KR101944128B1 - 센서 칩을 테스트하기 위한 장치를 포함하는 센서 칩을 제조하는 방법 - Google Patents

센서 칩을 테스트하기 위한 장치를 포함하는 센서 칩을 제조하는 방법 Download PDF

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KR101944128B1
KR101944128B1 KR1020137022245A KR20137022245A KR101944128B1 KR 101944128 B1 KR101944128 B1 KR 101944128B1 KR 1020137022245 A KR1020137022245 A KR 1020137022245A KR 20137022245 A KR20137022245 A KR 20137022245A KR 101944128 B1 KR101944128 B1 KR 101944128B1
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wafer
substrate
chuck
spacer
sensor
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KR20140006908A (ko
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마르쿠스 그라프
마티아스 스트레이프
베르너 훈지커
크리스토프 쉬안즈
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센시리온 에이지
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G1/00—Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators; General aspects or details, e.g. selection emphasis on particular characters, dashed line or dotted line generation; Preprocessing of data
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Pressure Sensors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measuring Fluid Pressure (AREA)
KR1020137022245A 2011-01-27 2012-01-26 센서 칩을 테스트하기 위한 장치를 포함하는 센서 칩을 제조하는 방법 Active KR101944128B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11000640.0A EP2481703B1 (en) 2011-01-27 2011-01-27 Sensor protection
EP11000640.0 2011-01-27
PCT/CH2012/000020 WO2012100361A2 (en) 2011-01-27 2012-01-26 Sensor protection

Publications (2)

Publication Number Publication Date
KR20140006908A KR20140006908A (ko) 2014-01-16
KR101944128B1 true KR101944128B1 (ko) 2019-01-30

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KR1020137022245A Active KR101944128B1 (ko) 2011-01-27 2012-01-26 센서 칩을 테스트하기 위한 장치를 포함하는 센서 칩을 제조하는 방법

Country Status (5)

Country Link
US (1) US9366720B2 (https=)
EP (3) EP2481703B1 (https=)
JP (1) JP6038048B2 (https=)
KR (1) KR101944128B1 (https=)
WO (3) WO2012100360A1 (https=)

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EP2731129A1 (en) * 2012-11-07 2014-05-14 ams AG Molded semiconductor sensor device and method of producing the same at a wafer-level
EP2762882B1 (en) 2013-01-31 2020-11-25 Sensirion AG Portable electronic device with ketone sensor
EP2762865A1 (en) * 2013-01-31 2014-08-06 Sensirion Holding AG Chemical sensor and method for manufacturing such a chemical sensor
EP2762870A1 (en) * 2013-01-31 2014-08-06 Sensirion AG Sensor arrangement and portable electronic device with such a sensor arrangement
EP2763381B1 (en) 2013-01-31 2017-04-05 Sensirion AG Portable electronic device with chemical sensor
EP2762880B1 (en) 2013-01-31 2017-03-15 Sensirion AG Portable electronic device with breath analyzer
EP2762869B1 (en) 2013-01-31 2016-11-16 Sensirion AG Integrated metal oxide chemical sensor
EP2801819A1 (en) 2013-05-08 2014-11-12 Sensirion AG Metal oxide chemical sensor for portable device
EP2808675A1 (en) 2013-05-31 2014-12-03 Sensirion AG Integrated metal oxide chemical sensor
DE202013102632U1 (de) * 2013-06-19 2013-12-20 Sensirion Ag Sensorbaustein
EP2816352B1 (en) 2013-06-21 2016-12-28 Sensirion AG Concentration measurements with a mobile device
EP2833127A1 (en) 2013-07-30 2015-02-04 Sensirion AG Integrated resistive-type sensor array arrangement, each sensor comprising a sensitive metal oxide layer each having a different length between the electrodes
EP2833128A1 (en) 2013-07-30 2015-02-04 Sensirion AG Integrated metal oxide chemical sensor
EP2871152B1 (en) 2013-11-06 2017-05-24 Sensirion AG Sensor device
EP2946722A1 (en) 2014-05-20 2015-11-25 Sensirion AG Portable electronic device for breath sampling
EP3001186B1 (en) * 2014-09-26 2018-06-06 Sensirion AG Sensor chip
WO2016088099A1 (en) * 2014-12-05 2016-06-09 Lfoundry S.R.L. Cmos process for manufacturing an integrated gas sensor and corresponding cmos integrated gas sensor
EP3032227B1 (en) 2014-12-08 2020-10-21 Sensirion AG Flow sensor package
WO2016204525A1 (ko) * 2015-06-19 2016-12-22 엘지전자(주) 터치 패널 및 표시 장치
CN109791117B (zh) 2016-09-21 2022-09-20 盛思锐股份公司 气体传感器
JP6917843B2 (ja) * 2016-10-13 2021-08-11 理研計器株式会社 ガスセンサ
US20180196022A1 (en) * 2017-01-12 2018-07-12 Integrated Device Technology, Inc. Gas sensor
KR20190035989A (ko) 2017-09-25 2019-04-04 (주)센텍코리아 가스 센서 패키지
US10727216B1 (en) 2019-05-10 2020-07-28 Sandisk Technologies Llc Method for removing a bulk substrate from a bonded assembly of wafers

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Also Published As

Publication number Publication date
EP2668131A2 (en) 2013-12-04
JP2014508288A (ja) 2014-04-03
EP2668130A1 (en) 2013-12-04
EP2481703B1 (en) 2020-07-01
WO2012100360A1 (en) 2012-08-02
WO2012100361A2 (en) 2012-08-02
KR20140006908A (ko) 2014-01-16
US20140028340A1 (en) 2014-01-30
WO2012100362A1 (en) 2012-08-02
EP2481703A1 (en) 2012-08-01
US9366720B2 (en) 2016-06-14
WO2012100361A3 (en) 2012-11-15
JP6038048B2 (ja) 2016-12-07

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