KR101967946B1 - 폴리이미드 수지 조성물 - Google Patents
폴리이미드 수지 조성물 Download PDFInfo
- Publication number
- KR101967946B1 KR101967946B1 KR1020147019891A KR20147019891A KR101967946B1 KR 101967946 B1 KR101967946 B1 KR 101967946B1 KR 1020147019891 A KR1020147019891 A KR 1020147019891A KR 20147019891 A KR20147019891 A KR 20147019891A KR 101967946 B1 KR101967946 B1 KR 101967946B1
- Authority
- KR
- South Korea
- Prior art keywords
- polyimide resin
- resin composition
- graphite
- polyimide
- boron nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161577212P | 2011-12-19 | 2011-12-19 | |
| US61/577,212 | 2011-12-19 | ||
| PCT/US2012/070206 WO2013096231A1 (en) | 2011-12-19 | 2012-12-17 | Polyimide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140105582A KR20140105582A (ko) | 2014-09-01 |
| KR101967946B1 true KR101967946B1 (ko) | 2019-08-13 |
Family
ID=47470241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147019891A Expired - Fee Related KR101967946B1 (ko) | 2011-12-19 | 2012-12-17 | 폴리이미드 수지 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2794742B1 (enExample) |
| JP (1) | JP6235486B2 (enExample) |
| KR (1) | KR101967946B1 (enExample) |
| CN (1) | CN103998501B (enExample) |
| WO (1) | WO2013096231A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107654499A (zh) * | 2017-09-12 | 2018-02-02 | 浙江双飞无油轴承股份有限公司 | 一种用氮化硼来增高材料抗压强度的自润滑轴承材料 |
| CN112223131A (zh) * | 2020-11-02 | 2021-01-15 | 惠州市新科磨具有限公司 | 耐磨薄片树脂切割片及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3179614A (en) | 1961-03-13 | 1965-04-20 | Du Pont | Polyamide-acids, compositions thereof, and process for their preparation |
| JPS6381160A (ja) * | 1986-09-25 | 1988-04-12 | Ube Ind Ltd | 無機質粉末含有ポリイミド粉末及びその製法 |
| JP2517604B2 (ja) * | 1987-07-13 | 1996-07-24 | 大豊工業株式会社 | 摺動材料 |
| JPH01259063A (ja) * | 1988-04-07 | 1989-10-16 | Toray Ind Inc | ポリイミド樹脂組成物 |
| JP2862173B2 (ja) * | 1988-08-25 | 1999-02-24 | 東レ株式会社 | ポリイミド粉末組成物の製造方法 |
| US5789523A (en) | 1995-07-11 | 1998-08-04 | E. I. Du Pont De Nemours And Company | Polyimide compositions with improved wear resistance and friction at high PV (pressure × velocity) conditions |
| US5886129A (en) | 1997-07-01 | 1999-03-23 | E. I. Du Pont De Nemours And Company | Oxidatively stable rigid aromatic polyimide compositions and process for their preparation |
| US20070160856A1 (en) * | 2005-12-05 | 2007-07-12 | Krizan Timothy D | Polyimide aircraft engine parts |
| DE602007013585D1 (de) * | 2006-10-11 | 2011-05-12 | Sumitomo Electric Industries | Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband |
-
2012
- 2012-12-17 CN CN201280061784.8A patent/CN103998501B/zh not_active Expired - Fee Related
- 2012-12-17 WO PCT/US2012/070206 patent/WO2013096231A1/en not_active Ceased
- 2012-12-17 EP EP12809068.5A patent/EP2794742B1/en not_active Not-in-force
- 2012-12-17 KR KR1020147019891A patent/KR101967946B1/ko not_active Expired - Fee Related
- 2012-12-17 JP JP2014549187A patent/JP6235486B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013096231A1 (en) | 2013-06-27 |
| CN103998501B (zh) | 2016-06-01 |
| JP2015501875A (ja) | 2015-01-19 |
| EP2794742B1 (en) | 2019-03-20 |
| JP6235486B2 (ja) | 2017-11-22 |
| KR20140105582A (ko) | 2014-09-01 |
| CN103998501A (zh) | 2014-08-20 |
| EP2794742A1 (en) | 2014-10-29 |
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| Publication | Publication Date | Title |
|---|---|---|
| KR101617481B1 (ko) | 고온 마모 용도를 위한 폴리이미드 수지 | |
| US20100029825A1 (en) | Polyimide resins for high temperature wear applications | |
| KR101663845B1 (ko) | 항공기 엔진용 복합재 부품 | |
| KR20120113718A (ko) | 고온 마모 용도를 위한 폴리이미드 수지 | |
| KR20080078039A (ko) | 폴리이미드 항공기 엔진 부품 | |
| KR101967946B1 (ko) | 폴리이미드 수지 조성물 | |
| KR20130097781A (ko) | 고온 용도를 위한 폴리이미드 수지 | |
| KR20110119836A (ko) | 고온 마모 용도를 위한 폴리이미드 수지 | |
| HK1159145A (en) | Polyimide resins for high temperature wear applications |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20220405 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20220405 |
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| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |