KR101999705B1 - 히터를 위한 열적 동적 응답 감지 시스템 - Google Patents

히터를 위한 열적 동적 응답 감지 시스템 Download PDF

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Publication number
KR101999705B1
KR101999705B1 KR1020177011493A KR20177011493A KR101999705B1 KR 101999705 B1 KR101999705 B1 KR 101999705B1 KR 1020177011493 A KR1020177011493 A KR 1020177011493A KR 20177011493 A KR20177011493 A KR 20177011493A KR 101999705 B1 KR101999705 B1 KR 101999705B1
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South Korea
Prior art keywords
heating
heater
heater assembly
control system
layer
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Korean (ko)
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KR20170078645A (ko
Inventor
루이스 피. 스테인하우저
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와틀로 일렉트릭 매뉴팩츄어링 컴파니
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Priority claimed from US14/530,670 external-priority patent/US10163668B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
KR1020177011493A 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템 Active KR101999705B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/530,670 2014-10-31
US14/530,670 US10163668B2 (en) 2011-08-30 2014-10-31 Thermal dynamic response sensing systems for heaters
PCT/US2015/057905 WO2016069808A1 (en) 2014-10-31 2015-10-28 Thermal dynamic response sensing systems for heaters

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020197016773A Division KR102110267B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Publications (2)

Publication Number Publication Date
KR20170078645A KR20170078645A (ko) 2017-07-07
KR101999705B1 true KR101999705B1 (ko) 2019-07-12

Family

ID=54548258

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177011493A Active KR101999705B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템
KR1020197016773A Active KR102110267B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020197016773A Active KR102110267B1 (ko) 2014-10-31 2015-10-28 히터를 위한 열적 동적 응답 감지 시스템

Country Status (6)

Country Link
EP (1) EP3213598B1 (enrdf_load_stackoverflow)
JP (2) JP6431190B2 (enrdf_load_stackoverflow)
KR (2) KR101999705B1 (enrdf_load_stackoverflow)
CN (1) CN107078082B (enrdf_load_stackoverflow)
TW (1) TWI681483B (enrdf_load_stackoverflow)
WO (1) WO2016069808A1 (enrdf_load_stackoverflow)

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KR102303971B1 (ko) * 2016-07-19 2021-09-24 엔지케이 인슐레이터 엘티디 정전척 히터
US10651095B2 (en) 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
WO2019104048A1 (en) * 2017-11-21 2019-05-31 Watlow Electric Manufacturing Company Multi-zone pedestal heater having a routing layer
KR20250007684A (ko) * 2018-03-08 2025-01-14 와틀로 일렉트릭 매뉴팩츄어링 컴파니 히터 제어를 위한 제어 시스템
JP7006523B2 (ja) * 2018-06-19 2022-01-24 オムロン株式会社 情報処理装置、情報処理方法、およびプログラム
US10872747B2 (en) * 2018-08-08 2020-12-22 Lam Research Corporation Controlling showerhead heating via resistive thermal measurements
US11240881B2 (en) * 2019-04-08 2022-02-01 Watlow Electric Manufacturing Company Method of manufacturing and adjusting a resistive heater
WO2020247787A1 (en) 2019-06-07 2020-12-10 Watlow Electric Manufacturing Company System and method for calibrating a control system operating an electric heater
JP2023502601A (ja) * 2019-11-19 2023-01-25 ラム リサーチ コーポレーション 温度監視
CN115211228A (zh) * 2020-02-24 2022-10-18 沃特洛电气制造公司 控制加热器的控制系统的动态校准
US11551951B2 (en) * 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
WO2021236812A1 (en) * 2020-05-19 2021-11-25 Watlow Electric Manufacturing Company Passive and active calibration methods for a resistive heater
KR102602807B1 (ko) * 2020-08-14 2023-11-15 세메스 주식회사 히터 제어 장치 및 이를 구비하는 기판 처리 시스템
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법
US12146794B2 (en) * 2021-05-17 2024-11-19 Rosemount Aerospace Inc. Infrared inspection system for heaters comprised of positive temperature coefficient resistors
CN116106652A (zh) * 2021-11-09 2023-05-12 苏州外延世电子材料有限公司 Pe-cvd加热板检测装置
US20230269840A1 (en) * 2022-02-24 2023-08-24 Samsung Electronics Company, Ltd. Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging
US12390046B2 (en) 2022-03-29 2025-08-19 Samsung Electronics Company, Ltd. Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms
KR102579663B1 (ko) * 2023-06-27 2023-09-18 시스트로닉스 주식회사 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치
CN119133323A (zh) * 2024-11-14 2024-12-13 中矿资源(天津)新材料有限公司 电池膜层的退火工艺及退火设备

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KR100194267B1 (ko) * 1990-01-19 1999-06-15 버킷 이.모리스 반도체 웨이퍼 또는 기판 가열장치 및 방법
KR100420871B1 (ko) 1999-02-22 2004-03-02 스티그 하마테크 악티엔게젤샤프트 기판의 열처리를 위한 장치 및 방법
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Also Published As

Publication number Publication date
WO2016069808A1 (en) 2016-05-06
TW201624588A (zh) 2016-07-01
TWI681483B (zh) 2020-01-01
KR20170078645A (ko) 2017-07-07
CN107078082B (zh) 2021-04-09
KR20190069624A (ko) 2019-06-19
JP2018502443A (ja) 2018-01-25
EP3213598A1 (en) 2017-09-06
KR102110267B1 (ko) 2020-05-14
JP6692875B2 (ja) 2020-05-13
CN107078082A (zh) 2017-08-18
EP3213598B1 (en) 2023-07-05
JP6431190B2 (ja) 2018-11-28
JP2019061960A (ja) 2019-04-18

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