CN109181561B - Stress dispersion membrane, optical component and electronic component - Google Patents

Stress dispersion membrane, optical component and electronic component Download PDF

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Publication number
CN109181561B
CN109181561B CN201810824492.4A CN201810824492A CN109181561B CN 109181561 B CN109181561 B CN 109181561B CN 201810824492 A CN201810824492 A CN 201810824492A CN 109181561 B CN109181561 B CN 109181561B
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weight
adhesive composition
methyl
content ratio
stress dispersion
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CN109181561A (en
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佐佐木翔悟
徐创矢
设乐浩司
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Nitto Denko Corp
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Nitto Denko Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a kind of stress dispersion membrane with excellent stress dispersibility.Additionally, it is provided a kind of optical component, electronic component for having such stress dispersion membrane.Stress dispersion membrane of the invention includes the laminated body of plastic foil and adhesive phase, wherein indentation energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body is 260 μ J or more.

Description

Stress dispersion membrane, optical component and electronic component
The application be the applying date be August in 2016 16, application No. is 201680058899.X, entitled " stress The divisional application of the application of dispersion membrane, optical component and electronic component ".
Technical field
The present invention relates to a kind of stress dispersion membranes, the optical component for having the stress dispersion membrane, electronic component.
Background technique
In order to using the touch panel of LCD (liquid crystal display), lens section, the electronic machine of camera The optical components such as device, electronic component assign rigidity, impact resistance, exist and expose surface side the case where being fitted with adhesiveness film (for example, Patent document 1).Such adhesiveness film usually has substrate layer and adhesive phase.
In assembling, when processing, when conveying, when using etc. under various situations, sometimes because pressing-in force is to as described above Optical component, electronic component bring load, optical component occur, the problem of electronic component is damaged because of suffered load.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-234460 bulletin
Summary of the invention
Problem to be solved by the invention
Problem of the present invention is that providing a kind of stress dispersion membrane with excellent stress dispersibility.In addition, being to mention For a kind of optical component, electronic component for having such stress dispersion membrane.
Solution to the problem
Stress dispersion membrane of the invention includes the laminated body of plastic foil and adhesive phase, wherein
Indentation energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body is 260 μ J or more.
In one embodiment, above-mentioned plastic foil with a thickness of 4 μm~500 μm.
In one embodiment, above-mentioned adhesive phase with a thickness of 1 μm~300 μm.
In one embodiment, above-mentioned adhesive phase is formed by adhesive composition, which includes polymerization Object (A), above-mentioned polymer (A) is with (methyl) propylene from the alkyl with carbon atom number 1~20 as alkylester moieties The monomer list of the monomeric unit (I) of acid alkyl ester and (methyl) acrylate from intramolecular with OH base and/or COOH base First (II).
In one embodiment, a mole content ratio for the NCO base in above-mentioned adhesive composition is set as [NCO], it will A mole content ratio for epoxy group in the adhesive composition is set as [EPOXY], by the OH base in the adhesive composition Mole content ratio is set as [OH], when a mole content ratio for the COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+[COOH]) < 0.05.
In one embodiment, above-mentioned adhesive composition includes the organic polyisocyanates class crosslinking agent of 2 functions or more And/or epoxies crosslinking agent.
In one embodiment, above-mentioned adhesive composition includes polymer (B), and above-mentioned polymer (B) has from logical The monomeric unit and weight average molecular weight of (methyl) acrylate of the structure containing ester ring type shown in formula (1) are 1000 or more and small In 30000,
CH2=C (R1)COOR2···(1)
In general formula (1), R1For hydrogen atom or methyl, R2For the alkyl with ester ring type structure.
In one embodiment, loss angle tangent of the above-mentioned adhesive phase in -40 DEG C~150 DEG C of entire temperature range Value tan δ is 0.10 or more.
Optical component of the invention has above-mentioned stress dispersion membrane.
Electronic component of the invention has above-mentioned stress dispersion membrane.
The effect of invention
According to the present invention, it is possible to provide a kind of stress dispersion membrane with excellent stress dispersibility.In addition, it is possible to provide a kind of Optical component, the electronic component for having such stress dispersion membrane.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of the stress dispersion membrane of one embodiment of the present invention.
Fig. 2 is the schematic cross-sectional view of the stress dispersion membrane of another embodiment of the present invention.
Symbol description
10 plastic foils
20 adhesive phases
100 stress dispersion membranes
Specific embodiment
In the case where the expression that there is so-called " (methyl) acrylic acid " in the present specification, it is meant that " acrylic acid and/or first Base acrylic acid ", there are in the case where the expression of so-called " (methyl) acrylate ", it is meant that " acrylate and/or metering system Acid esters ".In addition, in the case where there is the expression of so-called " weight " in the present specification, also could alternatively be as indicating weight SI system unit and usual " quality ".
In the case where the expression that there is so-called " monomeric unit (A) for coming from (a) " in the present specification, monomeric unit (A) It is the structural unit that unsaturated double-bond possessed by monomer (a) is formed by polymerizeing scission of link.It should be noted that so-called insatiable hunger With double bond by polymerizeing the structural unit that is formed of scission of link, refer to that (Rp, Rq, Rr, Rs are with list for the structure of " RpRqC=CRrRs " Any appropriate group that the form of key is bonded with carbon atom) unsaturated double-bond " C=C " formed and polymerizeing scission of link "-RpRqC-CRrRs- " structural unit.
In the present specification, the content ratio of the monomeric unit in polymer can for example pass through the various structures of the polymer It analyzes (such as NMR etc.) and learns.In addition, even if manufacture can also will be based on without various structural analyses as described above The content ratio of the calculated monomeric unit from the various monomers of the usage amount of used various monomers is made when polymer For the content ratio of the monomeric unit in polymer.That is, can be by certain list when manufacturing polymer in used total monomer ingredient Content ratio of the content ratio of body (m) as the monomeric unit from monomer (m) in the polymer.
" " A. stress dispersion membrane " "
Stress dispersion membrane of the invention includes the laminated body of plastic foil and adhesive phase.Plastic foil both can be 1 layer, can also Think 2 layers or more.Adhesive phase both can be 1 layer, or 2 layers or more.
Fig. 1 is the schematic cross-sectional view of the stress dispersion membrane of one embodiment of the present invention.In Fig. 1, stress of the invention Dispersion membrane 100 is made of plastic foil 10 and the laminated body of adhesive phase 20.Though not shown in Fig. 1, the surface of adhesive phase 20 Any appropriate strong adhesive layer can also be equipped with.
Fig. 2 is the schematic cross-sectional view of the stress dispersion membrane of another embodiment of the present invention.In Fig. 2, of the invention is answered Power dispersion membrane 100 is made of adhesive phase 20, plastic foil 10 and adhesive phase 20, has adhesive phase 20, modeling by following sequences Expect film 10 and adhesive phase 20.That is, stress dispersion membrane 100 of the invention is by adhesive phase 20, plastic foil 10 and glues in Fig. 2 The laminated body of mixture layer 20 is constituted.Though not shown in Fig. 2, can also be equipped on the surface of unilateral or two sides adhesive phase 20 Any appropriate strong adhesive layer.
In the case where the mode that adhesive phase exposes as outermost layer, any conjunction can also be set in the exposing surface side Suitable separator (stripping film).
The plastic foil of the laminated body of stress dispersion membrane of the invention from plastic foil and adhesive phase laterally hangs down with the laminated body Indentation energy when applying load on straight direction is 260 μ J or more.The measuring method of above-mentioned indentation energy is as described later.It is above-mentioned Being pressed into energy is preferably the 260 μ J of μ J~10000, the more preferably 270 μ J of μ J~9000, the further preferably 280 μ J of μ J~8000, Particularly preferably 290 μ of μ J~7000 J.Within the above range due to above-mentioned indentation energy, it can provide a kind of with excellent The stress dispersion membrane of stress dispersibility.
The thickness of plastic foil is preferably 4 μm~500 μm, and more preferably 10 μm~400 μm, further preferably 15 μm~ 350 μm, particularly preferably 20 μm~300 μm.Due to plastic foil thickness within the above range, can provide a kind of has more The stress dispersion membrane of excellent stress dispersibility.
The thickness of adhesive phase is preferably 1 μm~300 μm, and more preferably 2 μm~250 μm, further preferably 4 μm~ 200 μm, particularly preferably 5 μm~150 μm.Due to adhesive phase thickness within the above range, can provide one kind has The stress dispersion membrane of superior stress dispersibility.
As plastic foil, any appropriate plastic foil can be used within the scope of the effect of the invention.In this way Compressive strength of the plastic foil for example at ASTM D695 be preferably 100Kg/cm2~3000Kg/cm2, more preferably 200Kg/ cm2~2900Kg/cm2, further preferably 300Kg/cm2~2800Kg/cm2, particularly preferably 400Kg/cm2~2700Kg/ cm2.As such plastic foil, specifically, can for example enumerate: polyester resin, polyolefin resin, polyamide-based tree Rouge, polyimide based resin etc..It as polyester resin, such as can enumerate: polyethylene terephthalate, poly- terephthaldehyde Sour butanediol ester, polyethylene naphthalate etc..As polyolefin resin, such as can enumerate: the homopolymer of olefinic monomer, The copolymer etc. of olefinic monomer.As polyolefin resin, specifically, can for example enumerate: homo-polypropylene；By ethylene at being allocated as For the propylene copolymers of the block class of combined polymerization ingredient, Random Copolymer, grafting class etc.；Reactor TPO；Low-density, high density, line The polyvinyls such as property low-density, extremely-low density；Ethylene-propylene copolymer, vinyl-vinyl acetate copolymer, ethylene-the third E pioic acid methyl ester copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methyl methacrylate are total Ethene copolymers such as polymers, ethylene methyl methacrylate copolymer etc..
Plastic foil can contain any appropriate additive as needed.As the additive contained in plastic foil, such as It can enumerate: antioxidant, ultraviolet absorbing agent, light stabilizer, antistatic agent, filler, pigment etc..Contain in plastic foil Type, the quantity of additive can suitably be set according to purpose.
As adhesive phase, any appropriate adhesive phase can be used within the scope of the effect of the invention. It as such adhesive phase, such as can enumerate: the adhesive phase that is formed by acrylic adhesives, by rubber adhesive shape At adhesive phase, the adhesive phase formed by silicone adhesive category, the adhesive that is formed by carbamates adhesive Layer etc..
Adhesive phase is preferably formed by adhesive composition.
Be coated on any appropriate substrate for adhesive phase, such as by adhesive composition, as needed into Row drying, forms adhesive phase on substrate.Then, when substrate being removed, then adhesive phase is obtained.In addition, for example pass through by Adhesive composition is coated on any appropriate plastic foil, is dried as needed, forms adhesive phase on the plastic film, Residual plastic film in this state, to obtain the stress dispersion membrane comprising adhesive phase and plastic foil.In addition, for example pass through by Adhesive composition is coated on any appropriate substrate, is dried as needed, and adhesive phase is formed on substrate, will be shelled The adhesive phase obtained from substrate is placed in plastic foil, to obtain the stress dispersion membrane comprising adhesive phase and plastic foil.Separately Outside, it such as by the way that adhesive composition to be coated on any appropriate substrate, is dried, is formed on substrate as needed The adhesive phase formed on substrate is transferred to plastic foil by adhesive phase, to obtain answering comprising adhesive phase and plastic foil Power dispersion membrane.
It as the coating method of adhesive composition, such as can enumerate: roller coating, intaglio plate coating, reversed coating, roller brush, spray Painting, utilizes the extrusion coated etc. of the progress such as die coating machine at air knife coating method.
Such adhesive composition preferably comprises polymer (A), and above-mentioned polymer (A) is with from carbon atom number 1~20 alkyl has OH as the monomeric unit (I) of (methyl) alkyl acrylate of alkylester moieties and from intramolecular The monomeric unit (II) of (methyl) acrylate of base and/or COOH base.
The content ratio of above-mentioned polymer (A) in adhesive composition is preferably 80 weight of weight %~100 %, more excellent It is selected as the 85 weight % of weight %~100, the further preferably 90 weight % of weight %~100, particularly preferably 92.5 weight % ~100 weight %, most preferably 95 weight of weight %~100 %.Due to containing for above-mentioned polymer (A) in adhesive composition It is proportional within the above range, therefore can provide a kind of stress dispersion membrane with superior stress dispersibility.
Polymer (A) is with (methyl) acrylic acid from the alkyl with carbon atom number 1~20 as alkylester moieties The monomeric unit (I) of Arrcostab.In polymer (A) from the alkyl with carbon atom number 1~20 as alkylester moieties The monomeric unit (I) of (methyl) alkyl acrylate both can be only a kind, or two or more.
(methyl) acrylic acid from the alkyl with carbon atom number 1~20 as alkylester moieties in polymer (A) The content ratio of the monomeric unit (I) of Arrcostab is preferably the 90 weight % of weight %~99.5, more preferably 91 weight %~99 Weight %, the further preferably 92 weight % of weight %~98.5, the particularly preferably 93 weight % of weight %~98.2, most preferably For 94 weight of weight %~98 %.In polymer (A) from the alkyl with carbon atom number 1~20 as alkylester moieties The content ratio of the monomeric unit (I) of (methyl) alkyl acrylate within the above range, therefore can provide a kind of with more excellent The stress dispersion membrane of different stress dispersibility.
(methyl) alkyl acrylate as the alkyl with carbon atom number 1~20 as alkylester moieties, such as can Enumerate: (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-butyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) isobutyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) acrylic acid 2- ethyl hexyl Ester, (methyl) n-octyl, (methyl) Isooctyl acrylate monomer, the positive nonyl ester of (methyl) acrylic acid, the different nonyl of (methyl) acrylic acid Ester, the positive last of the ten Heavenly stems ester of (methyl) acrylic acid, (methyl) isodecyl acrylate, (methyl) acrylic acid n-dodecane base ester, (methyl) propylene Sour n-tridecane base ester, (methyl) n-myristyl base ester etc..
Monomeric unit of the polymer (A) with (methyl) acrylate from intramolecular with OH base and/or COOH base (II).The monomeric unit (II) of (methyl) acrylate from intramolecular with OH base and/or COOH base in polymer (A) Both it can be only a kind, or two or more.Since polymer (A) is with having OH base and/or COOH base from intramolecular A kind of monomeric unit (II) of (methyl) acrylate, it is possible to provide stress dispersion membrane with superior stress dispersibility.
The monomeric unit of (methyl) acrylate from intramolecular with OH base and/or COOH base in polymer (A) (II) content ratio is preferably the 0.5 weight % of weight %~10, more preferably the 1 weight % of weight %~9, further preferably The 1.5 weight % of weight %~8, the particularly preferably 1.8 weight % of weight %~7, most preferably 2 weight of weight %~6 %.Due to Monomeric unit (II's) of (methyl) acrylate from intramolecular with OH base and/or COOH base in polymer (A) contains It is proportional within the above range, it is possible to provide a kind of stress dispersion membrane with superior stress dispersibility.
There is (methyl) acrylate of OH base as intramolecular, such as can enumerate: (methyl) acrylic acid 2- hydroxy methacrylate, (methyl) acrylic acid 2- hydroxy propyl ester, (methyl) acrylic acid 4- hydroxybutyl, the own ester of (methyl) acrylic acid 6- hydroxyl, (methyl) third Olefin(e) acid 8- hydroxyl monooctyl ester, (methyl) acrylic acid 10- hydroxyl last of the ten Heavenly stems ester, (methyl) acrylic acid 12- hydroxylauric ester, (4- methylol ring Hexyl) methyl acrylate, N- methylol (methyl) acrylamide, vinyl alcohol, allyl alcohol, 2- hydroxyethyl vinyls ether, 4- hydroxyl butyl Vinethene, diethylene glycol monovinyl ether etc..
There is (methyl) acrylate of COOH base as intramolecular, such as can enumerate: (methyl) acrylic acid, (methyl) third Olefin(e) acid hydroxy methacrylate, (methyl) dihydroxypropyl pentyl ester, itaconic acid, maleic acid, fumaric acid, butenoic acid, methacrylate etc..
Polymer (A) also can have the monomeric unit (III) from other monomers.Coming from polymer (A) is other The monomeric unit (III) of monomer both can be only a kind, or two or more.
It as other monomers, such as can enumerate: cyano-containing monomer, vinyl acetate monomer, aromatic vinyl monomer, amide-containing Monomer, emulsion stability, contains epoxy based monomers, vinyl ether monomers, N- acryloyl morpholine, list containing sulfo group at monomer containing imide Body, phosphorous acid-based monomers, monomer containing anhydride group etc..
In adhesive composition, a mole content ratio for the NCO base in the adhesive composition is set as [NCO], by this A mole content ratio for epoxy group in adhesive composition is set as [EPOXY], by rubbing for the OH base in the adhesive composition You are set as [OH] at content ratio, when a mole content ratio for the COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+[COOH]) < 0.05.Since ([NCO]+[EPOXY])/([OH]+[COOH]) is in above-mentioned model It encloses, therefore can provide a kind of stress dispersion membrane with superior stress dispersibility.It should be noted that being combined in adhesive There is no in the case where NCO base in object, [NCO]=0, there is no in the case where epoxy group in adhesive composition, [EPOXY]= 0.That is, the lower limit value of ([NCO]+[EPOXY])/([OH]+[COOH]) is 0.
Adhesive composition preferably comprises organic polyisocyanates class crosslinking agent and/or the epoxies crosslinking of 2 functions or more Agent.The organic polyisocyanates class crosslinking agents and/or epoxies more than 2 functions that may include in adhesive composition of the invention Crosslinking agent both can be only a kind, or two or more.
More than above-mentioned 2 function organic polyisocyanates class crosslinking agent and epoxies crosslinking agent in adhesive composition Total content ratio is preferably 0.001 parts by weight~0.4 parts by weight, more preferably 0.0025 relative to 100 parts by weight of polymer (A) Parts by weight~0.3 parts by weight, further preferably 0.005 parts by weight~0.2 parts by weight, particularly preferably 0.0075 parts by weight~ 0.15 parts by weight, most preferably 0.01 parts by weight~0.1 parts by weight.Due to above-mentioned 2 official in adhesive composition of the invention Total content ratio of more than energy organic polyisocyanates class crosslinking agent and epoxies crosslinking agent is relative to 100 weight of polymer (A) It measures part within the above range, therefore can provide a kind of stress dispersion membrane with superior stress dispersibility.
It as organic polyisocyanates class crosslinking agents more than 2 functions, such as can enumerate: tetramethylene diisocyanate, six The lower aliphatics Polyisocyanate esters such as methylene diisocyanate；Cyclopentylene diisocyanate, cyclohexylidene diisocyanate The alicyclic isocyanates class such as ester, isophorone diisocyanate；2,4 toluene diisocyanate, 4,4'- diphenyl methane two The aromatic isocyanates class such as isocyanates, xylylene diisocyanate；Trimethylolpropane-toluene di-isocyanate(TDI) trimerization Object addition product (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate L ") ,-six methylene of trimethylolpropane Group diisocyanate trimer addition product (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate HL "), six The isocyanuric acid ester (for example, Japanese polyurethane industrial group manufactures, trade name " Coronate HX ") of methylene diisocyanate Equal isocyanate addition products etc..
It as epoxies crosslinking agent, such as can enumerate: bisphenol-A, the epoxylite of epichlorohydrin type, ethylene glycidol Ether, polyethyleneglycol diglycidylether, glycerin diglycidyl ether, T 55,1,6-HD glycidol Ether, trihydroxymethylpropanyltri diglycidyl ether, 2-glycidyl aniline, diamines glycidyl amine, N, N, N', N'- tetra- shrink sweet Oil base m-xylene diamine (for example, gas chemical company, Mitsubishi manufactures, trade name " TETRAD-X "), 1,3- are bis-, and (N, N- bis- shrinks Glyceramine methyl) hexamethylene (for example, gas chemical company, Mitsubishi manufactures, trade name " TETRAD-C ") etc..
Adhesive composition also may include polymer (B), and above-mentioned polymer (B), which has, to contain shown in self-drifting (1) The monomeric unit of (methyl) acrylate of ester ring type structure, weight average molecular weight are 1000 more than and less than 30000,
CH2=C (R1)COOR2···(1)
In general formula (1), R1For hydrogen atom or methyl, R2For the alkyl with ester ring type structure.
Polymer (B) both can be only a kind, or two or more.
The weight average molecular weight of polymer (B) is preferably 1000~30000, and more preferably 1250~25000, further preferably It is 1500~20000, particularly preferably 1750~15000, most preferably 2000~10000.Due to dividing equally for polymer (B) again Son amount within the above range, therefore even if increasing the amount of crosslinking agent, can also provide a kind of with superior stress dispersibility Stress dispersion membrane.
The content ratio of polymer (B) in adhesive composition is preferably 0.5 relative to 100 parts by weight of polymer (A) Parts by weight~50 parts by weight, more preferably 1 parts by weight~45 parts by weight, further preferably 2 parts by weight~40 parts by weight, especially Preferably 3 parts by weight~35 parts by weight, most preferably 4 parts by weight~30 parts by weight.Due to the polymer in adhesive composition (B) content ratio relative to 100 parts by weight of polymer (A) within the above range, therefore even if increase crosslinking agent amount, can also To provide a kind of stress dispersion membrane with superior stress dispersibility.
The monomeric unit of (methyl) acrylate for carrying out the structure containing ester ring type shown in self-drifting (1) in polymer (B) Content ratio be preferably the 40 weight % of weight %~99.5, the more preferably 42.5 weight % of weight %~99, further preferably For the 45 weight % of weight %~98.5, the particularly preferably 47.5 weight % of weight %~98, most preferably 50 weight %~97.5 Weight %.As the monomer list of (methyl) acrylate for carrying out the structure containing ester ring type shown in self-drifting (1) in polymer (B) Within the above range, therefore even if increasing the amount of crosslinking agent, can also provide one kind has superior answer to the content ratio of member The stress dispersion membrane of power dispersibility.
It as (methyl) acrylate of the structure containing ester ring type shown in above-mentioned general formula (1), such as can enumerate: (methyl) third Olefin(e) acid cyclohexyl, the bicyclic pentyl ester of (methyl) acrylic acid, methacrylic acid Bicvclopentyl oxygroup ethyl ester, acrylic acid Bicvclopentyl oxygroup Ethyl ester, methacrylic acid tricyclic pentyl ester, acrylic acid tricyclic pentyl ester, methacrylic acid 1- adamantane esters, acrylic acid 1- adamantane Base ester, methacrylic acid 2- methyl -2- adamantane esters, acrylic acid 2- methyl -2- adamantane esters, methacrylic acid 2- second Base -2- adamantane esters, acrylic acid 2- ethyl -2- adamantane esters etc..
Polymer (B) also can have the monomeric unit (IV) from other monomers.Other lists are come from polymer (B) The monomeric unit (IV) of body both can be only a kind, or two or more.
It as the other monomers that may include in polymer (B), such as can enumerate: (methyl) methyl acrylate, (methyl) third Olefin(e) acid ethyl ester, (methyl) n-butyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) propylene Sour isobutyl ester, (methyl) Hexyl 2-propenoate, (methyl) 2-EHA, (methyl) n-octyl, (methyl) third The different monooctyl ester of olefin(e) acid, the positive nonyl ester of (methyl) acrylic acid, the different nonyl ester of (methyl) acrylic acid, the positive last of the ten Heavenly stems ester of (methyl) acrylic acid, (methyl) third Olefin(e) acid isodecyl ester, (methyl) acrylic acid n-dodecane base ester, (methyl) acrylic acid n-tridecane base ester, (methyl) acrylic acid positive ten Tetraalkyl ester, acrylic acid, methacrylic acid, carboxy ethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, fourth Olefin(e) acid, methacrylate etc..
Polymer (A), polymer (B) can pass through any appropriate method in the range that does not impair the effects of the present invention Manufacture.It as such manufacturing method, such as can enumerate: polymerisation in solution, emulsion polymerization, bulk polymerization, suspension polymerisation, photopolymerization (active energy ray polymerization) etc..In these manufacturing methods, from the viewpoint of cost, productivity, preferably polymerisation in solution.It obtains Polymer (A) can be any one of random copolymer, block copolymer, alternate copolymer, graft copolymer etc..It obtains Polymer (B) can be random copolymer, block copolymer, alternate copolymer, graft copolymer etc..
As the method for polymerisation in solution, such as it can enumerate and monomer component, polymerization initiator etc. are dissolved in solvent, heat Make its polymerization, thus the method etc. for obtaining polymer solution.
Heating temperature when polymerizeing as the heating in polymerisation in solution, such as 50 DEG C~90 DEG C can be enumerated.It is poly- as solution Heating time in conjunction, such as can enumerate 1 hour~24 hours.
It, can within the scope of the effect of the invention, using any as solvent used in polymerisation in solution Suitable solvent.As such solvent, such as can enumerate: toluene, benzene, dimethylbenzene etc. are aromatic hydrocarbon；Ethyl acetate, acetic acid The esters such as N-butyl；The aliphatic hydrocarbons such as n-hexane, normal heptane；The ester ring types hydro carbons such as hexamethylene, hexahydrotoluene；Methyl ethyl ketone, Organic solvents such as the ketones such as methyl iso-butyl ketone (MIBK) etc..Solvent both can be only a kind, or two or more.
Polymer (A), polymer (B) manufacture in, can be used polymerization initiator.Such polymerization initiator both can be only It is a kind, or two or more.It as such polymerization initiator, such as can enumerate: 2,2'- azodiisobutyronitriles, 2,2'- Azo two (2- amidine propane) dihydrochloride, 2,2'- azo two [2- (5- methyl -2- imidazoline -2- base) propane] dihydrochloride, 2,2'- azo two (2- methyl amidine) dithionate, 2,2'- azo two (N, N'- dimethyl isobutyl amidine), two [N- of 2,2'- azo (2- carboxyethyl) -2- methyl amidine] azo-initiators such as hydrate (He Guangchun medicine company manufacture, VA-057)；Potassium peroxydisulfate, mistake The persulfates such as ammonium sulfate；Dicetyl peroxydicarbonate two (2- ethylhexyl) ester, dicetyl peroxydicarbonate two (4- tert-butylcyclohexyl) Ester, peroxide-butyl carbonate, new peroxide tert-butyl caprate, talkyl peropivalate, peroxidating pivalic acid uncle Butyl ester, dilauroyl peroxide, the positive decoyl of peroxidating two, peroxidating 2 ethyl hexanoic acid 1,1,3,3- tetramethyl butyl ester, peroxidating Two (4- toluyls), dibenzoyl peroxide, tert-butyl peroxyisobutyrate, 1,1- bis- (tertiary hexyl peroxide) hexamethylene, uncle The peroxide type initiators such as butylhydroperoxide, hydrogen peroxide；The combination of persulfate and sodium hydrogensulfite, peroxide with Combination of sodium ascorbate etc., the redox type initiators for combining peroxide with reducing agent etc..
For the usage amount of polymerization initiator, any conjunction can be used within the scope of the effect of the invention Suitable usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, preferably 0.01 parts by weight~5 weights Measure part.
Polymer (A), polymer (B) manufacture in, can be used chain-transferring agent.Such chain-transferring agent both can be only 1 Kind, or two or more.It as such chain-transferring agent, such as can enumerate: lauryl mercaptan, glycidyl mercaptan, mercapto Guanidine-acetic acid, 2 mercapto ethanol, thioglycolic acid, Methyl mercaptoacetate, thioglycolic acid 2- ethylhexyl, 2,3- dimercapto- 1- propyl alcohol etc..
It, can be within the scope of the effect of the invention using any appropriate for the usage amount of chain-transferring agent Usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, preferably 0.01 parts by weight~5 weight Part.
Polymer (A), polymer (B) manufacture in, can be used be typically used for the other any appropriate of polymerization reaction Additive.
Adhesive composition of the invention also may include crosslinking catalyst.As crosslinking catalyst, can not damage Any appropriate crosslinking catalyst is used in the range of effect of the invention.As such crosslinking catalyst, such as can enumerate: The crosslinking of the metals classes such as tetra-n-butyl titanate, tetraisopropyl titanate, ferric acetyl acetonade, butyl tin oxide, dioctyl tin cinnamic acid tin Catalyst (especially tin class crosslinking catalyst) etc..Crosslinking catalyst both can be only a kind, or two or more.
For the usage amount of crosslinking catalyst, any conjunction can be used within the scope of the effect of the invention Suitable usage amount.As such usage amount, such as relative to 100 parts by weight of monomer component, preferably 0.001 parts by weight~ 0.05 parts by weight.
Adhesive composition can also contain any appropriate other additions within the scope of the effect of the invention Agent.It as such other additives, such as can enumerate: silane coupling agent, delayed crosslinker, emulsifier, colorant, pigment etc. Powder, surfactant, plasticizer, adhesiveness imparting agent, surface lubricant, levelling agent, softening agent, antioxidant, is prevented dyestuff Aging agent, light stabilizer, ultraviolet absorbing agent, polymerization inhibitor, inorganic filler, organic filler, metal powder, particle shape, foil-like Object etc..Such other additives both can be only a kind, or two or more.
Loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range be preferably 0.10 with On.By make above-mentioned loss tangent tan δ 0.10 of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range with On, it is possible to provide a kind of stress dispersion membrane with superior stress dispersibility.It should be noted that above-mentioned loss tangent The measuring method of tan δ is as described later.
The upper limit of above-mentioned loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range is excellent 2.40 are selected as hereinafter, more preferably 2.20 hereinafter, further preferably 2.00 hereinafter, particularly preferably 1.80 or less.By making The upper limit of above-mentioned loss tangent tan δ is within the above range, it is possible to provide a kind of stress with superior stress dispersibility Dispersion membrane.
The lower limit of above-mentioned loss tangent tan δ of the adhesive phase in -40 DEG C~150 DEG C of entire temperature range is excellent It is selected as 0.12 or more, more preferably 0.14 or more, further preferably 0.16 or more, particularly preferably 0.18 or more.By making The lower limit of above-mentioned loss tangent tan δ is within the above range, it is possible to provide a kind of stress with superior stress dispersibility Dispersion membrane.
" " C. optical component, electronic component " "
Stress dispersion membrane of the invention has excellent stress dispersibility.Therefore, can suitably be used as to protect optics structure Part, electronic component be not by the protection materials for the purpose of external impact etc..That is, optical component of the invention has the present invention Stress dispersion membrane.In addition, electronic component of the invention has stress dispersion membrane of the invention.
Embodiment
Hereinafter, the present invention is concretely demonstrated by embodiment, but the present invention is not limited to these embodiments.It needs It is noted that test in embodiment etc. and evaluation method is as follows described.It should be noted that the case where being recorded as " part " Under, it is recorded as long as no special, that is, refers to " parts by weight ", in the case where being recorded as " % ", recorded, that is, refer to as long as no special " weight % ".
The measurement > of < weight average molecular weight
The weight average molecular weight (Mw) of polymer is carried out using the GPC device (HLC-8220GPC) that TOSOH Co., Ltd manufactures Measurement.It should be noted that weight average molecular weight (Mw) is found out by polystyrene scaled value.
Determination condition is as follows.
Sample solution concentration: 0.2 weight % (THF solution)
Sample injection rate: 10 μ l eluents
THF flow velocity: 0.6ml/min
Measuring temperature: 40 DEG C
Sample slug: TSKguardcolumn SuperHZ-H (1)+TSKgel SuperHZM-H (2)
Reference column: TSKgel SuperH-RC (1)
Detector: differential refractometer (RI)
The production > of < bonding sheet (A)
(embodiment 1,3,5,7,9,11,13,15,17,19,21,23,25,26, comparative example 1,3,5,7)
Obtained adhesive composition is coated on using fountain roll by gathering in such a way that the thickness after drying becomes 10 μm The substrate " Lumirror S10 " (50 μm of thickness, Toray manufacture) that ester resin is constituted, when 130 DEG C of drying temperature, dry Between under conditions of 30 seconds, solidify simultaneously dry.In this way, making adhesive phase on substrate.Next, being pasted on the surface of adhesive phase The organosilicon process face that 25 μm of thickness of the substrate being made of polyester resin of organosilicon processing is implemented together in another side, obtains Bonding sheet (A).
(embodiment 2,4,6,8,10,12,14,16,18,20,22,24, comparative example 2,4,6,8)
Obtained adhesive composition is coated on using fountain roll by gathering in such a way that the thickness after drying becomes 22 μm The substrate " Lumirror S10 " (38 μm of thickness, Toray manufacture) that ester resin is constituted, when 130 DEG C of drying temperature, dry Between under conditions of 30 seconds, solidify simultaneously dry.In this way, making adhesive phase on substrate.Next, being pasted on the surface of adhesive phase The organosilicon process face that 25 μm of thickness of the substrate being made of polyester resin of organosilicon processing is implemented together in another side, obtains Bonding sheet (A).
The measurement > of < indentation energy
" the SAICASDN-20 type " manufactured using Daipla Wintes company, in measuring temperature: 25 DEG C, press-in speed: 5 μm/sec under, according to following sequences, calculate indentation energy.
(sequence 1)
The adhesive phase side of obtained bonding sheet (A) is pasted on flat pressure head (load detecting side), with spherical indenter from It is pasted on the substrate side indentation of the bonding sheet (A) of above-mentioned flat pressure head, calculates compression distance (μ when detecting the load of 20N m)。
(sequence 2)
The adhesive phase side of obtained bonding sheet (A) is pasted on glass slide, with spherical indenter from being pasted on above-mentioned load glass The substrate side (load detecting side) of the bonding sheet (A) of piece is pressed into, and is pressed into the compression distance found out into sequence 1.
When normal load suffered by spherical indenter is set as y=f (x) (x: compression distance), calculated using following formula to viscous (r is the adhesive phase side application to bonding sheet (A) to indentation energy W (μ J) until closing the adhesive phase side application 20N of piece (A) The compression distance when load of 20N).
[mathematical expression 1]
The production > of < bonding sheet (B)
Obtained adhesive composition is coated in such a way that the thickness after drying becomes 50 μm using fountain roll and is passed through Organosilicon carries out 38 μm of thickness of the polyester film (trade name: MRF, polyester Co., Ltd., Mitsubishi Chemical after lift-off processing to single side Manufacture) lift-off processing face solidify simultaneously dry under conditions of 130 DEG C of drying temperature, drying time 3 minutes.In this way, in base Adhesive phase is made on material.Next, on the surface of adhesive phase, so that the lift-off processing face of the film becomes adhesive phase side Mode, cladding carry out 38 μm of thickness of polyester film (trade name: MRF, Mitsubishi Chemical after lift-off processing by organosilicon to single side Polyester Co., Ltd. manufacture).In this way, production bonding sheet (B).
The survey of < glass transition temperature (Tg), store elastic modulus, loss elastic modulus, tan δ (loss tangent) Determine >
Using measurement of dynamic viscoelasticity device (Rheometric company manufactures, ARES), found out by following methods.
Adhesive phase, lamination and the thickness that about 2mm is made only are taken out from obtained bonding sheet (B), extremely by its punching press 7.9mm makes columned particle, and as measurement sample.Said determination sample is fixed on controlling for 7.9mm parallel-plate Tool measures the temperature dependency of store elastic modulus G', loss elastic modulus G " by above-mentioned measurement of dynamic viscoelasticity device, It is set as tan δ=G "/G', calculates tna δ.It should be noted that obtained tan δ curve is become great temperature as glass Glass transition temperature (Tg) (DEG C).
Determination condition is as follows.
Measurement: shear mode,
Temperature range: -70 DEG C~150 DEG C
Heating rate: 5 DEG C/min
Frequency: 1Hz
(Production Example 1): (methyl) acrylic polymer (1)
Acrylic acid 2- ethyl hexyl is added into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser Base ester (Japanese catalyst Co. manufacture): 100 parts by weight, acrylic acid 2- hydroxy methacrylate (manufacture of East Asia Synesis Company): 4 weight Part, the 2,2'- azodiisobutyronitrile (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator: 0.2 parts by weight, acetic acid second Ester: 156 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 65 DEG C or so, is carried out 6 hours Polymerization reaction prepares the solution (40 weight %) of (methyl) acrylic polymer (1) of weight average molecular weight 550,000.
(Production Example 2): (methyl) acrylic polymer (2)
Acrylic acid 2- ethyl hexyl is added into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser Base ester (Japanese catalyst Co. manufacture): 100 parts by weight, acrylic acid 4- hydroxybutyl (Osaka Organic Chemical Industry corporation Make): 10 parts by weight, acrylic acid (manufacture of East Asia Synesis Company): 0.02 parts by weight, the 2,2'- azo two as polymerization initiator Isobutyronitrile (and the manufacture of Wako Pure Chemical Industries company): 0.2 parts by weight, ethyl acetate: 156 parts by weight are led while being slowly stirred Enter nitrogen, the liquid temperature in flask is held in 65 DEG C or so, carry out 6 hours polymerization reactions, prepares (the first of weight average molecular weight 540,000 Base) acrylic polymer (2) solution (40 weight %).
(Production Example 3): (methyl) acrylic polymer (3)
Butyl acrylate (day is added into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser The manufacture of this catalyst Co.): 99 parts by weight, acrylic acid 4- hydroxybutyl (manufacture of Osaka Organic Chemical Industry company): 1 weight Part, the 2,2'- azodiisobutyronitrile (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator: 1 parts by weight, ethyl acetate: 156 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 60 DEG C or so, polymerize within 7 hours Reaction prepares the solution (39 weight %) of (methyl) acrylic polymer (3) of weight average molecular weight 1,600,000.
(Production Example 4): (methyl) acrylic polymer (4)
Butyl acrylate (day is added into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser The manufacture of this catalyst Co.): 92 parts by weight, N- acryloyl morpholine (manufacture of Xing Ren company): 5 parts by weight, acrylic acid (East Asia synthesis Company's manufacture): 2.9 parts by weight, the 2,2'- azodiisobutyronitrile (and the manufacture of Wako Pure Chemical Industries company) as polymerization initiator: 0.1 parts by weight, ethyl acetate: 200 parts by weight import nitrogen while being slowly stirred, and the liquid temperature in flask is held in 55 DEG C or so, 8 hours polymerization reactions are carried out, the solution of (methyl) acrylic polymer (4) of weight average molecular weight 1,800,000 is prepared (33 weight %).
(Production Example 5): (methyl) acrylic polymer (5)
Butyl acrylate (day is added into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser The manufacture of this catalyst Co.): 95 parts by weight, acrylic acid (manufacture of East Asia Synesis Company): 5 parts by weight, as polymerization initiator 2,2'- azodiisobutyronitriles (and the manufacture of Wako Pure Chemical Industries company): 0.2 parts by weight, ethyl acetate: 156 parts by weight, on one side slowly Stirring imports nitrogen on one side, and the liquid temperature in flask is held in 63 DEG C or so, 10 hours polymerization reactions is carried out, prepares Weight-average molecular Measure the solution (40 weight %) of 700,000 (methyl) acrylic polymer (5).
(Production Example 6): (methyl) acrylic polymer (6) of the structure containing ester ring type
By as the cyclohexyl methacrylate of monomer component, [vitrifying of homopolymer (polycyclohexyl methacrylate) turns Temperature: 66 DEG C]: 95 parts by weight, acrylic acid: 5 parts by weight, the 2 mercapto ethanol as chain-transferring agent: 3 parts by weight, as poly- Close the 2,2'- azodiisobutyronitrile of initiator: 0.2 parts by weight and the toluene as polymer solvent: 103.2 parts by weight investment can In separate type flask, stirred while importing nitrogen 1 hour.In this way, being warming up to 70 after the oxygen in removal paradigmatic system DEG C, it reacts it 3 hours, reacts it 2 hours, obtain (methyl) acrylic acid of weight average molecular weight 4000 The solution (50 weight %) of quasi polymer (6).
(Production Example 6): (methyl) acrylic polymer (7) of the structure containing ester ring type
Toluene is put into the four-hole boiling flask for having stirring blade, thermometer, nitrogen ingress pipe, condenser, dropping funel: 100 parts by weight, two ring pentyl ester (DCPMA) of methacrylic acid (trade name: FA-513M, the manufacture of chemical conversion industry company, Hitachi): 60 weights Measure part, methyl methacrylate (MMA): 40 parts by weight and the Methyl mercaptoacetate as chain-transferring agent: 3.5 parts by weight.It connects Get off, after stirring 1 hour under 70 DEG C of nitrogen atmospheres, puts into 2, the 2'- azodiisobutyronitrile as polymerization initiator: 0.2 weight Part is measured, reacts it 2 hours, after reacting it 4 hours, makes its reaction 1 small at 90 DEG C When, obtain the solution (51 weight %) of (methyl) acrylic polymer (7) of weight average molecular weight 4000.
(embodiment 1,2)
In the solution of (methyl) acrylic polymer (1), relative to the molten of (methyl) acrylic polymer (1) 100 parts by weight of solid component of liquid, overall solid component become the mode of 25 weight %, are diluted by ethyl acetate, It is stirred using disperser, obtains the adhesive composition (1) comprising acrylic resin.It the results are shown in Table 1.
(embodiment 3,4)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.01 Parts by weight convert as crosslinking agent, with solid component is added ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 weight Part is used as crosslinking catalyst, in such a way that overall solid component becomes 25 weight %, is diluted by ethyl acetate, utilizes Disperser is stirred, and obtains the adhesive composition (2) comprising acrylic resin.As a result it is shown in table 1.
(embodiment 5,6)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, in such a way that overall solid component becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (3) comprising acrylic resin.As a result it is shown in table 1.
(embodiment 7,8)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.05 Parts by weight convert as crosslinking agent, with solid component is added ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 weight 5 parts by weight of solution of (methyl) acrylic polymer (6) are added as crosslinking catalyst, with solid component conversion for part, with total The solid component of body becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, is wrapped Adhesive composition (4) containing acrylic resin.As a result it is shown in table 1.
(embodiment 9,10)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, being converted with solid component is added 5 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid component become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, included The adhesive composition (5) of acrylic resin.As a result it is shown in table 1.
(embodiment 11,12)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, being converted with solid component is added 5 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid component become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, included The adhesive composition (6) of acrylic resin.As a result it is shown in table 1.
(embodiment 13,14)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, being converted with solid component is added 5 parts by weight of solution of (methyl) acrylic polymer (7), with totality Solid component become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, included The adhesive composition (7) of acrylic resin.As a result it is shown in table 1.
(embodiment 15,16)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, being converted with solid component is added 5 parts by weight of solution of (methyl) acrylic polymer (7), with totality Solid component become 25 weight % mode, be diluted by ethyl acetate, be stirred using disperser, included The adhesive composition (8) of acrylic resin.As a result it is shown in table 1.
(embodiment 17,18)
In the solution of (methyl) acrylic polymer (2), relative to the molten of (methyl) acrylic polymer (2) 100 parts by weight of solid component of liquid, overall solid component become the mode of 25 weight %, are diluted by ethyl acetate, It is stirred using disperser, obtains the adhesive composition (9) comprising acrylic resin.As a result it is shown in table 2.
(embodiment 19,20)
Solution in the solution of (methyl) acrylic polymer (2), relative to (methyl) acrylic polymer (2) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.1 weight Measure part as crosslinking agent, with solid component conversion addition TETRAD-C (manufacture of gas chemical company, Mitsubishi) 0.05 parts by weight, with Ferric acetyl acetonade (Japan chemistry industry companies manufacture) 0.005 parts by weight are added as crosslinking catalyst in solid component conversion, with Overall solid component becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, obtains Adhesive composition (10) comprising acrylic resin.As a result it is shown in table 2.
(embodiment 21,22)
Solution in the solution of (methyl) acrylic polymer (3), relative to (methyl) acrylic polymer (3) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.02 Parts by weight convert as crosslinking agent, with solid component is added ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 weight Part is used as crosslinking catalyst, in such a way that overall solid component becomes 25 weight %, is diluted by ethyl acetate, utilizes Disperser is stirred, and obtains the adhesive composition (11) comprising acrylic resin.As a result it is shown in table 2.
(embodiment 23,24)
Solution in the solution of (methyl) acrylic polymer (5), relative to (methyl) acrylic polymer (5) 100 parts by weight of solid component, with solid component convert be added TETRAD-C (manufacture of gas chemical company, Mitsubishi) 0.075 weight Ferric acetyl acetonade (the chemical industry companies' manufacture of Japan) 0.005 parts by weight work is added as crosslinking agent, with solid component conversion for part It is diluted by ethyl acetate in such a way that overall solid component becomes 25 weight % for crosslinking catalyst, utilizes dispersion Device is stirred, and obtains the adhesive composition (12) comprising acrylic resin.As a result it is shown in table 2.
(embodiment 25)
With relative to HYBRAR 5125 (KURARAY manufacture) 100 parts by weight, overall solid component becomes 25 weight % Mode, be diluted by toluene, obtain include rubber resin adhesive composition (13).As a result it is shown in table 2.
(embodiment 26)
With relative to HYBRAR 5127 (KURARAY manufacture) 100 parts by weight, overall solid component becomes 25 weight % Mode, be diluted by toluene, obtain include rubber resin adhesive composition (14).As a result it is shown in table 2.
(Comparative Examples 1 and 2)
Solution in the solution of (methyl) acrylic polymer (1), relative to (methyl) acrylic polymer (1) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.5 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, in such a way that overall solid component becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (C1) comprising acrylic resin.As a result it is shown in table 2.
(comparative example 3,4)
Solution in the solution of (methyl) acrylic polymer (2), relative to (methyl) acrylic polymer (2) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.45 TETRAD-C (manufacture of gas chemical company, Mitsubishi) 0.3 parts by weight are added as crosslinking agent, with solid component conversion in parts by weight, with Ferric acetyl acetonade (Japan chemistry industry companies manufacture) 0.005 parts by weight are added as crosslinking catalyst in solid component conversion, with Overall solid component becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, obtains Adhesive composition (C2) comprising acrylic resin.As a result it is shown in table 2.
(comparative example 5,6)
Solution in the solution of (methyl) acrylic polymer (4), relative to (methyl) acrylic polymer (4) 100 parts by weight of solid component, with solid component convert be added Coronate L (manufacture of Japanese polyurethane industrial group) 0.3 weight It measures part and ferric acetyl acetonade (manufacture of chemistry industry companies, Japan) 0.005 parts by weight is added as crosslinking agent, with solid component conversion As crosslinking catalyst, in such a way that overall solid component becomes 25 weight %, be diluted by ethyl acetate, using point Scattered device is stirred, and obtains the adhesive composition (C3) comprising acrylic resin.As a result it is shown in table 2.
(comparative example 7,8)
Solution in the solution of (methyl) acrylic polymer (5), relative to (methyl) acrylic polymer (5) 100 parts by weight of solid component, with solid component convert be added TETRAD-C (manufacture of gas chemical company, Mitsubishi) 0.075 weight Ferric acetyl acetonade (the chemical industry companies' manufacture of Japan) 0.005 parts by weight work is added as crosslinking agent, with solid component conversion for part For crosslinking catalyst, being converted with solid component is added 20 parts by weight of solution of (methyl) acrylic polymer (6), with totality Solid component becomes the mode of 25 weight %, is diluted by ethyl acetate, is stirred using disperser, and obtaining includes third The adhesive composition (C4) of olefin(e) acid resinoid.As a result it is shown in table 2.
(embodiment 27)
For bonding sheet (A) obtained from the adhesive composition (1) obtained in the embodiment 1,2 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 28)
For bonding sheet (A) obtained from the adhesive composition (2) obtained in the embodiment 3,4 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 29)
For bonding sheet (A) obtained from the adhesive composition (4) obtained in the embodiment 7,8 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 30)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (7) obtained in the embodiment 13,14 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 31)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (9) obtained in the embodiment 17,18 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 32)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (10) obtained in the embodiment 19,20 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 33)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (11) obtained in the embodiment 21,22 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 34)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (12) obtained in the embodiment 23,24 Each bonding sheet, from one side remove polyester film, conform to polarization plates (Nitto Denko Corp's system as optical component Make, trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 35)
For bonding sheet (A) obtained from the adhesive composition (13) obtained in the embodiment 25 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 36)
For bonding sheet (A) obtained from the adhesive composition (14) obtained in the embodiment 26 and bonding sheet (B) Each bonding sheet, from one side remove polyester film, conform to as optical component polarization plates (Nitto Denko Corp manufacture, Trade name " TEG1465DUHC "), obtain the optical component for being fitted with bonding sheet.
(embodiment 37)
For bonding sheet (A) obtained from the adhesive composition (1) obtained in the embodiment 1,2 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 38)
For bonding sheet (A) obtained from the adhesive composition (2) obtained in the embodiment 3,4 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 39)
For bonding sheet (A) obtained from the adhesive composition (4) obtained in the embodiment 7,8 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 40)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (7) obtained in the embodiment 13,14 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 41)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (9) obtained in the embodiment 17,18 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 42)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (10) obtained in the embodiment 19,20 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 43)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (11) obtained in the embodiment 21,22 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 44)
For bonding sheet (A) and bonding sheet (B) obtained from the adhesive composition (12) obtained in the embodiment 23,24 Each bonding sheet, from one side remove polyester film, conform to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 45)
For bonding sheet (A) obtained from the adhesive composition (13) obtained in the embodiment 25 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
(embodiment 46)
For bonding sheet (A) obtained from the adhesive composition (14) obtained in the embodiment 26 and bonding sheet (B) Each bonding sheet removes polyester film from one side, conforms to conductive film (Nitto Denko Corp's system as electronic component Make, trade name " ELECRYSTA V270L-TFMP "), obtain the electronic component for being fitted with bonding sheet.
Industrial applicibility
Stress dispersion membrane of the invention for example can suitably be used as to protect optical component, electronic component not by from outside Impact etc. for the purpose of protection materials.

Claims (13)

1. a kind of stress dispersion membrane, it includes the laminated bodies of plastic foil and adhesive phase, wherein
The plastic foil with a thickness of 15 μm~300 μm,
The adhesive phase with a thickness of 1 μm~300 μm,
The adhesive phase is formed by adhesive composition, which includes polymer (A) or rubber resin, institute Polymer (A) is stated with (methyl) alkyl acrylate from the alkyl with carbon atom number 1~20 as alkylester moieties Monomeric unit (I) and have from intramolecular OH base and/or COOH base (methyl) acrylate monomeric unit (II),
The polymer (A) is only a kind,
Indentation energy when applying load from the plastic foil of the laminated body laterally direction vertical with the laminated body be 280 μ J with Upper and 7000 μ J hereinafter,
Wherein, the measurement of the indentation energy carries out as described below:
" the SAICASDN-20 type " manufactured using Daipla Wintes company, in measuring temperature: 25 DEG C, press-in speed: 5 μm/ Under sec, according to following sequences, indentation energy is calculated,
Sequentially 1:
The adhesive phase side of the laminated body is pasted on flat pressure head, with spherical indenter from be pasted on the flat pressure head this is folded The plastic foil side pressure of layer body enters, and calculates compression distance when detecting the load of 20N,
Sequentially 2:
The adhesive phase side of the laminated body is pasted on glass slide, with spherical indenter from the laminated body for being pasted on the glass slide Plastic foil side pressure enter, be pressed into the compression distance that finds out into sequence 1,
When normal load suffered by spherical indenter is set as y=f (x), the adhesive to the laminated body is calculated using following formula Indentation energy W, r until layer side application 20N are that indentation when applying the load of 20N to the adhesive phase side of the laminated body is deep Degree,
Wherein, the unit of the compression distance be μm, the x be compression distance, it is described indentation energy W unit be μ J,
2. stress dispersion membrane as described in claim 1, wherein
The plastic foil with a thickness of 20 μm~300 μm.
3. stress dispersion membrane as described in claim 1, wherein
Described adhesive layer with a thickness of 1 μm~150 μm.
4. stress dispersion membrane as claimed in claim 2, wherein
Described adhesive layer with a thickness of 1 μm~150 μm.
5. stress dispersion membrane as described in claim 1, wherein
A mole content ratio for NCO base in described adhesive composition is set as [NCO], by the ring in the adhesive composition A mole content ratio for oxygroup is set as [EPOXY], and a mole content ratio for the OH base in the adhesive composition is set as [OH], When a mole content ratio for COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+ [COOH]) < 0.05.
6. stress dispersion membrane as claimed in claim 2, wherein
A mole content ratio for NCO base in described adhesive composition is set as [NCO], by the ring in the adhesive composition A mole content ratio for oxygroup is set as [EPOXY], and a mole content ratio for the OH base in the adhesive composition is set as [OH], When a mole content ratio for COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+ [COOH]) < 0.05.
7. stress dispersion membrane as claimed in claim 3, wherein
A mole content ratio for NCO base in described adhesive composition is set as [NCO], by the ring in the adhesive composition A mole content ratio for oxygroup is set as [EPOXY], and a mole content ratio for the OH base in the adhesive composition is set as [OH], When a mole content ratio for COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+ [COOH]) < 0.05.
8. stress dispersion membrane as claimed in claim 4, wherein
A mole content ratio for NCO base in described adhesive composition is set as [NCO], by the ring in the adhesive composition A mole content ratio for oxygroup is set as [EPOXY], and a mole content ratio for the OH base in the adhesive composition is set as [OH], When a mole content ratio for COOH base in the adhesive composition is set as [COOH], ([NCO]+[EPOXY])/([OH]+ [COOH]) < 0.05.
9. such as stress dispersion membrane described in any item of the claim 1 to 8, wherein
Described adhesive composition includes the organic polyisocyanates class crosslinking agent and/or epoxies crosslinking agent of 2 functions or more.
10. such as stress dispersion membrane described in any item of the claim 1 to 8, wherein
Loss tangent tan δ of the described adhesive layer in -40 DEG C~150 DEG C of entire temperature range is 0.10 or more.
11. stress dispersion membrane as claimed in claim 9, wherein
Loss tangent tan δ of the described adhesive layer in -40 DEG C~150 DEG C of entire temperature range is 0.10 or more.
12. a kind of optical component has stress dispersion membrane described in any one of claims 1 to 11.
13. a kind of electronic component has stress dispersion membrane described in any one of claims 1 to 11.
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