JP2008186948A - Optical semiconductor device, heat radiating member and package used for it, and their manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for an optical semiconductor device which efficiently radiates heat generated by the current to an LED chip, suppresses deterioration in brightness of the LED chip, decreases the number of packages of optical semiconductor devices on a board to reduce the packaging area of the optical semiconductor devices. <P>SOLUTION: The optical semiconductor device comprises: a plurality of lead frames electrically connected to a plurality of LED chips respectively; lead frame holders for holding the plurality of lead frames; and heat radiating members fixed to the lead frame holders and radiating the heat emitted from each LED chip. The heat radiating member comprises: a plurality of heat radiating pieces respectively corresponding to LED chips and radiating the heat emitted from the corresponding LED chips, and heat insulating parts provided between heat radiating pieces and integrated with the heat radiating pieces. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical semiconductor device, a heat radiation member used for the optical semiconductor device, a package for the optical semiconductor device, and a manufacturing method thereof, and more particularly, light used as various light sources such as a liquid crystal display backlight of an electronic device and illumination. The present invention relates to a semiconductor device, a heat radiation member used for the semiconductor device, a package for an optical semiconductor device, and a method for manufacturing the same. In particular, the present invention can reduce a mounting area on a substrate when obtaining a white light source, prevent a decrease in luminance of an LED (light emitting diode) chip, and has an excellent heat dissipation property, and a heat dissipation member used therefor And an optical semiconductor device package and a method of manufacturing the same.

  In recent years, optical semiconductor devices have been used as liquid crystal display backlights for electronic equipment, various light sources for illumination, and the like. In addition, improvements in semiconductor light emitting devices such as AlGaInP compound LEDs and InGaN compound LEDs have progressed, and remarkable progress has been made in achieving higher brightness and higher output. With the increase in brightness and output, the heat-generating energy of the semiconductor light-emitting element has become very large. If the heat generation energy of the semiconductor light emitting element stays, the brightness of the element will be reduced or destroyed, and therefore it is desired to dissipate heat efficiently. On the other hand, there is still a demand for reducing the mounting area of the optical semiconductor device on the substrate.

  Recently, there is an optical semiconductor device in which a metal body such as copper or aluminum excellent in heat conduction is provided as a heat radiating member in order to dissipate heat generated by a semiconductor light emitting element in the optical semiconductor device to the outside (for example, Patent Document 1). reference).

  FIG. 8 is a cross-sectional view showing a conventional optical semiconductor device.

As shown in FIG. 8, the optical semiconductor device 101 includes a first lead frame 102, a heat dissipating part 107 formed of a metal integrated molded body joined to the first lead frame 102, and 1 mounted on the heat dissipating part 107. A plurality of LED chips 103, a second lead frame 105 electrically connected to the LED chip 103 via a bonding wire 104, which is a metal wire, and the first and second lead frames 102, 105 surrounding the LED chip 103. And a synthetic resin portion 106 that holds The first and second lead frames 102 and 105, the synthetic resin portion 106, and the heat radiating portion 107 constitute an optical semiconductor device package.
JP 2004-214436 A

  In order to obtain white light, LED chips (three) for three colors of RGB (Red Green Blue) are required. However, since the heat dissipating part 107 provided in the conventional optical semiconductor device 101 is composed of a metal integrated molded body, it is often possible to mount only one LED chip. This is because LED chips often generate different amounts of heat depending on the color of light emitted. That is, when LED chips having different heat generation amounts are mounted on the heat radiation part 107 made of a metal integrated molded body, the heat generated by the LED chip having a large heat generation amount reaches the LED chip having a small heat generation amount through the heat radiation part 107, and the heat generation amount. This is to adversely affect the LED chip having a small size. When LED chips (three) for three colors of RGB are mounted on separate optical semiconductor devices 101 one by one, it is necessary to mount three optical semiconductor devices 101 on a substrate in order to obtain white light. As a result, there is a problem that the area occupied by the optical semiconductor device 101 on the substrate increases.

  In addition, there is an optical semiconductor device that emits white light by irradiating a resin material containing a phosphor with light from a blue LED chip. However, this type of optical semiconductor device has a problem that it is difficult to maintain the quality for a long period of time because the phosphor easily deteriorates due to heat generated during LED emission and light from the LED chip.

  The present invention has been made in view of such circumstances, and can efficiently dissipate heat generated by energization of the LED chip, and can suppress deterioration in luminance of the LED chip. An object of the present invention is to provide an optical semiconductor device capable of reducing the mounting area (occupied area) of the optical semiconductor device by reducing the number of mounted semiconductor devices, a heat radiation member used for the optical semiconductor device, and a package for the optical semiconductor device, and a method of manufacturing the same. To do.

The heat dissipation member according to the present invention is:
A heat radiating member capable of radiating heat generated by a plurality of LED chips,
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips;
A heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces;

  The present invention relates to a plurality of LED chips, a plurality of heat radiation pieces capable of dissipating heat generated by the corresponding LED chips, and a heat insulating portion provided between the heat radiation pieces and integrated with the heat radiation pieces. And. Therefore, the heat conducted from the LED chip to the heat radiating piece can be suppressed from being conducted to other heat radiating pieces, and the heat generated by each LED chip can be individually radiated. Therefore, each LED chip is not affected by the heat generated by the other LED chips, so that deterioration of the luminance of the LED chip can be suppressed. Thus, a plurality of LEDs having different heat generation characteristics can be mounted on one optical semiconductor device. Therefore, the mounting area of the optical semiconductor device can be reduced by reducing the number of optical semiconductor devices mounted on the substrate.

In the present invention,
It is preferable that the heat insulating part has insulating properties.

  Since the heat insulating portion has an insulating property, it is possible to prevent a short circuit in which a current passing through the LED chip flows into another LED through the heat dissipation member.

In the present invention,
Each of the heat dissipation pieces preferably has a thermal conductivity corresponding to the heat generation characteristics of the corresponding LED chip.

  Since each said heat radiating piece has the heat conductivity according to the heat generating characteristic of the said corresponding LED chip, it can thermally radiate efficiently for every LED chip.

In the present invention,
Each of the heat dissipating pieces preferably has an LED mounting surface on which the corresponding LED chip can be mounted.

  Since each said heat radiating piece has the LED mounting surface which can mount the said corresponding LED chip, an LED chip can be directly mounted in each heat radiating piece. Therefore, the heat generated by the LED chip can be efficiently radiated.

The package for an optical semiconductor device according to the present invention is:
A package for an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
A plurality of lead frames each electrically connectable to a plurality of LED chips;
A lead frame holding part for holding the plurality of lead frames;
A heat dissipating member attached to the lead frame holding portion and capable of dissipating heat generated by each of the LED chips;
The heat dissipation member is
A plurality of heat dissipation pieces corresponding to each of the LED chips and capable of dissipating heat generated by the corresponding LED chips;
A heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces;

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the heat conducted from the LED chip to the heat radiating piece is conducted to other heat radiating pieces, and the heat generated by each LED chip can be radiated individually. Therefore, each LED chip is not affected by the heat generated by the other LED chips, so that deterioration of the luminance of the LED chip can be suppressed. Thereby, a plurality of LED chips having different heat generation characteristics can be mounted on one optical semiconductor device. Therefore, the mounting area (occupied area) of the optical semiconductor device can be reduced by reducing the number of optical semiconductor devices mounted on the substrate. Further, when compared with the same area as the prior art, the number of LED chips mounted can be increased. Therefore, an optical semiconductor device with high luminance and high output can be obtained. In addition, an optical semiconductor device that emits white light can be obtained without using a fluorescent material. As a result, it is possible to solve the problem that the fluorescent material is deteriorated and the luminance is lowered due to heat and radiated light at the time of LED emission, and long-term quality maintenance of the optical semiconductor device is possible.

In the present invention,
It is preferable that the heat insulating part has an insulating property.

In the present invention,
Each of the heat dissipation pieces preferably has a thermal conductivity corresponding to the heat generation characteristics of the corresponding LED chip.

In the present invention,
Each of the heat radiation pieces preferably has an LED mounting surface on which the corresponding LED chip can be mounted.

An optical semiconductor device according to the present invention includes:
An optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
A plurality of LED chips;
A plurality of lead frames electrically connected to the plurality of LED chips,
A lead frame holding portion for holding the plurality of lead frames;
A heat dissipating member attached to the lead frame holding part and capable of dissipating heat generated by each of the LED chips;
The heat dissipation member is
Each of the LED chips corresponds to each of the plurality of heat dissipation pieces capable of dissipating heat generated by the corresponding LED chip,
A heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces;

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the heat conducted from the LED chip to the heat radiating piece is conducted to other heat radiating pieces, and the heat generated by each LED chip can be radiated individually. Therefore, each LED chip is not affected by the heat generated by the other LED chips, so that deterioration of the luminance of the LED chip can be suppressed. Thereby, a plurality of LED chips having different heat generation characteristics can be mounted on one optical semiconductor device. Therefore, the mounting area (occupied area) of the optical semiconductor device can be reduced by reducing the number of optical semiconductor devices mounted on the substrate. Further, when compared with the same area as the prior art, the number of LED chips mounted can be increased. Therefore, an optical semiconductor device with high luminance and high output can be obtained. In addition, an optical semiconductor device that emits white light can be obtained without using a fluorescent material. As a result, it is possible to solve the problem that the fluorescent material is deteriorated and the luminance is lowered due to heat and radiated light at the time of LED emission, and long-term quality maintenance of the optical semiconductor device is possible.

In the present invention,
It is preferable that the heat insulating part has insulating properties.

In the present invention,
Each of the heat dissipation pieces preferably has a thermal conductivity corresponding to the heat generation characteristics of the corresponding LED chip.

In the present invention,
Each of the heat dissipating pieces preferably has an LED mounting surface on which the corresponding LED chip can be mounted.

The manufacturing method of the heat radiating member according to the present invention is as follows:
A method of manufacturing a heat dissipation member capable of dissipating heat generated by a plurality of LED chips,
Forming a plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips;
A step of forming a heat insulating portion integrated with the heat dissipating piece between the heat dissipating pieces by performing insert molding in a state where the plurality of heat dissipating pieces are spaced apart from each other in the mold; and Is provided.

A method for manufacturing an optical semiconductor device package according to the present invention includes:
A method for manufacturing a package for an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
Forming a lead frame holding portion holding a plurality of lead frames and having a through hole; and
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips, and a heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces. And a step of inserting and fixing a heat radiating member capable of radiating heat generated by each LED chip into the through hole.

A method for manufacturing an optical semiconductor device according to the present invention includes:
A method of manufacturing an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
Forming a lead frame holding portion holding a plurality of lead frames and having a through hole; and
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips, and a heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces. A step of inserting and fixing a heat radiating member capable of radiating the heat generated by each LED chip into the through hole;
Mounting each LED chip on the corresponding heat dissipation piece;
Connecting each of the LED chips to the corresponding lead frame.

  According to the optical semiconductor device of the present invention, the heat radiation member and optical semiconductor device package used therefor, and the manufacturing method thereof, the heat generated by energization of the LED chip can be efficiently radiated and the brightness of the LED chip can be obtained. Degradation can be suppressed, and the mounting area (occupied area) of the optical semiconductor device can be reduced by reducing the number of optical semiconductor devices mounted on the substrate.

(Embodiment 1)
An optical semiconductor device according to Embodiment 1 of the present invention, and a heat radiation member and an optical semiconductor device package used therefor will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an optical semiconductor device according to the first embodiment. In FIG. 1, illustration of the LED chip and the bonding wire is omitted. 2 is a cross-sectional view of the optical semiconductor device in FIG.

  As shown in FIG. 2, the optical semiconductor device 1 according to the first embodiment is an optical semiconductor device that can dissipate heat generated by the plurality of LED chips 3. The optical semiconductor device 1 includes a plurality of LED chips 3, a plurality of lead frames 5, a lead frame holding part 2, a heat radiating member 7, and a sealing resin part (not shown). The plurality of lead frames 5, the lead frame holding portion 2, the heat radiating member 7, and the sealing resin portion constitute an optical semiconductor device package.

  The sealing resin portion is made of a synthetic resin such as a thermosetting resin filled in the opening 20 of the lead frame holding portion 2. The sealing resin portion protects the LED chip 3 and the bonding wire 4 from the external environment. The sealing resin portion can also be formed into a lens shape in order to collect the light from the LED chip 3.

  The lead frame 5 is for electrically connecting the LED chip 3 and the wiring (illustrated) on the substrate. The plurality of lead frames 5 are electrically connected to the plurality of LED chips 3, respectively. In the example shown in FIG. 2, the lead frame 5 and the LED chip 3 are connected via a metal bonding wire 4.

  The lead frame holding unit 2 holds a plurality of lead frames 5. The plurality of lead frames 5 are held by the lead frame holding unit 2 in a state of being spaced apart from each other. A hole 21 is formed in the lead frame holding part 2. The hole 21 is provided to fix the heat radiating part 7 to the lead frame holding part 2. In the example shown in FIG. 2, a through-hole penetrating between the first main surface 2 a and the second main surface 2 b (surface opposite to the first main surface 1 a) of the lead frame holding part 2 is formed. Yes. This through-hole has a small diameter from the midway part in the axial direction to the second main surface 2b. The portion where the diameter is reduced is the hole 21 described above. The insertion portion 71 of the heat dissipation member 7 is inserted and fixed in the hole portion 21. A portion from the first main surface 2 a of the lead frame holding portion 2 to the midway portion in the axial direction is a large-diameter opening 20. The opening 20 is filled with a synthetic resin (not shown) for protecting the LED chip 3 from the external environment.

  The heat radiating member 7 is attached to the lead frame holding part 2. In the example shown in FIG. 2, the heat dissipation member 7 includes a base portion 70 and an insertion portion 71 provided on one end side of the base portion 70. The insertion portion 71 is tightly inserted, that is, press-fitted into the hole portion 21 of the lead frame holding portion 2 and is attached to the lead frame holding portion 2.

3 and 4 are perspective views showing an example of the heat radiating member 7.
The heat radiating member 7 radiates heat generated by the plurality of LED chips 3. The heat radiating member 7 includes a plurality of heat radiating pieces 6 and a heat insulating portion 8. The plurality of heat radiation pieces 6 correspond to the plurality of LED chips 3, respectively, and can dissipate heat generated by the corresponding LED chips 3. The heat insulating portion 8 is provided between the plurality of heat radiating pieces 6 and integrated with the heat radiating pieces 6. The number of heat radiation pieces 6 may be the same as the number of LED chips 3, but may be larger than the number of LED chips 3.

  The material of the heat radiating piece 6 is not particularly limited as long as it has good thermal conductivity. For example, a metal such as copper, aluminum, brass, nickel, iron, stainless steel, copper alloy, and aluminum alloy is preferably used. it can. By using these metals, the heat radiation piece 6 with high heat dissipation can be configured. Note that it is possible to use other metal materials and materials other than metals such as ceramics as long as the heat dissipation is high.

  Further, the heat radiation piece 6 may have a surface plated with metal plating such as silver, palladium, gold, solder plating, alloy plating, or the like. Since the metal plating is excellent in electrical conductivity, low contact resistance, corrosion resistance, solderability, wear resistance (in the case of sliding contact), smoothness, high frequency characteristics, and light reflectivity, the reliability of the optical semiconductor device 1 is achieved. Can be improved.

  The heat radiation piece 6 can be formed, for example, by stamping or drawing a thick metal plate made of a single piece of aluminum, copper, brass, nickel, iron, stainless steel, copper alloy, or the like. The shape of the heat dissipating piece 6 is not particularly limited. For example, the heat radiating piece 6 can be formed in a columnar shape such as a columnar shape, a prismatic shape, a triangular prism shape, or a fan columnar column shape. What is necessary is just to select the shape of the thermal radiation piece 6 according to the mounting form etc. of the LED chip 3 suitably. For example, a prismatic or triangular prism shape is effective for reducing the package size. If it is a columnar shape or a fan-like columnar shape, a large mounting area of the LED chip 3 can be secured. In addition, the heat radiation piece 6 of the form which comprises the base 70 and the insertion part 71 can be formed by carrying out plastic working of metal lumps, such as a column shape and prismatic shape.

  The height H of the heat dissipating piece 6 is adjusted to an optimum value at which the heat dissipating property of the LED chip 3 becomes good in consideration of the heat generation characteristics of the LED chip 3. The area of the first main surface 6a of the heat radiating piece 6 is set to a size that allows the LED chip 3 to be mounted, and is adjusted so that the positive and negative bonding wires 4 do not contact each other.

  The heat insulation part 8 is for suppressing heat conduction between the heat radiation pieces 6. Although the material of the heat insulation part 8 will not be specifically limited if it has heat insulation, For example, a thermosetting resin, a thermoplastic resin, glass etc. can be used. Further, the material of the heat insulating portion 8 preferably has an insulating property in order to prevent a short circuit from occurring between the adjacent heat radiation pieces 6 and 6.

  Examples of such heat insulating and insulating materials include epoxy resins, phenol resins, unsaturated polyester resins, urea resins, melamine resins, diallyl phthalate resins, acrylic resins, polyimide resins, polyurethane resins, silicone resins, etc. At least any one of thermosetting resins can be used. The thermosetting resin may be mixed with at least one of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, and a light shielding material. A thermoplastic resin may be used as the material having heat insulating properties and insulating properties. Examples of thermoplastic resins include aromatic nylon resins, polyphthalamide resins (PPA), sulfone resins, polyamideimide resins (PAI), polyketone resins (PK), polycarbonate resins, polyphenylene sulfide (PPS), and liquid crystal polymers. Thermoplastic resins such as (LCP), ABS resin, and PBT resin can be used. In addition, you may use what contained glass fiber and a mineral filler in these thermoplastic resins.

  5 and 6 each show an example of the shape of the first main surface of the heat radiating piece. The shape of the first main surface of the heat radiating piece may be a flat surface (first main surface 6a) as shown in FIG. 2, or may be a concave shape (first main surface 60a) as shown in FIG. Alternatively, it may have a convex shape (first main surface 61a) as shown in FIG. In the case of the concave first main surface 60a, the LED chip 3 is mounted in the concave portion as shown in FIG. In this case, the light from the LED chip 3 can be reflected by the side wall surface of the recess, and the light emission efficiency of the optical semiconductor device 1 can be improved. On the other hand, when the first main surface 61a has a convex shape, the LED chip 3 is mounted on the convex portion as shown in FIG. In this case, when a coating material for suppressing deterioration of the lead frame holding part 2 due to light and heat generated from the LED chip 3 is applied to the inner wall surface of the opening 20 of the lead frame holding part 2, the coating material is applied. Can be prevented from flowing into the bonding surface of the LED chip 3 and the bonding wire 4.

  According to the optical semiconductor device 1 and the heat radiation member 7 and the optical semiconductor device package used therefor according to the first embodiment, the heat generated by energizing the LED chip 3 is efficiently transmitted through the heat radiation piece 6 corresponding to the LED chip 3. It can dissipate heat well. In addition, since the heat generated by the LED chip 3 is difficult to conduct to the other LED chips 3, it is possible to suppress the deterioration of the luminance of the LED chip 3. As a result, a plurality of LED chips 3 can be mounted on one optical semiconductor device 1, and the number of optical semiconductor devices 1 mounted on a substrate (not shown) is reduced to reduce the mounting area of the optical semiconductor device 1 ( (Occupied area) can be reduced.

  Hereinafter, a method for manufacturing the optical semiconductor device 1 according to the first embodiment, the heat radiating member 7 used therein, and the package for the optical semiconductor device will be described.

7A to 7C are cross-sectional views sequentially showing the process flow of the method for manufacturing the heat radiating member 7.
The manufacturing method of the heat radiating member 7 according to Embodiment 1 is a method of manufacturing a heat radiating member capable of radiating heat generated by the plurality of LED chips 3. The manufacturing method of the heat radiating member 7 includes a step of forming a plurality of heat radiating pieces 6 and a step of forming a heat insulating portion 8 integrated with the heat radiating pieces 6.

  In the step of forming a plurality of heat radiation pieces 6, a plurality of heat radiation pieces 6 corresponding to the plurality of LED chips 3 (see FIG. 2) and capable of radiating the heat generated by the corresponding LED chips 3 are formed.

  In the step of forming the heat insulating portion 8, insert molding is performed in a state where a plurality of heat dissipating pieces 6 are arranged in the mold 12 with a space between each other, so that the heat dissipating pieces 6 and An integrated heat insulating portion 8 is formed.

The manufacturing method of the heat radiating member 7 will be described in more detail.
First, as shown in FIG. 7 (a), for example, a single plate of aluminum, copper, brass, nickel, iron, stainless steel, copper alloy, or the like is punched, drawn, or cylindrical or prismatic. A plurality of heat radiation pieces 6 are formed by a known processing method such as plastic processing of a metal lump. The number of heat radiation pieces 6 may be the same as the number of LED chips 3 or may be larger than the number of LED chips 3. Thereby, one LED chip 3 can be reliably mounted on each heat radiating piece 6.

  The height of the heat radiating piece 6 is adjusted to an optimal size in order to improve the heat dissipation of the heat generated by the LED chip 3 in consideration of the heat generation characteristics of the LED chip 3. Moreover, the area of the 1st main surface 6a (refer FIG. 2) of the heat radiating piece 6 is made into the magnitude | size of the LED chip 3 mounted, and is adjusted so that the positive / negative bonding wire 4 may not contact. The 2nd main surface 6b (surface located in the other side of the 1st main surface 6a) of the thermal radiation piece 6 is a thermal radiation surface. The area of the second main surface 6b is preferably set larger than the area of the first main surface 6a in order to increase the heat dissipation efficiency (see FIG. 2).

  The material of the heat dissipating piece 6 is not particularly limited as long as it has a high heat dissipation property. For example, a metal such as copper, aluminum, brass, nickel, iron, stainless steel, copper alloy, and aluminum alloy is used. it can. Since these metals have high heat dissipation properties, the heat dissipation properties can be improved. The material of the heat radiating piece 6 may be a material other than metal, such as other metal materials or ceramics, as long as it has high heat dissipation.

  Further, the surface of the heat dissipation piece 6 may be subjected to metal plating such as silver, palladium, gold, solder plating, alloy plating, or the like.

  Next, as shown in FIG. 7B, each heat dissipating piece 6 is sandwiched and fixed between an upper mold 12a and a lower mold 12b of a pair of upper and lower molding molds 12 having cavities. At this time, a gap for forming the heat insulating portion 8 is provided between the heat radiating pieces 6.

  Next, as shown in FIG. 7C, a thermosetting resin is poured into the cavity by a transfer molding process. In the transfer molding process, a tablet-like thermosetting resin is placed in a container (not shown) connected to the cavity. When pressure is applied to the thermosetting resin in the container, the molten thermosetting resin flows into the cavity. The upper mold 12a and the lower mold 12b are heated to a predetermined temperature, and the poured thermosetting resin is cured. Thereby, the heat insulation part 8 is formed between the several heat radiating piece 6, and the heat radiating member 7 in which each heat radiating piece 6 and the heat insulating part 8 were integrated can be formed.

  Although the kind of thermosetting resin used here is not particularly limited, for example, epoxy resin, phenol resin, unsaturated polyester resin, urea resin, melamine resin, diallyl phthalate resin, acrylic resin, polyimide resin, At least one or more of thermosetting resins such as polyurethane resin and silicon resin can be selected. The thermosetting resin may be mixed with at least one of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, and a light shielding material.

  The heat dissipating piece 6 can also be configured using a thermoplastic resin, glass, or the like. The type of thermoplastic resin used is not particularly limited. For example, aromatic nylon resin, polyphthalamide resin (PPA), sulfone resin, polyamideimide resin (PAI), polyketone resin (PK) Polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, PBT resin, and the like can be used. In addition, you may use what added glass fiber and the mineral filler to the thermoplastic resin.

  According to the method for manufacturing the heat radiating member 7, it is possible to manufacture the heat radiating member 7 that efficiently radiates heat generated by energization of the LED chip 3 through the corresponding heat radiating pieces 6. Moreover, since the heat generated by the LED chip 3 is difficult to be conducted to the other LED chips 3, the heat dissipating member 7 that suppresses the deterioration of the luminance of the LED chip 3 can be manufactured. As a result, a plurality of LED chips 3 can be mounted on one optical semiconductor device 1, and the number of optical semiconductor devices 1 mounted on a substrate (not shown) is reduced to reduce the mounting area of the optical semiconductor device 1 ( (Occupied area) can be reduced.

Next, a method for manufacturing the optical semiconductor device 1 according to the first embodiment will be described with reference to FIG.
The manufacturing method of the optical semiconductor device 1 is a manufacturing method of an optical semiconductor device capable of dissipating heat generated by the plurality of LED chips 3. The manufacturing method includes a step of forming the lead frame holding portion 2, a step of fixing the heat radiating member 7 to the lead frame holding portion 2, a step of mounting each LED chip 3 on the corresponding heat radiating piece 6, and each LED. A step of connecting the chip 3 to the corresponding lead frame 5 respectively.
The manufacturing method of the package for an optical semiconductor device that is a part of the optical semiconductor device 1 includes a step of forming the lead frame holding portion 2 and a step of fixing the heat radiating member 7 to the lead frame holding portion 2. .

  In the step of forming the lead frame holding part 2, the lead frame holding part 2 in which a plurality of lead frames 5 are held at intervals and a hole (through hole) 9 is formed is formed. The diameter of the hole portion 21 is preferably set so that the insertion portion 71 of the heat radiating member 7 can be press-fitted.

  The lead frame holding unit 2 has a portion (opening 20) surrounding the periphery of the LED chip 3. In order to efficiently reflect the light emitted from the LED chip 3, a white synthetic resin having a high reflectance can be suitably used for the lead frame holding unit 2. Moreover, in order to irradiate light efficiently ahead, the opening part 20 of the lead frame holding | maintenance part 2 can be shape | molded, for example in the shape of an inverted truncated cone shape and an inverted square frustum shape whose diameter becomes large as it goes to a front-end | tip. . The color tone of the synthetic resin used for the lead frame holding unit 2 is not particularly limited, and for example, transparent, white turbidity, black, etc. can be applied.

  The lead frame holding part 2 can be formed by insert molding, for example. Examples of the thermoplastic resin used include aromatic nylon resin, polyphthalamide resin (PPA), sulfone resin, polyamideimide resin (PAI), polyketone resin (PK), polycarbonate resin, polyphenylene sulfide (PPS), A liquid crystal polymer (LCP), ABS resin, PBT resin, or the like can be used. In addition, you may use what contained glass fiber and a mineral filler in these thermoplastic resins. By containing glass fiber or the like, the lead frame holding part 2 having high strength can be formed.

  In order to protect the bonding wire 4 and the LED chip 3 from the external environment, the bonding wire 4 and the LED chip 3 are sealed with a translucent sealing resin (not shown) made of epoxy resin or silicon resin. It is preferable. The sealing resin portion can be formed by filling the opening 20 of the lead frame holding portion 2 with a thermosetting resin such as an epoxy resin or a silicon resin. The thermosetting resin is mainly cast by a potting method, and a transparent or milky white resin is used. The sealing resin portion can be molded by transfer molding other than the potting method, injection molding, or the like. The sealing resin portion can have an arbitrary shape such as a lens shape so that light from the LED chip 3 can be collected.

  In the step of fixing the heat radiating member 7 to the lead frame holding part 2, the heat radiating member 7 capable of radiating the heat generated by each LED chip 3 is inserted into the hole 21 of the lead frame holding part 2 and fixed. The heat dissipating member 7 corresponds to each of the plurality of LED chips 3, a plurality of heat dissipating pieces 6 that can dissipate heat generated by the corresponding LED chip 3, and the heat dissipating pieces 6 provided between the heat dissipating pieces 6. The heat insulating part 8 integrated is included. The manufacturing method of the heat dissipation member 7 is as described above.

The material of the lead frame 1 is not particularly limited, but generally an iron-based or copper-based alloy is preferable. The surface of the lead frame 5 is preferably metal-plated with silver, nickel, gold, palladium, or the like. These metal platings are excellent in electrical conductivity, low contact resistance, corrosion resistance, solderability, wear resistance (in the case of sliding contacts), smoothness, high frequency characteristics, and light reflectivity. Each metal plating can be appropriately selected according to the characteristics required for the LED chip 3. The lead frame 5 can be formed by a known processing technique such as punching with a progressive die.
The optical semiconductor device 1 can be formed through the above steps.

  INDUSTRIAL APPLICABILITY The optical semiconductor device according to the present invention, the heat radiation member and the optical semiconductor device package used therefor, and the manufacturing method thereof are used for the optical semiconductor device particularly required to reduce the mounting area on the substrate with high luminance. It is useful for a heat dissipation member, a package for an optical semiconductor device, a manufacturing method thereof, and the like.

The perspective view which shows the object for optical semiconductor devices which concerns on Embodiment 1 of this invention AA line sectional view of the optical semiconductor device shown in FIG. The perspective view which shows an example of the thermal radiation member which concerns on Embodiment 1 of this invention The perspective view which shows an example of the thermal radiation member which concerns on Embodiment 1 of this invention Sectional drawing which shows an example of the optical semiconductor device which concerns on Embodiment 1 of this invention Sectional drawing which shows an example of the optical semiconductor device which concerns on Embodiment 1 of this invention It is a figure which shows the manufacturing method of the thermal radiation member which concerns on Embodiment 1 of this invention, and is sectional drawing which shows the process progressed in order of (a), (b), (c) Sectional view showing a conventional optical semiconductor device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical semiconductor device 2 Lead frame holding part 3 LED chip 4 Bonding wire 5 Lead frame 6 Heat radiation piece 7 Heat radiation member 8 Heat insulation part 20 Opening part 21 Hole part (through-hole)

Claims (15)

A heat radiating member capable of radiating heat generated by a plurality of LED chips,
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips;
A heat dissipating member provided between each of the heat dissipating pieces and provided with a heat insulating part integrated with the heat dissipating piece.   The heat radiating member according to claim 1, wherein the heat insulating portion has insulating properties.   The heat radiating member according to claim 1, wherein each of the heat radiating pieces has a thermal conductivity corresponding to a heat generation characteristic of the corresponding LED chip.   The heat radiating member according to claim 1, wherein each of the heat radiating pieces has an LED mounting surface on which the corresponding LED chip can be mounted. A package for an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
A plurality of lead frames each electrically connectable to a plurality of LED chips;
A lead frame holding part for holding the plurality of lead frames;
A heat dissipating member attached to the lead frame holding portion and capable of dissipating heat generated by each of the LED chips;
The heat dissipation member is
A plurality of heat dissipation pieces corresponding to each of the LED chips and capable of dissipating heat generated by the corresponding LED chips;
The package for optical semiconductor devices provided with the heat insulation part provided between each said heat radiation piece, and the said heat radiation piece.   The package for an optical semiconductor device according to claim 5, wherein the heat insulating portion has an insulating property.   6. The optical semiconductor device package according to claim 5, wherein each of the heat dissipating pieces has a thermal conductivity corresponding to a heat generation characteristic of the corresponding LED chip.   6. The optical semiconductor device package according to claim 5, wherein each of the heat dissipating pieces has an LED mounting surface on which the corresponding LED chip can be mounted. An optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
A plurality of LED chips;
A plurality of lead frames each electrically connected to the plurality of LED chips;
A lead frame holding part for holding the plurality of lead frames;
A heat dissipating member attached to the lead frame holding portion and capable of dissipating heat generated by each of the LED chips;
The heat dissipation member is
A plurality of heat dissipation pieces corresponding to each of the LED chips and capable of dissipating heat generated by the corresponding LED chips;
An optical semiconductor device comprising: a heat insulating portion provided between the heat radiating pieces and integrated with the heat radiating pieces.   The optical semiconductor device according to claim 9, wherein the heat insulating portion has insulating properties.   The optical semiconductor device according to claim 9, wherein each of the heat dissipating pieces has a thermal conductivity corresponding to a heat generation characteristic of the corresponding LED chip.   The optical semiconductor device according to claim 9, wherein each of the heat dissipating pieces has an LED mounting surface on which the corresponding LED chip can be mounted. A method of manufacturing a heat dissipation member capable of dissipating heat generated by a plurality of LED chips,
Forming a plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips;
Forming a heat insulating portion integrated with the heat dissipating piece between the heat dissipating pieces by performing insert molding in a state in which the plurality of heat dissipating pieces are spaced apart from each other in the mold; and The manufacturing method of the heat radiating member provided with. A method for manufacturing a package for an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
Forming a lead frame holding portion holding a plurality of lead frames and having a through hole; and
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips, and a heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces. And a step of inserting and fixing a heat dissipating member capable of dissipating heat generated by each LED chip into the through hole. A method of manufacturing an optical semiconductor device capable of dissipating heat generated by a plurality of LED chips,
Forming a lead frame holding portion holding a plurality of lead frames and having a through hole; and
A plurality of heat dissipating pieces each corresponding to a plurality of LED chips and capable of dissipating heat generated by the corresponding LED chips, and a heat insulating portion provided between the heat dissipating pieces and integrated with the heat dissipating pieces. A step of inserting and fixing a heat radiating member capable of radiating heat generated by each LED chip into the through hole;
Mounting each LED chip on the corresponding heat dissipation piece;
And a step of connecting each of the LED chips to the corresponding lead frame.

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