KR101452118B1 - Apparatus for inspecting display cells - Google Patents

Apparatus for inspecting display cells Download PDF

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Publication number
KR101452118B1
KR101452118B1 KR1020130076297A KR20130076297A KR101452118B1 KR 101452118 B1 KR101452118 B1 KR 101452118B1 KR 1020130076297 A KR1020130076297 A KR 1020130076297A KR 20130076297 A KR20130076297 A KR 20130076297A KR 101452118 B1 KR101452118 B1 KR 101452118B1
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KR
South Korea
Prior art keywords
substrate
chamber
inspection
card
vacuum
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Application number
KR1020130076297A
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Korean (ko)
Inventor
어경호
진전호
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세메스 주식회사
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

An apparatus for inspecting display cells comprises: a test chamber for performing an inspection process for a plurality of display cells which are formed on a substrate; a substrate stage which is disposed in the test chamber and which supports the substrate so that the display cells face downward; and a card stage which is disposed below the substrate stage and which supports a probe card which is configured to contact the display cells for testing the display cells, wherein the substrate stage includes a plurality of vacuum holes for adsorbing the substrate and a plurality of clamps for gripping the edges of the substrate.

Description

Apparatus for inspecting display cells < RTI ID = 0.0 >

Embodiments of the present invention relate to an apparatus for testing display cells. And more particularly to an apparatus for electrically and optically inspecting display cells formed on a mother substrate (hereinafter, referred to as 'substrate') such as OLED (Organic Light Emitting Device) cells.

The OLED device used as a flat panel display device is widely used in portable display devices, smart phones, tablet PCs, and the like, as well as being widely used as a next-generation display device due to its large size, having a wide viewing angle, excellent contrast and high response speed . In particular, the OLED device has advantages such as brightness, driving voltage, response speed, etc., and is capable of multi-coloring as compared with an inorganic light emitting display device.

In the manufacturing process of the OLED device, a TFT (Thin Film Transistor) layer is formed on the substrate through various film forming processes and etching processes, and on the TFT layer, a lower electrode and an organic layer (for example, a hole transport layer, Transport layer) and an upper electrode may be formed. Then, the OLED device can be completed by sealing the TFT layer and the substrate on which the organic light emitting layer is formed using an encapsulating substrate.

In particular, a plurality of OLED cells may be formed on the substrate, and after the sealing process is completed, individual OLED cells may be individualized through a cutting process to complete the OLED device.

Meanwhile, after the sealing process is completed, an inspection process for OLED cells formed on the substrate may be performed. In the inspection process, a function test of the TFT layer, a correction circuit inspection, an image quality inspection, a spectral inspection, an image inspection, and the like may be performed by applying an inspection signal to the OLED cells. However, since the inspecting process is performed after the sealing process is completed as described above, the loss due to the defective OLED devices in the inspecting process may be increased.

In order to solve the above problems, Japanese Unexamined Patent Application Publication No. 10-2006-0017586 discloses a method of performing the TFT array function test before performing the cell process after the TFT array forming process, -0046645 and 10-2011-0096382 disclose a method for measuring the thickness of the thin film layers during or after forming each thin film layer of OLED cells.

However, even if the function test for the TFT array and / or the thickness measurement for the thin film layers forming the organic light emitting layer are performed as described above, since the final inspection processes must be additionally performed after the sealing process is performed, There is a possibility that the productivity of the apparatus is deteriorated.

In Korean Patent Application No. 10-2012-0120865 filed by the present applicant, in order to solve the above-mentioned problems, it is possible to perform an inspection process on display cells such as a plurality of OLED cells formed on a substrate before a sealing process An apparatus for inspecting display cells is disclosed, and an apparatus for inspecting the display cells is being continuously researched and developed.

Embodiments of the present invention are intended to provide an apparatus for testing an improved display cell.

According to an aspect of the present invention, there is provided an apparatus for inspecting display cells, the apparatus comprising: an inspection chamber for inspecting a plurality of display cells formed on a substrate; A substrate stage supporting the substrate such that the display cells face downward and a card stage disposed below the substrate stage and supporting a probe card configured to contact the display cells for inspection of the display cells have. At this time, the substrate stage may be provided with a plurality of vacuum holes for attracting the substrate and a plurality of clamps for holding edge portions of the substrate.

According to embodiments of the present invention, the substrate stage may include a vacuum plate formed with the vacuum holes, and the clamps may be disposed at the edge portions of the vacuum plate.

According to embodiments of the present invention, a stage driving unit for moving and rotating the vacuum plate in the vertical and horizontal directions may further be provided.

According to embodiments of the present invention, it is possible to further include clamp actuators for actuating the clamps, wherein the clamp actuators are arranged to grip the edge portions of the substrate when the internal pressure of the vacuum holes becomes higher than a predetermined pressure, Clamps can be operated.

According to embodiments of the present invention, the vacuum holes may be connected to a vacuum system including a vacuum pump. When the internal pressure of the vacuum holes becomes higher than a predetermined pressure due to an operation error of the vacuum system or a vacuum leak, An auxiliary vacuum system may be further provided to provide vacuum pressure for adsorbing the substrate.

According to embodiments of the present invention, an optical inspection unit may be further provided for inspecting optical characteristics of display cells to which an inspection signal is applied by the probe card.

According to embodiments of the present invention, the optical inspection unit includes an inspection camera for inspecting the image quality and brightness of the display cells, a spectroscope for measuring the color coordinates and color temperature of the display cells, a thin film pattern And a fluorescent microscope for inspecting the alignment state of the cells.

According to the embodiments of the present invention, there are provided a first horizontal driver for moving the inspection camera and the spectroscope in the horizontal direction, first vertical drivers for moving the inspection camera and the spectroscope in the vertical direction, A second horizontal driving unit for moving the microscope in the horizontal direction, and a second vertical driving unit for moving the fluorescence microscope in the vertical direction.

According to embodiments of the present invention, a first alignment camera for detecting alignment marks or probes of the probe card may be mounted on the substrate stage, and the optical inspection unit may detect an alignment mark of the substrate And a second alignment camera for the second camera.

According to embodiments of the present invention, there is provided a card dispenser comprising: a card accommodating chamber connected to one side of the inspection chamber and having a card cassette for accommodating a plurality of probe cards in a multilayer form and having a door for communicating with the inspection chamber; And a card transfer unit for selecting one of the probe cards through the door and transferring the card to the card stage.

According to the embodiments of the present invention, first and second gas supply units for supplying inert gas to the test chamber and the card storage chamber, respectively, and inert gas supplied to the test chamber and the card storage chamber, respectively The first and second pressure control valves may be further provided for discharging the pressure inside the test chamber, and the pressure inside the test chamber may be maintained higher than the internal pressure of the card storage chamber.

According to the embodiments of the present invention, a safety valve may be further provided for discharging the inert gas from the inspection chamber when the internal pressure of the inspection chamber becomes abnormally high.

According to embodiments of the present invention, a circulation pipe and a fan filter unit for circulating the inert gas supplied to the inspection chamber may be further provided.

According to embodiments of the present invention, there is provided a method of manufacturing a display device, comprising: a substrate transfer chamber connected between an in-line process facility for manufacturing the display cells and the inspection chamber; a substrate transfer chamber disposed within the substrate transfer chamber, And a substrate transfer robot for transferring the substrate may be further provided.

According to embodiments of the present invention, a first substrate aligning unit for aligning the substrate while transferring the substrate between the inline processing facility and the substrate transfer robot and transferring the substrate is disposed in the substrate transfer chamber .

According to embodiments of the present invention, a buffer chamber for temporarily storing the substrate may be connected to one side of the substrate transfer chamber.

According to embodiments of the present invention, the buffer chamber may include a cassette for accommodating the substrate and a second substrate aligning unit for aligning the substrate accommodated in the cassette.

According to the embodiments of the present invention as described above, when the substrate on which a plurality of display cells are formed is attractively gripped with the substrate facing downward by using a vacuum pressure provided through vacuum holes, A plurality of clamps are disposed on the substrate stage to hold the edge portions of the substrate, thereby preventing the substrate from dropping and stably holding the substrate.

Further, the substrate can be stably attracted to the substrate stage by an auxiliary vacuum system that provides vacuum pressure to the vacuum holes when the internal pressure of the vacuum holes is changed.

Meanwhile, even when the door of the card storage chamber is opened for replacement of the probe card by forming the atmosphere inside the card storage chamber accommodating the plurality of probe cards into an inert gas atmosphere similar to the inspection chamber, The contamination can be sufficiently reduced. In particular, by keeping the internal pressure of the card compartment chamber lower than the internal pressure of the check chamber, it is possible to form an air flow from the test chamber to the card compartment chamber when the door is opened, Can be sufficiently prevented.

In addition, a substrate transfer module may be used to transfer the substrate between the in-line process facility for manufacturing the display cells and the inspection chamber, and a first transfer chamber for aligning the substrate, And a substrate transfer robot for transferring the substrate from the first substrate alignment unit to the inspection chamber. In addition, a buffer chamber for temporarily storing the substrate may be connected to the substrate transfer chamber, and a second substrate alignment unit for aligning the substrate may be provided in the buffer chamber. Therefore, the alignment state of the substrate can be improved, and the reliability of the inspection process of the substrate can be improved.

1 is a schematic diagram for explaining OLED cells formed on a substrate.
2 is a schematic block diagram illustrating an inline process facility to which an apparatus for inspecting display cells according to an embodiment of the present invention is connected.
FIG. 3 is a schematic block diagram illustrating an apparatus for testing the display cells shown in FIG. 2. FIG.
4 is a schematic side view for explaining the substrate transfer module shown in FIG.
5 is a schematic plan view for explaining the first substrate aligning unit shown in FIG.
6 is a schematic plan view for explaining the buffer chamber shown in FIG.
7 is a schematic plan view for explaining the substrate stage shown in Fig.
Fig. 8 is a schematic side view for explaining the substrate stage shown in Fig. 3. Fig.
Fig. 9 is a schematic view for explaining the operation of the substrate stage shown in Fig. 3. Fig.
10 is a schematic plan view for explaining the probe card shown in FIG.
11 is a schematic front view for explaining the probe card shown in Fig.
12 is a schematic side view for explaining the probe card shown in FIG.
13 is a schematic view for explaining a method of controlling the gas atmosphere inside the inspection chamber shown in Fig. 3; Fig.
14 is a schematic side view for explaining the card transferring portion shown in Fig.
Fig. 15 is a schematic front view for explaining the card transferring portion shown in Fig. 3;
Figs. 16 and 17 are schematic plan views for explaining the card stage and the clamping unit shown in Fig. 3. Fig.
Figs. 18 and 19 are schematic side views for explaining the card stage and the clamping unit shown in Fig. 3. Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic structural view for explaining OLED cells formed on a substrate, FIG. 2 is a schematic view for explaining an inline process facility to which an apparatus for testing display cells according to an embodiment of the present invention is connected; . FIG. 3 is a schematic block diagram illustrating an apparatus for testing the display cells shown in FIG. 2. FIG.

Referring to FIGS. 1 to 3, an apparatus 100 for testing display cells according to an exemplary embodiment of the present invention may be used to electrically and optically inspect display cells such as OLED cells 20. FIG.

Specifically, the inspection apparatus 100 of the OLED cells 20 uses a cell process for forming a plurality of OLED cells 20 on the substrate 10 and an encapsulation substrate (not shown) in the manufacturing process of the OLED device May be used to inspect the electrical and optical characteristics of the OLED cells 20 during the sealing process for sealing the OLED cells 20. [

In particular, as shown in FIG. 2, the inspection apparatus 100 according to an embodiment of the present invention may be connected to an in-line process facility for manufacturing the display cells 20. For example, the testing apparatus 100 may be connected between the cell processing facility 30 for the cell process and the sealing process facility 40 for the sealing process. For example, the cell processing facility 30 and the sealing process facility 40 may have a cluster shape, and the substrate 10 may be transferred between the cell processing facility 30 and the sealing process facility 40 An in-line substrate transfer device 50 may be disposed. According to an embodiment of the present invention, the inspection apparatus 100 may be connected to the in-line substrate transfer apparatus 50 between the cell process facility 30 and the sealing process facility 40, 30 may be used to perform electrical and optical inspection processes on OLED cells 20 formed on the substrate 10.

The substrate 10 can be transferred from the cell processing facility 30 to the inspection apparatus 100 via the in-line substrate transfer apparatus 50 and the inspection and inspection process And then transferred to the sealing process facility 40 through the in-line substrate transfer device 50.

As described above, since the electrical and optical inspection process for the substrate 10 can be performed after the cell process and before the sealing process, the defect rate of the OLED cells 20 can be greatly reduced, It is possible to omit subsequent processes for the OLED cells 20 determined to be the OLED cells 20, thereby greatly reducing the manufacturing cost of the OLED cells 20. [

The cell process includes forming a plurality of OLED cells 20 on a substrate 10, forming a TFT array layer on the substrate 10 and forming an organic emission layer on the TFT array layer Lt; / RTI > For example, the organic light emitting layer may include a lower electrode layer, a hole transporting layer, a light emitting layer, an electron transporting layer, an upper electrode layer, and the like. 1, the OLED cells 20 formed on the substrate 10 in the cell process each have a plurality of test pads 22 electrically connected to the TFT array layer .

The sealing process may be performed after the cell process by sealing the OLED cells 20 by bonding the substrate 10 on which the OLED cells 20 are formed and the sealing substrate.

The inspection apparatus 100 may include an inspection chamber 102 providing a space for performing electrical and optical inspection processes on the OLED cells 20. [ That is, the substrate 10 can be transferred from the cell processing facility 30 to the inspection chamber 102 and then transferred from the inspection chamber 102 to the sealing process facility 40 after the inspection process is performed. .

According to an embodiment of the present invention, the inspection apparatus 100 may include a substrate transfer module 200 for transferring the substrate 100 between the inspection chamber 102 and the inline process facility. The substrate transfer module 200 includes a substrate transfer chamber 202 connected to the inspection chamber 102 and a substrate transfer chamber 202 disposed within the substrate transfer chamber 202 for transferring the substrate 100 between the inspection chamber 102 and the in- And a substrate transfer robot 204 for transferring the substrate.

The substrate transfer robot 202 may be connected between the inspection chamber 102 and the inline substrate transfer apparatus 50 and the substrate transfer robot 204 may be connected to the inline substrate transfer apparatus 50 And the substrate 10 can be transferred from the inline substrate transfer robot 52 provided in the substrate processing apparatus 100. [

FIG. 4 is a schematic side view for explaining the substrate transfer module shown in FIG. 3, and FIG. 5 is a schematic plan view for explaining the first substrate aligning unit shown in FIG.

3 to 5, the substrate 10 may be transferred into the substrate transfer chamber 202 by the in-line substrate transfer robot 52, A first substrate aligning unit 210 for aligning the substrate 10 transferred by the inline substrate transfer robot 52 and transferring the substrate 10 to the substrate transfer robot 204 may be provided.

For example, the first substrate aligning unit 210 may have a plurality of support members 212 for supporting the substrate 10 as shown in FIG. 5, and the support members 212 may have a plurality of alignment members 214 for aligning the substrate 10 supported thereon.

The support members 212 and alignment members 214 may be provided on the lower surface of the base panel 216 and the support members 212 may be disposed on the substrate 10 of the present invention. In particular, the support members 212 and the alignment members 214 may be configured to be movable by the horizontal driving units 218 and the alignment driving units 220 so as to be closer to or away from the center portion, The panel 216 can be configured to be movable in the vertical direction by the vertical driving unit 222.

For example, the horizontal driving units 218 and the alignment driving units 220 may be configured using a pneumatic cylinder, and the vertical driving unit 222 may include a linear motion guide, a motor, a ball screw, . ≪ / RTI > However, the configurations of the horizontal driving units 218, the alignment driving units 220, and the vertical driving unit 222 may be variously changed, so that the scope of the present invention is not limited by the detailed configurations thereof.

The operation of the first substrate aligning unit 210 will now be described in detail.

After the substrate 10 is transferred into the substrate transfer chamber 202 by the in-line substrate transfer robot 52, the vertical driving unit 222 drives the support members 212 to move to the substrate 10 The support members 212 can be lowered. The horizontal driving units 218 may move the support members 212 in the horizontal direction so that the support members 212 are positioned below the edge of the substrate 10, The support members 222 may lift the support members 212 so that the substrate 10 is supported by the support members 212. [

After the transfer of the substrate 10 is completed, the robot arm of the in-line substrate transfer robot 52 can be retracted to the in-line substrate transfer apparatus 50, The alignment of the substrate 10 can be performed while the substrate 10 is supported on the substrate 212. Specifically, the alignment driving portions 214 push the side portions of the substrate 10 toward the central portion of the substrate 10, so that the substrate 10 can be aligned at a predetermined position.

After the alignment of the substrate 10 is performed as described above, the vertical driving unit 222 moves the substrate 10 downward to transfer the substrate 10 onto the robot arm of the substrate transfer robot 204 . Subsequently, after the substrate 10 is supported by the robot arm of the substrate transfer robot 204, the state in which the substrate 10 is supported by the support members 212 can be released, The first substrate aligning unit 210 can be returned to the initial position. Specifically, the method of releasing the state that the substrate 10 is supported by the support members 212 can be performed by reversing the steps of supporting the substrate 10 by the support members 212 And the support members 212 may be lifted by the vertical driving unit 222. [

However, unlike the above, the supporting operation of the substrate 10 by the support members 212 may be performed after the alignment operation of the substrate 10 is performed first. That is, the substrate 10 may be aligned by the alignment members 214 while being supported on the robot arm of the in-line substrate transfer robot 52, and then supported by the support members 212 have. In this case, the horizontal movement of the support members 212 and the alignment members 214 may be performed at the same time, and one of the horizontal driving units 218 and the alignment driving units 220 may be omitted.

After the substrate transfer robot 204 transfers the substrate 10 from the in-line substrate transfer apparatus 50 to the substrate transfer robot 204 as described above, the substrate transfer robot 204 transfers the substrate 10 to the inspection chamber (Not shown).

4, the substrate transfer module 200 is connected to one side of the substrate transfer chamber 202 and includes a buffer chamber (not shown) for temporarily storing the substrate 10, (230).

6 is a schematic plan view for explaining the buffer chamber shown in FIG.

Referring to FIG. 6, the buffer chamber 230 may include a cassette 232 for receiving a plurality of substrates 10, and the cassette 232 may support the substrates 10 A plurality of support members 234 may be provided.

The buffer chamber 230 may include a second substrate aligning unit 240 for aligning the substrates 10 accommodated in the cassette 232. The second substrate alignment unit 240 includes pushers 242 for pushing the opposite side edges of the substrate 10 and a pusher driver 244 for driving the pushers 242 . The pushers 242 can be arranged at predetermined positions by pushing the opposite side edge portions of the substrate 10 and the support members 234 of the cassette 232 Stoppers 236 may be provided to align the substrate 10 at predetermined positions.

As shown, the pushers 242 may be configured to be rotatable by a respective pivot 246, as shown, and the pusher actuators 244 may be configured to pivot the pushers 242 And may be configured to rotate in a predetermined angle range. However, the detailed configurations of the pushers 242 and the pusher driving units 244 may be variously changed, and thus the scope of the present invention is not limited thereto.

Referring again to FIG. 3, the substrate 10 transferred to the inspection chamber 102 may be loaded on the substrate stage 300 disposed in the inspection chamber 10. According to an embodiment of the present invention, the substrate 10 may be transferred to the inspection chamber 102 with the OLED cells 20 facing downward. At this time, the substrate transfer robot 204 can transfer the substrate 10 while supporting the edge portions of the substrate 10.

FIG. 7 is a schematic plan view for explaining the substrate stage shown in FIG. 3, FIG. 8 is a schematic side view for explaining the substrate stage shown in FIG. 3, and FIG. 9 is a cross- Fig.

7 to 9, the substrate stage 300 includes a vacuum plate 302 having a plurality of vacuum holes 304 so as to suck the backside of the substrate 10, and a vacuum plate 302 And a stage driving unit 310 for moving and rotating the wafer W.

The substrate 10 can be adsorbed to the lower surface of the vacuum plate 302 by vacuum pressure provided through the vacuum holes 304. The vacuum holes 304 are connected to the vacuum system 116, Can be connected. Although not shown in detail, the vacuum system 116 may include a vacuum pump, a pressure control valve, and the like, as shown in FIG. 9, and the operation thereof may be controlled by the control unit 104.

The stage driving unit 310 may have a substantially rectangular coordinate robot shape. The stage driving unit 310 includes horizontal driving units 312 and 314 for moving the vacuum plate 302 in the horizontal direction, a vertical driving unit 316 for moving the vacuum plate 302 in the vertical direction, And a rotation driving unit 318 for rotating the vacuum plate 302.

The horizontal driving units 312 and 314 can horizontally move the vacuum plate 302 between the load and unload areas and the inspection area of the substrate 10 and can also move the OLED cells 20 in the inspection area. The vacuum plate 302 can be moved in the horizontal direction for inspection. The X-axis driving unit 312 and the Y-axis driving unit 314 may include an X-axis driving unit 312 and a Y-axis driving unit 314. The X-axis driving unit 312 and the Y- A motion guide, or the like.

The vertical driver 316 may vertically move the vacuum plate 302 to load and unload the substrate 10 and inspect the OLED cells 20. For example, the vertical driving unit 316 may be configured using a servo motor, a speed reducer, and a linear motion guide. However, the configurations of the X-axis driving unit 312, the Y-axis driving unit 314, and the vertical driving unit 316 may be variously changed, so that the scope of the present invention is not limited thereto.

The rotation driving unit 318 may include a motor for rotating the vacuum plate 302. For example, the rotation driving unit 318 may be constructed using a direct drive motor and a cross roller bearing, and a vacuum pipe or the like connected to the vacuum plate 302 through a central through hole of the direct drive motor Can be deployed.

The vertical driving unit 316 may be mounted on the X-axis driving unit 312 and the rotary driving unit 318 may be mounted on the lower portion of the vertical driving unit 316. That is, the vertical driving unit 316 can be moved in the horizontal direction by the horizontal driving units 312 and 314, the rotation driving unit 318 can be moved in the vertical direction by the vertical driving unit 316, The plate 302 may be mounted on the lower portion of the rotation driving unit 318.

According to an embodiment of the present invention, the inspection apparatus may include an auxiliary vacuum system 320 connected to vacuum holes 304 formed in the vacuum plate 302 as shown in FIG. Although not illustrated in detail, the auxiliary vacuum system 320 may include an auxiliary vacuum pump, a pressure control valve, and the like, and the pressure inside the vacuum holes may be reduced by an operation error of the vacuum system 116, And may provide vacuum pressure through the vacuum holes 304 to stably adsorb the substrate 10 when the pressure is higher than the set pressure.

Although not shown, a pressure sensor (not shown) for measuring the pressure inside the vacuum holes 304 may be mounted on the substrate stage 300, and the controller 104 controls the vacuum holes The operation of the auxiliary vacuum system 320 may be controlled based on the internal pressure of the auxiliary vacuum system 304.

In addition, according to an embodiment of the present invention, a plurality of clamps 330 may be disposed at edge portions of the vacuum plate 302 to grip edge portions of the substrate 10. The clamps 330 may be formed to prevent the substrate 10 from falling when the pressure inside the vacuum holes 304 becomes higher than a preset pressure due to an operation error of the vacuum system 116, The edge portions of the substrate 10 can be gripped.

For example, clamp actuators 332 for operating the clamps 330 may be disposed on the vacuum plate 302, and the clamps 330 may be rotatably mounted on the vacuum plate 302 It can be mounted on the edge portion. Pneumatic cylinders may be used as the clamp driving parts 332 and the clamp driving parts 332 may rotate the clamps 330 so that the substrate 10 is gripped by the clamps 330 have.

Alternatively, the clamps 330 may be coupled to the clamp actuators 332 and moved in a horizontal direction, that is, away from or closer to the substrate 10, whereby the clamps 330 The holding of the substrate 10 may be performed.

Referring again to FIG. 3, a probe card 120 for inspecting OLED cells 20 formed on the substrate 10 may be disposed under the substrate stage 300. The probe card 120 may include probes 122 (see FIG. 10) for contact with the OLED cells 20, and the substrate stage 300 may include probes 122 and the OLED cells 20 are in contact with each other.

Fig. 10 is a schematic plan view for explaining the probe card shown in Fig. 3, Fig. 11 is a schematic front view for explaining the probe card shown in Fig. 3, Fig. 12 is a view And Fig.

10-12, the probe card 120 may have a plurality of probes 122 configured to contact test pads 22 of OLED cells 20 formed on the substrate 10 have. The OLED cells 20 may be arranged to have a plurality of rows and a plurality of columns as shown in FIG. 1, and the probes 122 of the probe card 120 may have a plurality of rows and a plurality of columns, And may be arranged in a line so as to be simultaneously in contact with the row or column of OLED cells 20 in the row or column direction.

For example, as shown in the drawing, the probe card 120 may have a substantially rectangular plate shape, and the probes 122 may extend along one side edge of the probe card 120, They may be arranged in a line on one side.

Although not shown, a plurality of contact pads (not shown) electrically connected to the probes 122 may be provided on the lower surface of the probe card 120, and the contact pads may include pogo pins (See FIG. 3) for applying an inspection signal to the OLED cells 20 through the OLED cells 20 (see FIG. 3). However, since the electrical connection between the probe card 120 and the electrical inspection unit 130 can be variously changed, an electrical connection between the probe card 120 and the electrical inspection unit 130 The scope of the present invention is not limited thereto.

Referring again to FIG. 3, a card receiving chamber 140 for receiving a plurality of probe cards 120 may be provided at one side of the test chamber 102. A card cassette 142 for accommodating the plurality of probe cards 120 in a multilayer form may be provided in the card housing chamber 140. The card cassette 142 is connected to the cassette driver 144 by a cassette driver 144 And can be moved in the vertical direction. For example, the cassette driver 144 may have a shape of a uniaxial robot including guide rails arranged in parallel to each other in a vertical direction, and may be constructed using a motor, a ball screw, a ball nut, or the like.

Although not shown in detail, support members for supporting the probe cards 120 may be provided on both inner sides of the card cassette 142, and the probe cards 102 The card transfer unit 150 may be provided with a card transfer unit 150 for selecting one of the card transfer unit 120,

According to an embodiment of the present invention, a recess for inserting the card accommodating chamber 140 may be provided on one side of the inspection chamber 102, and on the inner surfaces of the recess, A flexible shielding member 146 may be disposed between the chamber 102 and the card housing chamber 140 so as not to transmit an impact force due to vibration or an external force. For example, the shielding member 146 may be made of silicone resin, and may be provided in a plate form between the test chamber 102 and the card receiving chamber 140.

An outer door 148 for accommodating the probe cards 120 may be provided at one side of the card housing chamber 140. The probe cards 120 may be provided at an upper portion of the card housing chamber 140. [ For transferring or replacing one of the test chambers 102 to the test chamber 102 may be provided. The upper door 149 transfers one of the probe cards 120 to the inspection chamber 102 or accommodates the probe card 120 in the card storage chamber 140 from the inspection chamber 102 Can be opened.

As an example, the upper door 149 may be opened by upward movement of the card cassette 142, and then closed by the downward movement of the card cassette 142. After the card cassette 142 is moved upward through the upper door 149, that is, when the card cassette 142 is moved from the card housing chamber 140 to the test chamber 102 via the upper door 149, So that the probe card 120 can be transferred. According to an embodiment of the present invention, one side of the upper door 149 may be hinged to the upper portion of the card housing chamber 140, and the card cassette 142 may be hinged to the upper portion of the card housing chamber 140, . However, unlike the above, the upper door 149 may be moved in the vertical direction by the card cassette 142.

Although not shown, a sealing member (not shown) may be interposed between the upper door 149 and the card housing chamber 140, and a separate member for maintaining the closed state of the upper door 149 A locking device may be additionally provided. In addition, a separate door driving unit (not shown) for opening and closing the upper door 149 may be provided.

According to an embodiment of the present invention, the inside of the inspection chamber 102 may be formed of an inert gas, for example, a nitrogen gas atmosphere to prevent the substrate 10 from coming into contact with outside air. The inspection apparatus 100 may include a first gas supplier 110 for providing an inert gas into the inspection chamber 102. The operation of the first gas supplier 110 may be controlled by the controller 104 ). ≪ / RTI > Although not shown in detail, the inert gas may be supplied through the upper portion of the inspection chamber 102, and the inert gas supplied to the inspection chamber 102 may be discharged through the lower portion of the inspection chamber 102 have.

The inside of the card housing chamber 140 may be formed in the same or similar atmosphere as the inside of the test chamber 102 so that even when the upper door 149 is opened to replace the probe card 120 Since the atmosphere inside the test chamber 102 is not changed, it is possible to eliminate the time required to adjust the process atmosphere due to the replacement of the probe card 120.

As an example, the inside of the card housing chamber 140 may be formed in an inert gas atmosphere, for example, a nitrogen gas atmosphere. The inspecting apparatus 100 may include a second gas supplier 112 for providing an inert gas into the card housing chamber 140 and the second gas supplier 112 may include a controller 104 The operation can be controlled. The first and second gas supply units 110 and 112 may be connected to a gas source 114 for supplying the inert gas and may supply the inert gas to the inspection chamber 102 in accordance with a control signal from the control unit 104. [ And the card housing chamber 140, respectively. Each of the first and second gas supply units 110 and 112 may be formed using a valve, a mass flow controller (MFC), or the like.

The inert gas may be supplied into the interior of the card compartment chamber 140 through the upper portion of the card compartment chamber 140 and may be discharged through the lower portion of the card compartment chamber 140.

According to an embodiment of the present invention, when the plurality of probe cards 120 are accommodated in the card housing chamber 140 through the outer door 148, And the second gas supplier 112 may supply an inert gas to the card housing chamber 140 to discharge the introduced outside air.

13 is a schematic view for explaining a method of controlling the gas atmosphere inside the inspection chamber shown in Fig. 3; Fig.

Referring to FIGS. 3 and 13, the oxygen concentration and the moisture concentration in the inspection chamber 102 can be controlled very strictly. For example, the oxygen concentration and the moisture concentration in the inspection chamber 102 can be controlled to be about 0.05 ppm to 0.5 ppm, respectively. In particular, as an example, the oxygen concentration and the moisture concentration in the inspection chamber 102 can be managed to be about 0.1 ppm, respectively.

According to an embodiment of the present invention, a nitrogen purge step may be performed to form the inside of the inspection chamber 102 in a nitrogen atmosphere. Nitrogen gas may be supplied from the gas source 114 into the inspection chamber 102 through the first gas supply 110 in the nitrogen purge step for the inspection chamber 102, The nitrogen gas can be discharged through the first pressure control valve 400 connected to the first pressure control valve 400. [ The first pressure control valve 400 may be opened or closed according to a pressure inside the inspection chamber 102. The nitrogen purge step may be performed when the oxygen concentration and the moisture concentration in the inspection chamber 102 reach a predetermined range Lt; / RTI >

Although not shown in detail, the inspection chamber 102 may include an oxygen sensor and a moisture sensor for measuring the oxygen concentration and the moisture concentration, and the controller 104 controls the oxygen concentration in the inspection chamber 102 The operation of the first gas supplier 110 and the operation of the first pressure control valve 400 can be controlled according to the concentration of water.

The first pressure control valve 400 may be closed by the control unit 104 after the oxygen concentration and the nitrogen concentration in the inspection chamber 102 reach a predetermined range. 13, the inspection apparatus 100 includes a first circulation pipe 410 for circulating nitrogen gas supplied to the inspection chamber 102, and a second circulation pipe 410 for circulating the nitrogen gas supplied to the inspection chamber 102. [ An adjustment unit 412 and a first fan filter unit 414. [

The nitrogen gas supplied into the inspection chamber 102 can be circulated by the first fan filter unit 414 and the first atmosphere control unit 412 controls the flow rate of the circulated nitrogen gas, Foreign matter contained in the nitrogen gas can be removed. The first atmosphere control unit 412 may be connected to the gas source 114 and the nitrogen gas may be supplied to the inspection chamber 102 from the gas source 114 through the first fan filter unit 414. [ Can supply. The first atmosphere control unit 412 may discharge a part of the circulated nitrogen gas through the first discharge pipe 416 and adjust the supply and discharge flow rates of the nitrogen gas, The internal pressure can be kept constant.

On the other hand, the oxygen concentration and the moisture concentration in the card housing chamber 140 can be adjusted within a range of about 1 to 10 ppm, respectively. Particularly, when the oxygen concentration and the water concentration in the card compartment chamber 140 are higher than the above range, the second gas supplier 112 can supply the nitrogen gas into the card compartment chamber 140, Nitrogen gas supplied to the accommodating chamber 140 and external air including oxygen and moisture can be discharged from the card accommodating chamber 140 through the second pressure control valve 420.

The purge step with the inert gas may be performed until the oxygen concentration and the water concentration in the card housing chamber 140 reach a predetermined range. In addition, although not shown in detail, an oxygen sensor and a moisture sensor for measuring oxygen concentration and moisture concentration may be provided in the card housing chamber 140, and the controller 104 controls the card housing chamber 140, The operation of the second gas supplier 112 and the operation of the second pressure control valve 420 can be controlled according to the oxygen concentration and the moisture concentration inside.

As described above, when a plurality of probe cards 120 are prepared in advance in the card housing chamber 140 and the types of the OLED cells 20 to be inspected are changed, Since the probe card 120 corresponding to the OLED cells 20 to be inspected can be selected and exchanged among the probe cards 120, the time required for replacing the probe card 120 can be greatly shortened.

When the upper door 149 is opened for providing or exchanging the probe card 120, the inspection chamber 102 and the card housing chamber 140 may communicate with each other. At this time, in order to prevent airflow from the card housing chamber 140 toward the inspection chamber 102, that is, to prevent the contaminants in the card storage chamber 140 from being transferred to the inspection chamber 102 The pressure inside the test chamber 102 is maintained to be higher than the pressure inside the card compartment chamber 140. [

As an example, the internal pressure of the check chamber 102 may be maintained at about a gauge pressure of about 10 mbar, and the internal pressure of the card receiving chamber 140 may be maintained at about gauge pressure of about 5 to 9 mbar. However, since the pressure range is provided as an example, various changes may be made, and thus the scope of the present invention is not limited thereto.

Although not shown, pressure sensors (not shown) may be provided to measure the internal pressure of the inspection chamber 102 and the card housing chamber 140, and the controller 104 may control the pressure sensors The first and second gas supply units 110 and 112, the first and second pressure control valves 400 and 420, and the first atmosphere control unit 412 according to the pressure values measured by the first and second gas supply units 110 and 112 .

According to an embodiment of the present invention, the first and second gas supply units 110 and 112 may respectively supply the inert gas to the test chamber 102 and / or the test chamber 102 via the first and second ionizers 180 and 182, respectively. And can be supplied to the card housing chamber 140, respectively. The first and second ionizers 180 and 182 may be used to prevent the substrate 10 and the probe cards 120 from being charged by the supply of the inert gas.

In addition, according to an embodiment of the present invention, the inspection apparatus 100 may further include a third gas supply unit 170 for supplying an inert gas into the substrate transfer chamber 202. The third gas supplier 170 may be connected to the gas source 114, and may be constructed using a valve, a mass flow meter, or the like.

The interior of the substrate transfer chamber 202 can be formed in a nitrogen atmosphere by performing a nitrogen purge step. Nitrogen gas may be supplied from the gas source 114 to the substrate transfer chamber 202 through the third gas supply 170 during the nitrogen purge step for the substrate transfer chamber 202, The nitrogen gas may be discharged through a third pressure control valve 430 connected to the transfer chamber 202. The third pressure control valve 430 may be opened or closed according to the pressure inside the substrate transfer chamber 202. The nitrogen purge step may be performed in a range of oxygen concentration and moisture concentration within the substrate transfer chamber 202 within a predetermined range Lt; / RTI > is reached.

Although not shown in detail, the substrate transfer chamber 102 may include an oxygen sensor, a moisture sensor, and a pressure sensor for measuring oxygen concentration, moisture concentration, and internal pressure, The operation of the third gas supply unit 170 and the operation of the third pressure control valve 430 may be controlled according to the oxygen concentration, the moisture concentration, and the internal pressure of the second gas supply unit 202.

The third pressure control valve 430 may be closed by the control unit 104 after the oxygen concentration and the nitrogen concentration in the substrate transfer chamber 202 reach a predetermined range. 13, the inspection apparatus 100 includes a second circulation pipe 440 for circulating the nitrogen gas supplied to the substrate transfer chamber 202 and a second circulation pipe 440 for circulating the nitrogen gas supplied to the substrate transfer chamber 202. In this embodiment, An atmosphere adjusting unit 442 and a second fan filter unit 444. [

The nitrogen gas supplied into the substrate transfer chamber 202 can be circulated by the second fan filter unit 444 and the second atmosphere control unit 442 controls the flow rate of the circulated nitrogen gas The foreign substance contained in the nitrogen gas can be removed. The second atmosphere control unit 442 may be connected to the gas source 114 and may supply nitrogen gas from the gas source 114 to the substrate transfer chamber 202 through the second fan filter unit 444. [ . The second atmosphere control unit 442 may discharge a part of the circulated nitrogen gas through the second discharge pipe 446 and adjust the supply and discharge flow rates of the nitrogen gas to the substrate transfer chamber 202 ) Can maintain a constant pressure inside.

In particular, the oxygen concentration, nitrogen concentration, and internal pressure within the substrate transfer chamber 202 are preferably kept the same as the inspection chamber 102. This is to prevent the atmosphere inside the inspection chamber 102 from being changed while the substrate 10 is transferred between the substrate transfer chamber 202 and the inspection chamber 102.

Meanwhile, the operation of the second atmosphere adjusting unit 442 may be controlled by the controller 104. Additionally, the nitrogen gas may be supplied to the substrate transfer chamber 202 from the third gas supplier 170 via a third ionizer 184. [ So that the charging of the substrate 10 transferred through the substrate transfer chamber 202 can be prevented.

According to an embodiment of the present invention, a safety valve 450 may be connected to the inspection chamber 102, the card storage chamber 140, and the substrate transfer chamber 202, respectively. The safety valves 450 may be provided in the inspection chamber 102 (or the first and second pressure control valves 400, 420, and 430) when the first, second, and third pressure control valves 400, 420, and 430 and / And the internal pressure of the card receiving chamber 140 and the substrate transfer chamber 202 can be kept constant. In particular, the safety valves 450 may be opened when the internal pressure of the inspection chamber 102, the card storage chamber 140, and the substrate transfer chamber 202 is abnormally raised, 102, the card housing chamber 140, and the substrate transfer chamber 202 can be stably maintained within a predetermined range.

According to another embodiment of the present invention, the first, second and third pressure control valves 400, 420 and 430 may be connected to a vacuum system (not shown) including a vacuum pump and the like. That is, the nitrogen gas supplied to the inspection chamber 102, the card housing chamber 140, and the substrate transfer chamber 202 may be forcedly exhausted by the vacuum system.

Fig. 14 is a schematic side view for explaining the card transporting unit shown in Fig. 3, and Fig. 15 is a schematic front view for explaining the card transporting unit shown in Fig.

14 and 15, the card transferring unit 150 may be disposed under the horizontal driving units 312 and 314 of the stage driving unit 310 and may include a holder 152 for gripping the probe card 120, And a holder vertical driving unit 154 and a holder horizontal driving unit 156 for moving the holder 152 in the vertical and horizontal directions. For example, the holder horizontal driving unit 156 may have a uniaxial robot shape including guide rails extending in parallel, and may be constructed using a motor, a ball screw, a ball nut, or the like. The holder vertical driving unit 154 may be constructed using a pneumatic cylinder and may be coupled to the holder horizontal driving unit 156 and moved in a horizontal direction.

The holder 152 may be coupled to the holder vertical driving unit 154 and may have a substantially plate shape. For example, hooks 158 for gripping the probe card 120 may be provided under the holder 152, and a hook driving unit 159 for driving the hooks 158 may be provided . In this case, the engagement protrusions 128 corresponding to the hooks 158 may be provided on the probe card 120. However, the method of holding the probe card 120 can be variously modified, so that the scope of the present invention is not limited thereto.

The card transferring unit 152 transfers the probe card 120 from the card cassette 142 to the holder 152 to transfer the probe card 120 from the card cassette 142 to the card stage 160 Can be moved in the horizontal and vertical directions.

The card stage 160 may be disposed below the card transfer unit 150 and a clamping unit 162 (see FIG. 16) for fixing the probe card 120 may be disposed on the card stage 160 .

Figs. 16 and 17 are schematic plan views for explaining the card stage and the clamping unit shown in Fig. 3, and Figs. 18 and 19 are schematic side views for explaining the card stage and the clamping unit shown in Fig.

16 to 19, the clamping unit 162 may be disposed on the card stage 160 and may grip both sides of the probe card 120. [ In addition, the clamping unit 162 may grip the other side of the probe card 120, which is adjacent to the probes 122, opposite to one side of the probe card 120.

The clamping unit 162 includes clamps 164 having fixing pins 166 for fixing the probe card 120 and a clamp driving unit 166 for moving the clamps 164 in the horizontal direction, (Not shown).

As shown in FIGS. 10 to 12, the side surfaces and the other side surfaces of the probe card 120 may be provided with slots 124 through which the fixing pins 166 are inserted, Likewise, each slot 124 may comprise a lower slot 124A formed in a substantially vertical direction and an upper slot 124B extending upwardly with a predetermined slope.

Particularly, as the probe card 120 is lowered by the card transferring unit 150, the fixing pins 166 can be inserted into the lower slots 124A, and then, by the clamp driving unit 166, And can be moved in the substantially horizontal direction along the upper slots 124B. At this time, the fixing pins 166 inserted into the lower slots 124A formed on both sides of the probe card 120 can be moved toward the other side of the probe card 120, 120 can be stably fixed between the fixing pins 164 while being moved downward.

As one example, the clamp driver 168 may include pneumatic cylinders for moving the fixation pins 166. However, since the detailed structure of the clamp driving unit 168 can be variously modified, the scope of the present invention is not limited thereto.

According to an embodiment of the present invention, as shown in FIGS. 18 and 19, positioning pins 190 for determining the position of the probe card 120 may be provided on the card stage 160 And the probe card 120 may be provided with positioning grooves 192 corresponding to the positioning pins 190.

For example, the holder vertical driving unit 154 may move the probe card 120 downward so that the positioning pins 190 partially insert the positioning grooves 192, The probe card 120 can be brought into close contact with the upper surface of the card stage 160 by the protrusion 162. Although not shown, pogo pins (not shown) or electrode pads (not shown) may be provided on the upper surface of the card stage 160 to be electrically connected to the contact pads of the probe card 120 have. Meanwhile, the pogo pins or electrode pads may be electrically connected to the electrical inspection unit 130.

After the probe card 120 is fixed by the clamping unit 162 as described above, the substrate stage 300 is moved so that the probes 122 of the OLED cells 20 and the probe card 120 are brought into contact with each other And then an inspection signal can be applied to the OLED cells 20 through the probes 122. [

The electrical inspection unit 130 may perform an electrical property test on the OLED cells 20 to which the inspection signal is applied through the probe card 120.

Meanwhile, according to an embodiment of the present invention, the inspection apparatus 100 may perform optical inspection of the OLED cells 20 to which the inspection signal is applied. The inspection apparatus 100 may further include an optical inspection unit 350 disposed on one side of the probe card 120 fixed to the clamping unit 162 as shown in FIG. 8, the optical inspection unit 350 may include an inspection camera 352 for measuring the image quality, brightness, etc. of the OLED cells 20, and an inspection camera 352 for measuring color coordinates, color temperature, etc., And a fluorescence microscope 356 for detecting foreign matter, unevenness, and the like on the substrate 10 and for checking an alignment state of thin film patterns formed on the substrate 10 can do. According to an embodiment of the present invention, two inspection cameras 352 and two spectroscopes 354 are used. However, since the number of the inspection cameras 352 and the spectroscopes 354 can be variously changed, The scope of which is not limited.

The electrical inspection may be performed sequentially or concurrently on a series of OLED cells 20 in contact with the probes 122 and the optical inspection may be performed sequentially on the OLED cells 20 have.

The optical inspection unit 350 may include driving units for moving the inspection camera 352, the spectroscope 354, and the fluorescence microscope 356 for optical inspection of the OLED cells 20. 8, the optical inspection unit 350 includes first horizontal driving units 360 and 362 for horizontally moving the inspection camera 352 and the spectroscope 354, and a second horizontal driving unit 360 and 362 for moving the fluorescence microscope 356, A first vertical driving unit 366 for moving the inspection camera 352 and the spectroscope 354 in the vertical direction and a second horizontal driving unit 366 for moving the inspection microscope 356 in the horizontal direction, And a second vertical driving unit 368 for moving the vertical driving unit in the vertical direction.

The first horizontal driving units 360 and 362 may include an X axis driving unit 360 and a Y axis driving unit 362. The first vertical driving units 366 may be connected to the Y axis driving unit 362 Can be mounted. The X-axis driving unit 360 can move the Y-axis driving unit 362 in the X-axis direction, and the Y-axis driving unit 362 can independently move the first vertical driving units 366 in the Y- Can be moved. For example, the X-axis driving unit 360 may be configured using a linear motion guide, a motor, a ball screw, a ball nut, and the Y-axis driving unit 362 may include the first vertical driving units 366 And may be constructed using a linear motion guide and a linear motor or the like in order to independently move them. The first vertical driving units 366 may be configured using linear motion guides, motors, ball screws, ball nuts, etc., and the inspection cameras 352 and the spectroscopic units 354 And may be mounted on the first vertical driving units.

The second horizontal driving unit 364 may move the second vertical driving unit 368 in the X axis direction and the fluorescence microscope 356 may be mounted on the second vertical driving unit 368. For example, . The second horizontal driving unit 364 and the second vertical driving unit 368 may be constructed using a linear motion guide, a motor, a ball screw, a ball nut, or the like.

According to an embodiment of the present invention, the inspection apparatus 100 includes alignment cameras 340 and 370 for aligning the substrate 10, the probe card 120, and the optical inspection unit 350 with each other Although not shown, the substrate 10 and the probe card 120 may be provided with alignment marks, respectively.

8, the substrate stage 300 may be provided with first alignment cameras 340 for detecting the alignment marks or probes of the probe card 120, The optical inspection unit 350 may include second alignment cameras 370 for detecting the alignment marks of the substrate 10.

8, one first alignment camera 340 is attached to the rotation driving unit 318 of the substrate stage 300 through brackets, but a plurality of first alignment cameras 340 are mounted on the rotation driving unit 318 of the substrate stage 300, May be used.

The second alignment cameras 370 may be disposed adjacent to the spectroscopes 354 and the fluorescence microscope 356, respectively. For example, the second alignment cameras 370 may be mounted on the first and second vertical driving units 366 and 368, respectively, and the first and second vertical driving units 366 and 368 may be mounted on the first and second vertical driving units 366 and 368, 354 to move the second alignment cameras 370 in the vertical direction.

10, an electronic tag 126 such as an RFID (Radio Frequency Identification) tag may be mounted on each of the probe cards 120. The controller 104 controls the electronic tag 126, And can recognize the probe cards 120. [0034] FIG.

The control unit 104 recognizes each probe card 120 according to the signal of the electronic tag 126 when the probe card 120 needs to be replaced and transmits the probe card 120 stored in the card cassette 142 (120).

Information on the probe cards 120 stored in the card cassette 142 may be provided to the control unit 104 in advance and the control unit 104 may be provided with a single probe The card 120 may be selected and the height of the selected probe card 120 may be adjusted to correspond to the card transferring unit 150 using the cassette driving unit 144.

Next, using the electronic tag signal generated from the selected probe card 120 before fetching the selected probe card 120 using the card transfer unit 150, the probe card 120 is further checked whether the probe card 120 is properly selected So that errors in which the erroneously selected probe card 120 is pulled out can be sufficiently prevented.

According to embodiments of the present invention as described above, a substrate transfer module 200 may be used to transfer the substrate 10 from an in-line process facility for manufacturing display cells 20, A first substrate aligning unit 210 for aligning the substrate 10 and a second substrate aligning unit 210 for aligning the substrate 10 from the first substrate aligning unit 210 in the inspection chamber 102, And a substrate transfer robot 204 for transferring the substrate transfer robot 204 to the substrate processing apparatus. A buffer chamber 230 for temporarily storing the substrate 10 may be connected to the substrate transfer chamber 202. The buffer chamber 230 may include a second substrate for aligning the substrate 10, An alignment unit 240 may be provided. Therefore, the alignment of the substrate 10 can be improved, and thus the reliability of the inspection process of the substrate 10 can be improved.

The probe cards 120 corresponding to the inspection target substrate 10 can be selected from the card cassettes 142 in which the plurality of probe cards 120 are accommodated. The time required for replacing the probe card 120 can be greatly shortened and the internal atmosphere of the card storage chamber 140 in which the card cassette 142 is disposed can be deactivated The contamination of the inspection chamber 102 can be sufficiently reduced even when the upper door 149 is opened for providing or replacing the probe card 120. [

In addition, by maintaining the internal pressure of the card storage chamber 140 lower than the internal pressure of the test chamber 102, the opening of the upper door 149 from the inspection chamber 102 to the card storage chamber 140 So that contamination inside the inspection chamber 102 can be sufficiently prevented.

On the other hand, when the substrate 10 is attracted to and held by the substrate 10 so that the front surface of the substrate 10 faces downward by using the vacuum pressure provided through the vacuum holes 304 of the substrate stage 300, Even if an operation error of the vacuum system 116 connected to the holes 304 or an internal pressure of the vacuum holes 304 is changed due to the vacuum leak or the like, the substrate stage 300 may be provided with a plurality of clamps 330 can be disposed to hold the edge portions of the substrate 10 to prevent the substrate 10 from dropping and stably maintain the substrate 10. In particular, when the vacuum system 116 malfunctions, the auxiliary vacuum system 320 connected to the vacuum holes 304 is operated to maintain the vacuum adsorption state of the substrate 10 more stably.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: substrate 20: OLED cell
22: Inspection pad 30: Cell processing equipment
40: Sealing process facility 50: Inline substrate transfer device
52: substrate transfer robot for in-line 100: inspection apparatus
102: Inspection chamber 104:
110: first gas supplier 112: second gas supplier
114: gas source 116: vacuum system
120: probe card 122: probe
130: Electrical inspection part 140: Card storage chamber
142: Card cassette 144: Cassette driving part
150: a card transferring unit 152:
154: holder vertical driving part 156: holder horizontal driving part
158: Hook 159:
160: Card stage 162: Clamping unit
164: Clamp 166: Retaining pin
168: Clamp driving unit 170: Third gas supplier
180: First ionizer 182: Second ionizer
184: third ionizer 190: positioning pin
192: positioning groove 200: substrate transfer module
202: substrate transfer chamber 204: substrate transfer robot
210: first substrate alignment unit 212: support member
214: alignment member 216: base panel
218: horizontal driver 220: alignment driver
222: vertical driver 230: buffer chamber
232: cassette 234: support member
236: stopper 240: second substrate alignment unit
242: pusher 244: pusher drive
246: rotation axis 300: substrate stage
302: Vacuum plate 304: Vacuum hole
310: stage driving unit 320: auxiliary vacuum system
330: Clamp 340: 1st alignment camera
350: Optical inspection part 352: Inspection camera
354: spectroscope 356: fluorescence microscope
370: Second alignment camera 400, 420, 430: Pressure control valve
412,442 atmosphere adjusting part 450: safety valve

Claims (17)

An inspection chamber for performing an inspection process for a plurality of display cells formed on a substrate;
A substrate stage disposed within the inspection chamber and supporting the substrate with the display cells facing downward;
A card stage disposed below the substrate stage and supporting a probe card configured to contact the display cells for inspection of the display cells;
A card storage chamber connected to one side of the inspection chamber and having a card cassette for storing a plurality of probe cards in a multilayered form and having a door for communicating with the inspection chamber; And
And a card transferring unit for selecting one of the probe cards through the door and transferring the selected one to the card stage,
Wherein the substrate stage is provided with a plurality of vacuum holes for attracting the substrate and a plurality of clamps for holding edge portions of the substrate. The apparatus of claim 1, wherein the substrate stage includes a vacuum plate having vacuum holes formed therein, the clamps being disposed at edge portions of the vacuum plate. 3. The apparatus of claim 2, further comprising a stage driver for moving and rotating the vacuum plate in vertical and horizontal directions. The apparatus of claim 1, further comprising clamp drivers for operating the clamps,
Wherein the clamp driving units operate the clamps to grip edge portions of the substrate when an internal pressure of the vacuum holes becomes higher than a preset pressure. The vacuum pump according to claim 1, wherein the vacuum holes are connected to a vacuum system including a vacuum pump,
Further comprising an auxiliary vacuum system for providing vacuum pressure for adsorbing the substrate when an internal pressure of the vacuum holes is higher than a predetermined pressure due to an operational error of the vacuum system or a vacuum leak, / RTI > The apparatus of claim 1, further comprising an optical inspection unit for inspecting optical characteristics of display cells to which an inspection signal is applied by the probe card. The optical inspection apparatus according to claim 6,
An inspection camera for checking image quality and brightness of the display cells;
A spectroscope for measuring a color coordinate and a color temperature of the display cells; And
And a fluorescence microscope for inspecting an alignment state of the thin film patterns formed on the substrate. The apparatus of claim 7, further comprising: a first horizontal driver for horizontally moving the inspection camera and the spectroscope;
First vertical drivers for moving the inspection camera and the spectroscope respectively in a vertical direction;
A second horizontal driver for moving the fluorescence microscope in a horizontal direction; And
And a second vertical driver for moving the fluorescence microscope in a vertical direction. The apparatus according to claim 7, wherein the substrate stage is equipped with a first alignment camera for detecting alignment marks or probes of the probe card,
Wherein the optical inspection unit further comprises a second alignment camera for detecting an alignment mark of the substrate. delete [2] The apparatus of claim 1, further comprising: first and second gas supply units for supplying an inert gas to the inspection chamber and the card storage chamber, respectively; And
Further comprising first and second pressure control valves for respectively discharging the inert gas supplied to the test chamber and the card compartment chamber,
Wherein a pressure inside the inspection chamber is maintained higher than an internal pressure of the card compartment chamber. 12. The apparatus of claim 11, further comprising a safety valve for discharging the inert gas from the inspection chamber when the internal pressure of the inspection chamber becomes abnormally high. 12. The apparatus of claim 11, further comprising a circulation line and a fan filter unit for circulating the inert gas supplied to the inspection chamber. 2. The apparatus of claim 1, further comprising: a substrate transfer chamber connected between the inline process facility for manufacturing the display cells and the inspection chamber; And
Further comprising a substrate transfer robot disposed within the substrate transfer chamber and configured to transfer the substrate between the inline process facility and the inspection chamber. 15. The apparatus of claim 14, further comprising a substrate alignment unit disposed within the substrate transfer chamber, for transferring the substrate between the inline processing facility and the substrate transfer robot and aligning the substrate while transferring the substrate Wherein the display cells are arranged in a matrix. 15. The apparatus of claim 14, further comprising a buffer chamber coupled to one side of the substrate transfer chamber for temporarily storing the substrate. 17. The apparatus of claim 16, wherein the buffer chamber is provided with a cassette for receiving the substrate and a second substrate alignment unit for aligning the substrate housed in the cassette.
KR1020130076297A 2013-05-29 2013-07-01 Apparatus for inspecting display cells KR101452118B1 (en)

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KR20090038726A (en) * 2007-10-16 2009-04-21 주식회사 실트론 Electrical measurement equipment for measuring characteristics of soi-wafer
KR20120111494A (en) * 2011-04-01 2012-10-10 세크론 주식회사 Probe station

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* Cited by examiner, † Cited by third party
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CN108120879A (en) * 2018-02-28 2018-06-05 昆山龙雨智能科技有限公司 Screen connection capacitance resistance test device
CN108120879B (en) * 2018-02-28 2024-03-12 昆山龙雨智能科技有限公司 Capacitive resistance testing device of screen connector
CN108761309A (en) * 2018-05-23 2018-11-06 昆山龙雨智能科技有限公司 A kind of test device

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