KR102007272B1 - 열적으로 보조되고 분할된 워드라인들을 구비하는 플래시 메모리 - Google Patents

열적으로 보조되고 분할된 워드라인들을 구비하는 플래시 메모리 Download PDF

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KR102007272B1
KR102007272B1 KR1020130013601A KR20130013601A KR102007272B1 KR 102007272 B1 KR102007272 B1 KR 102007272B1 KR 1020130013601 A KR1020130013601 A KR 1020130013601A KR 20130013601 A KR20130013601 A KR 20130013601A KR 102007272 B1 KR102007272 B1 KR 102007272B1
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KR20130092472A (ko
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항-팅 루에
밍-창 쿠오
치-창 시에
쿠오-핀 창
이-수안 시아오
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매크로닉스 인터내셔널 컴퍼니 리미티드
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/08—Address circuits; Decoders; Word-line control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/6891—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
    • H10D30/6893—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode wherein the floating gate has multiple non-connected parts, e.g. multi-particle floating gate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/24—Bit-line control circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/18—Bit line organisation; Bit line lay-out
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/14—Word line organisation; Word line lay-out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0413—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having charge-trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/681—Floating-gate IGFETs having only two programming levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/031—Manufacture or treatment of data-storage electrodes
    • H10D64/037—Manufacture or treatment of data-storage electrodes comprising charge-trapping insulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Read Only Memory (AREA)
KR1020130013601A 2012-02-09 2013-02-06 열적으로 보조되고 분할된 워드라인들을 구비하는 플래시 메모리 Active KR102007272B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201261596886P 2012-02-09 2012-02-09
US61/596,886 2012-02-09
US201261603810P 2012-02-27 2012-02-27
US61/603,810 2012-02-27
US13/458,975 2012-04-27
US13/458,975 US8824212B2 (en) 2011-05-02 2012-04-27 Thermally assisted flash memory with segmented word lines

Publications (2)

Publication Number Publication Date
KR20130092472A KR20130092472A (ko) 2013-08-20
KR102007272B1 true KR102007272B1 (ko) 2019-08-05

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KR1020130013601A Active KR102007272B1 (ko) 2012-02-09 2013-02-06 열적으로 보조되고 분할된 워드라인들을 구비하는 플래시 메모리

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Country Link
EP (1) EP2626903B1 (https=)
JP (1) JP6099419B2 (https=)
KR (1) KR102007272B1 (https=)
CN (1) CN103247337B (https=)
TW (1) TWI514387B (https=)

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US9666593B2 (en) 2014-09-29 2017-05-30 Sandisk Technologies Llc Alternating refractive index in charge-trapping film in three-dimensional memory
JP2017011123A (ja) * 2015-06-23 2017-01-12 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の駆動方法
TWI564893B (zh) * 2015-06-30 2017-01-01 財團法人工業技術研究院 記憶體控制方法及其系統
EP3913631A1 (en) * 2015-11-25 2021-11-24 Sunrise Memory Corporation Three-dimensional vertical nor flash thin film transistor strings
US9570192B1 (en) * 2016-03-04 2017-02-14 Qualcomm Incorporated System and method for reducing programming voltage stress on memory cell devices
US9773553B1 (en) * 2016-08-19 2017-09-26 Micron Technology, Inc. Segmented memory and operation
US10014390B1 (en) 2017-10-10 2018-07-03 Globalfoundries Inc. Inner spacer formation for nanosheet field-effect transistors with tall suspensions
US11538523B2 (en) 2018-08-17 2022-12-27 Tetramem Inc. Crossbar array with reduced disturbance
KR102766456B1 (ko) * 2019-06-21 2025-02-12 에스케이하이닉스 주식회사 리드 디스터번스를 완화시킬 수 있는 비휘발성 메모리 장치 및 이를 이용하는 시스템
US11557341B2 (en) * 2019-12-27 2023-01-17 Micron Technology, Inc. Memory array structures and methods for determination of resistive characteristics of access lines
CN113946178B (zh) * 2020-07-15 2023-04-28 上海江波龙微电子技术有限公司 存储器及其偏置电压产生电路、方法
US12385788B2 (en) * 2020-11-30 2025-08-12 Stmicroelectronics S.R.L. Thermographic sensor with thermal transistors driven by thermo-couples
US12094549B2 (en) * 2021-09-01 2024-09-17 Micron Technology, Inc. Defect detection during erase operations
US12156472B2 (en) * 2021-09-02 2024-11-26 Micron Technology, Inc. Power regeneration in a memory device
US11818886B2 (en) * 2021-09-29 2023-11-14 International Business Machines Corporation Low program voltage flash memory cells with embedded heater in the control gate
CN114093829B (zh) * 2021-11-02 2026-01-16 中国科学院微电子研究所 一种存储单元、三维存储器及其操作方法
US20240421032A1 (en) * 2021-11-02 2024-12-19 Institute of Microelectronics, Chinese Academy of Sciences Memory cell, three-dimensional memory, and method of operating three-dimensional memory
CN118676217A (zh) * 2023-03-20 2024-09-20 力旺电子股份有限公司 电荷捕捉式非易失性存储器的存储晶体管
KR20260000395A (ko) * 2024-06-25 2026-01-02 삼성전자주식회사 메모리 장치 및 이의 동작 방법

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US6911704B2 (en) * 2003-10-14 2005-06-28 Advanced Micro Devices, Inc. Memory cell array with staggered local inter-connect structure
US7315474B2 (en) 2005-01-03 2008-01-01 Macronix International Co., Ltd Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays
US7301818B2 (en) * 2005-09-12 2007-11-27 Macronix International Co., Ltd. Hole annealing methods of non-volatile memory cells
US7382654B2 (en) 2006-03-31 2008-06-03 Macronix International Co., Ltd. Trapping storage flash memory cell structure with inversion source and drain regions
US7391652B2 (en) * 2006-05-05 2008-06-24 Macronix International Co., Ltd. Method of programming and erasing a p-channel BE-SONOS NAND flash memory
US7646664B2 (en) * 2006-10-09 2010-01-12 Samsung Electronics Co., Ltd. Semiconductor device with three-dimensional array structure
WO2008067494A1 (en) * 2006-11-29 2008-06-05 Rambus Inc. Integrated circuit with built-in heating circuitry to reverse operational degeneration
US8344475B2 (en) * 2006-11-29 2013-01-01 Rambus Inc. Integrated circuit heating to effect in-situ annealing
KR20090037690A (ko) 2007-10-12 2009-04-16 삼성전자주식회사 비휘발성 메모리 소자, 그 동작 방법 및 그 제조 방법
JP2013502647A (ja) * 2009-08-21 2013-01-24 ラムバス・インコーポレーテッド インサイチュでのメモリのアニール
KR101060899B1 (ko) * 2009-12-23 2011-08-30 주식회사 하이닉스반도체 반도체 메모리 장치 및 이의 동작 방법

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JP2007184380A (ja) * 2006-01-05 2007-07-19 Micronics Internatl Co Ltd 不揮発性メモリセル、これを有するメモリアレイ、並びに、セル及びアレイの操作方法

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Publication number Publication date
EP2626903B1 (en) 2016-09-14
JP6099419B2 (ja) 2017-03-22
CN103247337B (zh) 2017-06-09
JP2013168209A (ja) 2013-08-29
TW201346913A (zh) 2013-11-16
KR20130092472A (ko) 2013-08-20
TWI514387B (zh) 2015-12-21
EP2626903A1 (en) 2013-08-14
CN103247337A (zh) 2013-08-14

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