KR101936677B1 - Tray for Measuring, Driving Method of the Tray for Measuring, Deposition Appratus having a Tray for Measuring and Measuring Method of the same - Google Patents

Abstract

An embodiment of the present invention includes a support frame; A base plate installed in the support frame and having a plurality of slits; A shutter plate located on one side of the base plate and having an exposed portion and a blocking portion; A motor portion for moving the shutter plate so that the exposed portion of the shutter plate is moved; And a driving unit for controlling the motor unit.

Description

Technical Field [0001] The present invention relates to a deposition apparatus having a measurement tray, a method of driving the same, a deposition apparatus having a measurement tray, and a measurement method using the deposition tray.

An embodiment of the present invention relates to a measuring tray, a driving method thereof, a deposition apparatus having a measuring tray, and a measuring method using the same.

As the information technology is developed, the market of display devices, which is a connection medium between users and information, is getting larger. Accordingly, an organic light emitting display (OLED), an electrophoretic display (EPD), a liquid crystal display (LCD), and a plasma display panel (PDP) And the like are increasing.

Some of the above-described display devices are formed by depositing an organic thin film or a metal thin film on a substrate by heating a source disposed in the deposition apparatus or the like. The deposition apparatus includes a loader portion for loading a substrate, a deposition portion for performing deposition for forming a thin film, a measurement portion for measuring the thickness of the thin film, and the like.

When a display device is manufactured by depositing a thin film on a substrate using a deposition apparatus, the thickness of the thin film and the like should be analyzed and the deposition process should be corrected based on the thickness. However, the conventional vapor deposition apparatus has a structure in which the vapor deposition section and the measurement section are separated. Therefore, when a conventional evaporation apparatus is used, an operator must manually move a substrate having a thin film formed thereon to a measuring unit, and perform measurements for analyzing the thickness of the thin film by using an ellipsometer or the like in a standby state.

Therefore, in the conventional evaporation apparatus, it takes a lot of time for the operator to manually move the substrate and measure the thickness of the thin film, etc., based on the installation conditions of the measurement unit separated from the deposition unit. In addition, the conventional deposition apparatus is not only difficult to measure the thickness of the thin film during mass production based on the above-mentioned equipment conditions, but also realizes difficulty in real-time measurement and causes problems such as lowered reliability of measured data due to the manual operation of the operator, Improvement is required.

In order to solve the problems of the background art described above, the present invention separates a thin film on a single substrate through each unit layer, and automates a measurement process such as thickness of a thin film to reduce the time required for measurement, And to improve the reliability of the measured data.

According to an embodiment of the present invention, A base plate installed in the support frame and having a plurality of slits; A shutter plate located on one side of the base plate and having an exposed portion and a blocking portion; A motor portion for moving the shutter plate so that the exposed portion of the shutter plate is moved; And a driving unit for controlling the motor unit.

The shutter plate may expose at least one slit row of the slits of the base plate and block the other.

The driving unit can control the motor unit so that the exposed portion of the shutter plate moves at least one space in correspondence with the control signal formed by the operation of the sensing unit provided in the support frame.

The shutter plate is supported by a guide formed on the base plate. The shutter plate exposes at least one slit row of the slits of the base plate corresponding to the rotational force of the motor unit formed on the base plate, and blocks the rest.

The support frame includes a first unit housing portion for housing the first unit including the base plate, the shutter plate and the motor portion, and a second unit housing portion for housing the second unit including the driving portion for driving the motor portion for moving the shutter plate. And a third unit housing portion for housing the third unit including the base plate, the shutter plate, and the motor portion.

The first unit and the third unit include one base plate including a plurality of slits divided into one side and the other side, and a pair of slits formed on one side of the base plate and slits formed on the other side of the base plate. A pair of shutter plates, and a pair of motor portions for separately driving the exposed portions of the pair of shutter plates.

The support frame includes a battery unit that supplies power to at least one of the first to third units, and a battery cover unit that protects the battery unit. The battery unit and the battery cover unit may be attached to the lower outer space of the support frame.

According to another aspect of the present invention, there is provided a method of manufacturing a measuring apparatus, comprising: recognizing a starting position of a measuring tray when a measuring tray is brought into a deposition chamber; Turning on the motor driving unit after the starting position is recognized; Recognizing whether the current position is a first layer using a switch or a sensor installed in the measurement tray; Driving the shutter plate to move the exposed portion and the blocking portion of the shutter plate of the measurement tray when it is determined that the current position of the measurement tray is the first layer; Recognizing a next layer of the measurement tray; Determining whether the current position of the measurement tray is the end position; Returning to the step of driving the shutter plate if the current position of the measurement tray is not the end position; If the current position of the measurement tray is the end position, returning the shutter plate to the home position and switching the motor driving unit to the sleep mode.

According to another aspect of the present invention, there is provided a plasma display apparatus comprising: a loader section for arranging a substrate according to a shape and loading one of substrates arranged; A tray rack master unit for placing a measurement tray in order of a substrate type and loading one of the arranged measurement trays; An alignment portion aligning the substrate and the measurement tray; A deposition unit for depositing a thin film on a substrate exposed through a slit of the base plate included in the measurement tray and an exposure area of the shutter plate; A separation unit for separating the substrate from the measurement tray when the deposition by the deposition unit is completed; And a measurement section for measuring a thin film formed on the substrate.

The measuring tray includes a support frame, a base plate provided on the support frame and having a plurality of slits, a shutter plate positioned on one side of the base plate and having an exposed portion and a blocking portion, And a driving unit for controlling the motor unit.

The support frame houses a second unit including a first unit housing part for housing a first unit including a base plate, a shutter plate and a motor part, and a driving part for driving a motor part for moving the shutter part and the exposed part of the shutter plate And a third unit housing portion for housing the third unit including the base plate, the shutter plate, and the motor portion.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: Loading a tray for measurement in the tray rack master in the order of the substrate type; Loading a substrate; Aligning the substrate and the measurement tray; Moving the aligned substrate and the measurement tray to a deposition unit and depositing the layer by layer; And separating the aligned substrate from the measuring tray, and moving the substrate to the measuring section and performing measurement. The present invention also provides a measuring method using a deposition apparatus having a measuring tray.

The present invention has the effect of separating a thin film on a single substrate through each unit layer by driving a shutter plate of a measuring tray located under the substrate. Further, since the thin film is formed separately on the substrate through the measurement tray, the present invention can reduce the time required for the measurement by automating the measurement process such as the thickness of the thin film. In addition, since the present invention can automate the measuring process such as the thickness of a thin film in a vapor deposition apparatus, real time measurement is easy and reliability of measured data can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a deposition apparatus according to an embodiment of the present invention; FIG.
2 is a flow chart showing a method of measuring a thickness of a thin film using a measuring tray.
3 is a diagram illustrating a process of forming an organic thin film using a measurement tray.
4 is a diagram of the operation of the measuring tray and the source portion.
5 illustrates the operation of the shutter plate of the measuring tray shown in Fig.
6 is a view schematically showing a configuration of a measurement tray;
7 is a view showing slits formed in the first unit and the third unit.
8 is a diagram specifically showing the EA1 area and the EA2 area in Fig. 6; Fig.
9 is a view for explaining a switch installed on an upper portion of a measurement tray;
10 is a view for explaining a sensor, a pipe, a battery, and a battery cover provided in a lower portion of a measurement tray.
11 is a cross-sectional view showing a switch and a sensor provided in the measurement tray.
Figs. 12 and 13 are views showing another example of a switch and a sensor provided in a measurement tray; Fig.
14 is a flowchart for explaining a control method of the measurement tray.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic structural view of a deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a flowchart illustrating a method of measuring a thickness of a thin film using a measurement tray.

1, a deposition apparatus according to an embodiment of the present invention includes a loader unit 10, a first aligning unit 30, a first tray rack master 40, a first deposition unit 50, The first separating portion 60, the second aligning portion 35, the second tray rack master 45, the second depositing portion 55, the second separating portion 65, the measuring portion 80, (90).

The loader section 10 arranges the substrates according to their types and loads one of the substrates arranged. The loader section 10 may be cleaned before placing or loading the substrate. The substrate loaded by the loader unit 10 is taken out of the loader unit 10 and the carried out substrate is carried into the first aligning unit 30. [

The first aligning portion 30 aligns the measurement tray (TRY) loaded through the loader unit (10) and the substrate (GLS) loaded through the first tray rack master (40). The first aligning portion 30 aligns the substrate GLS on the measuring tray TRY. The aligned substrate GLS and the measuring tray TRY are taken out of the first aligning portion 30 and the carried out substrate GLS and the measuring tray TRY are brought into the first deposition portion 50.

The first tray rack master 40 arranges the measuring tray TRY in accordance with the order of the substrates arranged in the loader unit 10 and loads one of the arranged measuring trays TRY to be loaded and unloaded. The measurement tray (TRY) taken out from the first tray rack master (40) is carried into the first aligning portion (30).

The first deposition unit 50 forms an organic thin film on the substrate GLS using the measuring tray TRY carried through the first aligning unit 30 as a mask. The first deposition unit 50 is divided into a deposition chamber for depositing an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer layer by layer. Therefore, in the deposition chamber of the first deposition unit 50, the organic source is formed in the form of an organic thin film on the substrate GLS via the measuring tray TRY serving as a mask. The substrate GLS and the measurement tray TRY which have been deposited by the first deposition unit 50 are removed from the first deposition unit 50 and transferred to the substrate GLS and the measurement tray TRY, And is carried into the separating portion 60.

The first separator 60 separates the substrate (GLS) and the measurement tray (TRY) carried through the first deposition unit (50). The first separator 60 takes out the substrate GLS separated from the measurement tray TRY in the direction in which the second alignment portion 35 is located and separates the measurement tray TRY separated from the substrate GLS, Out direction of the first tray rack master 40.

The second aligning portion 35 aligns the measurement tray (TRY) loaded through the first separating portion (60) and the substrate (GLS) loaded through the second tray rack master (45). The second aligning portion 35 aligns the substrate GLS on the measuring tray TRY. The aligned substrate GLS and the measuring tray TRY are taken out of the second aligning part 35 and the transferred substrate GLS and the measuring tray TRY are carried into the second deposition part 55.

The second tray rack master 45 arranges the measuring tray TRY in accordance with the order of the substrates arranged in the loader unit 10 and loads one of the arranged measuring trays TRY to be loaded and unloaded. The measuring tray (TRY) taken out from the second tray rack master (45) is carried into the second aligning portion (35).

The second deposition unit 55 forms a metal thin film on the substrate GLS using the measuring tray TRY carried through the second alignment unit 35 as a mask. The second deposition unit 55 is implemented as a deposition chamber for depositing a metal thin film such as aluminum (Al) or silver (Ag). Therefore, in the deposition chamber of the second deposition unit 55, the metal source is formed as a metal thin film on the substrate GLS via the measurement tray TRY serving as a mask. The substrate GLS and the measuring tray TRY that have been deposited by the second deposition unit 55 are taken out from the second deposition unit 55 and transferred to the substrate GLS and the measurement tray TRY are transferred to the second And is introduced into the separating portion 65.

The second separator 65 separates the substrate GLS and the measurement tray TRY carried in via the second deposition unit 55. The second separating unit 65 takes out the substrate GLS separated from the measuring tray TRY in the direction in which the measuring unit 80 is positioned and separates the measuring tray TRY separated from the substrate GLS 2 Tray The rack master 45 is carried out in the half-entrance direction.

The measuring unit 80 includes a measuring device for measuring the thickness of the thin film formed on the substrate GLS by layers by the measuring tray TRY. The measuring unit of the measuring unit 80 may be composed of an ellipsometer using an optical method, a phase modulation method, or a rotation analyzer method.

The unloader unit 90 unloads the substrate (GLS) that has been measured or processed.

In the above description, a device related to thickness measurement of a thin film using a measurement tray having a complex function is mainly described so that the thickness of a unit layer can be measured in a deposition apparatus. The deposition apparatus according to the embodiment can automatically measure the thickness of a thin film using a tray for measurement when a roller type in-line deposition apparatus is used. The flow of measuring the thickness of a thin film using the in-line deposition apparatus described above is as shown in FIG. 2, and FIG.

The loader section 10 counts the type of the substrate GLS in step S10. The loader section 10 arranges the substrates GLS by type and counts the type of the substrate GLS in order to load one of the placed substrates. And stores this information in a memory or the like.

The first and second tray rack masters 40 and 45 arrange the measuring tray TRY in the order of the substrate arranged in the loader unit 10 and feed the measuring tray TRY in accordance with the following flow 1 and the second aligning portions 30 and 35. (S20)

When the placement of the substrate (GLS) and the measurement tray (TRY) is completed by the loader unit (10), the first and second tray rack masters (40, 45) (S30).

If the matching between the map of the substrate and the map of the measurement tray is confirmed, the loader section 10 loads the substrate (GLS) used for measuring the thickness of the thin film. (S40) At this time, Is automatically paused.

When the substrate (GLS) to be used for measuring the thickness of the thin film is loaded, the operator selects a source to be used in the first deposition unit 50, sets conditions for the deposition layer, and arranges the selected source (S50).

When the substrate GLS arrives at the first aligning portion 30 according to the flow in the deposition apparatus, the measuring tray TRY and the substrate GLS transferred from the first tray rack master 40 are aligned (S60 )

The aligned substrate GLS and the measurement tray TRY are transferred to the first deposition unit 50 and the deposition is progressed for each layer. (S70) When the deposition process is completed by the first deposition unit 50, (GLS), organic thin films are formed separately. When the deposition by the first deposition unit 50 is completed, the substrate (GLS) and the measurement tray (TRY) are separated by the first separation unit (60).

Thereafter, the substrate (GLS) and the measurement tray (TRY) are aligned by the second aligning portion (35) according to the flow in the deposition apparatus. A metal thin film is formed on the substrate (GLS) by the second evaporation part (55). When the deposition by the second deposition unit 55 is completed, the substrate (GLS) and the measurement tray (TRY) are separated by the second separation unit (65). The substrate GLS is transferred to the measuring unit 80 according to the flow in the deposition apparatus, and the thickness of the thin film is measured by an ellipsometer or the like.

Meanwhile, one of the deposition processes of the thin film by the first deposition unit 50 and the second deposition unit 55 may be skipped in the above process. That is, depending on the kind of the thin film to be measured, the organic thin film deposition process and the metal thin film deposition process can be selectively performed. Since the organic thin film and the metal thin film are formed in different shapes on the substrate GLS, the measurement tray (TRY) disposed on the first and second tray rack masters 40 and 45 may have a different structure.

On the other hand, the above process is mainly performed by forming a thin film on a substrate using a measuring tray (TRY) and measuring the thickness of the thin film. However, when a deposition apparatus according to an embodiment of the present invention is used, an organic thin film is formed on a substrate, and a metal thin film is formed on the organic thin film formed on the substrate. Organic light emitting display (OLED) (OLED), an electrophoretic display (EPD), and a liquid crystal display (LCD).

The deposition apparatus according to the embodiment is easy to fabricate a conventional OLED in which the subpixels included in the display panel are composed of red, green, and blue, as well as a WOLED in which the subpixels included in the display panel are composed of white. Particularly, the deposition apparatus according to the embodiment has high efficiency when a roll-type inline deposition apparatus capable of mass-producing a large area WOLED by introducing a shuttle concept instead of using a fine metal mask (FMM).

Hereinafter, the formation process of the organic thin film using the measurement tray will be described in more detail.

3 is a diagram illustrating a process of forming an organic thin film using a measurement tray.

As shown in FIG. 3, the substrate GLS and the measurement tray TRY are aligned in the first aligning portion 30. At this time, the substrate (GLS) is aligned on the measurement tray (TRY). The alignment between the substrate (GLS) and the measurement tray (TRY) may be performed by a method using a vacuum chuck, a vision system, and an alignment key, but is not limited thereto.

The aligned substrate GLS and the measuring tray TRY are transported to the first deposition unit 50 by a moving device composed of a roller or the like and are removed from the first deposition unit 50 when the deposition is completed, (60). The substrate (GLS) and the measuring tray (TRY) carried into the first separator (60) are separated for the subsequent process.

The first deposition unit 50 forms an organic thin film on the substrate GLS using the measurement tray TRY as a mask. In the first deposition unit 50, organic source units SP1, SP2, and SP3 capable of depositing various organic sources by layers according to deposition conditions are separately provided in the deposition chamber. That is, the deposition chamber provided with the first organic source portion SP1 becomes the first deposition chamber for depositing the first layer. The evaporation chamber provided with the second organic source part SP2 becomes a second evaporation chamber for evaporating the second layer. The deposition chamber provided with the third organic source portion SP3 is a third deposition chamber for depositing the third layer. In the description, the organic source units SP1, SP2, and SP3 are three, but the present invention is not limited thereto.

Meanwhile, each of the first to third organic source units SP1, SP2 and SP3 includes three organic sources. That is, the first to third organic sources S1 to S3 are connected to the first organic source unit SP1, the fourth to sixth organic sources S4 to S6 are connected to the second organic source unit SP2, And the seventh to ninth organic sources S7 to S9 are included in the part SP3. The first to third organic sources S1 to S3 may include the same or different organic sources, and the fourth to ninth organic sources S4 to S9 may also include an organic source in this form. Although the first through third organic source units SP1, SP2, and SP3 each include three organic sources, the present invention is not limited thereto.

The first to ninth organic sources S1 to S9 included in the first to third organic source units SP1, SP2 and SP3 are evaporated by the heater or the like and evaporated, Respectively. Further, the organic source is separately deposited on the substrate (GLS) by the masking operation of the deposition tray (TRY).

Hereinafter, the operation of the measuring tray and the source portion and the operation of the shutter plate of the measuring tray will be described.

FIG. 4 is a view illustrating the operation of the measuring tray and the source unit, and FIG. 5 is a view illustrating the operation of the shutter plate of the measuring tray shown in FIG.

As shown in Figs. 4 and 5, the measurement tray TRY includes a support frame SFM, a base plate BPL, and a shutter plate SPL.

The support frame SFM is a frame that receives and supports the base plate BPL and the shutter plate SPL. The base plate BPL acts as a mask to form a thin film only in a certain region of the substrate GLS. The base plate BPL includes matrix-shaped slits SLT1 to SLT3. The slits SLT1 to SLT3 are open regions through which substances such as liquids, solids, and gases can pass.

The shutter plate SPL serves as a shutter to expose only one row (one space in the Y direction) of the slits SLT1 to SLT3 of the base plate BPL. The shutter plate SPL includes an exposure unit OPN exposing only one slit row of the slits SLT1 through SLT3 of the base plate BPL and a blocking unit NOPN blocking the remaining slit rows.

4 and 5A show the state before the substrate GLS and the measurement tray TRY are brought into the first deposition unit 50. FIG. The first to third slits SLT1 to SLT3 of the base plate BPL are all blocked by the blocking portion NOPN of the shutter plate SPL as shown in Figs. 4 and 5A.

FIGS. 4 and 5B show a state in which the substrate GLS and the measurement tray TRY are brought into the first deposition chamber of the first deposition unit 50. FIG. As shown in FIGS. 4 and 5B, when the substrate GLS and the measurement tray TRY are loaded into the first deposition chamber, the exposed portion OPN of the shutter plate SPL is in the X1 The first slit SLT1 of the base plate BPL is in an exposed state. At this time, in the state of the first organic source part SP1, only the cell cap CC covering the first organic source S1 is opened and the cell cap CC covering the second and third organic sources S2 and S3 It is closed.

The substrate GLS and the measuring tray TRY move into the first deposition chamber in which the first organic source portion SP1 is located and then move in the X2 direction by a moving device composed of a roller or the like. The first organic source S1 is connected to the first organic thin film 1S on one side of the substrate GLS via the exposed portion OPN of the shutter plate SPL and the first slit SLT1 of the base plate BPL, .

4 and 5C show a state in which the substrate GLS and the measurement tray TRY are brought into the second deposition chamber of the first deposition unit 50. FIG. As shown in FIGS. 4 and 5C, when the substrate GLS and the measurement tray TRY are loaded into the second deposition chamber, the exposed portion OPN of the shutter plate SPL is exposed to the outside of the base plate BPL The second slit SLT1 of the base plate BPL is exposed as the first slit SLT1 moves one column in the X1 direction. At this time, in the state of the second organic source part SP2, only the cell cap CC covering the fourth organic source S4 is opened and the cell cap CC covering the fifth and sixth organic sources S5 and S6 It is closed.

The substrate GLS and the measurement tray TRY move into the second deposition chamber where the second organic source part SP2 is located and then move in the X2 direction by the moving device composed of a roller or the like. The fourth organic source S4 is connected to the fourth organic thin film 4S on one side of the substrate GLS via the exposed portion OPN of the shutter plate SPL and the second slit SLT2 of the base plate BPL, .

4 and 5D show a state in which the substrate GLS and the measurement tray TRY are brought into the third deposition chamber of the first deposition unit 50. FIG. As shown in FIGS. 4 and 5D, when the substrate GLS and the measurement tray TRY are loaded into the third deposition chamber, the exposed portion OPN of the shutter plate SPL is in contact with the base plate BPL The third slit SLT3 of the base plate BPL is exposed as the first slit SLT2 moves one column in the X1 direction. At this time, only the cell cap CC covering the seventh organic source S7 of the third organic source portion SP3 is opened and the cell cap CC covering the eighth and ninth organic sources S8 and S9 is closed do.

The substrate GLS and the measurement tray TRY move into the third deposition chamber in which the third organic source part SP3 is located and then move in the X2 direction by a moving device composed of a roller or the like. The seventh organic source S7 is connected to the seventh organic thin film 7S on one surface of the substrate GLS via the exposed portion OPN of the shutter plate SPL and the third slit SLT3 of the base plate BPL. .

As described above, the measuring tray (TRY) is controlled by a sensing unit such as a switch or a sensor installed at a predetermined position to expose at least one of the slits of the base plate (BPL) in a sliding manner . More specifically, the exposed portion OPN of the shutter plate SPL included in the measurement tray TRY serves as a shutter for sequentially exposing at least one slit row of the slits of the base plate BPL. Here, the shape of the exposed portion OPN of the shutter plate SPL may be a linear motion, a circular motion, or the like.

Hereinafter, the configuration of the measurement tray (TRY) for performing the above operation will be described in more detail.

7 is a view showing slits formed in the first unit and the third unit, and FIG. 8 is a view specifically showing areas EA1 and EA2 in FIG. 6 . However, in FIG. 8, three slits are formed on the base plate for convenience of explanation.

As shown in Fig. 6, the measurement tray TRY includes a support frame SFM, a first unit UNIT_A, a second unit UNIT_B and a third unit UNIT_C.

The support frame SFM accommodates and supports the first unit UNIT_A, the second unit UNIT_B and the third unit UNIT_C. The support frame SFM includes a first unit housing part SFM_A for housing and supporting the first unit UNIT_A, a second unit housing part SFM_B for housing and supporting the second unit UNIT_B, And a third unit storage portion SFM_C for storing and supporting the UNIT_C. The first to third unit storage portions SFM_A to SFM_C of the support frame SFM are formed of a structure having a structure capable of receiving and supporting the first to third units UNIT_A to UNIT_C separately.

The first unit UNIT_A is housed and supported in the first unit housing part SFM_A of the support frame SFM and at least one slit row of the slits SLT of the base plate BPL is successively And a shutter plate (SPL) for exposing the shutter plate.

The first unit UNIT_A includes a base plate BPL, a shutter plate SPL, a motor unit STM, and an LM guide LMG. The second unit UNIT_B has a drive unit DRV for controlling the shutter unit SPL of the first unit UNIT_A and the third unit UNIT_C. The third unit UNIT_C is housed and supported in the third unit housing part SFM_C of the support frame SFM and is provided with at least one slit row of the slits SLT of the base plate BPL, And a shutter plate (SPL) for exposing the shutter plate.

The first and third units UNIT_A and UNIT_C are received and supported in the support frame SFM with the second unit UNIT_B therebetween. The base plate BPL of the first and third units UNIT_A and UNIT_C includes the slits SLT as described above. The shutter plate SPL of the first and third units UNIT_A and UNIT_C includes a blocking portion and an exposure portion as described above. The shutter plate SPL of the first and third units UNIT_A and UNIT_C is installed below the base plate BPL.

And the second unit UNIT_B individually drives the first and third units UNIT_A and UNIT_C. The second unit UNIT_B includes a driving unit DRV for driving the shutter plate SPL of the first and third units UNIT_A and UNIT_C. The driving unit DRV of the second unit UNIT_B may be a central processing unit (CPU), a memory, a communication module (not shown) for reporting the status of the measuring tray TRY after real- . Here, the communication module may be composed of a Bluetooth or a serial wireless communication module for receiving the position of each unit layer of the measurement tray (TRY) or for reporting status to the host.

The motor unit STM of the first and third units UNIT_A and UNIT_C is installed on the base plate BPL of the first and third units UNIT_A and UNIT_C. The motor portion STM of the first and third units UNIT_A and UNIT_C is protected by a protective cover so that it can be protected from the evaporation material.

The motor unit STM of the first and third units UNIT_A and UNIT_C is controlled by the driving unit DRV of the second unit UNIT_B to move the shutter plate SPL of the first and third units UNIT_A and UNIT_C X1 or X2 direction.

The LM guide LMG of the first and third units UNIT_A and UNIT_C is installed on the base plate BPL of the first and third units UNIT_A and UNIT_C. The LM guides LMG of the first and third units UNIT_A and UNIT_C are protected by a protective cover so that they can be protected from the evaporation material.

The LM guide LMG of the first and third units UNIT_A and UNIT_C is connected to the first and third units UNIT_A and UNIT_C when the motor unit STM of the first and third units UNIT_A and UNIT_C is driven. And guides the moving section so that the shutter plate SPL can move in the X1 or X2 direction.

As shown in FIG. 7, the slits SLTA1 and SLTA2 formed in the first unit UNIT_A and the slits SLTC1 and SLTC2 formed in the third unit UNIT_C may be formed in a symmetrical mirror shape. That is, the right slits SLTA1 of the first unit UNIT_A are symmetrical to the left slits SLTC2 of the third unit UNIT_C, and the left slits SLTA2 of the first unit UNIT_A are symmetrical with respect to the left- Symmetry to the right slits SLTC1 of the unit UNIT_C.

For example, if the number of slits SLTA1 and SLTA2 of the first unit UNIT_A is four and five, then the number of slits SLTC1 and SLTC2 of the third unit UNIT_C is five, . The present embodiment is merely an example in which the slits SLTA1 and SLTA2 formed in the first unit UNIT_A and the slits SLTC1 and SLTC2 formed in the third unit UNIT_C are formed in a symmetrical mirror shape. But is not limited thereto.

As shown in FIG. 8, the shutter plate SPL is provided corresponding to the position where the slits SLT1 to SLT3 of the base plate BPL are formed. The shutter plate SPL is formed of one of the slits SLT1 to SLT3 of the base plate BPL, for example, an exposed portion OPN exposing only the second slit SLT2 as shown in Fig. 8, SLT1, and SLT3).

The slits SLT1 to SLT3 of the base plate BPL have opening areas divided into a rectangular shape in which the Y direction is long and the X direction is short. On the other hand, the exposed portion OPN of the shutter plate SPL has an opening area exposing all of the divided opening areas corresponding to the slits SLT1 to SLT3 of the base plate BPL. Here, the exposed portion OPN of the shutter plate SPL also has a rectangular opening region in which the Y direction is long and the X direction is short, but the opening region is an opening region which forms the slits SLT1 to SLT3 of the base plate BPL . Accordingly, when the exposed portion OPN of the shutter plate SPL moves in the X2 direction, all the first slits SLT1 of the base plate BPL are exposed and the exposed portion OPN of the shutter plate SPL is exposed to X1 The third slits SLT3 of the base plate BPL are all exposed.

The shutter plate SPL is installed under the base plate BPL. The shutter plate SPL is supported by an LM guide LMG provided on the base plate BPL. The LM guide LMG is installed in a large number of areas where the slits SLT1 to SLT3 of the base plate BPL are not formed so as to correspond to the size and load of the shutter plate SPL. The shutter plate SPL moves in the X1 direction or the X2 direction by one space at the bottom of the base plate BPL. Therefore, the LM guide LMG is installed in the X direction.

The shutter plate SPL is driven by a motor portion STM formed on the base plate BPL. The motor section (STM) is a vacuum step motor, which can be used with a wide temperature range and excellent vacuum. The motor section STM transfers power to a spiral or screw-shaped rotary shaft AR. When the motor section STM rotates, the length of the rotary shaft AR becomes longer or shorter due to the ball screw BCW provided on the rotary shaft AR.

The ball screw (BCW) can be heat-treated at a high frequency and using vacuum grease. The fixing portion FP located at the end of the rotary shaft AR is fixed to the shutter plate SPL. Accordingly, when the motor STM rotates, the shutter plate SPL moves at least one space in the X1 direction or the X2 direction as the length of the rotation axis AR is varied by the ball screw BCW.

The slits formed in the base plate BPL are divided into one side slits SLTA1 and SLTC1 and the other side slits SLTA2 and SLTC2 as shown in FIG. Therefore, the shutter plate SPL, the motor unit STM and the LM guide LMG are separately provided on one side slits SLTA1 and SLTC1 of the base plate BPL and on the other side slits SLTA2 and SLTC2.

The four motor units STM move the four shutter plates SPL located below one side slits SLTA1 and SLTC1 of the base plate BPL and the other side slits SLTA2 and SLTC2 However, the present invention is not limited thereto.

Hereinafter, the structure and functions of the components installed in the measurement tray will be described, showing the top and bottom of the measurement tray TRY.

10 is a view for explaining a sensor, a pipe, a battery unit, and a battery cover unit provided under the tray for measurement, FIG. 11 is a view for explaining a switch installed on the measurement tray, And FIGS. 12 and 13 are views showing another example of a switch and a sensor provided on the measurement tray.

As shown in FIG. 9, the first to third units UNIT_A to UNIT_C are accommodated in the support frame SFM of the measurement tray TRY. The drive unit DRV included in the second unit UNIT_B is protected by a protective cover so that the internal circuit can be protected in various environments in the deposition apparatus.

As shown in Figs. 9 and 11, a switch M_SW is provided in the support frame SFM which is the upper outer edge of the measurement tray TRY. The switch M_SW is formed by a mechanical switch or the like capable of generating an electrical signal every time the measuring tray TRY passes a specific region of the deposition chamber. The switch M_SW may be composed of a first contact part PC1, a second contact part PC2, a roller part, and a spring part.

For example, an electrical signal is supplied to the first contact point PC1 and the second contact point PC2 of the switch M_SW. No control signal is generated when the first contact point PC1 and the second contact point PC2 of the switch M_SW maintain the contact state by the elasticity of the spring portion. However, when the roller of the switch M_SW is pressed by an external component, the contact state due to the elasticity of the spring portion is released. When the contact state between the first contact point PC1 and the second contact point PC2 of the switch M_SW is released, a control signal is generated.

When a control signal is generated according to the contact state of the switch M_SW, the corresponding control signal is transmitted to the second unit UNIT_B. When the control signal is transmitted to the second unit UNIT_B, the driving unit DRV drives the motor unit included in the first unit UNIT_A or the second unit UNIT. Then, the exposed portion of the shutter plate is moved corresponding to the driving of the motor portion.

In this way, the switch M_SW generates a specific control signal in cooperation with an external device, and its use is not limited to the above description. Meanwhile, in the embodiment, the switch M_SW performing this role is provided in the corner area in the X direction, which is the long axis direction of the support frame SFM.

However, the present invention is not limited to this. As shown in FIG. 12, one switch M_SW may be provided on the support frame SFM corresponding to one side in the direction of movement of the measurement tray (TRY) And the like.

10, a first pipe (not shown) for protecting the wirings for transmitting power or signals to the first to third units UNIT_A to UNIT_C is provided at a lower outer portion of the support frame SFM of the measuring tray TRY PIPE). In addition, a second pipe M_PIPE for protecting the wirings for transferring the motor drive signal output from the second unit UNIT_B is included in the lower portion of the shutter plate where the motor STM of the measurement tray TRY is located .

In addition, on the outer periphery of the support frame SFM of the measurement tray TRY, a battery unit for supplying power to the motor unit STM of the first and third units UNIT_A and UNIT_C and the driving unit of the second unit UNIT_B, (BAT_1, 2, 3, 4). The battery units BAT_1, 2, 3, and 4 may be formed in a double structure composed of two battery packs.

The battery units BAT_1, 2, 3, and 4 are protected by the battery covers BCC_1, BCC_1, BCC2, and BCC4 so as to be protected from the process conditions in the evaporation material or the deposition apparatus. In the embodiment, four battery units BAT_1, 2, 3, and 4 are provided and two battery covers BCC_1, 2, 3, and 4 are provided. However, the present invention is not limited thereto. On the other hand, the measurement tray (TRY) can be implemented so that it can be automatically charged in a standby state in which the measurement process does not proceed. In this case, the measuring tray (TRY) is charged by a battery automatic filling system or the like in a waiting place such as a tray rack master or the like.

As shown in Figs. 9 and 11, a sensor F_Sens is installed in a support frame SFM which is a lower outer edge of the measurement tray TRY. The sensor (F_Sens) is protected by a guide bracket (SGB) to prevent contamination during the deposition process. In the drawing, the guide bracket SGB is provided on the inner surface of the sensor F_Sens as an example. However, the guide bracket SGB is not limited thereto and may be installed in various positions and structures depending on the installed position.

The sensor F_Sens is formed by an optical sensor (for example, a laser diode sensor) or an acceleration sensor, which includes a light emitter and a light receiver so that an electrical signal can be generated every time a measurement tray passes through a specific region of the deposition chamber do. When the sensor F_Sens is constituted by an optical sensor, it generates a control signal corresponding to a reflection pattern including a reflection part RP and a non-reflection part NRP installed in a specific area. The reflection pattern including the reflection part RP and the non-reflection part NRP may be installed on the reflection plate DP through which the measurement tray TRY passes.

For example, the first to fifth sensors FS1 to FS5 of the sensor F_Sens can generate different control signals according to the combination of the pattern shapes of the reflection part RP and the non-reflection part NRP provided at a specific position. Therefore, if the pattern shapes of the reflection part RP and the non-reflection part NRP are different for each deposition chamber, the sensor F_Sens can be used to know which deposition tray is located in which deposition chamber. Therefore, when a control signal is generated according to the pattern shape of the sensor F_Sens, the reflection part RP and the non-reflection part NRP, the corresponding control signal is transmitted to the second unit UNIT_B. When the control signal is transmitted to the second unit UNIT_B, the driving unit DRV drives the motor unit included in the first unit UNIT_A or the second unit UNIT. Then, the exposed portion of the shutter plate is moved corresponding to the driving of the motor portion.

In this way, the sensor F_Sens generates a specific control signal in cooperation with an external device, and its use is not limited to the above description. Meanwhile, in the embodiment, the sensor F_Sens performing this role is installed at the center of the outer periphery in the X direction, which is the long axis direction of the support frame SFM.

However, the present invention is not limited to this. As shown in FIG. 13, three sensors F_Sens are provided on a support frame SFM corresponding to one side in the direction of movement of the measurement tray (TRY) And two sensors are installed.

Hereinafter, a method of controlling the measuring tray will be described.

14 is a flowchart for explaining a control method of the measurement tray.

(S110) When the measuring tray is brought into the deposition chamber, the previous value set in the driving unit can be reset and initialized.

When the measuring tray is brought into the deposition chamber, the driving unit recognizes the starting position using a switch or a sensor (S120)

After the starting position is recognized, the driving unit turns on the main system other than the motor driving unit (S130)

The driving unit recognizes whether the current position is the first layer by using a switch or a sensor installed in the measurement tray (S140)

When it is determined that the current position of the measurement tray is the first layer, the driving unit drives the motor driving unit to drive the shutter plate (S150). The driving unit is driven so that the exposed portion of the shutter plate moves one slit , One slit row of the slits of the base plate is exposed.

When the deposition on the first layer is completed and the measurement tray moves to the next deposition chamber, the driver recognizes whether the current position is the next layer, that is, the second layer, using a switch or a sensor installed on the measurement tray. )

Then, the driving unit checks whether the current position of the measuring tray is the end position by using a switch or a sensor installed in the measuring tray (S170). If the current position of the measuring tray is not the end position (N) (S150). If the current position of the measurement tray is the end position (Y), the shutter plate is returned to its original position (S180)

Then, the driving unit switches the motor driving unit to the sleep mode to prevent unnecessary power loss (S190)

Thereafter, since the measurement process using the measurement tray has been completed, the measurement tray is released from the substrate and aligned and taken out to be taken out to the tray rack master (S195)

As described above, the driving unit moves the exposed portion of the shutter plate for each position of the deposition chamber by using a switch or a sensor provided on the measurement tray, and drives the thin film to be selectively formed on the alignment tray and the aligned substrate.

As described above, according to the present invention, a shutter plate of a measurement tray located at a lower portion of a substrate is driven to deposit a thin film on a single substrate through each unit layer. Further, since the thin film is formed separately on the substrate through the measurement tray, the present invention can reduce the time required for the measurement by automating the measurement process such as the thickness of the thin film. In addition, since the present invention can automate the measuring process such as the thickness of a thin film in a vapor deposition apparatus, real time measurement is easy and reliability of measured data can be improved.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Loader section 90: Unloader section
30: 1st aligning portion 40: 1st tray rack master
50: first deposition unit 60: first deposition unit
35: 2nd aligning portion 45: 2nd tray rack master
55: second evaporation part 65: second separation part
80:
SFM: Support frame BPL: Base plate
SPL: Shutter plate OPN: Exposed part
NOPN: Breaking unit UNIT_A: First unit
UNIT_B: second unit UNIT_C: third unit
STM: Motor part LMG: LM guide

Claims (12)

A support frame;
A base plate installed on the support frame and having a plurality of slits;
A shutter plate located on one side of the base plate and having an exposed portion and a blocking portion;
A motor unit for moving the shutter plate to move the exposure unit; And
And a driving unit for controlling the motor unit,
Wherein the driving unit controls the motor unit so that the exposed portion of the shutter plate is moved by at least one space in response to a control signal formed by an operation of a sensing unit provided on the support frame. The method according to claim 1,
The shutter plate
Wherein at least one of the slits of the base plate is exposed and the other of the slits is blocked. delete The method according to claim 1,
The shutter plate
The base plate being supported by a guide formed on the base plate,
Wherein at least one of the slits of the base plate is exposed and the other is blocked corresponding to the rotational force of the motor unit formed on the base plate. The method according to claim 1,
The support frame
A first unit housing section for housing the first unit including the base plate, the shutter plate, and the motor section;
A second unit housing section for housing a second unit including the driving section for driving the motor section for moving the exposed portion of the shutter plate;
And a third unit housing portion for housing a third unit including the base plate, the shutter plate, and the motor portion. 6. The method of claim 5,
The first unit and the third unit
One base plate including a plurality of slits separated into one side and the other side,
A pair of shutter plates divided into slits formed on one side of the base plate and slits formed on the other side of the base plate,
And a pair of motor units for separately driving the exposed portions of the pair of shutter plates. 6. The method of claim 5,
The support frame
A battery unit for supplying power to at least one of the first to third units,
And a battery cover portion for protecting the battery portion,
Wherein the battery part and the battery cover part are attached to a lower outer space of the support frame. Recognizing a starting position of the measuring tray when the measuring tray containing the configuration according to claim 1 is brought into the deposition chamber;
Turning on the motor driving unit after the starting position is recognized;
Recognizing whether the current position is a first layer using a switch or a sensor installed in the measurement tray;
Driving the shutter plate to move the exposed portion and the blocking portion of the shutter plate of the measurement tray when it is determined that the current position of the measurement tray is the first layer;
Recognizing a next layer of the measurement tray;
Determining whether a current position of the measurement tray is an end position;
Returning to driving the shutter plate if the current position of the measurement tray is not the end position;
And returning the shutter plate to the home position when the current position of the measurement tray is the end position, and switching the motor driving unit to the sleep mode. A loader section for arranging the substrates according to their shapes and for loading one of the arranged substrates;
A tray rack master unit for placing a measuring tray including the configuration according to claim 1 in the order of the type of the substrate and loading one of the arranged measuring trays;
An aligning portion for aligning the substrate and the measurement tray;
A deposition unit for depositing a thin film on the substrate exposed through the slit of the base plate and the exposed area of the shutter plate included in the measurement tray;
A separation unit for separating the substrate from the measurement tray when the deposition by the deposition unit is completed; And
And a measurement section for measuring a thin film formed on the substrate. 10. The method of claim 9,
The measuring tray
A support frame,
A base plate provided on the support frame and having a plurality of slits,
A shutter plate disposed on one side of the base plate and having an exposed portion and a blocking portion;
A motor portion for moving the exposed portion of the shutter plate and the position of the blocking portion,
And a driving unit for controlling the motor unit. 11. The method of claim 10,
The support frame
A first unit housing section for housing the first unit including the base plate, the shutter plate, and the motor section;
A second unit housing portion for housing a second unit including the exposed portion of the shutter plate and the driving portion for driving the motor portion to move the blocking portion,
And a third unit housing section for housing a third unit including the base plate, the shutter plate, and the motor section. Counting the type of substrate;
The method comprising the steps of: bringing in a tray for measurement comprising the configuration according to claim 1 in the order of the type of the substrate in the tray rack master;
Loading the substrate;
Aligning the substrate and the measurement tray;
Moving the aligned substrate and the measurement tray to a deposition unit and depositing the deposition tray by layer; And
And separating the aligned substrate from the measuring tray, moving the substrate to the measuring unit, and measuring the measurement tray.

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