KR101983740B1 - 대면적의 플렉서블 oled 어셈블리에서의 열 관리 - Google Patents

대면적의 플렉서블 oled 어셈블리에서의 열 관리 Download PDF

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KR101983740B1
KR101983740B1 KR1020147005642A KR20147005642A KR101983740B1 KR 101983740 B1 KR101983740 B1 KR 101983740B1 KR 1020147005642 A KR1020147005642 A KR 1020147005642A KR 20147005642 A KR20147005642 A KR 20147005642A KR 101983740 B1 KR101983740 B1 KR 101983740B1
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oled
cathode
thickness
metal
thermal management
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KR20140067020A (ko
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디더 오롱젭
제임스 마이클 코스티카
개리 로버트 알렌
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보에 테크놀로지 그룹 컴퍼니 리미티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020147005642A 2011-09-01 2012-08-23 대면적의 플렉서블 oled 어셈블리에서의 열 관리 Active KR101983740B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/223,935 US8829556B2 (en) 2011-09-01 2011-09-01 Thermal management in large area flexible OLED assembly
US13/223,935 2011-09-01
PCT/US2012/052051 WO2013032854A1 (en) 2011-09-01 2012-08-23 Thermal management in large area flexible oled assembly

Publications (2)

Publication Number Publication Date
KR20140067020A KR20140067020A (ko) 2014-06-03
KR101983740B1 true KR101983740B1 (ko) 2019-05-29

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KR1020147005642A Active KR101983740B1 (ko) 2011-09-01 2012-08-23 대면적의 플렉서블 oled 어셈블리에서의 열 관리

Country Status (7)

Country Link
US (1) US8829556B2 (enExample)
EP (1) EP2751856B1 (enExample)
JP (1) JP6189298B2 (enExample)
KR (1) KR101983740B1 (enExample)
CN (1) CN103782409B (enExample)
TW (1) TWI560920B (enExample)
WO (1) WO2013032854A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012109238A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
DE102013108871A1 (de) * 2013-08-16 2015-03-12 Osram Opto Semiconductors Gmbh Organisches Licht emittierendes Bauelement
KR102107622B1 (ko) * 2013-09-06 2020-05-07 엘지이노텍 주식회사 조명장치
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
CN104021735B (zh) * 2014-05-23 2016-08-17 京东方科技集团股份有限公司 一种量子点发光显示屏及其制备方法
DE102015105484B4 (de) * 2015-01-13 2025-08-21 Pictiva Displays International Limited Organisches Licht emittierendes Bauelement
CN104701353A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 有机发光显示面板和显示装置
CN106328680B (zh) * 2016-08-25 2019-03-15 昆山国显光电有限公司 有机发光显示装置的激光密封导热治具及激光密封方法
CN107195795B (zh) * 2017-06-07 2019-06-14 武汉天马微电子有限公司 可折叠显示面板和可折叠显示装置
US10369774B2 (en) 2017-06-30 2019-08-06 Microsoft Technology Licensing, Llc Thermally conductive de-bonding aid
KR102565415B1 (ko) * 2018-02-21 2023-08-09 삼성디스플레이 주식회사 표시 장치
CN108760144A (zh) * 2018-05-29 2018-11-06 成都新柯力化工科技有限公司 一种提高压力电子传感器灵敏度的柔性膜
US11084955B2 (en) 2018-07-23 2021-08-10 Microsoft Technology Licensing, Llc Pressure sensitive adhesive with thermally conductive release tab
KR102772788B1 (ko) 2020-02-26 2025-02-26 삼성디스플레이 주식회사 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050468A (ja) 2000-08-04 2002-02-15 Sony Corp 平面表示素子
US20040032209A1 (en) 2002-08-19 2004-02-19 Chin-Long Wu Organic light-emitting panel and manufacturing method thereof
US20050285518A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thick cathode
US20060132031A1 (en) * 2004-12-16 2006-06-22 Au Optronics Corp. Organic light emitting diode devices
JP2006196271A (ja) 2005-01-12 2006-07-27 Fuji Electric Holdings Co Ltd 有機ｅｌ素子およびその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318627A (ja) 2000-02-29 2001-11-16 Semiconductor Energy Lab Co Ltd 発光装置
US6819316B2 (en) 2001-04-17 2004-11-16 3M Innovative Properties Company Flexible capacitive touch sensor
JP2003109773A (ja) 2001-07-27 2003-04-11 Semiconductor Energy Lab Co Ltd 発光装置、半導体装置およびそれらの作製方法
US20040035360A1 (en) 2002-05-17 2004-02-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7172813B2 (en) 2003-05-20 2007-02-06 Burgener Ii Robert H Zinc oxide crystal growth substrate
US7141489B2 (en) 2003-05-20 2006-11-28 Burgener Ii Robert H Fabrication of p-type group II-VI semiconductors
US7227196B2 (en) 2003-05-20 2007-06-05 Burgener Ii Robert H Group II-VI semiconductor devices
US7161173B2 (en) 2003-05-20 2007-01-09 Burgener Ii Robert H P-type group II-VI semiconductor compounds
US6967439B2 (en) 2004-02-24 2005-11-22 Eastman Kodak Company OLED display having thermally conductive backplate
US7393598B2 (en) 2004-03-10 2008-07-01 Hcf Partners, L.P. Light emitting molecules and organic light emitting devices including light emitting molecules
US7205718B2 (en) 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive adhesive
US7205717B2 (en) 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive material
US7583022B2 (en) 2004-08-02 2009-09-01 Eastman Kodak Company OLED display with electrode
JP2006107755A (ja) 2004-09-30 2006-04-20 Seiko Epson Corp 電気光学装置、画像形成装置および画像読み取り装置
KR20070103204A (ko) 2006-04-18 2007-10-23 주식회사 동진쎄미켐 우수한 열전도도를 갖는 광경화성 수지 조성물
TWI331483B (en) 2006-08-07 2010-10-01 Ritdisplay Corp Organic light emitting device with heat dissipation structure
JP2008289124A (ja) 2007-04-17 2008-11-27 Hitachi Ltd アクティブマトリクスディスプレイを備えたテレビジョン装置
TWI341599B (en) * 2007-06-06 2011-05-01 Chipmos Technoligies Inc Light source module and the method for adjusting the brightness thereof
JP5541872B2 (ja) * 2009-02-26 2014-07-09 パナソニック株式会社 面状発光装置および照明器具
TWI587734B (zh) * 2009-03-26 2017-06-11 精工愛普生股份有限公司 有機ｅｌ裝置、有機ｅｌ裝置之製造方法、及電子機器
US20100294526A1 (en) 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package
JP5501687B2 (ja) * 2009-07-27 2014-05-28 パナソニック株式会社 有機ｅｌ光源ユニット
JP2011076844A (ja) * 2009-09-30 2011-04-14 Sumitomo Chemical Co Ltd 発光装置
US8710732B2 (en) 2009-12-22 2014-04-29 General Electric Company Organic light emitting device connection methods
US8253329B2 (en) 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050468A (ja) 2000-08-04 2002-02-15 Sony Corp 平面表示素子
US20040032209A1 (en) 2002-08-19 2004-02-19 Chin-Long Wu Organic light-emitting panel and manufacturing method thereof
US20050285518A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thick cathode
US20060132031A1 (en) * 2004-12-16 2006-06-22 Au Optronics Corp. Organic light emitting diode devices
JP2006196271A (ja) 2005-01-12 2006-07-27 Fuji Electric Holdings Co Ltd 有機ｅｌ素子およびその製造方法

Also Published As

Publication number Publication date
US8829556B2 (en) 2014-09-09
JP6189298B2 (ja) 2017-08-30
TW201316587A (zh) 2013-04-16
CN103782409B (zh) 2016-10-12
CN103782409A (zh) 2014-05-07
EP2751856B1 (en) 2020-04-08
EP2751856A1 (en) 2014-07-09
US20130056783A1 (en) 2013-03-07
JP2014525661A (ja) 2014-09-29
TWI560920B (en) 2016-12-01
WO2013032854A1 (en) 2013-03-07
KR20140067020A (ko) 2014-06-03

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