KR101950756B1 - Light emitting device package - Google Patents

Abstract

In an embodiment, at least two first light emitting elements, a second light emitting element, and a first region in which the first light emitting element is disposed, the first region having a first thickness with respect to the first lower surface, And a third region spaced apart from the first lead frame and having a third thickness with respect to the second bottom surface, the second region being spaced apart from the first lead frame, And a second region including a fourth region having a fourth thickness based on the first region and the second region, wherein the first and second leadframes include a body having a first cavity formed on the first and second lead frames, And a second cavity for diffusing heat generated in the first and second light emitting devices.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As disclosed in Publication No. 10-2008-0060114, a light emitting device package includes a light emitting element and a light emitting element arranged therein, and a resin body filled in the cavity and a body formed with the cavity are described.

In recent years, when at least two light emitting elements are disposed, research is underway to prevent breakage of at least two or more light emitting elements by overlapping heat generated by at least two light emitting elements in a region between at least two light emitting elements .

Embodiments provide a light emitting device package that is easy to prevent breakage of at least two or more light emitting devices due to superimposition of heat generated by at least two light emitting devices by expanding a region between at least two light emitting devices.

A light emitting device package according to an embodiment includes a first region having at least two first light emitting elements, a second light emitting element, and a first light emitting element, the first region having a first thickness with respect to a first lower surface, And a third region having a third thickness with respect to the second lower surface, the first region being spaced apart from the first lead frame, the second region being spaced apart from the first region, And a second leadframe including a fourth region having a fourth thickness with respect to the second bottom surface, the body including a first cavity formed on the first and second leadframes, A second cavity for diffusing heat generated from the first and second light emitting devices may be formed on the fourth region.

In the light emitting device package according to the embodiment, the first cavity is formed between the first and second light emitting devices by the first and second lead frames in the first cavity formed by the body, There is an advantage that the overlapped area with respect to the heat is enlarged and the heat is diffused to prevent the first and second light emitting devices from being damaged by heat.

In addition, the light emitting device package according to the embodiment has an advantage that the heat concentrated can be dispersed by the second cavity in the heat concentrated in the center of the first cavity.

1 is a perspective view illustrating a light emitting device package according to an embodiment.
FIG. 2 is a perspective view showing the first and second lead frames shown in FIG. 1 according to an embodiment. FIG.
FIG. 3 is a cross-sectional view showing a first embodiment of a cut surface of the light emitting device package shown in FIG. 1. FIG.
4 is a cross-sectional view showing a second embodiment of a cut surface of the light emitting device package shown in FIG.
5 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
6 is a cross-sectional view showing an AA section of the illumination apparatus shown in Fig.
7 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.
8 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the second embodiment.

In the description of the present embodiment, in the case where one element is described as being formed "on or under" of another element, the upper (upper) or lower (lower) on or under includes both the two elements being directly contacted with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

In the drawings, the thickness and size of each layer are exaggerated, omitted, or schematically illustrated for convenience and clarity. Therefore, the size of each component does not entirely reflect the actual size.

Further, the angles and directions mentioned in the description of the structure of the light emitting device package in this specification are based on those shown in the drawings. In the description of the structure of the light emitting device package in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 is a perspective view illustrating a light emitting device package according to an embodiment.

1 is a transparent perspective view showing a part of a light emitting device package. In the embodiment, the light emitting device package is shown as a top view type, but it may be a side view type and is not limited thereto.

Referring to FIG. 1, the light emitting device package 100 may include a body 20 having first and second light emitting devices 11 and 12 and first and second light emitting devices 11 and 12.

The body 20 may include a first partition 22 disposed in a first direction (not shown) and a second partition 24 disposed in a second direction (not shown) that intersects the first direction And the first and second barrier ribs 22 and 24 may be integrally formed with each other, and may be formed by injection molding, etching, or the like, but are not limited thereto.

That is, the first and second barrier ribs 22 and 24 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, at least one of photo sensitive glass, polyamide 9T (PA9T), syndiotactic polystyrene (SPS), metal material, sapphire (Al2O3), beryllium oxide (BeO), ceramics, and a printed circuit board .

The upper and lower surfaces of the first and second barrier ribs 22 and 24 may have various shapes such as a triangular shape, a rectangular shape, a polygonal shape, and a circular shape depending on the use and design of the first and second light emitting devices 11 and 12, Do not.

The first and second barrier ribs 22 and 24 form a first cavity s1 in which the first and second light emitting devices 11 and 12 are disposed and the sectional shape of the first cavity s1 is a cup shape, And the first and second barrier ribs 22 and 24 forming the first cavity s1 may be inclined downwardly and the inner side surface may have a concave and convex structure. I will not.

The planar shape of the first cavity s1 may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a circular shape, but is not limited thereto.

The first and second lead frames 13 and 14 may be formed of a metal material such as titanium (Ti), copper (Au), chrome (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P) And may include one or more materials or alloys of indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) .

The first and second lead frames 13 and 14 may be formed to have a single layer or a multilayer structure, but are not limited thereto.

The inner surfaces of the first and second barrier ribs 22 and 24 are inclined at a predetermined inclination angle with respect to any one of the first and second lead frames 13 and 14, The reflection angle of the emitted light can be changed, and thus the directivity angle of the light emitted to the outside can be controlled. The concentration of light emitted to the outside from the first and second light emitting devices 11 and 12 increases as the directional angle of light decreases while the concentration of light emitted to the outside increases from the first and second light emitting devices 11 and 12 as the directional angle of light increases. The concentration of light decreases.

The inner surface of the body 20 may have a plurality of inclination angles, but is not limited thereto.

The first and second lead frames 13 and 14 are electrically connected to the first and second light emitting devices 11 and 12 and connected to the positive and negative poles of an external power source So that power can be supplied to the first and second light emitting devices 11 and 12.

In the embodiment, the first light emitting element 11 is disposed on the first lead frame 13, the second lead frame 14 is separated from the first lead frame 13, and the second light emitting element 11 .

The first light emitting device 11 is die-bonded to the first lead frame 13 and wire-bonded to the second lead frame 14 by wires (not shown) The first and second light emitting devices 11 and 12 are connected to the first and second lead frames 13 and 13 by wire bonding with a first lead frame 13 and a wire (not shown) And 14, respectively.

Here, the first and second light emitting devices 11 and 12 may be bonded to the first lead frame 13 and the second lead frame 14 with different polarities.

The first and second light emitting devices 11 and 12 can be wire-bonded or die-bonded to the first and second lead frames 13 and 14, respectively, and the connection method is not limited.

The first lead frame 13 has a first region (not shown) having a first thickness (not shown) based on a first lower surface (not shown) and a second region And a second region (not shown) having a second thickness (not shown).

The second lead frame 14 has a third region (not shown) having a third thickness (not shown) based on a second lower surface (not shown), and a second region And a fourth region (not shown) having a fourth thickness (not shown).

At this time, the second cavity s2 may be formed on the second and fourth regions, the second cavity s2 may diffuse the heat generated from the first and second light emitting devices 11 and 12, The description will be given later.

The first and second light emitting devices 11 and 12 can be adhered to the first and second lead frames 13 and 14 by an adhesive member (not shown).

An insulating dam (not shown) is provided on the lower surface of the second cavity s2 between the first and second lead frames 13 and 14 to prevent electrical shorting of the first and second lead frames 13 and 14. [ (16) may be formed.

In the embodiment, the upper portion of the insulating dam 16 may be formed in a semicircular shape, and the shape of the upper portion may vary depending on the injection material injection method, and is not limited thereto.

A cathode mark (17) may be formed on the body (20). The cathode mark 17 is formed by dividing the polarities of the first and second light emitting devices 11 and 12, that is, the polarities of the first and second lead frames 13 and 14 so that the first and second lead frames 13 and 14 When electrically connected, it may be used to prevent confusion.

The first and second light emitting devices 11 and 12 may be light emitting diodes. The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, and white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. However, The number of the first and second light emitting devices 11 and 12 and the mounting position of the first and second light emitting devices 11 and 12 may be limited Do not.

The body 20 may include a resin material 18 filled in the first cavity s1. That is, the resin material 18 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

The resin material 18 may be formed in a film form and may include at least one of a phosphor and a light diffusing material, and a light-transmitting material not including a phosphor and a light diffusing material may be used. Do not.

FIG. 2 is a perspective view showing the first and second lead frames shown in FIG. 1 according to an embodiment. FIG.

2 (a) is a perspective view of the first surfaces 13sa and 14sa of the first and second lead frames 13 and 14 in which the first and second light emitting devices 11 and 12 are disposed, and FIG. b are perspective views of the second faces 13sb and 14sb facing the first faces 13sa and 14sa of the first and second lead frames 13 and 14. [

Here, referring to FIGS. 6A and 6B, the side surfaces of the first and second lead frames 13 and 14 may have stepped portions, and the stepped portions may not be formed, and the present invention is not limited thereto.

The first lead frame 13 includes a first upper surface 13sa and a first lower surface 13sb opposed to the first upper surface 13sa and extends from the first lower surface 13ab to the first upper surface 13sa A first region 13a having a first thickness d1 and a second region 13b having a second thickness d2 up to the first top surface 13sa with respect to the first bottom surface 13sb .

The second lead frame 14 includes a second lower surface 14sa and a second lower surface 14sb opposed to the second upper surface 14sa and the second upper surface 14sa with respect to the second lower surface 14ab. And a fourth region 14b having a fourth thickness d4 from the second lower surface 14sb to the second upper surface 14sa with a third region 14a having a third thickness d3 up to the second top surface 14sa .

One side of the first and second light emitting devices 11 and 12 may be disposed on the interface between the first and second regions 13a and 13b and the third and fourth regions 14a and 14b.

One side of each of the first and second light emitting devices 11 and 12 shown in Fig. 1 is not disposed on the boundary line between the first and second regions 13a and 13b and the third and fourth regions 14a and 14b , But does not limit it.

The second and fourth thicknesses d2 and d4 may be 0.1 to 0.25 times the thicknesses of the first and third thicknesses d1 and d3 or 0.1 to 0.25 times the thicknesses of the first and third thicknesses d1 and d3. Mm to 0.25 mm, but is not limited thereto.

That is, when the second and fourth thicknesses d2 and d4 are less than 0.1 mm or less than 0.1 times the thicknesses of the first and third thicknesses d1 and d3, the second and fourth regions 13b and 14b are bent It is difficult to secure the airtightness with the body 20 and securing of the second cavity s2 is not easy if 0.25 mm or 0.25 times the thickness of the first and third thicknesses d1 and d3 is greater than 0.25 mm, Diffusion of heat generated by the first and second light emitting devices 11 and 12 can be lowered.

At least one of the second width w2 of the second region 13b and the fourth width w4 of the fourth region 14b is greater than the width w1 of the first lead frame 13 exposed in the first cavity s1 May be 0.1 to 0.3 times the at least one of the first width (not shown) of the first top surface 13sa and the third width (not shown) of the second top surface 14sa of the second lead frame 14.

That is, when at least one of the second and fourth widths w2 and w4 is less than 0.1 times the width of at least one of the first and third widths, the width of the second cavity s2 is narrow and the width of the first and second light emitting devices 11, The width of the second cavity s2 may be widened and the distance between the first and second light emitting devices 11 and 12 may be increased and the first cavity , The two light emitting elements 11 and 12 approach the inner surface of the first cavity s1 and the brightness of the inner surface of the first cavity s1 may be brighter than that of the center portion.

FIG. 3 is a cross-sectional view illustrating a first embodiment of a cut surface of the light emitting device package shown in FIG. 1, and FIG. 4 is a cross-sectional view illustrating a cut surface of the light emitting device package shown in FIG.

3 and 4, the repetitive description will be simplified or omitted for the parts overlapping in Figs.

3, the light emitting device package 100 includes a first lead frame 13 including first and second regions 13a and 13b, and a second lead frame 13 including third and fourth regions 14a and 14b. And may include a frame 14.

The first and second lead frames 13 and 14 have the same first and second thicknesses d1 and d3 between the first and second upper surfaces 13a and 14a and the first and second lower surfaces 13b and 14b And is not limited thereto.

The light emitting device package 100 may have the first cavity s1 and the second cavity s2 formed in the first cavity s1.

At this time, the second cavity s2 may be formed of at least one of the second region 13b, the fourth region 14b, and the insulation dam 16, and the second region 13b, the fourth region 14b, It may be formed by the insulating dam 16 and the second bank 24, but is not limited thereto.

The upper surface of the insulating dam 16 is shown as being the same as the upper surface of the second and fourth regions 13b and 14b but a portion of the upper surface of the insulating dam 16 may be formed on a part of the upper surface of the second and fourth regions 13b and 14b But is not limited thereto.

First, the first and second light emitting devices 11 and 12 have the same structure as each other in a vertical type. In the embodiment, the first light emitting device 11 and the second light emitting device 11 are not limited thereto .

 The first light emitting device 11 is disposed on the substrate 1 and the substrate 1 and is disposed between the first semiconductor layer 4 and the second semiconductor layer 6 and between the first and second semiconductor layers 4 and 6 (7) including an active layer (5).

At this time, the substrate 1 may be formed using a material having excellent thermal conductivity, or may be formed of a conductive material.

The substrate 1 may be formed as a single layer, and may be formed as a double structure or a multiple structure, but is not limited thereto.

The substrate 1 may be formed of Au, Ni, W, Mo, Cu, Cu-W, or a carrier wafer.

At this time, the carrier wafer may be formed of Si, Ge, GaAs, ZnO, SiC, SiGe, GaN, Ga ₂ O ₃ or the like.

In addition, the substrate 1 facilitates the release of heat generated in the first light emitting device 11, thereby improving the thermal stability of the first light emitting device 11.

A conductive layer 1a may be formed on the substrate 1 and the conductive layer 1a may be formed to minimize the electromigration phenomenon in which atoms of the first electrode 3 are moved by the electric field during the application of current .

The conductive layer 1a may be formed using a metal material having excellent adhesion to the substrate 1. The conductive layer 1a may include a barrier metal or a bonding metal. , Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, and Ta. However, the present invention is not limited thereto.

The conductive layer 1a may be formed by bonding different metal materials to form a plurality of layers, but is not limited thereto.

A channel layer 2 contacting the side surfaces of the first electrode 3 and the first electrode 3 may be formed on the conductive layer 1a.

At this time, the channel layer 2 may include at least one of a metal material and an insulating material. When the channel layer 2 is made of a metal material, a material having lower electric conductivity than the material constituting the first electrode 3 It is possible to prevent the power applied to the first electrode 3 from being applied to the channel layer 2.

The first electrode 3 may include at least one of a reflective layer (not shown) and a transparent electrode layer (not shown). The reflective layer and the transparent electrode layer may be formed through a co-firing process, .

The reflective layer may be formed of one or more layers selected from the group consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, .

The light-transmitting electrode layer may contain at least one of Ni, Pt, Ru, Ir, Rh, Ta, Mo, Ti, Ag, W, Cu, Cr, Pd, V, Co, Nb and Zr, And may include at least one.

A light emitting structure 7 may be formed on the channel layer 2 and the first electrode 3.

The first semiconductor layer 4 is formed of a p-type semiconductor layer, and holes can be injected into the active layer 5. For example, the first semiconductor layer 4 may be a semiconductor material having a composition formula of In _x Al _y Ga _(1-xy) N (0? X? 1, 0? _Y? 1, 0? _X + For example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN and the like, and p-type dopants such as Mg, Zn, Ca, Sr and Ba can be doped.

The active layer 5 may be formed on the first semiconductor layer 4.

The active layer 5 may be formed of a single or multiple quantum well structure, a quantum-wire structure, a quantum dot structure, or the like using a compound semiconductor material of Group 3-V group elements.

Well active layer 5 having the formula in this case formed of a quantum well structure, for _{example, In x Al y Ga 1 -x-} y N (0≤x≤1, 0 ≤y≤1, 0≤x + y≤1) Layer and a barrier layer having a composition formula of In _a Al _b Ga _{1 -a- b} N (0? A? ₁ , 0? B? ₁ , 0? A + b? 1) have. The well layer may be formed of a material having a band gap lower than the band gap of the barrier layer.

A conductive cladding layer may be formed on and / or below the active layer 5. The conductive cladding layer may be formed of an AlGaN-based semiconductor, and may have a band gap higher than that of the active layer 5.

A second semiconductor layer 6 may be formed on the active layer 5.

The second semiconductor layer 6 may be formed of an n-type semiconductor layer, for example, In _x Al _y Ga _(1-xy) N (0? X? 1, 0? _Y? for example, InAlGaN, GaN, AlGaN, InGaN, AlN, InN, AlInN or the like and may be doped with an n-type dopant such as Si, Ge or Sn.

A passivation 8 for insulating the first and second semiconductor layers 4 and 6 and the active layer 5 may be formed on the side surface of the light emitting structure 7.

The passivation 8 can prevent the insulation between the first and second semiconductor layers 4 and 6 and the active layer 5 and the corrosion caused by moisture and foreign substances flowing into the outside.

The second electrode 9 may be formed on the upper portion of the light emitting structure 7 or the second semiconductor layer 6 and the second electrode 9 may be made of the same material as the first electrode 2, It is not limited to this.

At this time, the second electrode 9 may be bonded to the second lead frame 14 and the wire w, and the first electrode 3 may be bonded to the first lead frame 13 and the bonding member 52 and may be electrically connected to the first lead frame 13.

Although the other side of the wire w connected to the second electrode 9 of the first and second light emitting devices 11 and 12 is shown as being bonded to the second and fourth regions 13b and 14b, Do not.

The first lead frame 13 exposed in the first cavity s1 has a first width w1 and the second width w2 of the second region 13b has a width w1 of 0.1 The second lead frame 14 exposed to the first cavity s1 has the third width w3 and the fourth width w4 of the fourth region 14b has the third width w2, (w3), which will be described later with reference to FIG. 2, and a detailed description thereof will be omitted.

That is, as the second and fourth widths w2 and w4 of the second and fourth regions 13b and 14b are wider, the heat generated from the first and second light emitting devices 11 and 12 can be easily diffused The first and second light emitting devices 11 and 12 may be maintained at 0.1 to 0.3 times the first and third widths w1 and w3 in order to improve the light concentration and the light uniformity.

4, the light emitting device package 100 is mounted on the upper surfaces of the second and fourth regions 13b and 14b and the insulation dam 16 with heat absorption higher than that of the first and second lead frames 13 and 14 A member 19 may be disposed.

That is, when the heat generated from the first and second light emitting devices 11 and 12 is diffused into the second cavity s2, the heat absorbing member 19 absorbs the heat to form the first and second lead frames 13 and 14 To be discharged to the outside.

The heat absorbing member 19 may have conductive and nonconductive features and may be provided on the upper surfaces of the second and fourth regions 13b and 14b and the insulating dam 16, for example, when the heat absorbing member 19 is conductive, The conductive material may be disposed on the nonconductive material after the conductive material is disposed, but is not limited thereto.

3 and 4, the first and third regions 13a and 14b in which the first and second light emitting devices 11 and 12 are disposed may be formed as an island, and thus the second and fourth regions 13b and 13b , 14b may wrap around the first and third regions 13a, 14a, but are not limited thereto.

FIG. 5 is a perspective view showing a lighting apparatus including a light emitting device package according to an embodiment, and FIG. 6 is a cross-sectional view showing an A-A cross section of the lighting apparatus shown in FIG.

In order to describe the shape of the illumination device 300 according to the embodiment in detail, the longitudinal direction Z of the illumination device 300, the horizontal direction Y perpendicular to the longitudinal direction Z, The direction Z and the horizontal direction Y and the vertical direction X perpendicular to the horizontal direction Y will be described.

6 is a cross-sectional view of the lighting apparatus 300 of FIG. 5 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. FIG.

5 and 6, the lighting device 300 may include a body 310, a cover 330 coupled to the body 310, and a finishing cap 350 positioned at opposite ends of the body 310 have.

A light emitting device array 340 is coupled to the lower surface of the body 310. The body 310 is electrically conductive so that heat generated from the light emitting device package 344 can be emitted to the outside through the upper surface of the body 310. [ And a metal material having an excellent heat dissipation effect.

The light emitting device array 340 may include a light emitting device package 344 and a substrate 342.

The light emitting device package 344 is mounted on the substrate 342 in a multi-color, multi-row manner to form an array. The light emitting device package 344 can be mounted at equal intervals or can be mounted with various distances as needed. As the substrate 342, MCPCB (Metal Core PCB) or FR4 material PCB may be used.

The cover 330 may be formed in a circular shape so as to surround the lower surface of the body 310, but is not limited thereto.

Here, the cover 330 can protect the internal light emitting device array 340 from foreign substances or the like.

The cover 330 prevents glare of light generated in the light emitting device package 344 and a prism pattern or the like may be formed on at least one of the inner and outer surfaces of the cover 330. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 330.

Meanwhile, since the light generated in the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 344 The cover 330 may be formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like.

The finishing cap 350 is located at both ends of the body 310 and can be used for sealing the power supply unit (not shown). In addition, the finishing cap 350 is provided with the power pin 352, so that the lighting device 300 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

7 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the first embodiment.

7, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410 in an edge-light manner.

The liquid crystal display panel 410 can display an image using the light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with a liquid crystal therebetween.

The color filter substrate 412 can realize the color of the image to be displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to a printed circuit board 418 on which a plurality of circuit components are mounted through a driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 includes a light emitting device array 420 for outputting light, a light guide plate 430 for converting light provided from the light emitting device array 420 into a surface light source and providing the light to the liquid crystal display panel 410, A plurality of films 450, 466 and 464 for uniforming the luminance distribution of the light provided from the light guide plate 430 and improving the vertical incidence property and a reflective sheet 430 for reflecting the light emitted to the rear of the light guide plate 430 to the light guide plate 430 447).

The light emitting device array 420 may include a PCB substrate 422 so that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 are mounted to form an array.

The backlight unit 470 includes a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410 and a prism film 450 for enhancing vertical incidence by condensing the diffused light. And may include a protective film 464 for protecting the prism film 450.

8 is an exploded perspective view of a liquid crystal display device including the light emitting device package according to the second embodiment.

However, the parts shown and described in Fig. 7 are not repeatedly described in detail.

8, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in a direct-down manner.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 6, detailed description is omitted.

The backlight unit 570 includes a plurality of light emitting element arrays 523, a reflective sheet 524, a lower chassis 530 in which the light emitting element array 523 and the reflective sheet 524 are accommodated, A plurality of optical films 560, and a diffuser plate 540 disposed on the diffuser plate 540. [

The light emitting device array 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

The reflection sheet 524 reflects light generated from the light emitting device package 522 in a direction in which the liquid crystal display panel 510 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element array 523 is incident on the diffusion plate 540 and the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the illumination device 300 and the liquid crystal display devices 400 and 500 may be included in the illumination system. In addition, the illumination device may include a light emitting device package and a device for illumination purposes.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It will be appreciated that various modifications and applications are possible without departing from the scope of the present invention. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (13)

At least two first light emitting elements and a second light emitting element; And
A first lead frame including a first region in which the first light emitting device is disposed and having a first thickness with respect to a first lower surface and a second region having a second thickness with respect to the first lower surface, And a fourth region having a fourth thickness with respect to the second bottom surface, the second region being spaced apart from the frame, the third region having a third thickness with respect to the second bottom surface, A body having a first cavity formed on the first and second lead frames; And
And an insulation dam which insulates between the first and second lead frames,
On the second and fourth regions,
A second cavity for diffusing heat generated from the first and second light emitting devices is formed,
At least a portion of the insulation dam
A second contact region on the second and fourth regions,
Wherein at least one of the insulation dam and the second,
And a heat absorbing member having a thermal conductivity higher than that of at least one of the first and second lead frames. 2. The method of claim 1,
0.1 to 0.25 times the first thickness, 0.1 to 0.25 mm,
The fourth thickness may be,
And the second thickness is equal to the second thickness. delete delete The method according to claim 1,
Wherein the second region comprises:
The second light emitting device and the wire,
Wherein the fourth region comprises:
And the light emitting device package is bonded with the first light emitting device and the wire. The method of claim 1, wherein the width of the second region
The width of the first lead frame exposed to the first cavity is 0.1 to 0.3 times the width of the first lead frame,
The width of the fourth region
The width of the second region is equal to the width of the second region,
Or 0.1 to 0.3 times the width of the second lead frame exposed in the first cavity. delete delete delete delete The method according to claim 1,
Wherein the second region comprises:
Surrounding the periphery of the first region,
Wherein the fourth region comprises:
And surrounds the periphery of the third region. The method according to claim 1,
And a resin filled in the first and second cavities,
The resin material,
And at least one of a phosphor and a light diffusing material. A lighting system comprising the light emitting device package according to any one of claims 1, 2, 5, 6, 11 and 12.

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