CN103782409B - 在大面积柔性有机发光二极管组件中的热管理 - Google Patents

在大面积柔性有机发光二极管组件中的热管理 Download PDF

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Publication number
CN103782409B
CN103782409B CN201280042358.XA CN201280042358A CN103782409B CN 103782409 B CN103782409 B CN 103782409B CN 201280042358 A CN201280042358 A CN 201280042358A CN 103782409 B CN103782409 B CN 103782409B
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China
Prior art keywords
oled
assemblies according
thickness
assembly
heat management
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CN201280042358.XA
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English (en)
Chinese (zh)
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CN103782409A (zh
Inventor
D.奥隆泽布
J.M.科斯特卡
G.R.艾伦
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
General Electric Co
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Publication of CN103782409A publication Critical patent/CN103782409A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN201280042358.XA 2011-09-01 2012-08-23 在大面积柔性有机发光二极管组件中的热管理 Active CN103782409B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13/223,935 US8829556B2 (en) 2011-09-01 2011-09-01 Thermal management in large area flexible OLED assembly
US13/223935 2011-09-01
US13/223,935 2011-09-01
PCT/US2012/052051 WO2013032854A1 (en) 2011-09-01 2012-08-23 Thermal management in large area flexible oled assembly

Publications (2)

Publication Number Publication Date
CN103782409A CN103782409A (zh) 2014-05-07
CN103782409B true CN103782409B (zh) 2016-10-12

Family

ID=46981072

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280042358.XA Active CN103782409B (zh) 2011-09-01 2012-08-23 在大面积柔性有机发光二极管组件中的热管理

Country Status (7)

Country Link
US (1) US8829556B2 (enExample)
EP (1) EP2751856B1 (enExample)
JP (1) JP6189298B2 (enExample)
KR (1) KR101983740B1 (enExample)
CN (1) CN103782409B (enExample)
TW (1) TWI560920B (enExample)
WO (1) WO2013032854A1 (enExample)

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DE102012109238A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
DE102013108871A1 (de) * 2013-08-16 2015-03-12 Osram Opto Semiconductors Gmbh Organisches Licht emittierendes Bauelement
KR102107622B1 (ko) * 2013-09-06 2020-05-07 엘지이노텍 주식회사 조명장치
DE102014205747A1 (de) * 2014-03-27 2015-10-01 Tridonic Gmbh & Co Kg Leuchtmodul und Herstellungsverfahren für ein Leuchtmodul
CN104021735B (zh) * 2014-05-23 2016-08-17 京东方科技集团股份有限公司 一种量子点发光显示屏及其制备方法
DE102015105484B4 (de) * 2015-01-13 2025-08-21 Pictiva Displays International Limited Organisches Licht emittierendes Bauelement
CN104701353A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 有机发光显示面板和显示装置
CN106328680B (zh) * 2016-08-25 2019-03-15 昆山国显光电有限公司 有机发光显示装置的激光密封导热治具及激光密封方法
CN107195795B (zh) * 2017-06-07 2019-06-14 武汉天马微电子有限公司 可折叠显示面板和可折叠显示装置
US10369774B2 (en) 2017-06-30 2019-08-06 Microsoft Technology Licensing, Llc Thermally conductive de-bonding aid
KR102565415B1 (ko) * 2018-02-21 2023-08-09 삼성디스플레이 주식회사 표시 장치
CN108760144A (zh) * 2018-05-29 2018-11-06 成都新柯力化工科技有限公司 一种提高压力电子传感器灵敏度的柔性膜
US11084955B2 (en) 2018-07-23 2021-08-10 Microsoft Technology Licensing, Llc Pressure sensitive adhesive with thermally conductive release tab
KR102772788B1 (ko) 2020-02-26 2025-02-26 삼성디스플레이 주식회사 표시 장치

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US20060132031A1 (en) * 2004-12-16 2006-06-22 Au Optronics Corp. Organic light emitting diode devices
JP2006196271A (ja) * 2005-01-12 2006-07-27 Fuji Electric Holdings Co Ltd 有機ｅｌ素子およびその製造方法

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US20050285518A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thick cathode
US20060132031A1 (en) * 2004-12-16 2006-06-22 Au Optronics Corp. Organic light emitting diode devices
JP2006196271A (ja) * 2005-01-12 2006-07-27 Fuji Electric Holdings Co Ltd 有機ｅｌ素子およびその製造方法

Also Published As

Publication number Publication date
US8829556B2 (en) 2014-09-09
JP6189298B2 (ja) 2017-08-30
TW201316587A (zh) 2013-04-16
CN103782409A (zh) 2014-05-07
KR101983740B1 (ko) 2019-05-29
EP2751856B1 (en) 2020-04-08
EP2751856A1 (en) 2014-07-09
US20130056783A1 (en) 2013-03-07
JP2014525661A (ja) 2014-09-29
TWI560920B (en) 2016-12-01
WO2013032854A1 (en) 2013-03-07
KR20140067020A (ko) 2014-06-03

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Effective date of registration: 20160510

Address after: Beijing economic and Technological Development Zone 100176 Beijing Zelu 9

Applicant after: BOE Technology Group Co., Ltd.

Address before: New York, USA

Applicant before: General Electric Company

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE Technology Group Co., Ltd.

Address before: Beijing economic and Technological Development Zone 100176 Beijing Zelu 9

Patentee before: BOE Technology Group Co., Ltd.