KR101949316B1 - 저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름 - Google Patents

저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름 Download PDF

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KR101949316B1
KR101949316B1 KR1020180019367A KR20180019367A KR101949316B1 KR 101949316 B1 KR101949316 B1 KR 101949316B1 KR 1020180019367 A KR1020180019367 A KR 1020180019367A KR 20180019367 A KR20180019367 A KR 20180019367A KR 101949316 B1 KR101949316 B1 KR 101949316B1
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South Korea
Prior art keywords
polyamic acid
mol
polyimide film
viscosity
dianhydride
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KR1020180019367A
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English (en)
Korean (ko)
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황인환
김주영
이익상
임현재
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에스케이씨코오롱피아이 주식회사
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Priority to KR1020180019367A priority Critical patent/KR101949316B1/ko
Priority to PCT/KR2018/012258 priority patent/WO2019160218A1/fr
Priority to TW108101287A priority patent/TWI714944B/zh
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Publication of KR101949316B1 publication Critical patent/KR101949316B1/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/05Alcohols; Metal alcoholates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020180019367A 2018-02-19 2018-02-19 저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름 KR101949316B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180019367A KR101949316B1 (ko) 2018-02-19 2018-02-19 저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름
PCT/KR2018/012258 WO2019160218A1 (fr) 2018-02-19 2018-10-17 Composition d'acide polyamique ayant une stabilité au stockage améliorée, procédé de fabrication de film de polyimide l'utilisant, et film de polyimide fabriqué au moyen de celle-ci
TW108101287A TWI714944B (zh) 2018-02-19 2019-01-14 具改良儲存穩定性的聚醯胺酸組成物、使用其製備聚醯亞胺膜之方法、以其所製備的聚醯亞胺膜以及電子裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180019367A KR101949316B1 (ko) 2018-02-19 2018-02-19 저장 안정성이 향상된 폴리아믹산 조성물, 이를 이용한 폴리이미드 필름의 제조방법 및 이로 제조된 폴리이미드 필름

Publications (1)

Publication Number Publication Date
KR101949316B1 true KR101949316B1 (ko) 2019-02-18

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Country Status (3)

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KR (1) KR101949316B1 (fr)
TW (1) TWI714944B (fr)
WO (1) WO2019160218A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102097406B1 (ko) * 2019-05-10 2020-04-07 에스케이씨코오롱피아이 주식회사 폴리이미드 전구체 조성물, 이의 제조 방법 및 폴리이미드
KR102125686B1 (ko) * 2019-05-24 2020-06-23 피아이첨단소재 주식회사 폴리아믹산 조성물, 및 이의 제조 방법
WO2020141708A1 (fr) * 2018-12-31 2020-07-09 피아이첨단소재 주식회사 Composition d'acide polyamique et son procédé de préparation
EP4368662A1 (fr) * 2022-11-14 2024-05-15 SK microworks Co., Ltd. Film à base de polyamide-imide, son procédé de préparation, et fenêtre de couverture et dispositif d'affichage le comprenant

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114805806B (zh) * 2022-05-10 2024-04-02 上海华谊三爱富新材料有限公司 降低聚酰胺酸溶液粘度的方法和聚酰亚胺膜的制备方法

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Publication number Priority date Publication date Assignee Title
JP2004079415A (ja) * 2002-08-21 2004-03-11 Ube Ind Ltd ポリイミドシロキサン系絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法
JP2011242676A (ja) * 2010-05-20 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置

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JP2012150503A (ja) * 2006-06-29 2012-08-09 Jnc Corp 液晶配向膜用組成物、液晶配向膜および液晶表示素子
KR101811479B1 (ko) * 2010-09-28 2017-12-21 도레이 카부시키가이샤 수지 조성물 및 그의 제조 방법
KR101729177B1 (ko) * 2011-12-14 2017-05-11 한국전자통신연구원 유무기 하이브리드 폴리아믹 에스테르, 이의 제조 방법 및 이의 필름 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079415A (ja) * 2002-08-21 2004-03-11 Ube Ind Ltd ポリイミドシロキサン系絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法
JP2011242676A (ja) * 2010-05-20 2011-12-01 Asahi Kasei E-Materials Corp 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020141708A1 (fr) * 2018-12-31 2020-07-09 피아이첨단소재 주식회사 Composition d'acide polyamique et son procédé de préparation
KR102097406B1 (ko) * 2019-05-10 2020-04-07 에스케이씨코오롱피아이 주식회사 폴리이미드 전구체 조성물, 이의 제조 방법 및 폴리이미드
WO2020230966A1 (fr) * 2019-05-10 2020-11-19 피아이첨단소재 주식회사 Composition de précurseur de polyimide, son procédé de préparation et polyimide
KR102125686B1 (ko) * 2019-05-24 2020-06-23 피아이첨단소재 주식회사 폴리아믹산 조성물, 및 이의 제조 방법
EP4368662A1 (fr) * 2022-11-14 2024-05-15 SK microworks Co., Ltd. Film à base de polyamide-imide, son procédé de préparation, et fenêtre de couverture et dispositif d'affichage le comprenant

Also Published As

Publication number Publication date
TWI714944B (zh) 2021-01-01
TW201934613A (zh) 2019-09-01
WO2019160218A1 (fr) 2019-08-22

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