KR102007307B1 - 코일 기판, 그 제조 방법 및 인덕터 - Google Patents
코일 기판, 그 제조 방법 및 인덕터 Download PDFInfo
- Publication number
- KR102007307B1 KR102007307B1 KR1020140093053A KR20140093053A KR102007307B1 KR 102007307 B1 KR102007307 B1 KR 102007307B1 KR 1020140093053 A KR1020140093053 A KR 1020140093053A KR 20140093053 A KR20140093053 A KR 20140093053A KR 102007307 B1 KR102007307 B1 KR 102007307B1
- Authority
- KR
- South Korea
- Prior art keywords
- wiring
- insulating layer
- coil
- substrate
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000000696 magnetic material Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims 1
- 239000012762 magnetic filler Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 165
- 239000012790 adhesive layer Substances 0.000 abstract description 45
- 239000010949 copper Substances 0.000 description 22
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 238000007789 sealing Methods 0.000 description 18
- 239000011888 foil Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 6
- 238000004804 winding Methods 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2013-159572 | 2013-07-31 | ||
| JP2013159572A JP6393457B2 (ja) | 2013-07-31 | 2013-07-31 | コイル基板及びその製造方法、インダクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150015374A KR20150015374A (ko) | 2015-02-10 |
| KR102007307B1 true KR102007307B1 (ko) | 2019-08-05 |
Family
ID=52427137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140093053A Active KR102007307B1 (ko) | 2013-07-31 | 2014-07-23 | 코일 기판, 그 제조 방법 및 인덕터 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9472332B2 (enExample) |
| JP (1) | JP6393457B2 (enExample) |
| KR (1) | KR102007307B1 (enExample) |
| CN (1) | CN104347599B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE534510C2 (sv) * | 2008-11-19 | 2011-09-13 | Silex Microsystems Ab | Funktionell inkapsling |
| US9391565B2 (en) | 2013-03-15 | 2016-07-12 | TriQuint International PTE, Ltd. | Amplifier phase distortion correction based on amplitude distortion measurement |
| US12224096B2 (en) | 2013-03-15 | 2025-02-11 | Qorvo Us, Inc. | Advanced 3D inductor structures with confined magnetic field |
| US9899133B2 (en) | 2013-08-01 | 2018-02-20 | Qorvo Us, Inc. | Advanced 3D inductor structures with confined magnetic field |
| US9705478B2 (en) | 2013-08-01 | 2017-07-11 | Qorvo Us, Inc. | Weakly coupled tunable RF receiver architecture |
| KR101832559B1 (ko) * | 2015-05-29 | 2018-02-26 | 삼성전기주식회사 | 코일 전자부품 |
| US10796835B2 (en) * | 2015-08-24 | 2020-10-06 | Qorvo Us, Inc. | Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff |
| JP6623028B2 (ja) | 2015-10-27 | 2019-12-18 | 新光電気工業株式会社 | インダクタ装置及びその製造方法 |
| IT201600083187A1 (it) * | 2016-08-05 | 2018-02-05 | Lym S R L | Sistema di illuminazione |
| JP6520875B2 (ja) * | 2016-09-12 | 2019-05-29 | 株式会社村田製作所 | インダクタ部品およびインダクタ部品内蔵基板 |
| KR102658611B1 (ko) | 2016-11-03 | 2024-04-19 | 삼성전기주식회사 | 코일 전자 부품 |
| US11139238B2 (en) | 2016-12-07 | 2021-10-05 | Qorvo Us, Inc. | High Q factor inductor structure |
| JP7106058B2 (ja) * | 2018-12-03 | 2022-07-26 | 株式会社オートネットワーク技術研究所 | リアクトル |
| US20210375540A1 (en) * | 2020-05-28 | 2021-12-02 | Texas Instruments Incorporated | Integrated magnetic device with laminate embedded magnetic core |
| JP7548201B2 (ja) * | 2021-12-14 | 2024-09-10 | 株式会社村田製作所 | インダクタ部品およびインダクタ部品の製造方法 |
| CN115516585A (zh) * | 2022-03-28 | 2022-12-23 | 英麦科磁集成科技有限公司 | 线圈电感器及其制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012248629A (ja) | 2011-05-26 | 2012-12-13 | Tdk Corp | コイル部品及びその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61124117A (ja) * | 1984-11-20 | 1986-06-11 | Matsushita Electric Ind Co Ltd | プリントコイルの製造方法 |
| JPH06231996A (ja) * | 1992-12-10 | 1994-08-19 | Taiyo Yuden Co Ltd | 積層セラミック電子部品の製造方法 |
| JPH07142256A (ja) * | 1993-11-19 | 1995-06-02 | Yokogawa Electric Corp | 積層形プリントコイル及びその製造方法 |
| JPH0817653A (ja) * | 1994-06-27 | 1996-01-19 | Murata Mfg Co Ltd | 積層型コイル及びその製造方法 |
| JPH1032129A (ja) * | 1996-07-15 | 1998-02-03 | Tdk Corp | 薄型コイル部品とその製造方法 |
| US6362716B1 (en) * | 1998-07-06 | 2002-03-26 | Tdk Corporation | Inductor device and process of production thereof |
| JP2003168610A (ja) | 2001-11-29 | 2003-06-13 | Toko Inc | インダクタンス素子 |
| JP2004343036A (ja) * | 2003-04-23 | 2004-12-02 | Murata Mfg Co Ltd | 積層インダクタ |
| JP2004335620A (ja) * | 2003-05-02 | 2004-11-25 | Sony Corp | コイルとその製造方法 |
| US7994889B2 (en) * | 2006-06-01 | 2011-08-09 | Taiyo Yuden Co., Ltd. | Multilayer inductor |
| US8004381B2 (en) * | 2006-07-05 | 2011-08-23 | Hitachi Metals, Ltd. | Laminated device |
| US8164410B2 (en) * | 2007-04-17 | 2012-04-24 | Hitachi Metals, Ltd. | Low-loss ferrite and electronic device formed by such ferrite |
| JP5126243B2 (ja) * | 2010-02-08 | 2013-01-23 | 株式会社村田製作所 | 電子部品 |
| KR101381016B1 (ko) * | 2010-03-31 | 2014-04-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자 부품 및 그 제조 방법 |
| WO2012053439A1 (ja) * | 2010-10-21 | 2012-04-26 | Tdk株式会社 | コイル部品及びその製造方法 |
| JP2012221995A (ja) * | 2011-04-04 | 2012-11-12 | Tdk Corp | 積層型電子部品 |
| JP5873316B2 (ja) * | 2011-12-14 | 2016-03-01 | 旭化成エレクトロニクス株式会社 | 平面コイル、平面コイルの製造方法 |
-
2013
- 2013-07-31 JP JP2013159572A patent/JP6393457B2/ja active Active
-
2014
- 2014-07-23 KR KR1020140093053A patent/KR102007307B1/ko active Active
- 2014-07-28 US US14/341,868 patent/US9472332B2/en active Active
- 2014-07-31 CN CN201410374209.4A patent/CN104347599B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012248629A (ja) | 2011-05-26 | 2012-12-13 | Tdk Corp | コイル部品及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6393457B2 (ja) | 2018-09-19 |
| US9472332B2 (en) | 2016-10-18 |
| CN104347599B (zh) | 2019-03-01 |
| CN104347599A (zh) | 2015-02-11 |
| KR20150015374A (ko) | 2015-02-10 |
| US20150035639A1 (en) | 2015-02-05 |
| JP2015032626A (ja) | 2015-02-16 |
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| PA0109 | Patent application |
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Patent event code: PA02012R01D Patent event date: 20181005 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20140723 Comment text: Patent Application |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20190620 |
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| GRNT | Written decision to grant | ||
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Comment text: Registration of Establishment Patent event date: 20190730 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20190731 End annual number: 3 Start annual number: 1 |
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