KR101997252B1 - Optical lens with light emitting module - Google Patents

Abstract

A light emitting module according to an embodiment includes a plurality of lead frames; A light emitting chip on at least one of the plurality of lead frames; A light emitting element disposed on the plurality of lead frames and including a body having a first cavity and a second cavity concave lower than a bottom of the first cavity; And an optical lens disposed on the light emitting element,
The optical lens includes: a light-transmitting body having a light exit surface; A light guide protrusion having a first recess portion corresponding to the second cavity and protruding into the first cavity; A first incidence surface which is convex in a direction opposite to the light emission surface in the first recess portion; A support disposed on an outer periphery of the light guide protrusion and coupled to the body; A second recess portion disposed between the light guide projection and the support portion and corresponding to the first cavity; And a second incident surface disposed in the second recess portion and corresponding to the light exit surface.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting module having an optical lens,

An embodiment relates to a light emitting module having an optical lens.

BACKGROUND ART A light emitting device, for example, a light emitting device (Light Emitting Device) is a type of semiconductor device that converts electrical energy into light, and has been widely recognized as a next generation light source in place of existing fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor device, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten or a fluorescent lamp that generates ultraviolet rays generated by high-pressure discharge .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode. The light emitting diode has been increasingly used as a light source for various lamps used in indoor and outdoor, lighting devices such as a liquid crystal display, have.

The embodiment provides an optical lens of a new structure.

Embodiments provide an optical lens having first and second incidence surfaces of different depths.

Embodiments provide an optical lens that includes a light guide projection separating first and second incidence surfaces of different depths.

Embodiments provide an optical lens having first and second incident surfaces of different depths and a flat light exit surface.

An embodiment provides a light emitting module having an optical lens and a light emitting element corresponding to the optical lens.

Embodiments provide a light emitting module that includes a light emitting device having cavities of different depths corresponding to incident planes at different depths of an optical lens.

Embodiments provide a light emitting module comprising a light emitting element having a light emitting chip in a cavity corresponding to different recessed portions of the optical lens.

A light emitting module including an optical lens according to an embodiment includes: a light transmitting body having a light emitting surface; A light guide protrusion having a first recessed portion in a region opposite to the light emitting surface and protruding in a direction opposite to the light emitting surface of the lower surface of the translucent body; A first incidence surface which is convex in a direction opposite to the light emission surface in the first recess portion; A support disposed around an outer periphery of the light guide projection; A second recess portion disposed between the light guide projection and the support portion; And a second incident surface disposed in the second recess portion and corresponding to the light exit surface, wherein the first recess portion can have the lowest depth at the center portion.

A light emitting module according to an embodiment includes a plurality of lead frames; A light emitting chip on at least one of the plurality of lead frames; A light emitting element disposed on the plurality of lead frames and including a body having a first cavity and a second cavity concave lower than a bottom of the first cavity; And an optical lens disposed on the light emitting element,

The optical lens includes: a light-transmitting body having a light exit surface; A light guide protrusion having a first recess portion corresponding to the second cavity and protruding into the first cavity; A first incidence surface which is convex in a direction opposite to the light emission surface in the first recess portion; A support disposed on an outer periphery of the light guide protrusion and coupled to the body; A second recess portion disposed between the light guide projection and the support portion and corresponding to the first cavity; And a second incident surface disposed in the second recess portion and corresponding to the light exit surface.

Embodiments provide an optical lens with improved illuminance uniformity and a light emitting module having the same.

The embodiment can provide an optical lens for a light emitting element.

The embodiment has an effect that the light emitting element and the optical lens can be easily combined.

The embodiment can provide an optical lens capable of improving the light collection efficiency of the light emitted from the light emitting element.

The embodiment can improve the reliability of the light emitting module having the optical lens and the light emitting element.

The light emitting module of the embodiment can be provided as an illumination module for flash such as a camera of a portable terminal.

Embodiments can improve the reliability of an illumination system with a module having an optical lens and a light emitting element.

1 is an exploded side cross-sectional view showing an optical lens and a light emitting device of a light emitting module according to a first embodiment.
FIG. 2 is a cross-sectional side view of the optical lens of the light emitting module of FIG. 1 and the light emitting device on the combined side.
3 is a plan view of the light emitting device of FIG.
4 is a cross-sectional view of the light-emitting device of Fig. 3 taken along the line AA.
5 is a cross-sectional view of the light emitting device of Fig. 3 taken along line BB.
Fig. 6 is a perspective view of the optical lens of Fig. 1;
7 is a plan view of the optical lens of Fig.
8 is a cross-sectional side view of the optical lens of Fig. 7 on the CC side.
9 is a sectional view of the optical lens of Fig. 7 on the DD side.
10 is a side view seen from the first side of the optical lens of Fig. 7;
11 is a side view seen from the second side of the optical lens of Fig. 7;
Fig. 12 is a plan view showing a light exit surface of the optical lens of Fig. 7; Fig.
13 is a partial side cross-sectional view showing the recess of the optical lens of Fig.
14 is a plan view showing another example of the light emitting device of FIG.
Fig. 15 is a cross-sectional view of another example of the light emitting device of Fig. 1 on the FF side.
16 is a cross-sectional side view of the optical lens and light emitting device of the light emitting module according to the second embodiment.
17 is a cross-sectional side view of the optical lens and the light emitting device of the light emitting module according to the third embodiment.
18 is a perspective view of a light emitting module in which a substrate is disposed under the light emitting device according to the embodiment.
19 is a diagram showing the illuminance distribution of light emitted to the optical lens according to the embodiment.
20 is a diagram showing the center brightness of light emitted to the optical lens according to the embodiment.
21 is a diagram showing an example of a light emitting chip according to the embodiment.
22 is a perspective view showing a display device having a light emitting element according to an embodiment.
23 is a perspective view showing a display device having a light emitting device according to an embodiment.
24 is a diagram showing an example of a lighting apparatus having a light emitting element according to the embodiment.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both being formed" directly "or" indirectly " . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. Also, the size of each component does not entirely reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings.

Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a side sectional view showing a decomposed state of a light emitting device and an optical lens of the light emitting module according to the first embodiment, FIG. 2 is a cross- 3 is a cross-sectional view of the light emitting device taken along the line AA of FIG. 3, FIG. 5 is a cross-sectional view of the light emitting device of FIG. 3 taken along the line BB, FIG. 6 is a perspective view of the optical lens of FIG. 7 is a cross-sectional view of the optical lens shown in Fig. 7, Fig. 9 is a cross-sectional view of the optical lens shown in Fig. 7, FIG. 12 is a plan view of the optical lens of FIG. 7, and FIG. 13 is a partial side sectional view of the optical lens of FIG. 7; FIG.

Referring to FIGS. 1 and 2, the light emitting module 300 includes a light emitting device 100 and an optical lens 200. The light emitting module 300 includes a structure in which the light emitting device 100 has a one-to-one correspondence with the optical lens 200, and can irradiate at least one of white light, blue light, green light, red light, and ultraviolet light. For example, the light emitting module 300 may be provided as a flash light for a camera module, or as another light emitting module, a display module, or a pointing module. For example, the light emitting module 300 may be a module that emits white light.

The light emitting device 100 includes cavities 113 and 114 having different depths and the optical lens 200 includes recesses 213 and 223 having different depths in different regions. The cavities 113 and 114 of the light emitting device 100 are disposed to correspond to different recesses 213 and 223 of the optical lens 200. The optical lens 200 can increase the amount of light by the incident surfaces 215 and 225 disposed in the recess portions 213 and 223 corresponding to the cavities 113 and 114 of the light emitting device 100. The area of the light exit surface 65 of the optical lens 200 may be equal to or smaller than the bottom surface area of the light emitting device 100.

1 to 5, the light emitting device 100 includes a body 111 having first and second cavities 113 and 114, a plurality of lead frames 121 and 131, and a light emitting chip 171.

The body 111 may include an insulating material or a conductive material. The body 111 may be formed of a resin material such as polyphthalamide (PPA), polycyclohexylene terephthalate (PCT), silicon (Si), a metal material, a photo sensitive glass (PSG) (Al ₂ O ₃ ), and a printed circuit board (PCB). For example, the body 111 may be injection molded by injection molding, and the material may be made of a resin material such as epoxy or silicone.

The body 111 includes an epoxy molding compound material having epoxy, and the EMC material is improved in moldability, moisture resistance, adhesion, and is an insulating material. A filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to the body 111 to enhance reflection efficiency. The content of the filler may be 10 wt% or more, for example, 15 wt% or more in the body 111. The body 111 may be formed of a reflective material for reflection of light, or may be formed of a light-transmitting material to widen the distribution of the directivity angle, but is not limited thereto.

The outer shape of the body 111 may be formed in a polygonal structure such as a rectangular shape or a square shape as viewed from above, and the outer edge portion may be formed as a surface or a curved surface.

When the body 111 has a rectangular shape, the body 111 may include a plurality of side portions, for example, at least four side portions 11 to 14. The first side surface portion 11 and the second side surface portion 12 are opposite to each other and the third side surface portion 13 is formed on the side surface of the first side surface portion 11, And the fourth side surface portion 14 are opposed to each other.

At least one of the plurality of side portions 11 to 14 may be arranged to be perpendicular or inclined with respect to the lower surface of the body 111. 3 and 5, the first and second side portions 11 and 12 of the side portions 11 to 14 of the body 111 are connected to an upper surface of the first and second lead frames 121 and 131, 1, and the first angle? 1 may be formed in a range of 90 degrees or more, for example, in a range of 90.1 degrees to 120 degrees. Since the first and second side portions 11 and 12 of the body 111 are formed as inclined surfaces, the body 111 can be easily separated from the molding die during injection molding. The first and second side parts 11 and 12 of the body 111 are opposite to each other and the third and fourth side parts 13 and 14 are adjacent to the first and second side parts 11 and 12 And are formed on opposite sides. The third and fourth side portions 13 and 14 may be inclined at the same angle as the first and second side portions 11 and 12 or may be formed at different angles, for example, at right angles, but the present invention is not limited thereto. In addition, when the angle of the first and second side portions 11 and 12 is less than the first angle? 1, injection is difficult. When the angle is greater than the first angle? 1, the body 111 functions There is a difficulty.

The body 111 is coupled to a plurality of lead frames 121 and 131 and includes a gap portion 115 disposed between the plurality of lead frames 121 and 131. The gap portion 115 may be made of the same material as that of the body 111 or may be made of another material. The recessed regions 122 and 132 may be formed in the first and second lead frames 121 and 131 corresponding to the gap portion 115 and the recessed regions 122 and 132 may be formed to increase the bonding force of the gap portion 115 . The recess regions 122 and 132 may not be formed, but the present invention is not limited thereto. As another example, as a structure for increasing the coupling force of the gap part 115, a part of the gap part 115 may be formed on the upper surface of the first and second lead frames 121 and 131, I do not.

The length X2 of the body 111 in the first direction (X-axis direction) may be equal to or shorter than the length Y1 of the second direction (Y-axis direction), for example, (X2) may be formed to be shorter than the length (Y1) in the second direction by 0.1 mm or more. The length ratio of X2 and Y1 may range from 3: 4 to 4: 4. The length X2 in the first direction may be in the range of 3.5 mm +/- 0.3 mm in the longitudinal direction of the light emitting device 100. The length Y1 in the second direction may be in the range of 4 mm +/- 0.5 mm in the width direction of the light emitting device 100. The size of the body 111 can be changed according to the size of the optical lens 200. The outer shape of the body 111 may have a polygonal shape, for example, a rectangular shape corresponding to the light exit surface 65 of the optical lens 200. Further, the rectangular shape may be a shape corresponding to the horizontal and vertical ratio of the photographed image of the camera.

The lengths X1 and Y1 in the first or second direction may be longer than the length X2 in the first direction of the body 111 in view of the size of the light emitting device 100, I do not. The light emitting device 100 may have a length X1 in the first direction and a length Y1 in the second direction. For example, the length may be in the range of 4 mm ± 0.5 mm. As another example, the length (X1) of the light emitting device 100 in the first direction and the length (Y1) in the second direction may be different from each other, but the present invention is not limited thereto.

The body 111 includes a first cavity 113 having an open top and a predetermined depth and the first cavity 113 has a cup structure having a lower depth than the top surface 16 of the body 111, And may include a shape such as a recessed structure. The side wall 31 of the first cavity 113 may be inclined at a second angle 2 with respect to the bottom of the first cavity 113 and the second angle 2 may be inclined at 90 degrees or more, Lt; RTI ID = 0.0 > 135 < / RTI > The light directing angle distribution may vary along the inclined surface of the sidewall 31 of the first cavity 113. If the second angle? 2 is smaller than the second angle? 2, the light extraction efficiency may be lowered, When the angle is larger than the range of the angle [theta] 2, the directivity angle distribution may become too wide.

The width D1 in the first direction and the width D5 in the second direction may be equal to each other in the bottom width of the first cavity 113. For example, When the outer peripheries are formed in a circular shape, the two widths D1 and D5 may be equal to each other. The outer circumference of the first cavity 114 may be formed to correspond to the second recess portion 223 of the optical lens 200. Here, the widths D1 and D5 of the first cavity 113 may be, for example, 2.77 mm ± 0.03 mm, that is, a diameter.

The width C1 of the area adjacent to the first side 11 of the first cavity 113 is wider than the width C2 of the area adjacent to the second side 12, 171 may be aligned with the center of the optical lens 200. This is because the center of the second cavity 114 may be disposed closer to the second side portion 12 than the first side portion 11.

The depth H2 of the first cavity 113 is greater than the depth H3 of the second cavity 114 as a distance from the bottom 25 of the first cavity 113 to the top surface 16 of the body. For example, in the range of 0.45 mm to 0.49 mm.

A coupling groove 18 is disposed in an inner region of an upper surface 16 of the body 111 and the coupling groove 18 is disposed along an inner circumference of an upper surface 16 of the body 111, 1 < / RTI > The coupling groove 18 may have a predetermined width D4 and may be formed in a circular or ring shape and may be changed along the contour of the side wall 31 of the first cavity 113. However, Do not. The coupling grooves 18 may be formed in a shape in which one groove is continuously connected or a plurality of the coupling grooves 18 are discontinuously arranged. The coupling groove 18 may have a depth corresponding to the coupling protrusion 68 of the optical lens 200 and may be formed around the upper portion of the first cavity 113. As shown in FIG. 3, the first cavity 113 may have a circular outer shape, and may include an elliptical shape or a polygonal shape as another example. The first cavity 113 will be described as an example of a circular shape for light focusing.

1 and 4, the depth H1 of the coupling groove 18 is in the range of 0.04 mm to 0.06 mm, and may be formed to a depth such that the coupling protrusion 68 may not be detached. The width D4 of the engaging groove 18 may be formed to have a width corresponding to the width of the engaging projection 68 of the optical lens 200 and is not limited thereto.

A second cavity 114 is disposed on the bottom 35 of the first cavity 113 and the second cavity 114 is recessed to a depth lower than the bottom 35 of the first cavity 113 . The second cavity 114 has a sidewall 41 that is thicker than the light emitting chip 171 and has a width wider than the width of the light emitting chip 171. The side wall 41 of the second cavity 114 is inclined at a third angle? 3 with respect to the upper surface of the first and second lead frames 121 and 131, and the third angle? , And 91 to 135 degrees. When the side wall 41 of the second cavity 114 is smaller than the third angle? 3, the reflection efficiency of light emitted from the light emitting chip 171 may be lowered, and the range of the third angle? The incident efficiency to the first incident surface 215, which is the main incident surface of the optical lens 200, may be lowered.

The depth T2 from the upper surface 16 of the body 111 to the bottom of the second cavity 114 is greater than the depth T2 of the upper surface 16 of the body 111 from the upper surface of the first and second lead frames 121, And may be formed to have a depth that is twice or more the thickness of the light emitting chip 171, for example, in the range of 0.67 mm ± 0.03 mm. With this double cavity structure, the light collection efficiency of the light extracted from the light emitting chip 171 can be increased.

The width D2 in the first direction may be wider than the width D6 in the second direction in view of the bottom width of the second cavity 114. For example, the width D2 in the second direction may be 0.3 mm to 0.6 mm or more. The width ratio D2: D6 may vary depending on the size and type of the light emitting chip 171, but is not limited thereto. The width D2 of the second cavity 114 in the first direction is in the range of 2.14 mm ± 0.03 mm and the width D6 in the second direction is in the range of 1.60 mm ± 0.03 mm. The distance D3 from the bottom of the second cavity 114 to the side wall 41 adjacent to the second side face 12 is smaller than the distance D3 from the center of the light emitting chip 171 to the side of the second cavity 114 Can be disposed at a position equal to or more than half or 50% of the floor width D2. That is, the optical axis ZO, which is the center of the light emitting chip 171, may be disposed at a position deviated from the center of the second cavity 114.

A first lead frame 121 and a second lead frame 131 are disposed below the second cavity 114. The first lead frame 121 is connected to the first and second cavities 114, Third and fourth side portions 12,13 and 14 in the second cavity 114. The second lead frame 131 extends under the first, second and third side portions 11,13 and 14, Lt; / RTI >

3, the outer side 123 of the first lead frame 121 may protrude outward beyond the first side 11 of the body 111, and the outer side 123 of the first lead frame 121 may protrude outward from the first side 11 of the body 111, (133) may protrude further outward than the second side surface (12) of the body (111). The outer side portions 123 and 133 increase the bottom surface area of the first and second lead frames 121 and 131 and improve the solder wetting area.

The thickness (T1 in FIG. 4) of the first and second lead frames 121 and 131 may be in a range of 0.15 mm to 0.8 mm, for example, in a range of 0.3 mm to 0.6 mm. The first lead frame 121 and the second lead frame 131 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorous (P), and aluminum (Al) Though the thicknesses T1 of the first and second lead frames 121 and 131 are the same as each other, the present invention is not limited thereto. As another example, although the first and second lead frames 121 and 131 are provided in a flat shape, they may further include at least one of a structure having a bent shape and a structure having a concave shape, Do not.

A light emitting chip 171 is mounted on the first lead frame 121 and the light emitting chip 171 is bonded to the first lead frame 121 with an adhesive 177 and the first lead frame 171, And is electrically connected. The light emitting chip 171 is connected to the second lead frame 131 by one or more wires 175. 3, a protective chip 172 may be further disposed in the second cavity 114. The protective chip 172 may be bonded on the second lead frame 121 to be electrically connected thereto And may be connected to the first lead frame 121 by a wire 176. The protective chip 172 may be removed and is not limited thereto.

The light emitting chip 171 can selectively emit light in the range of visible light band to ultraviolet light band. For example, a red LED chip, a blue LED chip, a green LED chip, a yellow green LED chip, a UV LED chip, LED chips. The light emitting chip 171 includes an LED chip including at least one of a compound semiconductor of Group III-V elements and a compound semiconductor of Group II-VII elements. One or more light emitting chips 171 may be disposed in the second cavity 114, but the present invention is not limited thereto. The light emitting chip 171 may be a vertical type chip in which the anode and the cathode electrodes are vertically arranged or a flip chip in which the anode and the cathode electrodes are arranged in either one direction, It may be a balanced chip. The protection chip 172 may be a chip such as a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), but is not limited thereto.

Here, as shown in FIG. 2, the width F1 of one side of the light emitting chip 171 may be in the range of 0.5 mm to 1.5 mm, and the widths of two adjacent sides may be equal to or different from each other. The thickness of the light emitting chip 171 may be in the range of 100-300 mu m.

The light emitting chip 171 has a width F1 that is narrower than the width B1 of the light guide projection 217 of the optical lens 200 in the first direction, As shown in FIG. Accordingly, the light guide protrusion 217 is guided to the first recess 213 of the light incident from the light emitting chip 171, so that the light condensing efficiency can be improved.

A phosphor layer 181 may be formed on the light emitting chip 171. The phosphor layer 181 may selectively include YAG, TAG, Silicate, Nitride and Oxy-nitride materials. A blue phosphor, a green phosphor, and a yellow phosphor. The phosphor layer 181 may be formed on the upper surface of the light emitting chip 171 or on the upper surface and the side surface of the light emitting chip 171. However,

A molding member 161 is formed in the second cavity 114 and the molding member 161 covers the light emitting chip 171. The molding member 161 may include an upper surface having a lower height than the bottom 35 of the first cavity 113 and the upper surface may include at least one of a horizontal surface, a concave surface, And is not limited thereto. The molding member 161 includes a light-transmitting resin layer such as silicon or epoxy, and may be formed as a single layer or a multilayer. The molding member 161 may include a phosphor, but the present invention is not limited thereto. At least one of the molding member 161 and the phosphor layer 181 may not be formed, but the present invention is not limited thereto.

As another example, a resin reflection member may be disposed around the light emitting chip 171, and the reflection member may be disposed between the light emitting chip 171 and the inner surface 41 of the second cavity 114 And a metal oxide having a refractive index of 1.5 or more such as TiO ₂ , SiO ₂ , and Al ₂ O ₃ may be added to the resin material. The reflecting member may reflect light emitted laterally from the light emitting chip 171. [

1, 2, and 7 to 12, the optical lens 200 includes a light-transmitting body 211 having a light exit surface 65, a light guide protrusion (not shown) having a first recess portion 213 217), a first incidence surface 215 in the first recess portion 213, a support portion 221 having a second recess portion 223, a second incidence surface 221 in the second recess portion 223, Lt; / RTI >

The optical lens 200 may include a translucent material such as a translucent resin material or a glass material. The optical lens 200 is made of a plastic material such as acrylic plastic material, and PMMA (Polymethyl methacrylate) is a typical example of the optical lens 200. Such PMMA is advantageous in that it is superior in transparency to glass and easy to process and form.

The optical lens 200 functions as a lens such as a light extracting lens and a condensing lens and is a member for changing the direction of light emitted from the light emitting device 100. The optical lens 200 has a refractive index of 1.4 or more and 1.7 or less A transparent material can be used. The optical lens 200 is formed of transparent resin material of transparent resin such as polymethyl methacrylate (PMMA) having a refractive index of 1.49, polycarbonate (PC) having a refractive index of 1.59 or epoxy resin (EP) It can be.

The light exit surface 65 of the optical lens 200 includes a flat surface and includes a polygonal shape as shown in FIG. Further, the light exit surface 65 may have a rectangular shape, and the corner portion may include the chamfered surface R1, but the present invention is not limited thereto. The light exit surface 65 may have a length X5 in the first direction shorter than a length Y5 in the second direction such that the lengths X5 and Y5 of the adjacent two directions are different from each other as shown in FIG. , But is not limited thereto. The first direction (X-axis direction) is a direction orthogonal to the second direction (Y-axis direction), but is not limited thereto. The length X5 in the first direction may be shorter than the length Y5 in the second direction by 0.3 mm or more. For example, the length X5 may include a range of 3.45 mm ± 0.1 mm. 3.95 mm ± 0.1 mm.

The outer side walls 61 to 64 of the transmissive body 211 may be inclined at 90 degrees or more with respect to the extension lines of the light emission face 65 and the light emission face 65 of FIGS. 1, 10, and 11.

The first recess portion 213 disposed in the light guide protrusion 217 includes a non-circular or irregular shape, for example, a rectangular shape with a curved corner, The corner portions of the rectangular shape are chamfered, and each of the inner side walls 71 can be formed with a predetermined curvature.

The first recess portion 213 may have a width in a first direction, that is, a maximum width B1 and a width in a second direction, that is, a maximum width B2. For example, the width B1 in the first direction, May be formed wider than the width (B2) in the second direction. The width difference B1-B2 of the first recess portion 213 may be formed to correspond to, for example, the ratio of the width and height of the image of the image photographed by the camera. For example, if the image is 4: 3 or 16: 9, the width ratio B1: B2 of the first and second directions may be 4: 3 or 16: 9. By illuminating the object to be photographed with the width ratio B1: B2 of the first recess portion 213 in the first and second directions, such as flash, the correction in the camera control process can be minimized . In addition, the width ratio (B1: B2) of the first recess portion 213 in the first and second directions may provide an incidence region matching the angle of view of the camera. The width B1 of the first recess 213 in the first direction may be 50% or less of the length X5 of the optical lens 200 in the first direction, and the width B1 may be 1.52 mm < / RTI > 0.07 mm, and the width B2 may be in the range of 1.27 mm +/- 0.07 mm.

The light guide protrusions 217 protrude downward from the lower surface of the translucent body 211, that is, the lower surface 216 of the support portion 221, and part of the incident light is condensed on the first incident surface 215 The first incident surface 215 transmits the condensed light, and the transmitted light is irradiated to the light exit surface 65 through the light-transmitting body 211.

The inner wall 71 of the light guide projection 217 may be inclined with respect to an axis ZO perpendicular to the light exit surface 65. The inclination angle may be 0.1 degree or more, . ≪ / RTI > For example, as shown in FIG. 1, an angle 6 between the inner wall 71 of the light guide projection 217 and the first incident surface 215 may be formed in an acute angle range, for example, in the range of 60 degrees to 89 degrees have. The first incident surface 215 is formed as a surface that is not parallel to the light emitting chip 171, thereby allowing the light to be condensed to be effectively transmitted.

The first incident surface 215 may have a spherical shape protruding in the direction of the light emitting chip 171 or may include a surface having a spherical surface and an inclined surface. For example, the center portion 216 of the first incident surface 215 may have a spherical shape, and the peripheral region of the center portion 216 may be formed of an inclined surface. The first recess portion 213 may be formed to have the lowest depth H5 of the central portion 216 of the first incident surface 215 and the periphery of the central portion 216 may be greater than the center portion 216 And a deep depth H6. The depth of the first recess portion 213 is a distance from the lower surface of the light guide protrusion 217 to the first incident surface 215 and may be different from each other depending on the region. The first recess portion 213 may be formed to have a depth gradually increasing toward the outer side from the central portion of the first incident surface 215. The first incident surface 215 may include an inclined plane between the central portion 216 of the first incident surface 215 and the inner wall 71 of the light guide protrusion 217. 1, the internal angle at the central portion 216 of the first incident surface 215 may be formed at an angle [theta] 7 of 180 degrees or less, for example, in a range of 120 degrees to 179 degrees. The inclined plane of the first incident surface 215 may be formed not parallel to the light exit surface 65, but is not limited thereto.

The width of the first recess portion 213 of the light guide protrusion 217 may gradually increase toward the light exit surface 65 and may be narrower than the bottom width of the first and second cavities 113 and 114 And may be formed to be wider than the width Fl of the light emitting chip 171. The light guide plate 217 is formed on the upper surface of the light emitting chip 171 so as to correspond to the first recess 213, (Not shown).

8 and 9, the first recess portion 213 may have a minimum width L6 in the first direction larger than a minimum width L16 in the second direction. For example, the minimum width L6 may be in the range of 1.45 mm ± 0.05 mm, and the width L16 may be in the range of 1.20 mm ± 0.05 mm.

The outer wall 72 of the light guide protrusion 217 may include a curved surface having a predetermined curvature. The curved surface may reflect light emitted from the light emitting device 100 toward the second incident surface 225 and / or the second recess portion 223. The outer wall 72 of the light guide projection 217 may include, but is not limited to, an inclined surface as another example. The side surface of the light guide protrusion 217 may be formed to gradually increase in the direction of the light exit surface 6, but the present invention is not limited thereto.

The second recess portion 223 is disposed around the light guide projection 217 and the second recess portion 223 is formed on the outer wall 72 of the light guide projection 217 and the support portion 221, And includes a second incidence surface 225. The second incidence surface 225 has a generally triangular shape. The depth H7 of the second recess portion 223 is a distance from the support portion 221 to the second incident surface 225 and is larger than the first incident surface 215 of the first recess portion 213 May be formed closer to the light exit surface (65). May be inclined at an angle of 10 degrees or less with respect to the vertical axis of the inner wall 71 of the light guide projection 217 and the light exit surface 65 of the inner wall 81 of the support portion 221.

The second incident surface 225 may be formed in a plane parallel to the light exit surface 65. The width of the second recess portion 223 disposed between the light guide protrusion 217 and the support portion 221, that is, the minimum width L7 in the first direction is smaller than the minimum width L17 in the second direction Can be formed differently. That is, the widths L7 and L17 of the second recess portion 223 in the first and second directions are the bottom width of the second incident surface 225, and the width L7 in the first direction and the width For example, the width L7 in the first direction may be narrower than the width L17 in the second direction, for example, 0.02 mm or narrower than the width L17 in the second direction. The width L7 of the second incident surface 225 in the first direction includes, for example, 0.30 mm ± 0.02 mm and the width L17 of the second direction includes 0.35 mm ± 0.02 mm.

The interval L5 in the first direction and the interval L15 in the second direction are different from each other, for example, the interval L5 in the first direction is larger than the interval L5 in the second direction (L15). The interval L5 is in the range of 2.30 mm ± 0.05 mm, and the interval L15 is in the range of 2.20 ± 0.05 mm.

The translucent body 211 of the optical lens 200 is formed so that the thickness L8 between the lower surface 66 and the light exit surface 65 is thinner than the central portion thickness L12 of the first recess portion 213, L11), and may be formed in a range of 0.75 mm +/- 0.05 mm, for example.

The thickness L11 (that is, the minimum thickness) between the central portion 216 of the first incident surface 215 and the light exit surface 65 is larger than the thickness L11 (i.e., the minimum thickness) between the second incident surface 225 and the light exit surface 65, May be formed thicker than the thickness L9. The thickness L9 between the second incident surface 225 and the light exit surface 65 may be 50% or less of the thickness L8 of the transmissive body 211. The thickness difference L11 to L9 in the light transmissive body 211 may correspond to the difference between the amount of light incident on the first incident surface 215 and the amount of light incident on the second incident surface 225, Or more. The thickness difference L11 to L9 in the light transmissive body 211 can improve the uniformity of light output to the light exit surface 65. [ The thickness L11 includes a range of 0.56 mm ± 0.05 mm, and the thickness L9 includes a range of 0.35 mm ± 0.03 mm. If the thicknesses L11 and L9 are larger than the above range, the thickness of the optical lens 200 can be thicker, and if it is thinner than the above range, it is difficult to uniformly distribute the light. The central portion thickness L12 of the transmissive body 211 is a distance between the central portion 216 of the first incident surface 215 and the light exit surface 65 and is formed to be 0.2 mm or more thicker than the thickness L11 For example, the range of 0.84 mm ± 0.06 mm. The light transmissive body 211 can effectively diffuse the incident light using the thickness difference L12-L11 of the region corresponding to the first incident surface 215. [

The inner wall 81 of the support portion 221 which is the outer wall of the second recess portion 223 may be formed as an inclined surface with respect to the vertical axis of the light exit surface 65, , And an angle [theta] 8 between the second incident surface 225 and the inner wall 81 may be in a range of 90 degrees or more, for example, in a range of 91 degrees to 97 degrees. The incident light amount and the light condensing efficiency of the light reflected from the outer wall 72 of the light guide projection 217 or the light emitted from the light emitting element 100 can be increased by the angle? 8.

The both side walls 71 and 72 of the light guide projection 217 and the inner side wall 81 of the support portion 221 are formed as inclined surfaces, . The inner wall 81 of the support portion 221 includes a circular contour.

As shown in FIGS. 1 and 7, the support portion 221 includes a polygonal shape on the lower surface and corresponds to the upper surface of the body 111 of the light emitting device 100. The outer walls 61 to 64 of the support portion 221 may be formed at an angle? 5 of 90 degrees or more, for example, in a range of 90.5 degrees to 93 degrees with respect to the light exit surface 65.

The support portion 221 includes an engagement protrusion 68 disposed around the first recess portion 213. The engagement protrusion 68 is disposed below the lower surface 66 of the support portion 221 More protruding. The engaging protrusions 68 may have a circular contour and may have a continuous structure. A plurality of the coupling protrusions 68 may be disposed in a discontinuous structure along the outer wall of the support portion 221. The coupling protrusion 68 may be formed to have a height H4 ranging from the depth H1 of the coupling groove 18 of FIG. 4, but the present invention is not limited thereto. The coupling protrusions 68 may be formed in a structure having a predetermined curved surface, and may include, for example, a hemispherical shape.

The body 111 of the light emitting device 100 and the light transmitting body 211 of the optical lens 200 may include a plurality of recesses and / or convex portions for alignment. For example, a plurality of convex portions 119 may be formed on the body 111 of the light emitting device 100 as shown in FIG. 3, and the light transmitting body 211 of the optical lens 200 may have a plurality of convex portions 119, 13, a plurality of recessed portions 219 corresponding to the convex portions 119 may be formed. As another example, a plurality of concave portions may be formed on the body 111 of the light emitting device 100, and a plurality of convex portions may be formed on the support portion 221 of the optical lens 200, Do not.

A plurality of convex portions 119 formed in the body 111 of the light emitting device 100 may be inserted into the plurality of concave portions 219 and coupled to the light transmitting body 211 of the optical lens 200. The shape of the convex portion 119 and the concave portion 219 may be circular, polygonal, or hemispherical, but is not limited thereto. 13, the depth E2 and the width E1 of the concave portion 219 may be the same or different from each other. For example, the depth E2 is 0.2 mm +/- 0.02 mm and the width E1 is 0.3 mm +/- 0.03 mm . ≪ / RTI >

2, the light guide protrusions 217 of the optical lens 200 are coupled to the first cavity 113 of the light emitting device 100, The light emitting chip 171 is spaced apart from the horizontal line of the bottom 35 of the light emitting chip 171 by a predetermined distance F2 and disposed within the first cavity 113 and arranged with a width wider than the width F1 of the light emitting chip 171. The light guide protrusion 217 extends to the first cavity 113 so that the first recess 213 can correspond to the entire area of the upper surface of the light emitting chip 171. Accordingly, more than 50% of the light emitted from the light emitting chip 171 can be incident on the first recess portion 213.

A portion of the first incident surface 215 of the optical lens 200 such as the central portion 216 is disposed below the horizontal extension line on the upper surface 16 of the body 111 of the light emitting device 100 , The amount of light incident on the first incident surface 215 can be improved.

8 and 9, the lower portion of the inner side wall of the light guide protrusion 217 is formed in a curved shape R2, thereby improving the amount of light incident on the first recess portion 213 . Further, the bottom edge portion of the support portion 221 is formed of the curved surface R3, so that the rigidity of the corner portion can be enhanced.

The second recess portion 223 of the optical lens 200 is arranged to correspond to the first cavity 113 of the light emitting device 100 in the vertical direction so that the light emitted through the first cavity 113 It can be condensed.

The upper surface 16 of the body 111 of the light emitting device 100 and the lower surface 66 of the light transmitting body 211 of the optical lens 200 are brought into contact with each other, , But is not limited thereto.

The coupling groove 18 disposed in the body 111 of the light emitting device 100 and the coupling protrusion 68 disposed in the light transmitting body 211 of the optical lens 200 are coupled to each other to prevent light leakage . 2, the space between the optical lens 200 and the light emitting device 100 may be an air space or a closed space, but is not limited thereto.

The optical lens 200 receives most of light emitted through the first cavity 113 of the light emitting device 100 to the first and second recesses 213 and 223 and transmits the light through the light transmitting body 211 To the light exit surface (65).

Further, the optical lens 200 is formed in a line-symmetrical structure with respect to the central portion 216 of the first incident surface 215, so that the distribution of light can be made uniform in the symmetric region. This can illuminate the illumination corresponding to the image size such as the photographed image. As shown in Fig. 19, the illuminance uniformity can be improved by 70 to 80% at 0.7 field from the center of the optical lens. 20, the brightness of the central portion of the optical lens is 550 lux or more.

14 and 15 are still other examples of the light emitting device of the first embodiment. Fig. 14 is a plan view of the light emitting device, and Fig. 15 is a F-F side view of the light emitting device of Fig. 14 and 15, the same parts as those in the first embodiment will be referred to the first embodiment.

14 and 15, the light emitting device includes a body 111 having a first cavity 113 and a second cavity 114, first and second light emitting devices 112 and 113 disposed in the second cavity 114 of the body 111, A light emitting chip 171 disposed on the first lead frame 121, and a protection chip 172. The first and second lead frames 121,

The side wall 41 of the second cavity 114 includes a recessed region 140 corresponding to the side surface of the light emitting chip 171 and recessed in the direction of the fourth side surface 14 of the body 111 , And recessed side wall (43) in the recessed region (140). The recessed side wall 41 may be formed at an angle perpendicular to the upper surface of the first and second lead frames 121 and 131 and may be formed at an angle larger than the side wall 41 of the second cavity 114 do. The recessed sidewall 41 of the recess region 140 secures a space between one side of the light emitting chip 171 and the side wall 41 so that the wire 176 connected to the protection chip 172 It is possible to provide a bonding space. By providing such a bonding space, the size of the light emitting chip 171 can be further increased, and a chip having a large area can be applied. The side wall 43 of the recess region 140 is recessed in the direction of the fourth side portion 14 by a predetermined distance C3 from the bottom line of the side wall 41 of the second cavity 114, (C3) may be formed in a range of 0.01 mm or more, for example, in a range of 0.01 mm to 0.3 mm. The width C1 of the recessed side wall 43 may be narrower than the width of the light emitting chip 171 and may be 150% or more, for example, 150% to 300% of the ball diameter of the wire 176 As shown in FIG.

A portion of the width C2 in the second direction of the second cavity 114 may be formed to be wider by the distance C3 of the recessed region 140. [ That is, the widths of the second cavities 114 in the second direction may be different from each other depending on the regions.

16 is a cross-sectional side view of a light emitting device and an optical lens of the light emitting module according to the second embodiment. In describing the second embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.

Referring to FIG. 16, the light emitting module 300 includes a light emitting device 100 and an optical lens 200A. The light emitting device 100 will be described with reference to the light emitting device of FIG. 3 or FIG.

The optical lens 200A has a structure in which the first incident surface 215A of the first recess portion 223 disposed in the light guide projection 217 is deformed. The first incident surface 215A is provided with a plurality of patterns 215B having the same central portion 216. The plurality of patterns 215B includes a shape in which concentric bands having different radii are arranged, for example, a Fresnel lens shape. The first incident surface 215A having the plurality of patterns 215B can efficiently collect the incident light. As another example, a rough pattern may be formed on the second incident surface 225 in the second recess portion 223, but the present invention is not limited thereto.

A phosphor layer 181 may be disposed on the light emitting device 100 or a phosphor may be added on the molding member 161. However, the present invention is not limited thereto.

17 is a cross-sectional side view of the light emitting device and the optical lens of the light emitting module according to the third embodiment. In describing the third embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.

Referring to FIG. 17, the light emitting module 300B includes a light emitting device 100B and an optical lens 200B.

The light emitting device 100B includes a body 111 having a first cavity 113 and a second cavity 114 and first and second lead frames 110 and 120 disposed in a second cavity 114 of the body 111. [ A light emitting chip 171 disposed on the first lead frame 121, and a molding member 162 covering the light emitting chip 171.

The molding member 162 may be defined as a clean resin layer in which no impurity such as a phosphor is added, but the present invention is not limited thereto. The light emitting device 100B may not include the phosphor layer disclosed in the first embodiment.

The optical lens 200B includes a light guide protrusion 217 protruding below the light transmissive body 211, a first recess portion 213 and a first incident surface 215 in the light guide protrusion 217, And includes a second recess portion 223 and a second incident surface 225 between the guide protrusion 217 and the support portion 221.

The optical lens 200B includes a first resin layer 261 disposed in the first recess portion 213 and a second resin layer 263 disposed under the first resin layer 261. The first resin layer 261 may include a resin material to which an impurity such as a phosphor is not added, and the second resin layer 263 may include a resin material to which a phosphor is added. The lower surface of the first resin layer 261 may have a concavo-convex shape, but the present invention is not limited thereto.

Also, the third resin layer 265 may be included in the second recess portion 223, and the third resin layer 265 may or may not be doped with the phosphor.

The fluorescent material that can be added to the second and third resin layers 263 and 265 includes at least one of a yellow fluorescent material, a red fluorescent material, a blue fluorescent material, and a green fluorescent material, but is not limited thereto.

18 is a view showing a camera module having a light emitting module according to an embodiment.

Referring to FIG. 18, the camera module 310 includes a light emitting module 300 and a camera unit 305. The light emitting module 300 includes the light emitting device 100 and the optical lens 200 described in the embodiment and the camera unit 305 is disposed adjacent to the light emitting module 300. The light emitting device 100 may operate in conjunction with the camera unit 305 when the flash mode is selected, but the present invention is not limited thereto.

The light emitting device 100 and the camera unit 305 are mounted on a module substrate 301 and the module substrate 301 supplies power to the light emitting device 100 and the camera unit 305 . The module substrate 301 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB but also a ceramic substrate, a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like.

21 is a diagram showing an example of a light emitting chip of the light emitting device disclosed in the embodiment.

21, a light emitting chip includes a light emitting structure 310, a contact layer 321 below the light emitting structure 310, a reflective layer 324 below the contact layer 321, A protection layer 323 around the reflective layer 324 and the light emitting structure 310 and an electrode 316 on the light emitting structure layer 310 may be included.

The light emitting structure 310 includes a first conductive semiconductor layer 313, an active layer 314, and a second conductive semiconductor layer 315. The first conductivity type semiconductor layer 313 is formed of a Group III-V compound semiconductor doped with a first conductivity type dopant, and the first conductivity type semiconductor layer 313 is formed of In _x Al _y Ga _1-xy N (0? X? 1, 0? Y? 1, 0? X + y? 1). The first conductive semiconductor layer 313 may be a stacked structure of layers including at least one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, . ≪ / RTI > The first conductive type semiconductor layer 313 is an n-type semiconductor layer, and the first conductive type dopant is an n-type dopant including Si, Ge, Sn, Se, and Te.

A first clad layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. [ The first clad layer may be formed of a GaN-based semiconductor, and the band gap of the first clad layer may be greater than a bandgap of the active layer 314. The first cladding layer is formed in the first conductivity type and serves to constrain carriers.

The active layer 314 may be disposed under the first conductive semiconductor layer 313 and may selectively include a single quantum well, a MQW, a quantum wire structure, or a quantum dot structure. . The active layer 314 includes a well layer and a barrier layer period. The well layer comprises a composition formula of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1), and wherein the barrier layer is In _x Al _y And Ga _1-xy N (0? X? 1, 0? Y? 1, 0? X + y? 1). The period of the well layer / barrier layer may be one or more cycles using a lamination structure of, for example, InGaN / GaN, GaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, and InAlGaN / InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than a band gap of the well layer.

A second conductive semiconductor layer 315 is formed under the active layer 314. The second conductive semiconductor layer 315 may include a semiconductor doped with a second conductive dopant, such as In _x Al _y Ga _{1 -x- y} N (0? X? 1, 0? _Y ? 1, y? 1). The second conductive semiconductor layer 315 may be formed of any one of compound semiconductors such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP. The second conductivity type semiconductor layer 315 may be a p-type semiconductor layer, and the second conductivity type dopant may include Mg, Zn, Ca, Sr, and Ba as a p-type dopant.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductivity type semiconductor layer 315 may protect the active layer 314 by diffusing a current contained in the voltage abnormally.

The first conductivity type semiconductor layer 313 may be a p-type semiconductor layer, and the second conductivity type semiconductor layer 315 may be an n-type semiconductor layer. can do. A first conductive semiconductor layer having a polarity opposite to that of the second conductive type may be further disposed on the second conductive type semiconductor layer 315.

The light emitting structure 310 may have any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, and n is an n-type semiconductor layer, and the - includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer are in direct contact or indirect contact. Hereinafter, for convenience of explanation, the uppermost layer of the light emitting structure 310 will be described as the second conductive type semiconductor layer 315.

An electrode 316 is disposed on the first conductive type semiconductor layer 313 and the electrode 316 functions as a pad. The electrode 316 may be disposed in one or a plurality of layers and includes a pad to which the wire is bonded.

A contact layer 321 and a protective layer 323, a reflective layer 324 and a supporting member 325 are disposed under the second conductive type semiconductor layer 315. The contact layer 321 is in ohmic contact with the lower layer of the light emitting structure 310, for example, the second conductivity type semiconductor layer 315. The material of the contact layer 321 may be selected from a metal oxide, a metal nitride, an insulating material, (ITO), indium zinc oxide (IZO), indium zinc oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO) a material selected from the group consisting of an oxide, an antimony tin oxide (ATO), a gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, . In addition, the metal material and the light transmitting conductive material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, and ATO can be used in a multilayer structure. For example, IZO / Ni, AZO / Ag, IZO / / Ag / Ni or the like. The contact layer 321 may further include a current blocking layer to correspond to the electrode 316.

The protective layer 323 may be selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO) (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO 2, SiO x, SiO x N y, Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ . The protective layer 323 may be formed using a sputtering method, a deposition method, or the like, and metal such as the reflective layer 324 may prevent the layers of the light emitting structure 310 from being short-circuited.

The reflective layer 324 may be formed of a material selected from the group consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and combinations thereof. The reflective layer 324 may be formed to have a width larger than the width of the light emitting structure 310, which may improve the light reflection efficiency. A metal layer for bonding and a metal layer for thermal diffusion may be further disposed between the reflective layer 324 and the support member 325, but the present invention is not limited thereto.

The support member 325 may be a base substrate made of a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu- Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the supporting member 325 and the reflective layer 324, and the bonding layer may bond the two layers together. The above-described light emitting chip is merely an example, and is not limited to the features disclosed above. The light emitting chip may be selectively applied to the light emitting device, but the present invention is not limited thereto.

<Lighting system>

The light emitting module according to the embodiment can be applied to the illumination system. The lighting system includes a structure in which a plurality of light emitting modules are arrayed, and includes a display device shown in Figs. 22 and 23, a lighting device shown in Fig. 24, and may include an illumination lamp, a traffic light, a vehicle headlight, have.

22 is an exploded perspective view of a display device having a light emitting module according to an embodiment.

22, a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. &Lt; / RTI &gt;

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

The light source module 1031 includes at least one light source module 1031 and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a module substrate 1033 and a light emitting module 300 according to the embodiment described above and the light emitting module 300 may be arrayed at a predetermined interval on the module substrate 1033 have.

The module substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like. When the light emitting device of the light emitting module 300 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the module substrate 1033 can be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The plurality of light emitting modules 300 may be mounted on the module substrate 1033 such that the light emitting surface of the plurality of light emitting modules 300 is spaced apart from the light guiding plate 1041 by a predetermined distance.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the invention is not limited thereto.

23 is a diagram showing a display device having a light emitting element according to the embodiment.

23, the display device 1100 includes a bottom cover 1152, a module substrate 1020 in which the above-described light emitting module 300 is arrayed, an optical member 1154, and a display panel 1155 .

The module substrate 1020 and the light emitting module 300 may be defined as a light source module 1060. The bottom cover 1152, the at least one light source module 1060, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto. The light source module 1060 includes a module substrate 1020 and a plurality of light emitting modules 300 arranged on the module substrate 1020.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of PC material or PMMA (poly methyl methacrylate), and the light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light source module 1060, and performs surface light source, diffusion, and light condensation of light emitted from the light source module 1060.

24 is an exploded perspective view of a lighting device having a light emitting device according to an embodiment.

24, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting module according to an embodiment of the present invention.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200 and may be coupled to the heat discharger 2400. The cover 2100 may have a recess portion to be coupled with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint having a diffusion material. The light from the light source module 2200 can be scattered and diffused to emit to the outside using the milky white material.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light emitting device 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 into which a plurality of illumination elements 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the illumination device 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components may include, for example, a DC converter, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protection device for protecting the light source module 2200, The present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. The extension 2670 may be electrically connected to the socket 2800 through a wire.

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100, 100B: light emitting element 111: body
113: first cavity 114: second cavity
121, 131: lead frames 161, 162:
171: Light emitting chip 181: Phosphor layer
200, 200A, 200B: optical lens 211: translucent body
213: first recess portion 215: first incident surface
217: light guide projection 221: support
223: second recess portion 225: second incident surface
300: light emitting module 301: module substrate
305: camera unit 310: camera module

Claims (23)

A translucent body having a light exit surface;
A first recess portion protruding in a direction opposite to the light emission surface in a region opposite to the light emission surface and including a first incident surface;
A light guide projection extending from the first incident surface and projecting in a direction opposite to the light exit surface;
A support disposed around an outer periphery of the light guide projection;
A second recess portion disposed between the light guide projection and the support portion; And
And a second incident surface disposed in the second recess portion and corresponding to the light outgoing surface,
Wherein the first recess portion includes an optical lens having a center portion at the lowest depth. The method according to claim 1,
And a distance between the first incident surface and the light exit surface is larger than an interval between the second incident surface and the light exit surface. The method according to claim 1,
Wherein the first recess portion has an optical lens formed at a depth that becomes deeper toward the outer side from the center of the first incident surface. The method of claim 3,
And the optical guide protrusion is further protruded from the lower surface of the support portion. 5. The method according to any one of claims 1 to 4,
The light guide protrusion includes an inner wall having an acute angle with the first incident surface; An optical lens having a curved surface and an outer wall connected to the second incident surface.  6. The light emitting module according to claim 5, wherein the inner wall of the support portion has an optical lens arranged at an acute angle with the second incident surface. The method according to claim 6,
And an optical lens extending from the inner wall of the support portion and protruding from the lower surface of the support portion. The method according to claim 1,
Wherein the first incident surface includes a spherical surface and an inclined surface protruding from the first incident surface toward the light emitting chip,
Wherein the center of the first incident surface has a spherical shape and the peripheral region of the central portion has a sloped surface. The method according to claim 1,
The length of the body in the first direction is shorter than the length of the body in the second direction,
And a width of the first recess portion in the first direction and a width of the second direction perpendicular to the first direction are different from each other. delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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