3, 4에서 얻어진 점착제 조성물(2)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (2) obtained in Examples 3 and 4, the polyester film is peeled off from one side, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 29〕EXAMPLE 29

실시예 7, 8에서 얻어진 점착제 조성물(4)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (4) obtained in Example 7, 8, the polyester film is peeled from one side, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 30〕EXAMPLE 30

실시예 13, 14에서 얻어진 점착제 조성물(7)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (7) obtained in Examples 13 and 14, the polyester film is peeled off from one side, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 31〕[Example 31]

실시예 17, 18에서 얻어진 점착제 조성물(9)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 9 obtained in Examples 17 and 18, a polyester film is peeled off from one surface, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 32〕[Example 32]

실시예 19, 20에서 얻어진 점착제 조성물(10)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 10 obtained in Examples 19 and 20, a polyester film is peeled off from one surface, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 33〕[Example 33]

실시예 21, 22에서 얻어진 점착제 조성물(11)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 11 obtained in Examples 21 and 22, the polyester film is peeled off from one side, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 34〕EXAMPLE 34

실시예 23, 24에서 얻어진 점착제 조성물(12)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 12 obtained in Examples 23 and 24, a polyester film is peeled off from one surface, and it is a polarizing plate (Nitto Denko Corporation make) which is an optical member. And the brand name "TEG1465DUHC"), and the optical member to which the adhesive sheet was bonded was obtained.

〔실시예 35〕EXAMPLE 35

실시예 25에서 얻어진 점착제 조성물(13)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 13 obtained in Example 25, the polyester film is peeled off from one side, and it is a polarizing plate (Nitto Denko Co., Ltd. make, brand name) which is an optical member. It bonded to "TEG1465DUHC", and obtained the optical member to which the adhesive sheet was bonded.

〔실시예 36〕[Example 36]

실시예 26에서 얻어진 점착제 조성물(14)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 광학 부재인 편광판(닛토덴코 가부시키가이샤 제조, 상품명 「TEG1465DUHC」)에 접착하여, 점착 시트가 접착된 광학 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 14 obtained in Example 26, a polyester film is peeled from one side, and it is a polarizing plate (Nitto Denko Corporation make, brand name) which is an optical member It bonded to "TEG1465DUHC", and obtained the optical member to which the adhesive sheet was bonded.

〔실시예 37〕[Example 37]

실시예 1, 2에서 얻어진 점착제 조성물(1)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (1) obtained in Examples 1 and 2, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Co., Ltd.) which is an electronic member And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 38〕EXAMPLE 38

실시예 3, 4에서 얻어진 점착제 조성물(2)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (2) obtained in Examples 3 and 4, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Co., Ltd. which is an electronic member) And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 39〕EXAMPLE 39

실시예 7, 8에서 얻어진 점착제 조성물(4)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition (4) obtained in Examples 7 and 8, a polyester film is peeled off from one side, and an electroconductive film (Nitto Denko Co., Ltd. which is an electronic member) And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 40〕[Example 40]

실시예 13, 14에서 얻어진 점착제 조성물(7)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 7 obtained in Examples 13 and 14, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Co., Ltd. which is an electronic member) And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 41〕[Example 41]

실시예 17, 18에서 얻어진 점착제 조성물(9)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 9 obtained in Examples 17 and 18, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Corporation) which is an electronic member And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 42〕EXAMPLE 42

실시예 19, 20에서 얻어진 점착제 조성물(10)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 10 obtained in Examples 19 and 20, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Co., Ltd. which is an electronic member) And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 43〕EXAMPLE 43

실시예 21, 22에서 얻어진 점착제 조성물(11)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 11 obtained in Examples 21 and 22, a polyester film is peeled off from one side, and an electrically conductive film (Nitto Denko Co., Ltd. which is an electronic member) And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 44〕EXAMPLE 44

실시예 23, 24에서 얻어진 점착제 조성물(12)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 12 obtained in Examples 23 and 24, a polyester film is peeled off from one side, and the electrically conductive film (Nitto Denko Corporation) which is an electronic member And an electronic member to which the pressure-sensitive adhesive sheet was adhered.

〔실시예 45〕[Example 45]

실시예 25에서 얻어진 점착제 조성물(13)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 13 obtained in Example 25, the polyester film is peeled off from one side, and the electrically conductive film (Nitto Denko Co., Ltd. product) which is an electronic member, It adhere | attached on brand name "Elecrister V270L-TFMP", and the electronic member to which the adhesive sheet was bonded was obtained.

〔실시예 46〕EXAMPLE 46

실시예 26에서 얻어진 점착제 조성물(14)로부터 얻어진 점착 시트(A) 및 점착 시트(B) 각각에 대해서, 한쪽 면으로부터 폴리에스테르 필름을 박리하고, 전자 부재인 도전성 필름(닛토덴코 가부시키가이샤 제조, 상품명 「엘레크리스타 V270L-TFMP」)에 접착하여, 점착 시트가 접착된 전자 부재를 얻었다.About each of the adhesive sheet (A) and the adhesive sheet (B) obtained from the adhesive composition 14 obtained in Example 26, a polyester film is peeled off from one side, and an electroconductive film (Nitto Denko Corporation make) which is an electronic member, It adhere | attached on brand name "Elecrister V270L-TFMP", and the electronic member to which the adhesive sheet was bonded was obtained.

본 발명의 응력 분산 필름은, 예를 들어 광학 부재나 전자 부재를 외부로부터의 충격으로부터 지키는 것 등을 목적으로 하는 보호재로서 적합하게 사용할 수 있다.The stress dispersion film of this invention can be used suitably as a protective material for the purpose of protecting an optical member or an electronic member from the impact from the outside, for example.

10 : 플라스틱 필름
20 : 점착제층
100 : 응력 분산 필름
10: plastic film
20: adhesive layer
100: stress dispersion film

Claims (8)

플라스틱 필름과 점착제층의 적층체로 이루어지는 응력 분산 필름이며,
해당 플라스틱 필름의 두께가 15㎛ 내지 300㎛이고,
해당 점착제층의 두께가 1㎛ 내지 300㎛이고,
해당 점착제층이 점착제 조성물로 형성되고, 해당 점착제 조성물이, 탄소수 1 내지 20의 알킬기를 알킬에스테르 부분으로서 갖는 (메트)아크릴산알킬에스테르 유래의 단량체 단위(I)와 분자 내에 OH기 및/또는 COOH기를 갖는 (메트)아크릴산에스테르 유래의 단량체 단위(II)를 갖는 중합체(A) 또는 고무계 수지를 포함하고,
상기 점착제 조성물이 2관능 이상의 유기 폴리이소시아네이트계 가교제 및/또는 에폭시계 가교제를 포함하고,
해당 적층체의 플라스틱 필름측으로부터 해당 적층체와 수직 방향으로 하중을 가했을 때의 압입 에너지가 280μJ 이상 7000μJ 이하인, 응력 분산 필름.
단, 상기 압입 에너지의 측정은 하기와 같이 행한다.
다이플라 윈테스사 제조의 「SAICAS DN-20형」을 사용하여, 측정 온도: 25℃, 압입 속도: 5㎛/sec로, 하기 수순에 따라 압입 에너지를 산출한다.
(수순 1)
상기 적층체의 점착제층측을 플랫 압자(하중 검출측)에 부착하고, 해당 플랫 압자에 부착한 해당 적층체의 플라스틱 필름측을 구형 압자에 압입하여, 20N의 하중이 검출되었을 때의 압입 깊이(㎛)를 산출한다.
(수순 2)
상기 적층체의 점착제층측을 슬라이드 글래스에 부착하고, 해당 슬라이드 글래스에 부착한 해당 적층체의 플라스틱 필름측(하중 검출측)으로부터 구형 압자로 압입하여, 수순 1에서 구한 압입 깊이까지 압입한다.
구형 압자에 걸리는 수직 하중 y=f(x)(x: 압입 깊이)로 했을 때, 상기 적층체의 점착제층측에 20N이 가해질 때까지의 압입 에너지(W)(μJ)를 하기 식에 의해 산출한다(r은 상기 적층체의 점착제층측에 20N의 하중이 가해질 때의 압입 깊이).
Figure 112019038263781-pat00004
It is a stress dispersion film which consists of a laminated body of a plastic film and an adhesive layer,
The thickness of this plastic film is 15 micrometers-300 micrometers,
The thickness of this adhesive layer is 1 micrometer-300 micrometers,
The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition, and the pressure-sensitive adhesive composition has a monomer unit (I) derived from (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as an alkyl ester portion, and an OH group and / or a COOH group in a molecule. It includes the polymer (A) or rubber type resin which has a monomeric unit (II) derived from (meth) acrylic acid ester to have,
The pressure-sensitive adhesive composition comprises a bifunctional or higher organic polyisocyanate crosslinking agent and / or an epoxy crosslinking agent,
The stress-dispersion film whose indentation energy when the load is applied to the said laminated body in the perpendicular direction from the plastic film side of this laminated body is 280 microJ or more and 7000 microJ or less.
However, the said indentation energy is measured as follows.
Using "SAICAS DN-20 type" manufactured by Dipla Wintes Co., Ltd., the indentation energy is calculated according to the following procedure at a measurement temperature of 25 ° C and a indentation rate of 5 µm / sec.
(Step 1)
Indentation depth when the pressure-sensitive adhesive layer side of the laminate is attached to a flat indenter (load detection side), the plastic film side of the laminate attached to the flat indenter is pressed into a spherical indenter, and a 20 N load is detected. ) Is calculated.
(Step 2)
The pressure-sensitive adhesive layer side of the laminate is attached to the slide glass, press-fitted with a spherical indenter from the plastic film side (load detection side) of the laminate attached to the slide glass, and press-fits to the press-fitting depth determined in Step 1.
When the vertical load y = f (x) (x: indentation depth) applied to the spherical indenter is calculated, the indentation energy W (μJ) until 20 N is applied to the pressure-sensitive adhesive layer side of the laminate is calculated by the following equation. (r is the indentation depth when a load of 20 N is applied to the pressure-sensitive adhesive layer side of the laminate).
Figure 112019038263781-pat00004
제1항에 있어서, 상기 플라스틱 필름의 두께가 20㎛ 내지 300㎛인, 응력 분산 필름.The stress dispersing film of claim 1, wherein the plastic film has a thickness of 20 μm to 300 μm. 제1항 또는 제2항에 있어서, 상기 점착제층의 두께가 1㎛ 내지 150㎛인, 응력 분산 필름.The stress distribution film of Claim 1 or 2 whose thickness of the said adhesive layer is 1 micrometer-150 micrometers. 제1항 또는 제2항에 있어서, 상기 점착제 조성물 중의 NCO기의 몰 함유 비율을 [NCO]로 하고, 해당 점착제 조성물 중의 에폭시기의 몰 함유 비율을 [에폭시]로 하고, 해당 점착제 조성물 중의 OH기의 몰 함유 비율을 [OH]로 하고, 해당 점착제 조성물 중의 COOH기의 몰 함유 비율을 [COOH]로 했을 때, 0≤([NCO]+[에폭시])/([OH]+[COOH])<0.05인, 응력 분산 필름.The molar content ratio of NCO groups in the pressure-sensitive adhesive composition is set to [NCO], the molar content ratio of epoxy groups in the pressure-sensitive adhesive composition is set to [epoxy], and the OH group in the pressure-sensitive adhesive composition according to claim 1 or 2. When the molar content ratio is [OH] and the molar content ratio of COOH groups in the pressure-sensitive adhesive composition is [COOH], 0 ≦ ([NCO] + [epoxy]) / ([OH] + [COOH]) < Stress dispersion film, which is 0.05. 삭제delete 제1항 또는 제2항에 있어서, 상기 점착제층의, -40℃ 내지 150℃의 전체 온도 영역에서의 손실 정접 tanδ가 0.10 이상 2.40 이하인, 응력 분산 필름.The stress dispersion film according to claim 1 or 2, wherein the loss tangent tan δ in the entire temperature range of −40 ° C. to 150 ° C. of the pressure-sensitive adhesive layer is 0.10 or more and 2.40 or less. 제1항 또는 제2항에 기재된 응력 분산 필름을 구비하는 광학 부재.The optical member provided with the stress-dispersion film of Claim 1 or 2. 제1항 또는 제2항에 기재된 응력 분산 필름을 구비하는 전자 부재.The electronic member provided with the stress-dispersion film of Claim 1 or 2.
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Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6467548B1 (en) 2017-09-28 2019-02-13 日東電工株式会社 Reinforcement film
KR102097143B1 (en) 2017-09-28 2020-04-03 닛토덴코 가부시키가이샤 Reinforcing film, and method for manufacturing device with reinforcing film
JP6581694B1 (en) 2018-06-27 2019-09-25 日東電工株式会社 Reinforcement film
JP2020033400A (en) 2018-08-27 2020-03-05 日東電工株式会社 Laminate
JP7111558B2 (en) 2018-08-27 2022-08-02 日東電工株式会社 laminate
JP6581704B1 (en) 2018-08-27 2019-09-25 日東電工株式会社 Reinforcement film
JP6995033B2 (en) * 2018-09-27 2022-01-14 日東電工株式会社 Reinforcing film
CN111325071A (en) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 Optical adhesive and optical sensor module
WO2020158349A1 (en) 2019-02-01 2020-08-06 日東電工株式会社 Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate
JP7348727B2 (en) 2019-02-12 2023-09-21 日東電工株式会社 reinforcing film
JP2020132659A (en) 2019-02-12 2020-08-31 日東電工株式会社 Reinforcement film, manufacturing method thereof, manufacturing method of device and reinforcement method
TWI779211B (en) 2019-02-12 2022-10-01 日商日東電工股份有限公司 Reinforcing film, manufacturing method and reinforcing method of device
JP7257165B2 (en) 2019-02-12 2023-04-13 日東電工株式会社 Device with reinforcing film, manufacturing method thereof, and reinforcing method
KR20200098401A (en) 2019-02-12 2020-08-20 닛토덴코 가부시키가이샤 Reinforcing film, method for making device and reinforcing method
JP6916836B2 (en) 2019-05-14 2021-08-11 日東電工株式会社 Method of manufacturing a laminate
JP6803426B2 (en) 2019-05-14 2020-12-23 日東電工株式会社 Laminated body and its manufacturing method
JP2020196820A (en) 2019-06-03 2020-12-10 日東電工株式会社 Pressure sensitive adhesive sheet, pressure sensitive adhesive kit and laminate
USD922701S1 (en) 2019-12-23 2021-06-15 Samsung Electronics Co., Ltd. Shoe care machine
KR102566606B1 (en) 2021-11-19 2023-08-16 울산과학기술원 Method of polymer material analysis on surface and interfacial cutting analysis system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001294834A (en) * 2000-04-13 2001-10-23 Lintec Corp Pressure-sensitive adhesive composition and pressure- sensitive adhesive optical member using the same
US6720375B2 (en) * 2000-04-13 2004-04-13 Lintec Corporation Adhesive composition and adhesive optical component using the composition
US7208206B2 (en) * 2003-03-10 2007-04-24 Nitto Denko Corporation Glass crack prevention laminate and liquid crystal display device
JP2006036843A (en) * 2004-07-23 2006-02-09 Diatex Co Ltd Heat-resistant and moisture-resistant adhesive and adhesive sheet
JP4869748B2 (en) * 2006-03-14 2012-02-08 日東電工株式会社 Glass protective adhesive sheet and automotive glass protective film
JP5288733B2 (en) * 2007-05-31 2013-09-11 出光ユニテック株式会社 Surface protection film
JP5212688B2 (en) * 2007-10-26 2013-06-19 サイデン化学株式会社 Optical pressure-sensitive adhesive composition and optical functional film
JP5115218B2 (en) * 2008-01-30 2013-01-09 株式会社デンソー Starter
JP2012067315A (en) * 2011-11-02 2012-04-05 Nitto Denko Corp Pressure sensitive adhesive composition, double-sided pressure sensitive adhesive tape, and method for bonding
JP5785489B2 (en) * 2011-12-27 2015-09-30 旭化成イーマテリアルズ株式会社 Pellicle
JP5844201B2 (en) * 2012-03-30 2016-01-13 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
WO2014168178A1 (en) * 2013-04-11 2014-10-16 綜研化学株式会社 Laminate
JP6043240B2 (en) * 2013-05-13 2016-12-14 積水化学工業株式会社 Adhesive sheet for electronic equipment
JP6229926B2 (en) 2013-06-03 2017-11-15 大日本印刷株式会社 Adhesive composition and adhesive sheet using the same
JP6037990B2 (en) * 2013-09-30 2016-12-07 大王製紙株式会社 Toilet roll packaging film and toilet roll packaging
JP6364224B2 (en) * 2014-05-02 2018-07-25 積水化学工業株式会社 Double-sided adhesive tape for fixing optical films

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