WO2020158349A1

WO2020158349A1 - Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate

Info

Publication number: WO2020158349A1
Application number: PCT/JP2020/000679
Authority: WO
Inventors: 武史仲野; 賢一片岡
Original assignee: 日東電工株式会社
Priority date: 2019-02-01
Filing date: 2020-01-10
Publication date: 2020-08-06
Also published as: CN113382858B; TW202045359A; CN113382858A; JPWO2020158349A1; KR20210124207A

Abstract

An intermediate laminate 1 comprises a pressure-sensitive adhesive sheet 4 provided with a base material 2 and a pressure-sensitive adhesive layer 3 disposed on one surface of the base material 2, and an adherend 5 disposed on one surface of the pressure-sensitive adhesive sheet 4. The pressure-sensitive adhesive layer 3 is composed of a pressure-sensitive adhesive composition that can irreversibly change its state between a state with a high adhesive and a state with a low adhesive force. The pressure-sensitive adhesive layer 3 comprises a high-adhesion region 10 made of a pressure-sensitive adhesive composition in a state with a high adhesive force and a low-adhesion region 11 made of a pressure-sensitive adhesive composition in a state with a low adhesive force.

Description

Intermediate laminate, method for producing intermediate laminate, and method for producing product laminate

The present invention relates to an intermediate laminate, a method for producing the intermediate laminate, and a method for producing the product laminate, and more specifically, the intermediate laminate, the method for producing the intermediate laminate, and the intermediate laminate. The present invention relates to a method for manufacturing a product laminate.

It is known that surface protection and impact resistance are provided by temporarily attaching an adhesive film to the surface of a device before the processes such as assembling, processing, and transportation of various devices such as electronic devices are performed. ..

As such an adhesive film, a stress dispersion film including a laminate of a plastic film and an adhesive layer is known (see, for example, Patent Document 1).

In addition, as such an adhesive film, before heating or before irradiation with ultraviolet rays, a curable adhesive sheet that has weak adhesive force and exhibits adhesiveness by being heated or irradiated with ultraviolet rays is known (for example, See Patent Document 2.).

Also, as such an adhesive film, an adhesive tape for processing a semiconductor substrate is known that can be peeled off without leaving an adhesive after being irradiated with ultraviolet rays (see, for example, Patent Document 3).

The adhesive tape for semiconductor substrate processing of Patent Document 3 can be peeled from the device by adhering it to the device and irradiating it with ultraviolet rays after finishing the steps such as assembling and processing.

JP, 2017-132977, A JP, 2011-127054, A Japanese Patent Laid-Open No. 2005-050953

On the other hand, from the viewpoint of reinforcing the device, there is a desire to leave part of the tacky adhesive film that has been temporarily adhered to the device without being peeled off.

However, since the stress-dispersion film of Patent Document 1 is premised on being adhered to reinforce the adherend, it has a strong adhesive force and cannot easily remove only a part of the stress-dispersion film. There is a problem called.

Further, in the curable adhesive sheet of Patent Document 2, if a part of the curable adhesive sheet is cut and removed before heating or before irradiation with ultraviolet rays, the adhesive force is weak, so that floating occurs around the cut portion. There is a problem of peeling.

The heat-peelable pressure-sensitive adhesive sheet of Patent Document 3 is a process material that is supposed to be removed after the above process is completed, and its adhesive strength is adjusted so that no adhesive residue is left on the device.

Therefore, the heat-peelable pressure-sensitive adhesive sheet of Patent Document 3 has a problem that the adhesive strength is not sufficient from the viewpoint of device reinforcement.

An object of the present invention is to provide an intermediate laminate having both an area left to be adhered to an adherend and an area removed from the adherend to reinforce the adherend, and a method for producing the intermediate laminate. And a method for producing a product laminate obtained by using the intermediate laminate.

The present invention [1] includes a pressure-sensitive adhesive sheet including a base material and a pressure-sensitive adhesive layer disposed on one surface of the base material, and an adherend disposed on one surface of the pressure-sensitive adhesive sheet, wherein the pressure-sensitive adhesive layer is The high-adhesive state and the low-adhesive state are composed of an adhesive composition which is irreversibly changeable in state, and the adhesive layer has a high-adhesive region made of the adhesive composition having a high adhesive strength. And a low-adhesion region made of an adhesive composition having a low adhesive strength.

In the present invention [2], the pressure-sensitive adhesive layer is composed of a first pressure-sensitive adhesive composition capable of irreversibly changing its state from a state having a high adhesive force to a state having a low adhesive force, and the high-adhesive region has a state before the state change. Of the first adhesive composition, and the low-adhesion region includes the intermediate laminate according to the above [1], which is formed of the first adhesive composition after a state change.

In the present invention [3], the pressure-sensitive adhesive layer is composed of a second pressure-sensitive adhesive composition capable of irreversibly changing its state from a state of low adhesive strength to a state of high adhesive strength, and the high-adhesive region has a state after change of state. Of the second adhesive composition, and the low-adhesion region includes the intermediate laminate according to the above [1], which includes the second adhesive composition before the state change.

In the present invention [4], the high-adhesion region is adhered to a polyimide film at 25° C., and the adhesive force measured by a 180-degree peel test at a peeling speed of 300 mm/min is 5 N/25 mm or more. ] The intermediate laminate according to any one of [3] to [3] is included.

In the present invention [5], the low-adhesion region is adhered to a polyimide film at 25° C., and the adhesive force measured by a 180-degree peel test at a peeling rate of 300 mm/min is 4 N/25 mm or less. ] The intermediate laminate according to any one of [4] to [4] is included.

The present invention [6] is composed of a base material and an adhesive composition which is disposed on one surface of the base material and which can irreversibly change its state by light irradiation between a state having a high adhesive force and a state having a low adhesive force. Step of preparing a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, step of disposing an adherend on one surface of the pressure-sensitive adhesive sheet, and irradiating a part of the pressure-sensitive adhesive layer with light, and irradiating the pressure-sensitive adhesive layer with light. By forming a portion and a non-irradiated portion that has not been light-irradiated, any one of the irradiated portion and the non-irradiated portion, a high-adhesion region made of an adhesive composition having a high adhesive strength, The other is a method for producing an intermediate laminate, which comprises a step of forming a low-adhesion region made of an adhesive composition having a low adhesive force.

The present invention [7] is characterized in that the adhesive layer is composed of a first adhesive composition which is irreversibly changeable by light irradiation from a state where the adhesive force is high to a state where the adhesive force is low, and the irradiated part is the The method for producing the intermediate laminate according to the above [6], which comprises a low-adhesion region and the non-irradiated portion serves as the high-adhesion region.

The present invention [8] comprises the second adhesive composition, wherein the pressure-sensitive adhesive layer is irreversibly changeable by light irradiation from a low pressure-sensitive adhesive state to a high pressure-sensitive adhesive state. The method for producing the intermediate laminate according to the above [6], which comprises a high-adhesion region and the non-irradiated portion serves as the low-adhesion region.

The present invention [9] provides a step of preparing an intermediate laminate produced by the method for producing an intermediate laminate according to any one of the above [6] to [8], and the low-adhesion region in the adhesive layer. And a step of removing the product.

The pressure-sensitive adhesive layer of the intermediate laminate of the present invention is composed of a pressure-sensitive adhesive composition that can irreversibly change its state between a state with high adhesive force and a state with low adhesive force.

Therefore, depending on the state change, it is possible to form a high-adhesion region made of an adhesive composition having a high adhesive force and a low-adhesion region made of an adhesive composition having a low adhesive force.

That is, the intermediate laminate forms a high-adhesion region from a high-adhesive pressure-sensitive adhesive composition, and forms a low-adhesive region from a low-adhesive composition to give a high-adhesive region and a low-adhesive region. However, these can be combined by forming the high-adhesion region and the low-adhesion region from the adhesive composition having the same composition.

Since the adhesive layer of the intermediate laminate has a high-adhesion region and a low-adhesion region, the high-adhesion region can be left attached to the adherend and used together with the corresponding base material for reinforcing the adherend. On the other hand, the low-adhesion region can be removed from the adherend together with the corresponding substrate.

As a result, it is possible to obtain a product laminate in which the adherend is reinforced.

The method for producing an intermediate laminate of the present invention, in a state where the adhesive force is high and a state where the adhesive force is low, a part of the adhesive layer made of an adhesive composition which is irreversibly changeable by light irradiation is irradiated with light. By forming a light-irradiated portion and a non-light-irradiated portion on the pressure-sensitive adhesive layer, either one of the light-irradiated portion and the non-irradiated portion has a high pressure-sensitive adhesive composition. And a low-adhesion region made of an adhesive composition having a low adhesive strength.

Therefore, an intermediate laminate including an adhesive layer having a high-adhesion region and a low-adhesion region can be manufactured.

In addition, in the method for manufacturing the intermediate laminate, the adhesive composition is partially photocured by light irradiation to form a high adhesive area and a low adhesive area.

Therefore, it is possible to suppress damage to the adherend due to heat, as compared with the case where the adhesive composition is thermally cured by heating.

The method for producing a product laminate of the present invention comprises a step of removing the low-adhesion region of the adhesive layer in the intermediate laminate produced by the method for producing an intermediate laminate of the present invention.

Since the adhesive strength in the low adhesive area is low, the low adhesive area can be easily removed from the intermediate laminate together with the corresponding base material. On the other hand, the high-adhesion region can be left in the intermediate laminate and used together with the corresponding base material to reinforce the adherend.

FIG. 1 shows a schematic view of one embodiment of the intermediate laminate of the present invention. FIG. 2 is a schematic view showing an embodiment of a method for producing a pressure-sensitive adhesive sheet, FIG. 2A shows a first step of preparing a base material, and FIG. 2B shows an adhesive layer on one surface of the base material. The second step of laminating is shown, and FIG. 2C shows the step of laminating a release film on one surface of the adhesive layer. FIG. 3 is a schematic view showing an embodiment of the method for producing an intermediate laminate of the present invention when the adhesive layer is formed of the first adhesive composition, and FIG. 3B shows three steps, FIG. 3B shows a fourth step of arranging an adherend on one surface of the pressure-sensitive adhesive sheet, and FIG. 3C irradiates a part of the pressure-sensitive adhesive layer with light to form a high-pressure-adhesive area and a low-adhesive area. A fifth step is shown. FIG. 4 is a schematic view showing an embodiment of the method for producing an intermediate laminate of the present invention when the adhesive layer is formed of the second adhesive composition, and FIG. FIG. 4B shows a fourth step of disposing the adherend on one surface of the pressure-sensitive adhesive sheet, and FIG. 4C irradiates a part of the pressure-sensitive adhesive layer with light to form a high-adhesion region and a low-adhesion region. A fifth step is shown. FIG. 5 is a schematic view showing an embodiment of a method for producing a product laminate of the present invention, FIG. 5A shows a sixth step of preparing an intermediate laminate, and FIG. 5B shows low adhesion in an adhesive layer. The 7th process of removing a region is shown. FIG. 6 is a schematic view showing an embodiment of a method for manufacturing a product laminate of the present invention when the low-adhesion region is a cross shape, and FIG. 6A shows a sixth step of preparing an intermediate laminate. 6B shows a seventh step of removing the low-adhesion region in the adhesive layer. FIG. 7 is a schematic view showing an embodiment of a method for manufacturing a product laminate of the present invention when the low-adhesion region is round, and FIG. 7A shows a sixth step of preparing an intermediate laminate. 7B shows a seventh step of removing the low-adhesion region in the adhesive layer.

One embodiment of the intermediate laminate of the present invention will be described with reference to FIG.
1. Intermediate Laminated Body As shown in FIG. 1, the intermediate laminated body 1 has a film shape (including a sheet shape) having a predetermined thickness, extends in a direction (plane direction) orthogonal to the thickness direction, and has a flat upper surface and It has a flat lower surface.

Specifically, the intermediate laminate 1 includes an adhesive sheet 4 including a base material 2 and an adhesive layer 3 arranged on one surface of the base material 2, and an adherend 5 arranged on one surface of the adhesive sheet 4. With.

As will be described in detail later, the intermediate laminate 1 can be obtained by attaching the adhesive sheet 4 to the adherend 5.

Further, the intermediate laminate 1 is an intermediate component of the product laminate 12 (described later).

Hereinafter, each layer will be described in detail.
2. Adhesive Sheet The adhesive sheet 4 has a film shape (including a sheet shape) having a predetermined thickness, extends in a direction (plane direction) orthogonal to the thickness direction, and has a flat upper surface and a flat lower surface.

Specifically, the pressure-sensitive adhesive sheet 4 includes a base material 2 and a pressure-sensitive adhesive layer 3 arranged on one surface of the base material 2.

Hereinafter, each layer constituting the pressure-sensitive adhesive sheet 4 will be described.
2-1. Base Material The base material 2 is a lower layer of the adhesive sheet 4. The base material 2 is a support layer (support material) that secures the mechanical strength of the adhesive sheet 4. Further, the base material 2 is a reinforcing material for reinforcing the adherend 5 in the intermediate laminate 1. The base material 2 has a film shape extending in the surface direction and has a flat plane surface and a flat lower surface.

The base material 2 is made of a flexible plastic material.

Examples of such a plastic material include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate and polyethylene naphthalate, and (meth)acrylic resins (acrylic resin and/or methacrylic resin) such as polymethacrylate, for example, Polyolefin resin such as polyethylene, polypropylene, cycloolefin polymer (COP), for example, polycarbonate resin, for example, polyether sulfone resin, for example, polyarylate resin, for example, melamine resin, for example, polyamide resin, for example, polyimide resin, for example, , Cellulose resin, for example, polystyrene resin, for example, synthetic resin such as norbornene resin.

As will be described in detail later, when the adhesive layer 3 is cured by irradiating light from the base material 2 side, the base material 2 preferably has transparency to light.

From the viewpoint of achieving both transparency to light and mechanical strength, the plastic material is preferably polyester resin, more preferably polyethylene terephthalate (PET).

The thickness of the substrate 2 is, for example, 4 μm or more, preferably 20 μm or more, more preferably 30 μm or more, further preferably 45 μm or more from the viewpoint of reinforcing the adherend 5 (described later), and, for example, , 500 μm or less, preferably 300 μm or less, more preferably 200 μm or less, still more preferably 100 μm or less, from the viewpoint of flexibility and handleability.
2-2. Adhesive Layer The adhesive layer 3 is arranged on the entire one surface of the substrate 2, and the adhesive layer 3 is an upper layer of the adhesive sheet 4.

The adhesive layer 3 is a pressure-sensitive adhesive layer for adhering the adhesive sheet 4 to the adherend 5. Further, the adhesive layer 3 has a film shape extending in the surface direction and has a flat plane surface and a flat lower surface.

Adhesive layer 3 is made of an adhesive composition that can irreversibly change its state between high adhesive strength and low adhesive strength.

Examples of such an adhesive composition include a first adhesive composition capable of irreversibly changing its state from a state of high adhesive force to a state of low adhesive force, and a state of low adhesive force to a state of high adhesive force. And a second adhesive composition which can irreversibly change its state.

The first adhesive composition contains a polymer, a first photocuring agent, and a photopolymerization initiator.

Examples of the polymer include acrylic polymers, silicone polymers, urethane polymers, rubber polymers, and the like, and acrylic polymers are listed from the viewpoint of optical transparency, adhesiveness, and control of storage elastic modulus. To be

The acrylic polymer is obtained by polymerizing a monomer component containing (meth)acrylic acid alkyl ester as a main component.

The (meth)acrylic acid alkyl ester is an acrylic acid ester and/or a methacrylic acid ester, and examples thereof include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and (meth)acrylic acid. Butyl, isopropyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, (meth) ) Neopentyl acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, ( (Meth)isononyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, isotridodecyl (meth)acrylate, tetradecyl (meth)acrylate, Isotetradecyl (meth)acrylate, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, isooctadecyl (meth)acrylate, (meth)acrylic acid Examples thereof include linear or branched C1-20 alkyl esters of (meth)acrylic acid such as nonadecyl and eicosyl (meth)acrylate, and preferably methyl (meth)acrylate, butyl (meth)acrylate, 2-Ethylhexyl (meth)acrylate, more preferably, methyl methacrylate, butyl acrylate, and 2-ethylhexyl acrylate are mentioned.

The (meth)acrylic acid alkyl ester can be used alone or in combination of two or more kinds.

As the (meth)acrylic acid alkyl ester, preferably, butyl (meth)acrylic acid is used alone.

From the viewpoint of adjusting the glass transition temperature and the shear storage elastic modulus G′, the (meth)acrylic acid alkyl ester is preferably a combination of methyl methacrylate and a (meth)acrylic acid C4-12 alkyl ester, more preferably Examples include a combination of methyl methacrylate and 2-ethylhexyl acrylate.

When methyl methacrylate and (meth)acrylic acid C4-12 alkyl ester are used together as the (meth)acrylic acid alkyl ester, the total amount of methyl methacrylate and (meth)acrylic acid C4-12 alkyl ester is 100 parts by mass. On the other hand, the mixing ratio of methyl methacrylate is, for example, 5 parts by mass or more, and is, for example, 20 parts by mass or less, and the mixing ratio of (meth)acrylic acid C4-12 alkyl ester is, for example, , 80 parts by mass or more, and for example, 95 parts by mass or less. The mixing ratio of the (meth)acrylic acid alkyl ester is, for example, 50% by mass or more, and preferably 60% by mass or more, with respect to the monomer component. And, for example, 99% by mass or less, preferably 80% by mass or less.

Further, the monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with (meth)acrylic acid alkyl ester.

Examples of the functional group-containing vinyl monomer include a hydroxyl group-containing vinyl monomer, a carboxyl group-containing vinyl monomer, a nitrogen-containing vinyl monomer, a cyano group-containing vinyl monomer, a glycidyl group-containing vinyl monomer, a sulfo group-containing vinyl monomer, and a phosphoric acid group-containing vinyl monomer. Examples thereof include monomers, aromatic vinyl monomers, vinyl ester monomers and vinyl ether monomers.

Examples of the hydroxyl group-containing vinyl monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)cyclohexyl)methyl (meth)acrylate, and the like are preferable. Is 2-hydroxyethyl (meth)acrylate, and more preferably 2-hydroxyethyl acrylate.

Examples of the carboxyl group-containing vinyl monomer include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylic acid carboxypentyl, itaconic acid, maleic acid, fumaric acid and crotonic acid. However, (meth)acrylic acid is preferable, and acrylic acid is more preferable.

Further, examples of the carboxyl group-containing vinyl monomer also include acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride.

Examples of the nitrogen-containing vinyl monomer include N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-acryloylmorpholine and N. -Vinylcarboxylic acid amides, N-vinylcaprolactam and the like can be mentioned.

Examples of the cyano group-containing vinyl monomer include (meth)acrylonitrile.

Examples of the glycidyl group-containing vinyl monomer include glycidyl (meth)acrylate.

Examples of the sulfo group-containing vinyl monomer include styrene sulfonic acid and allyl sulfonic acid.

Examples of the vinyl monomer containing a phosphoric acid group include 2-hydroxyethylacryloyl phosphate.

Examples of the aromatic vinyl monomer include styrene, p-methylstyrene, o-methylstyrene, α-methylstyrene and the like.

Examples of vinyl ester monomers include vinyl acetate and vinyl propionate.

Examples of vinyl ether monomers include methyl vinyl ether and the like.

The functional group-containing vinyl monomer can be used alone or in combination of two or more kinds. When a cross-linking agent (described later) is blended, a hydroxyl group-containing vinyl monomer is preferable from the viewpoint of introducing a cross-linking structure into the polymer, and a nitrogen-containing vinyl monomer is preferable from the viewpoint of improving cohesive force. A vinyl monomer is mentioned, More preferably, a hydroxyl group-containing vinyl monomer and a nitrogen-containing vinyl monomer are used in combination.

When the hydroxyl group-containing vinyl monomer and the nitrogen-containing vinyl monomer are used in combination, the mixing ratio of the hydroxyl group-containing vinyl monomer is, for example, 40 parts by mass with respect to 100 parts by mass of the total amount of the hydroxyl group-containing vinyl monomer and the nitrogen-containing vinyl monomer. Or more parts, for example, 60 parts by mass or less, and the mixing ratio of the nitrogen-containing vinyl monomer is, for example, 40 parts by mass or more, and for example, 60 parts by mass or less.

The mixing ratio of the functional group-containing vinyl monomer is, for example, 1% by mass or more, preferably 5% by mass or more, more preferably 10% by mass or more, and further preferably 15% by mass or more, based on the monomer component. Further, for example, it is 30 mass% or less, preferably 20 mass% or less.

The acrylic polymer is a polymer obtained by polymerizing the above-mentioned monomer components.

In order to polymerize the monomer component, for example, a (meth)acrylic acid alkyl ester and, if necessary, a functional group-containing vinyl monomer are blended to prepare a monomer component, which is subjected to, for example, solution polymerization, bulk polymerization, or emulsification. It is prepared by a known polymerization method such as polymerization.

As the polymerization method, solution polymerization is preferable.

In solution polymerization, for example, a solvent is mixed with a monomer component and a polymerization initiator to prepare a monomer solution, and then the monomer solution is heated.

Examples of the solvent include organic solvents.

Examples of the organic solvent include aromatic hydrocarbon solvents such as toluene, benzene, and xylene, ether solvents such as diethyl ether, ketone solvents such as acetone and methyl ethyl ketone, and ester solvents such as ethyl acetate. Examples thereof include amide solvents such as N,N-dimethylformamide, preferably ester solvents, and more preferably ethyl acetate.

The solvent can be used alone or in combination of two or more kinds.

The mixing ratio of the solvent is, for example, 100 parts by mass or more, preferably 200 parts by mass or more, and for example, 500 parts by mass or less, preferably 300 parts by mass or less, relative to 100 parts by mass of the monomer component. ..

Examples of the polymerization initiator include peroxide-based polymerization initiators and azo-based polymerization initiators.

Examples of peroxide-based polymerization initiators include organic peroxides such as peroxycarbonates, ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides and peroxyesters.

Examples of the azo-based polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis(2-methylbutyronitrile) and 2,2′-azobis(2,4-dimethylvalero). Nitriles) and azo compounds such as

dimethyl

2,2′-azobisisobutyrate.

The polymerization initiator is preferably an azo polymerization initiator, more preferably 2,2'-azobisisobutyronitrile.

The polymerization initiators can be used alone or in combination of two or more kinds.

The mixing ratio of the polymerization initiator is, for example, 0.05 parts by mass or more, preferably 0.1 parts by mass or more, and for example, 1 part by mass or less, preferably 100 parts by mass with respect to 100 parts by mass of the monomer component. It is 0.5 parts by mass or less.

The heating temperature is, for example, 50° C. or more and 80° C. or less, and the heating time is, for example, 1 hour or more and 8 hours or less.

By this, the monomer component is polymerized to obtain an acrylic polymer solution containing an acrylic polymer.

The solid content concentration of the acrylic polymer solution is, for example, 20% by mass or more and, for example, 80% by mass or less.

The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, 500,000 or more, and for example, 5,000,000 or less, preferably 3,000,000 or less, more preferably 2,000,000 or less.

The above weight average molecular weight is a value measured by GPC (gel permeation chromatograph) and calculated in terms of polystyrene.

In the photocurable composition, the blending ratio of the polymer is, for example, 70% by mass or more, and for example, 95% by mass or less, based on the total amount of the polymer, the first photocuring agent, and the photopolymerization initiator. is there.

Examples of the first photocuring agent include polyfunctional (meth)acrylates having 4 or more functional groups, preferably 5 or more and 6 or less from the viewpoint of sufficiently reducing the adhesive strength of the adhesive layer 3 by light irradiation. Specifically, tetrafunctional (meth)acrylates such as ditrimethylolpropane tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, for example, dipentaerythol poly( Hexafunctional (meth)acrylates such as (meth)acrylate and dipentaerythritol hexa(meth)acrylate may be mentioned, preferably hexafunctional (meth)acrylate, and more preferably dipentaerythritol hexaacrylate.

The first photo-curing agent can be used alone or in combination of two or more kinds.

The functional group equivalent of the first photo-curing agent is, for example, 50 g/eq or more, and is, for example, 500 g/eq or less.

The viscosity of the first photo-curing agent at 25° C. is, for example, 100 mPa·s or more, preferably 400 mPa·s or more, more preferably 1000 mPa·s or more, further preferably 3000 mPa·s or more, and particularly preferably 4000 mPa. -S or more, most preferably 5000 mPa-s or more, further 6000 mPa-s or more, and usually 8000 mPa-s or less.

The above viscosity can be measured with a B-type viscometer. Specifically, using a Toki Sangyo VISCOMTER (BH type), a measurement temperature of 25°C, a rotor No. 3, a rotation speed of 10 rpm, a measurement time It can be measured under the condition of 5 minutes.

From the viewpoint of compatibility, the molecular weight of the first photo-curing agent is, for example, 1500 or less, preferably 1000 or less, and for example, 100 or more.

The first photo-curing agent is preferably selected so that it is compatible with the polymer.

If the first photo-curing agent is compatible with the polymer, the adhesive force (described later) of the adhesive layer 3 that is not irradiated with light can be increased.

Specifically, if the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the first photo-curing agent is, for example, 4 or less, preferably 3.5 or less, the first light The curing agent and the polymer are compatible with each other, and as a result, the adhesive force (described later) of the adhesive layer 3 which is not irradiated with light can be increased.

Note that the Hansen solubility parameter (HSP) of the polymer is calculated based on the Hansen solubility parameter (HSP) of the monomers that make up the polymer.

The mixing ratio of the first photocuring agent is, for example, 10 parts by mass or more, and for example, 50 parts by mass or less, preferably 30 parts by mass or less, relative to 100 parts by mass of the polymer.

The mixing ratio of the first photo-curing agent is, for example, 5 mass% or more, and for example, 30 mass% or less, with respect to the total amount of the polymer, the first photo-curing agent, and the photopolymerization initiator. ..

The photopolymerization initiator accelerates the curing reaction of the first photocuring agent and is appropriately selected according to the type of the first photocuring agent. For example, a photocationic initiator (photoacid generator) such as 1- Photo radical initiators such as hydroxy ketones such as hydroxycyclohexyl phenyl ketone, benzyl dimethyl ketals, amino ketones, acylphosphine oxides, benzophenones, triazine derivatives containing trichloromethyl group, for example, photo anion initiators (photo base generation) Agent) and the like.

The photopolymerization initiators can be used alone or in combination of two or more kinds.

Among such photopolymerization initiators, when a polyfunctional (meth)acrylate is used as the first photocuring agent, preferably a photoradical initiator, more preferably a hydroxyketone is adopted.

The light absorption region of the photopolymerization initiator is, for example, 300 nm or more and, for example, 450 nm or less.

The mixing ratio of the photopolymerization initiator is, for example, 0.01 part by mass or more, and for example, 1 part by mass or less, preferably 0.5 part by mass or less, relative to 100 parts by mass of the polymer.

The blending ratio of the photopolymerization initiator is, for example, 0.01% by mass or more, and for example, 1% by mass or less, based on the total amount of the polymer, the first photocuring agent, and the photopolymerization initiator. It is preferably 0.5 parts by mass or less.

Then, in order to prepare the first adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization, the polymer solution), the first photocuring agent, and the photopolymerization initiator are blended in the above proportions. , Mix.

From the viewpoint of introducing a crosslinked structure into the polymer, the first adhesive composition preferably contains a crosslinking agent.

Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, a carbodiimide crosslinking agent, a metal chelate crosslinking agent, and the like, and preferably an isocyanate crosslinking agent. Can be mentioned.

Examples of the isocyanate-based crosslinking agent include aliphatic diisocyanates such as butylene diisocyanate and hexamethylene diisocyanate, for example, cyclopentylene diisocyanate, cyclohexylene diisocyanate, alicyclic diisocyanates such as isophorone diisocyanate, and 2,4-tolylene diisocyanate. Aromatic diisocyanates such as isocyanate, 4,4′-diphenylmethane diisocyanate and xylylene diisocyanate can be mentioned.

Also, as the isocyanate-based cross-linking agent, the above-mentioned isocyanate derivatives (for example, isocyanurate modified products, polyol modified products, etc.) can be mentioned.

As the isocyanate-based cross-linking agent, a commercially available product may be used, and examples thereof include Coronate L (tolylene diisocyanate trimethylolpropane adduct, manufactured by Tosoh), Coronate HL (hexamethylene diisocyanate trimethylolpropane adduct, manufactured by Tosoh). ), Coronate HX (isocyanurate body of hexamethylene diisocyanate), Takenate D110N (trimethylolpropane adduct body of xylylene diisocyanate, manufactured by Mitsui Chemicals, Inc.) and the like.

Examples of the epoxy-based cross-linking agent include diglycidylaniline, N,N,N′,N′-tetraglycidyl-m-xylylenediamine, and the like.

As the epoxy-based cross-linking agent, a commercially available product may be used, and examples thereof include Tetrad C (manufactured by Mitsubishi Gas Chemical Co., Ltd.).

The epoxy-based cross-linking agent is preferably N,N,N′,N′-tetraglycidyl-m-xylylenediamine.

Cross-linking agents can be used alone or in combination of two or more.

If a crosslinking agent is added to the first adhesive composition, a functional group such as a hydroxyl group in the polymer reacts with the crosslinking agent, and a crosslinked structure is introduced into the polymer.

The functional group equivalent of the cross-linking agent is, for example, 50 g/eq or more and, for example, 500 g/eq or less.

The mixing ratio of the cross-linking agent is, for example, 0.1 parts by mass or more, preferably 1.0 parts by mass or more, more preferably 1.5 parts by mass or more, and further preferably 2 parts by mass with respect to 100 parts by mass of the polymer. It is 0.0 part by mass or more and, for example, 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 4 parts by mass or less.

When a crosslinking agent is added to the first adhesive composition, a crosslinking catalyst may be added to accelerate the crosslinking reaction.

Examples of the crosslinking catalyst include metal-based crosslinking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, ferric nacem, butyltin oxide and dioctyltin dilaurate.

The cross-linking catalyst can be used alone or in combination of two or more kinds.

The blending ratio of the crosslinking catalyst is, for example, 0.001 part by mass or more, preferably 0.01 part by mass or more, and for example, 0.05 part by mass or less, relative to 100 parts by mass of the polymer.

In addition, the first adhesive composition may include, for example, a silane coupling agent, a tackifier, a plasticizer, a softening agent, a deterioration inhibitor, a filler, a coloring agent, under fluorescent light or under natural light, if necessary. From the viewpoint of stabilization in, ultraviolet absorber, from the viewpoint of stabilization under fluorescent light or natural light, various additives such as antioxidants, surfactants, additives such as antistatic agents, the present invention, It can be contained within a range that does not impair the effect of.

By this, the first adhesive composition is obtained.

The blending ratio of the polymer is, for example, 50 mass% or more, preferably 80 mass% or more, and for example, 90 mass% or less with respect to the first adhesive composition.

The blending ratio of the first photocuring agent is, for example, 10% by mass or more, and for example, 50% by mass or less, based on the first adhesive composition.

The mixing ratio of the photopolymerization initiator is, for example, 0.01% by mass or more, and for example, 0.5% by mass or less, preferably 0.1% by mass or less, based on the first adhesive composition. Is.

The second adhesive composition contains the above-mentioned polymer, the second photo-curing agent, and the above-mentioned photo-polymerization initiator.

Examples of the polymer include the same as the polymer blended in the above first adhesive composition, and preferably an acrylic polymer.

The polymers can be used alone or in combination of two or more.

The blending ratio of the polymer is the same as the blending ratio of the polymer blended in the above first adhesive composition.

The second photocuring agent may be, for example, a polyfunctional (meth)acrylate having 2 or more and 3 or less functional groups from the viewpoint of sufficiently improving the adhesive strength of the adhesive layer 3 by light irradiation, and specifically, polyethylene glycol. Di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkanediol di( (Meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, pentaerythritol di(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerin di(meth)acrylate and other bifunctional (meth)acrylates, for example, Examples include trifunctional (meth)acrylates such as ethoxylated isocyanuric acid tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and trimethylolpropane tri(meth)acrylate, and preferably bifunctional (meth)acrylate, More preferably, polypropylene glycol diacrylate is used.

The second photo-curing agent can be used alone or in combination of two or more kinds.

Also, the functional group equivalent of the second photo-curing agent is, for example, 50 g/eq or more and, for example, 500 g/eq or less.

The viscosity of the second photo-curing agent at 25° C. is, for example, 5 mPa·s or more and, for example, 1000 mPa·s or less.

From the viewpoint of compatibility, the molecular weight of the second photo-curing agent is, for example, 200 or less, and is, for example, 1000 or more.

Also, the second photo-curing agent is preferably selected such that it is incompatible with the polymer.

If the second photo-curing agent is not compatible with the polymer, the adhesive force (described later) of the adhesive layer 3 that is not irradiated with light can be reduced.

Specifically, if the difference between the Hansen solubility parameter (HSP) of the polymer and the Hansen solubility parameter (HSP) of the second photocuring agent is, for example, 3 or more, preferably 4 or more, the second photocuring agent And the polymer are not compatible with each other, and as a result, the adhesive force (described later) of the adhesive layer 3 which is not irradiated with light can be reduced.

The mixing ratio of the second photo-curing agent is the same as the mixing ratio of the first photo-curing agent mixed in the above-mentioned first adhesive composition.

Examples of the photopolymerization initiator include those similar to the photopolymerization initiator blended in the above first adhesive composition, and when a polyfunctional (meth)acrylate is used as the second photocuring agent, Photo radical initiators are preferably used, more preferably hydroxyketones.

The blending ratio of the photopolymerization initiator is the same as the blending ratio of the photopolymerization initiator blended in the above-mentioned first adhesive composition.

Then, in order to prepare the second pressure-sensitive adhesive composition, the polymer (in the case of preparing the polymer by solution polymerization), the second photocuring agent, and the photopolymerization initiator are blended in the above proportions. And mix.

From the viewpoint of introducing a crosslinked structure into the polymer, the second adhesive composition preferably contains a crosslinking agent.

As the cross-linking agent, the same cross-linking agents as those contained in the above-mentioned first adhesive composition can be mentioned, and preferably an isocyanate-based cross-linking agent and an epoxy-based cross-linking agent can be mentioned.

Cross-linking agents can be used alone or in combination of two or more.

The blending ratio of the cross-linking agent is the same as the blending ratio of the cross-linking agent blended in the above first adhesive composition.

When a crosslinking agent is added to the second adhesive composition, a crosslinking catalyst may be added to accelerate the crosslinking reaction.

As the cross-linking catalyst, the same cross-linking catalyst as the above-mentioned first tacky composition may be used.

The blending ratio of the cross-linking catalyst is the same as the blending ratio of the cross-linking catalyst blended in the above-mentioned first adhesive composition.

Further, the second adhesive composition may contain, if necessary, various additives to be blended with the above-mentioned first adhesive composition within a range that does not impair the effects of the present invention.

By this, the second adhesive composition is obtained.

The blending ratio of the polymer to the second adhesive composition, the blending ratio of the second photocuring agent, and the blending ratio of the photopolymerization initiator are the blending ratio of the polymer to the first adhesive composition and the blending ratio of the first photocuring agent. It is the same as the mixing ratio and the mixing ratio of the photopolymerization initiator.

That is, the first adhesive composition and the second adhesive composition are common in that they include a polymer, a photopolymerization initiator, and optionally a cross-linking agent, a cross-linking catalyst, and various additives. The adhesive composition contains a first photocuring agent which is a polyfunctional (meth)acrylate having 4 or more functional groups, while the second adhesive composition is a polyfunctional (meth)acrylate having 3 or less functional groups. It differs in that it contains two photo-curing agents.

That is, the first adhesive composition or the second adhesive composition can be selectively prepared depending on which of the first photocuring agent and the second photocuring agent is mixed.

Then, the adhesive layer 3 is formed from the first adhesive composition or the second adhesive composition by the method described below.

The thickness of the adhesive layer 3 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, further preferably 20 μm or more from the viewpoint of adhesiveness, and from the viewpoint of handleability, for example, It is 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, further preferably 40 μm or less, and particularly preferably 30 μm or less.
2-3. Method for Manufacturing Adhesive Sheet Next, a method for manufacturing the adhesive sheet 4 will be described with reference to FIG.

The method for manufacturing the pressure-sensitive adhesive sheet 4 includes a first step of preparing the base material 2 and a second step of disposing the pressure-sensitive adhesive layer 3 on one surface of the base material 2.

In the first step, the base material 2 is prepared as shown in FIG. 2A.

In the second step, as shown in FIG. 2B, the adhesive layer 3 is arranged on one surface of the base material 2.

In order to arrange the adhesive layer 3 on one surface of the base material 2, for example, the first adhesive composition or the second adhesive composition described above is applied to one surface of the base material 2 and a solvent is added if necessary. Remove by drying.

Examples of the method for applying the first adhesive composition or the second adhesive composition include roll coat, kiss roll coat, gravure coat, reverse coat, roll brush, spray coat, dip roll coat, bar coat, knife coat, Examples include air knife coat, curtain coat, lip coat, die coat and the like.

As the drying conditions, the drying temperature is, for example, 50° C. or higher, preferably 70° C. or higher, more preferably 100° C. or higher, and, for example, 200° C. or lower, preferably 180° C. or lower, more preferably, The temperature is 150° C. or less, and the drying time is, for example, 5 seconds or more, preferably 10 seconds or more, and for example, 20 minutes or less, preferably 15 minutes or less, more preferably 10 minutes or less.

As a result, the adhesive layer 3 is formed on one surface of the base material 2, and the adhesive sheet 4 including the base material 2 and the adhesive layer 3 arranged on the one surface of the base material 2 is obtained.

When the first adhesive composition or the second adhesive composition contains a cross-linking agent, it is dried and removed at the same time or after the solvent is dried (on one surface of the adhesive layer 3, a release film 6 (described later)). Cross-linking), the crosslinking is preferably promoted by aging.

The aging conditions are appropriately set depending on the type of the cross-linking agent, and the aging temperature is, for example, 20° C. or higher, and, for example, 160° C. or lower, preferably 50° C. or lower, and the aging time is 1 minute. The time is not less than 12 hours, preferably not less than 12 hours, more preferably not less than 1 day, and not more than 7 days.

As described above, the adhesive layer 3 of the adhesive sheet 4 is formed of either the first adhesive composition or the second adhesive composition.

The state of the first adhesive composition can be irreversibly changed from a state of high adhesive force to a state of low adhesive force. Specifically, the first adhesive composition can irreversibly change its state from a state of high adhesive strength to a state of low adhesive strength by light irradiation.

That is, when the pressure-sensitive adhesive layer 3 formed from such a first pressure-sensitive adhesive composition is irradiated with light, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 after photocuring becomes smaller than the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 before photocuring.

Therefore, in the fifth step described later, when a part of the adhesive layer 3 is irradiated with light, the adhesive layer 3 made of the first adhesive composition, which is not irradiated with light, becomes the high adhesive region 10 and is irradiated with light. The adhesive layer 3 made of the adhesive composition 1 becomes the low adhesive area 11. Thereby, the adhesive layer 3 includes the high adhesive region 10 and the low adhesive region 11.

The adhesive strength of the adhesive layer 3 not irradiated with light (adhesive strength of the high adhesive area 10) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and further preferably , 12 N/25 mm or more.

The adhesive force of the adhesive layer 3 irradiated with light (adhesive force of the low adhesive region 11) is, for example, 4 N/25 mm or less, preferably 3 N/25 mm or more.

If the adhesive strength of the high-adhesion region 10 is equal to or higher than the above lower limit, the high-adhesion region 10 can be left attached to the adherend 5 and used to reinforce the adherend 5 together with the corresponding base material 2.

If the adhesive strength of the low-adhesion region 11 is equal to or less than the above upper limit, the low-adhesion region 11 can be easily removed from the intermediate laminate 1 together with the corresponding base material 2.

The above-mentioned adhesive strength will be described in detail in Examples described later, but it is measured by sticking the adhesive sheet 4 to a polyimide film at 25° C. and performing a 180-degree peel test at a peeling speed of 300 mm/min.

The shear storage elastic modulus G′ at 25° C. of the pressure-sensitive adhesive layer 3 not irradiated with light is, for example, 6×10 ⁴ Pa or more, preferably 7×10 ⁴ Pa or more, and, for example, 9×10 ⁴ Pa or less, preferably 8×10 ⁴ Pa or less.

Further, the shear storage elastic modulus G′ at 25° C. of the adhesive layer 3 irradiated with light is 2.00×10 ⁶ Pa or more, preferably 2.50×10 ⁶ Pa or more, more preferably 3.0. It is ×10 ⁶ Pa or more.

The shear storage elastic modulus G′ will be described in detail later in Examples, but the dynamic viscoelasticity measurement is performed under the conditions of a frequency of 1 Hz, a temperature rising rate of 5° C./min, and a temperature range of −50° C. to 150° C. Measured by

On the other hand, the second adhesive composition can irreversibly change its state from low adhesive strength to high adhesive strength. Specifically, the second adhesive composition can irreversibly change its state from low adhesive strength to high adhesive strength by light irradiation.

That is, when the pressure-sensitive adhesive layer 3 formed of the second pressure-sensitive adhesive composition is irradiated with light, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 after photocuring becomes larger than the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 before photocuring.

Therefore, when a part of the adhesive layer 3 is irradiated with light in a later-described fifth step, the adhesive layer 3 made of the second adhesive composition, which is not irradiated with light, becomes the low adhesive region 11 and is irradiated with light. 2 The adhesive layer 3 made of the adhesive composition becomes the high adhesive area 10. Thereby, the adhesive layer 3 includes the high adhesive region 10 and the low adhesive region 11.

And the adhesive force of the adhesive layer 3 irradiated with light (adhesive force of the high adhesive region 10) is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and further preferably Is 12 N/25 mm or more.

Further, the adhesive force of the adhesive layer 3 not irradiated with light (adhesive force of the low adhesive region 11) is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less.

Further, the shear storage elastic modulus G′ at 25° C. of the adhesive layer 3 which is not irradiated with light is, for example, 1×10 ⁴ Pa or more, preferably 5×10 ⁴ Pa or more, and, for example, 1.2× It is not more than 10 ⁵ Pa, preferably not more than 1×10 ⁵ Pa.

The shear storage elastic modulus G′ at 25° C. of the adhesive layer 3 irradiated with light is, for example, 1.00×10 ⁵ Pa or more, preferably 1.3×10 ⁵ Pa or more, and more preferably 1 It is not less than 0.5×10 ⁵ Pa and not more than 1.0×10 ⁶ Pa, for example.

Further, as shown in FIG. 2C, the pressure-sensitive adhesive sheet 4 may have a release film 6 laminated on one surface of the pressure-sensitive adhesive layer 3 if necessary.

In such a case, the adhesive sheet 4 includes the base material 2, the adhesive layer 3, and the release film 6 in order.

Examples of the release film 6 include flexible plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester film.

The thickness of the release film 6 is, for example, 3 μm or more, preferably 10 μm or more, and for example, 200 μm or less, preferably 100 μm or less, more preferably 50 μm or less.

The release film 6 is preferably subjected to a release treatment with a silicone-based, fluorine-based, long-chain alkyl-based, fatty acid amide-based release agent, or a release treatment with silica powder.
3. Adherend The adherend 5 is an object to be reinforced by the pressure-sensitive adhesive sheet 4, and examples thereof include an optical device, an electronic device, and components thereof.

In FIG. 1, the adherend 5 has a flat plate shape, but the shape of the adherend 5 is not particularly limited, and various shapes are selected depending on the types of the optical device, the electronic device and the structural parts thereof. It
4. Method for Producing Intermediate Laminated Body An embodiment of a method for producing the intermediate laminated body 1 will be described with reference to FIGS. 3 and 4.

The manufacturing method of this intermediate|middle laminated body 1 WHEREIN: The process of preparing the adhesive sheet 4 (3rd process), the process of arrange|positioning the to-be-adhered body 5 on one surface of the adhesive sheet 4 (4th process), and the adhesive layer 3 One of the irradiated portion 7 and the non-irradiated portion 8 is formed by partially irradiating the adhesive layer 3 with light and forming an irradiated portion 7 that is irradiated with light and a non-irradiated portion 8 that is not irradiated with light. Is a high adhesion region 10 made of an adhesive composition having a high adhesive force, and the other is a low adhesion region 11 made of an adhesive composition having a low adhesive force (fifth step).

In the fifth step, one of the irradiated portion 7 and the non-irradiated portion 8 becomes the high-adhesive region 10 and the other becomes the low-adhesive region 11, but the adhesive layer 3 is the first adhesive composition or the second adhesive. Which of the irradiating composition 7 and the non-irradiating composition 8 is the high-adhesion region 10 or the low-adhesion region 11 is determined depending on which of the volatile compositions is formed.

Therefore, the case where the adhesive layer 3 is formed of the first adhesive composition and the case where the adhesive layer 3 is formed of the second adhesive composition will be separately described below.
4-1. Method of Manufacturing Intermediate Laminate for Forming Adhesive Layer with First Adhesive Composition First, FIG. Will be described with reference to.

In the third step, as shown in FIG. 3A, the adhesive sheet 4 is prepared.

Next, in the fourth step, as shown in FIG. 3B, the adhesive sheet 4 is attached to the adherend 5 so that the adhesive layer 3 arranged on one surface of the base material 2 and the adherend 5 come into contact with each other. To wear.

Next, in a fifth step, as shown in FIG. 3C, a part of the adhesive layer 3 is irradiated with light to form a high adhesive region 10 and a low adhesive region 11.

In addition, in the following description, the non-irradiated portions 8 are two portions of both ends of the pressure-sensitive adhesive sheet 4 which is divided into three in the surface direction (in other words, the center portion of the pressure-sensitive adhesive sheet 4 is divided into three in the surface direction. Only the irradiation part 7) will be explained.

In the fifth step, in the adhesive sheet 4, the irradiated portion 7 is irradiated with light and the non-irradiated portion 8 is not irradiated with light.

Specifically, the mask 9 is not placed on the irradiated portion 7, and the mask 9 that blocks light is placed on the non-irradiated portion 8.

As described above, when the pressure-sensitive adhesive layer 3 formed of the first pressure-sensitive adhesive composition is irradiated with light and is photocured, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 after photocuring is the same as that of the pressure-sensitive adhesive layer 3 before photocuring. Will be smaller than.

That is, while the adhesive strength of the adhesive layer 3 in the irradiated portion 7 decreases, the adhesive strength of the adhesive layer 3 in the non-irradiated portion 8 does not decrease and the adhesive strength remains strong.

Then, the irradiated portion 7 has a relatively lower adhesive strength than the non-irradiated portion 8, and therefore the irradiated portion 7 (specifically, the first adhesive composition after the state change (after photocuring) is The adhesive layer 3) becomes a low adhesive area 11, and the non-irradiated portion 8 (specifically, the adhesive layer 3 made of the first adhesive composition before the state change (before photocuring)) is the high adhesive area 10 Becomes

Thereby, the adhesive layer 3 including the high adhesive area 10 and the low adhesive area 11 is obtained. Moreover, the intermediate|middle laminated body 1 which equips the adhesive sheet 4 and the to-be-adhered body 5 in order (in other words, the base material 2, the adhesive layer 3, and the to-be-adhered body 5 in order) is obtained.

In FIG. 3, since the base material 2 has a flat plate shape, the mask 9 can be arranged on an arbitrary portion of the upper surface of the base material 2. However, depending on the shape of the base material 2, the mask 9 may be placed on a specific portion. It may be difficult to place. Then, there are cases where the portion where the mask 9 is difficult to arrange is removed.

In such a case, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the second adhesive composition, the non-irradiated portion 8 where the mask 9 is placed becomes the low adhesive region 11, that is, the mask 9 is placed. Since it is necessary to dispose the mask 9 in a difficult portion, the work becomes complicated. However, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the first adhesive composition, the irradiation portion 7 where the mask 9 is not disposed is The low-adhesion region 11, that is, it is not necessary to place the mask 9 in a portion where it is difficult to place the mask 9, and the mask 9 can be placed in other portions, so that the work is simplified.
4-2. Manufacturing Method of Intermediate Laminate for Forming Adhesive Layer with Second Adhesive Composition Second, for manufacturing method of intermediate laminate 1 for forming adhesive layer 3 with the second adhesive composition (manufacturing method 2), FIG. Will be described with reference to.

In the third step, as shown in FIG. 4A, the adhesive sheet 4 is prepared.

Next, in the fourth step, as shown in FIG. 4B, the adhesive sheet 4 is attached to the adherend 5 so that the adhesive layer 3 arranged on one surface of the base material 2 and the adherend 5 come into contact with each other. To wear.

Next, in the fifth step, as shown in FIG. 4C, a part of the adhesive layer 3 is irradiated with light to form a high adhesive region 10 and a low adhesive region 11.

In the following description, two parts of both ends of the pressure-sensitive adhesive sheet 4 divided into three in the plane direction are irradiated parts 7 (in other words, one part of the center of the pressure-sensitive adhesive sheet 4 divided into three in the plane direction. Only the non-irradiated portion 8) will be described.

As described above, when the pressure-sensitive adhesive layer 3 formed from the second pressure-sensitive adhesive composition is irradiated with light and photocured, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer 3 after photocuring is the same as that of the pressure-sensitive adhesive layer 3 before photocuring. Will be larger than.

That is, the adhesive strength of the adhesive layer 3 in the irradiated portion 7 is improved, whereas the adhesive strength of the adhesive layer 3 in the non-irradiated portion 8 is not improved.

Then, the irradiated portion 7 has a relatively higher adhesive force than the non-irradiated portion 8, and therefore the irradiated portion 7 (specifically, from the second adhesive composition after the state change (after photocuring)) The adhesive layer 3) becomes a high adhesive area 10, and the non-irradiated portion 8 (specifically, the adhesive layer 3 made of the second adhesive composition before the state change (before photocuring)) is the low adhesive area 11 Becomes

In FIG. 4, since the base material 2 has a flat plate shape, the mask 9 can be arranged on an arbitrary portion of the upper surface of the base material 2. However, depending on the shape of the base material 2, the mask 9 may be placed on a specific portion. It may be difficult to place. Then, there may be a case where a portion where the mask 9 is difficult to arrange remains.

In such a case, in the intermediate laminate 1 in which the adhesive layer 3 is formed by the first adhesive composition, the non-irradiated portion 8 where the mask 9 is not arranged becomes the high adhesive region 10, that is, the mask 9 is arranged. The work is complicated because it is necessary to dispose the mask 9 on a difficult portion, but in the intermediate laminate 1 in which the adhesive layer 3 is formed by the second adhesive composition, the non-irradiated portion 8 where the mask 9 is not disposed is used. However, it becomes the high-adhesion region 10, that is, it is not necessary to dispose the mask 9 on a portion where the mask 9 is difficult to dispose, and the mask 9 can be disposed on other portions, so that the work is simplified.
5. Action and Effect of Intermediate Laminate and Method for Producing Intermediate Laminate The adhesive layer 3 of the intermediate laminate 1 is composed of an adhesive composition that can irreversibly change its state between a state with high adhesive force and a state with low adhesive force. ..

Therefore, the state change (photocuring) may form the high-adhesion region 10 made of the adhesive composition having a high adhesive force and the low-adhesion region 11 made of the adhesive composition having a low adhesive force. it can.

That is, in the intermediate laminate 1, the high-adhesive region 10 is formed from the adhesive composition having a high adhesive force, and the low-adhesive region 11 is formed from the adhesive composition having a low adhesive force. The low-adhesion region 11 and the low-adhesion region 11 are not included together, but the high-adhesion region 10 and the low-adhesion region 11 can be formed together by forming the high-adhesion region 10 and the low-adhesion region 11 from the same adhesive composition.

Since the adhesive layer 3 of the intermediate laminate 1 includes the high-adhesion region 10 and the low-adhesion region 11, the high-adhesion region 10 is left attached to the adherend 5 and the corresponding substrate 2 While it can be used to reinforce the adherend 5, the low-adhesion region 11 can be removed from the adherend 5 together with the corresponding base material 2.

As a result, a product laminate 12 (described later) in which the adherend 5 is reinforced can be obtained.

The method for manufacturing the intermediate laminate 1 includes a fifth step of forming the high adhesion region 10 and the low adhesion region 11 by irradiating a part of the adhesion layer 3 with light.

Therefore, the adhesive layer 3 including the high-adhesion region 10 and the low-adhesion region 11 can be obtained. As a result, it is possible to manufacture the intermediate laminate 1 including such an adhesive layer 3.

In addition, in the method for manufacturing the intermediate laminate 1, the adhesive composition is partially photocured by light irradiation to form the high-adhesion region 10 and the low-adhesion region 11.

Therefore, as compared with the case where the pressure-sensitive adhesive composition is heat-cured by heating, damage to the adherend 5 due to heat can be suppressed.
6. Product Laminate and Manufacturing Method of Product Laminate The product laminate 12 is a device in the final form or a component of the device.

The product laminate 12 is manufactured by removing the low-adhesion region 11 from the above intermediate laminate 1.

Specifically, the product laminate 12 includes a sixth step of preparing the intermediate laminate 1 manufactured by the above-described method of manufacturing the intermediate laminate 11, and a seventh step of removing the low-adhesion region 11 in the adhesive layer 3. It is manufactured by the method for manufacturing a product laminate including.

An embodiment of a method for manufacturing the product laminate 12 will be described with reference to FIG.

In the sixth step, as shown in FIG. 5A, the method for producing the intermediate laminate 1 in which the adhesive layer 3 is formed by the first adhesive composition (manufacturing method 1), or the adhesive layer 3 is formed by the second adhesive composition. The intermediate laminate 1 is manufactured by the method of manufacturing the intermediate laminate 1 to be formed (manufacturing method 2), and the intermediate laminate 1 is prepared.

In the seventh step, as shown in FIG. 5B, the low adhesion region 11 is removed from the intermediate laminate 1.

Specifically, the remaining portion 13 composed of the high-adhesion region 10 and the corresponding base material 2 and the removed portion 14 composed of the low-adhesion region 11 and the corresponding base material 2 are cut by, for example, a CO ₂ laser. After that, only the removed portion 14 is peeled off from the end of the removed portion 14 as a starting point.

At this time, since the adhesive strength of the low-adhesion region 11 in the removed portion 14 is reduced, the removed portion 14 can be easily peeled from the intermediate laminate 1.

On the other hand, the adhesive strength of the high-adhesion region 10 in the remaining portion 13 has not decreased and has the above-described high adhesive strength, so that the remaining portion 13 remains in the intermediate laminate 1.

Further, since the high-adhesion region 10 has the above-described high adhesive force, even if the removed portion 14 is peeled off, it is possible to prevent the end portion of the remaining portion 13 in contact with the removed portion 14 from rising.

The remaining portion 13 can be used as it is to reinforce the adherend 5.

Thereby, the product laminated body 12 is obtained.
7. Function and Effect of Manufacturing Method of Product Laminated Product The manufacturing method of the product laminated body 12 is the above-mentioned manufacturing method of the intermediate laminated body (manufacturing method of the intermediate laminated body 1 in which the adhesive layer 3 is formed by the first adhesive composition (manufacturing method 1 ) Or the seventh step of removing the low-adhesion region 11 of the adhesive layer 3 in the intermediate laminate 1 produced by the method for producing the intermediate laminate 1 (production method 2)) which forms the adhesive layer 3 with the second adhesive composition. Prepare

Since the adhesive force in the low adhesive area 11 is low, the removed portion 14 can be easily removed from the intermediate laminate 1.

On the other hand, the remaining portion 13 can be left in the intermediate laminate 1 to reinforce the adherend 5.

Moreover, since the remaining portion 13 imparts appropriate rigidity, the handling property is improved.

In particular, when the adherend 5 is an electronic device, the thickness of the components of the electronic device tends to become smaller as the degree of integration becomes higher, the size and weight of the electronic device become thinner, and the components become thinner. Due to this thinning, bending and curling due to stress are likely to occur at the laminated interface of the component parts. Further, due to the reduced thickness, bending due to its own weight is likely to occur.

Even in such a case, according to the pressure-sensitive adhesive sheet 4, the remaining portion 13 can impart rigidity to the electronic device, so that curving, curling, bending and the like due to stress, self-weight, etc. can be suppressed, and the handling property can be improved. You can

Also, in the process of manufacturing electronic devices, if the devices are transported or processed by automated equipment, the components of the electronic device may come into contact with the components such as the transport arm and the pins, and the components may be damaged.

In particular, with highly integrated, small, lightweight, and thin devices, damage or dimensional change may occur due to local stress concentration when contacting or cutting a transfer device.

Even in such a case, according to the pressure-sensitive adhesive sheet 4, appropriate rigidity is imparted by the remaining portion 13 and stress is relaxed/dispersed to suppress cracks, cracks, peeling, dimensional changes, and the like. it can.
8. Modified Example The shape of the low-adhesion region 11 is not particularly limited, and may be, for example, a cross shape (FIG. 6) or a round shape (FIG. 7).

A case where the low-adhesion region 11 has a cross shape (specifically, a cross shape including both ends of the surface of the adhesive sheet 4) will be described with reference to FIG. 6.

In the sixth step, as shown in FIG. 6A, the method for producing the intermediate laminate 1 in which the first adhesive composition is used to form the adhesive layer 3 (manufacturing method 1), or the second adhesive composition is used to form the adhesive layer 3. The intermediate laminate 1 is manufactured by the method of manufacturing the intermediate laminate 1 to be formed (manufacturing method 2), and the intermediate laminate 1 is prepared.

As shown in FIG. 6A, in the intermediate laminate 1, the low-adhesion region 11 has a cross shape, and the high-adhesion region 10 is a part other than the cross shape.

Next, in the seventh step, as shown in FIG. 6B, the low adhesion region 11 (removed portion 14) is removed from the intermediate laminate 1 by the method described above.

With this, the product laminate 12 is obtained.

Further, in the above description, in the seventh step, the removed portion 14 was peeled off from the intermediate laminate 1 with the end of the removed portion 14 as the starting point, but in particular, there are cases where it is difficult to use the end of the removed portion 14 as the starting point.

Specifically, as shown in FIG. 7A, in the case where the low-adhesion region 11 is circular in the pressure-sensitive adhesive sheet 4, in the central portion of the pressure-sensitive adhesive sheet 4, the removed portion 14 causes the edge of the surface of the pressure-sensitive adhesive sheet 4 to move. Since it is not included, it is difficult to peel off the removed portion 14 starting from the end of the removed portion 14.

However, in such a case, as shown in FIG. 7B, in the seventh step, the removed portion 14 can be peeled off by adhering the removed portion 14 with the adhesive roller 15.

In this way, according to this intermediate laminate 1, any part can be removed.

The present invention will be described more specifically by showing Examples and Comparative Examples below. The present invention is not limited to the examples and comparative examples. In addition, specific numerical values such as a blending ratio (content ratio), physical property values, and parameters used in the following description are described in the above-mentioned "Description of Embodiments", and a corresponding blending ratio ( Content ratio), physical property value, parameter, etc. are replaced by the upper limit (numerical value defined as “below” or “less than”) or lower limit value (numerical value defined as “greater than or equal to” or “exceeded”) be able to.

In addition, "part" and "%" are based on mass unless otherwise specified.
1. Details of Components Each component used in each Example and each Comparative Example is described below.
Takenate D110N: 75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate, Mitsui Chemicals A-DPH: dipentaerythritol hexaacrylate; functional group equivalent weight: 96 g/eq
APG700: polypropylene glycol #700 (n=12) diacrylate; functional group equivalent weight 404 g/eq
A200: Polyethylene glycol #200 (n=4) diacrylate tetrad C: N,N,N',N'-tetraglycidyl-m-xylylenediamine (tetrafunctional epoxy compound), manufactured by Mitsubishi Gas Chemical Co., Inc.
Irgacure 184: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF 2. Preparation of Polymer Synthesis Example 1
In a reaction vessel equipped with a thermometer, a stirrer, a reflux condenser and a nitrogen gas inlet tube, 9 parts by weight of methyl methacrylate (MMA), 63 parts by weight of 2-ethylhexyl acrylate (2EHA) and 13 parts of hydroxyethyl acrylate (HEA) were used as monomers. Parts by weight, 15 parts by weight of N-vinylpyrrolidone (NVP), 0.2 parts by weight of azobisisobutyronitrile as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent were charged, and nitrogen gas was flown in while stirring. The atmosphere was replaced with nitrogen for about 1 hour. Then, it heated at 60 degreeC and made it react for 7 hours, and obtained the solution of the acrylic polymer whose weight average molecular weight (Mw) is 1200,000.

Synthesis example 2
Polymerization was performed in the same manner as in Synthesis Example 1 except that the monomers were changed to 95 parts by weight of butyl acrylate and 5 parts by weight of acrylic acid to obtain a solution of an acrylic polymer having a weight average molecular weight (Mw) of 600,000.
3. Preparation of adhesive composition Preparation example 1 (preparation of first adhesive composition)
1. In the acrylic polymer solution of Synthesis Example 1, Takenate D110N (75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Chemicals Inc.) as a cross-linking agent was used per 100 parts by weight of the solid content of the polymer. 5 parts by mass, A-DPH (dipentaerythritol hexaacrylate) as a photocuring agent, 20 parts by mass relative to 100 parts by weight of the solid content of the polymer, and Irgacure 184 (1-hydroxycyclohexylphenyl ketone) as a photopolymerization initiator. (Manufactured by BASF Co., Ltd.) was added in an amount of 0.1 part by mass to 100 parts by mass of the solid content of the polymer, and the mixture was uniformly mixed to prepare a first adhesive composition.

Preparation Example 2 (Preparation of second adhesive composition)
A second adhesive composition was prepared in the same manner as in Preparation Example 1 except that the photocuring agent was changed to APG700 (polypropylene glycol #700 (n=12) diacrylate).

Preparation Example 3 (Preparation of second adhesive composition)
Tetrad C (N,N,N′,N′-tetraglycidyl-m-xylylenediamine (tetrafunctional epoxy compound, manufactured by Mitsubishi Gas Chemical Co., Inc.)) was used as a cross-linking agent in the acrylic polymer solution of Synthesis Example 2. 0.5 parts by weight based on 100 parts by weight of solid content, A200 (polyethylene glycol #200 (n=4) diacrylate) as a photocuring agent, 30 parts by weight based on 100 parts by weight of solid content of the polymer, As a photopolymerization initiator, Irgacure 184 was added in an amount of 0.1 part by mass with respect to 100 parts by mass of the solid content of the polymer, and uniformly mixed to prepare a second adhesive composition.
4. Production of adhesive sheet Production example 1
A 75 μm-thick polyethylene terephthalate film (“Lumirror S10” manufactured by Toray Co., Ltd.) that has not been surface-treated is used as a base material, and the photocurable composition of Preparation Example 1 is dried on the base material to a thickness of 25 μm. As in the fountain roll. The solvent was removed by drying at 130° C. for 1 minute. Thereby, the adhesive layer was formed on one surface of the substrate. Further, a release-treated surface of a release film (25 μm-thick polyethylene terephthalate film having a silicone release-treated surface) was attached to one surface of the adhesive layer. After that, aging treatment was performed for 4 days in an atmosphere of 25° C., and a crosslinking reaction between the polymer and the crosslinking agent was allowed to proceed. This produced the adhesive sheet.

Production example 2
A pressure-sensitive adhesive sheet was produced in the same manner as in Production Example 1 except that the adhesive composition was changed to the second adhesive composition of Preparation Example 2.

Production Example 3
A pressure-sensitive adhesive sheet was produced in the same manner as in Production Example 1 except that the adhesive composition was changed to the second adhesive composition of Preparation Example 3.
5. Production of Intermediate Laminate Example 1
After peeling the release film from the pressure-sensitive adhesive sheet of Production Example 1, this pressure-sensitive adhesive sheet was attached to a polyimide film (“Kapton 50EN” manufactured by Toray-DuPont) having a thickness of 12.5 μm.

Next, a part of the adhesive layer was irradiated with light.

Specifically, by arranging masks at two positions (non-irradiated portions) on both ends of the pressure-sensitive adhesive sheet divided into three in the plane direction, the pressure-sensitive adhesive sheet is divided into three in the plane direction without irradiating light. One of the central portions (irradiated portion) was irradiated with light without placing a mask.

As is clear from the evaluation of the adhesive strength described below, the adhesive strength of the adhesive sheet of Production Example 1 after photocuring is smaller than the adhesive strength before photocuring.

From this, it can be seen that the irradiated part has a relatively lower adhesive strength than the non-irradiated part, the irradiated part has a low adhesive area, and the non-irradiated part has a high adhesive area.

With this, an intermediate laminate was manufactured.

Example 2
After peeling the release film from the pressure-sensitive adhesive sheet of Production Example 2, the pressure-sensitive adhesive sheet was attached to a polyimide film (“Kapton 50EN” manufactured by Toray-DuPont) having a thickness of 12.5 μm.

Next, a part of the adhesive layer was irradiated with light.

Specifically, the adhesive sheet is divided into three parts in the surface direction by irradiating light without arranging a mask at two positions (irradiated portions) of both ends of the adhesive sheet. By arranging a mask at one place (non-irradiation portion) in the center, light was not emitted.

As is clear from the evaluation of the adhesive strength described later, in the adhesive sheet of Production Example 2, the adhesive strength after photocuring is higher than the adhesive strength before photocuring.

From this, it can be seen that the irradiated area has a relatively higher adhesive force than the non-irradiated area, the irradiated area has a high adhesive area, and the non-irradiated area has a low adhesive area.

With this, an intermediate laminate was manufactured.

Example 3
After peeling the release film from the pressure-sensitive adhesive sheet of Production Example 3, the pressure-sensitive adhesive sheet was attached to a polyimide film (“Kapton 50EN” manufactured by Toray-DuPont) having a thickness of 12.5 μm.

Next, a part of the adhesive layer was irradiated with light.

As is clear from the evaluation of the adhesive strength described later, in the adhesive sheet of Production Example 3, the adhesive strength after photocuring is higher than the adhesive strength before photocuring.

With this, an intermediate laminate was manufactured.

Comparative Example 1
A pickup tape was used as an adhesive sheet, and the pickup tape was attached to a polyimide film (“Kapton 50EN” manufactured by Toray-DuPont) having a thickness of 12.5 μm.

This produced the intermediate laminated body.
6. Evaluation (shear storage elastic modulus)
The photocurable composition of each preparation example was applied to a PET film that had been subjected to a mold release treatment so that the thickness after drying was 25 μm, and then dried and aged to obtain an adhesive layer. According to the same procedure, 60 adhesive layers were prepared, the adhesive layers were laminated, and a 1.5 mm sample for shear storage elastic modulus measurement (before photocuring) was prepared. The shear storage elastic modulus was also obtained by irradiating the sample for shear storage elastic modulus measurement (before photocuring) obtained as described above with a UV lamp having an illuminance of 5 mW/cm ² for 360 seconds using a chemical lamp. A sample for measurement (after photocuring) was prepared.

A sample for shear storage elastic modulus measurement (before photo-curing) and a sample for shear storage elastic modulus measurement (after photo-curing) were used under the following conditions by using "Advanced Rheometric Expansion System (ARES)" manufactured by Rheometric Scientific. The shear storage elastic modulus was measured. The results are shown in Table 1.
(Measurement condition)
Deformation mode: Torsional measurement frequency: 1 Hz
Temperature rising rate: 5°C/min Measuring temperature: -50 to 150°C
Shape: Parallel plate 8.0mmφ
(Adhesive force)
A 12.5 μm-thick polyimide film (“Kapton 50EN” manufactured by DuPont Toray) was attached to a glass plate via a double-sided adhesive tape (“No.531” manufactured by Nitto Denko) to obtain a polyimide film substrate for measurement. The release film was removed from the pressure-sensitive adhesive sheet of each production example that was cut into a width of 25 mm and a length of 100 mm, and the pressure-sensitive adhesive sheet and the polyimide film substrate for measurement were bonded at 25° C. using a hand roller, and before photocuring. A sample for measurement was prepared.

Separately, in the same procedure as above, prepare a pressure-sensitive adhesive sheet before photo-curing, from the base material side of the pressure-sensitive adhesive sheet before photo-curing, irradiate ultraviolet rays to photo-cur the pressure-sensitive adhesive layer, and measure sample after photo-curing Was prepared.

Adhesive force was measured for each of the measurement sample before photocuring and the measurement sample after photocuring.

Specifically, the ends of the measurement sample before photocuring and the measurement sample after photocuring (the ends of the adhesive sheet) are held by a chuck, and the 180° peel of the reinforcing film is performed at a pulling speed of 300 mm/min. Was carried out and the peel strength was measured. The results are shown in Table 1.

(Appearance after peeling)
In the intermediate laminate of each example, the high-adhesion region and the low-adhesion region were cut, and then only the low-adhesion region was peeled off, starting from the end of the low-adhesion region.

Also, in Comparative Example 1, the center portion of the three parts divided in the surface direction of the pickup tape was cut, and this part was peeled off.

The appearance after peeling was visually evaluated.

Regarding the appearance after peeling, superiority or inferiority was evaluated according to the following criteria. The results are shown in Table 1. Good: No peeling was observed in the adhesive sheet remaining in the intermediate laminate.
X: Peeling was observed on the adhesive sheet remaining in the intermediate laminate.

The above-mentioned invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be limitedly interpreted. Modifications of the invention that will be apparent to those skilled in the art are within the scope of the following claims.

The intermediate laminate, the method for producing the intermediate laminate, and the method for producing the product laminate of the present invention can be preferably used in the production of various devices.

1 Intermediate Laminate 2 Base Material 3 Adhesive Layer 4 Adhesive Sheet 5 Adherent 7 Irradiated Area 8 Non-Irradiated Area 10 High Adhesive Area 11 Low Adhesive Area 12 Product Laminate

Claims

A pressure-sensitive adhesive sheet having a base material and an adhesive layer disposed on one surface of the base material, and an adherend disposed on one surface of the pressure-sensitive adhesive sheet,
The pressure-sensitive adhesive layer, in a state of high adhesive strength and low adhesive strength, consisting of an adhesive composition irreversibly changeable state,
The intermediate layered product, wherein the adhesive layer comprises a high-adhesive region made of an adhesive composition having a high adhesive force and a low-adhesive region made of an adhesive composition having a low adhesive force.
The pressure-sensitive adhesive layer comprises a first pressure-sensitive adhesive composition capable of irreversibly changing its state from a state of high adhesive strength to a state of low adhesive strength,
The high-adhesion region is composed of the first adhesive composition before the state change,
The said low adhesive area|region consists of the said 1st adhesive composition after a state change, The intermediate laminated body of Claim 1 characterized by the above-mentioned.
The pressure-sensitive adhesive layer is composed of a second pressure-sensitive adhesive composition capable of irreversibly changing its state from a state of low adhesion to a state of high adhesion.
The high-adhesion region is composed of the second adhesive composition after the state change,
The said low-adhesion area|region consists of the said 2nd adhesive composition before a state change, The intermediate laminated body of Claim 1 characterized by the above-mentioned.
The adhesive force measured by a 180-degree peel test at a peeling rate of 300 mm/min by adhering the high-adhesion region to a polyimide film at 25° C. is 5 N/25 mm or more, 2. Intermediate laminate.
The adhesive force measured by a 180-degree peel test at a peeling speed of 300 mm/min by adhering the low-adhesion region to a polyimide film at 25° C. is 4 N/25 mm or less. Intermediate laminate.
A pressure-sensitive adhesive sheet provided on a base material and one surface of the base material, and provided with a pressure-sensitive adhesive layer made of a pressure-sensitive adhesive composition that is irreversibly changeable by light irradiation in a high adhesive state and a low adhesive state. The process of preparing
Disposing an adherend on one surface of the pressure-sensitive adhesive sheet, and
By irradiating a part of the pressure-sensitive adhesive layer with light, the pressure-sensitive adhesive layer is formed with a light-irradiated irradiated portion and a non-light-irradiated non-irradiated portion. One is a high-adhesive region made of an adhesive composition having a high adhesive force, and the other is a low-adhesive region made of an adhesive composition having a low adhesive force. Manufacturing method of intermediate laminate.
The pressure-sensitive adhesive layer is composed of a first pressure-sensitive adhesive composition capable of irreversibly changing its state by light irradiation, from a state having a high pressure-sensitive adhesive force to a state having a low pressure-sensitive adhesive force,
The irradiated portion becomes the low adhesion area,
The method for producing an intermediate laminate according to claim 6, wherein the non-irradiated portion is the high adhesion region.
The pressure-sensitive adhesive layer is composed of a second pressure-sensitive adhesive composition capable of irreversibly changing its state by light irradiation from a low pressure-sensitive adhesive state to a high pressure-sensitive adhesive state.
The irradiated portion becomes the high adhesive area,
The method for manufacturing an intermediate laminate according to claim 6, wherein the non-irradiated portion is the low-adhesion region.
A step of preparing an intermediate laminate produced by the method for producing an intermediate laminate according to claim 6;
A step of removing the low-adhesion region in the adhesive layer, the method for producing a product laminate.