KR101932837B1 - Inspection jig, inspection apparatus and inspection method - Google Patents

Abstract

Provided are an inspection jig, an inspection apparatus, and an inspection method capable of suppressing a reduction in the accuracy of the inspection value and a reduction in the repeat stability in the noncontact inspection of the circuit board.
An inspection jig 100 for inserting and holding a circuit board FX1 on which an insulating protection member CL1 is laminated on a surface of a substrate SB provided with an inspected electrode EL on a substrate SB, And a detection electrode 122 is provided on the second fitting surface 124. The first fitting surface 110 has a second fitting surface 124 disposed opposite to the first fitting surface 113, When the circuit board FX1 is sandwiched between the first and second fitting supporting portions 120 and 120 so that the inspecting electrode EL and the detecting electrode 122 face each other, (112) for adjusting the distance between the detection electrode (122) and the inspection target electrode (EL) so that the detection electrode (122) is in close contact with the protection member (CL1).

Description

[0001] DESCRIPTION [0002] INSPECTION JIG, INSPECTION APPARATUS AND INSPECTION METHOD [

The present invention relates to an inspection jig, an inspection apparatus and an inspection method.

In a circuit board having an insulating protective member (for example, a coverlay) on its surface, such as a flexible substrate, it is not possible to conduct the energization test by bringing the probe into contact with the electrodes to be inspected. For this reason, a non-contact type inspection has conventionally been performed.

In the non-contact type inspection, first, the electrodes to be inspected and the sensor electrode are opposed to each other, and the electrodes to be inspected and the sensor electrode are arranged to form a capacitor. Next, the probe is brought into contact with the input electrode electrically connected to the inspected electrode via the wiring, and an electric signal is inputted to the input electrode. As a result, electric charges accumulate on the electrodes to be inspected in accordance with the electric signals, and the potential of the sensor electrodes changes. Therefore, the presence or absence of disconnection can be checked by measuring the change in potential time of the sensor electrode.

As a test apparatus for facilitating the measurement of the potential of the sensor electrode, there is a method of measuring capacitance by increasing the capacitance between the electrodes to be inspected and the sensor electrode (see, for example, Patent Document 1). The non-contact type inspection is performed by inserting and holding the circuit board by a test jig including a pair of fitting supporting portions. A sensor electrode is provided on one fitting support portion. First, the circuit board is disposed so that the inspected electrode and the sensor electrode face each other. Thereafter, the circuit board is held between the one fitting support portion provided with the sensor electrode and the other fitting supporting portion facing the one fitting supporting portion. When the circuit board is sandwiched and supported, the distance between the electrodes to be inspected and the sensor electrode is reduced, and both electrodes are filled with the insulating protecting member. The electrostatic capacity of the flat plate capacitor is inversely proportional to the distance between the opposing electrodes, and is proportional to the dielectric constant between both electrodes and the area of the parallel plate electrodes, so that the capacitance between the electrodes to be inspected and the sensor electrode becomes large. As a result, the potential of the sensor electrode can be easily measured.

Japanese Patent Laid-Open Publication No. 8-327708

The circuit board may have irregularities in the thickness direction due to its layer structure, material and manufacturing variations. Further, the pair of fitting support portions are manufactured so that the respective fitting supporting surfaces are parallel to each other and each fitting supporting surface is made as flat as possible, but the unevenness of the fitting supporting surface can not be completely removed. Due to this, depending on the position in the production lot or circuit board, an air layer is formed between the electrodes to be inspected and the sensor electrode due to the irregularities of the circuit board and the irregularities of the fitting surface when the circuit board is held by the inspection jig . As a result, the dielectric constant between both electrodes becomes low, and the capacitance becomes small. In addition, the distance between both the electrodes sandwiching the protective member becomes unstable due to the irregularities of the protective member and the irregularities of the fitting surface, and the electrostatic capacity becomes unstable. For these reasons, there has been a problem that the accuracy of the inspection value is lowered and the repetitive stability is decreased.

An object of the present invention is to provide an inspection jig, an inspection apparatus, and an inspection method which can suppress a decrease in accuracy of inspection value and a decrease in repeat stability in a noncontact inspection of a circuit board.

A test jig according to an aspect of the present invention is a test jig for inserting a circuit board on which an insulated protective member is laminated on a surface of a base provided with electrodes to be inspected on a base body and provided with the electrodes to be inspected, And a second fitting support portion having a first fitting support portion having a supporting surface and a second fitting supporting face disposed opposite to the first fitting supporting face and having detecting electrodes provided on the second fitting supporting face, The distance between the detection electrode and the electrode to be inspected such that the detection electrode is in close contact with the protection member when the circuit board is sandwiched between the first fitting support portion and the second fitting support portion so that the electrode and the detection electrode face each other And the inter-electrode distance adjusting unit to be adjusted is provided on at least one of the first fitting support portion and the second fitting support portion.

In the inspection jig according to an aspect of the present invention, the inter-electrode distance adjusting section may include an elastic member provided on the first fitting supporting section so as to face the second fitting supporting surface.

In the inspection jig according to an aspect of the present invention, the elastic member may be formed of a plurality of different materials.

In the inspection jig according to an aspect of the present invention, a first member having a relatively high elastic modulus is provided in a region of the elastic member corresponding to a position where the electrodes to be inspected are arranged when the circuit board is fitted, And a second member having a relatively low elastic modulus may be provided in the region of the elastic member.

In the inspection jig according to one aspect of the present invention, the elastic member may include a first layer having a relatively high elastic modulus and a second layer having a relatively low elastic modulus.

In the inspection jig according to an aspect of the present invention, the interelectrode distance adjustment unit may include an inspection probe provided in the second fitting support portion, the detection electrode may include a tip end of the inspection probe, The tip may protrude from the second fitting surface and be reciprocally movable in a direction substantially perpendicular to the second fitting surface.

In the inspection jig according to an aspect of the present invention, the tip of the inspection probe may be a probe pin pressed by a pressing member.

According to an aspect of the present invention, there is provided an inspection apparatus comprising: a circuit board interposer including an inspection jig according to an aspect of the present invention; a test signal generator for generating a test signal to be input to the electrodes to be inspected; And an electric signal measuring unit for measuring an electric signal detected by the electric signal measuring unit.

A testing method according to an aspect of the present invention is a testing method for testing a circuit board on which an inspecting electrode is provided on a base and an insulating protecting member is laminated on a surface of the base on which the inspecting electrode is provided, A fitting support step having a fitting support portion and a second fitting support portion having a second fitting face opposed to the first fitting face and provided with a detecting electrode on the second fitting face; And a measuring step of measuring an electric signal detected by a detection electrode disposed opposite to the electrode under test via the protection member, wherein in the fitting step, The distance between the detection electrode and the electrode to be inspected is adjusted so as to be in close contact with the protective member.

In the inspecting method according to an aspect of the present invention, it is preferable that, in the fitting step, the elastic member provided on the first fitting support portion so as to face the second fitting supporting surface has a distance between the detecting electrode and the electrode to be inspected It may be adjusted.

In the inspection method according to an aspect of the present invention, in the fitting step, the elastic member formed of a plurality of different materials may adjust the distance between the detection electrode and the electrode to be inspected.

In the inspecting method according to an aspect of the present invention, a first member having a relatively high elastic modulus is provided in a region of the elastic member corresponding to a position where the electrodes to be inspected are arranged when the circuit board is fitted and held, And a second member having a relatively low modulus of elasticity is provided in the region of the elastic member so that when the circuit board is fitted and held in the fitting support step outside the region corresponding to the position where the electrodes to be inspected are disposed, Elastic deformation of the elastic member may be suppressed.

In the inspection method according to an aspect of the present invention, the elastic member includes a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity, whereby in the fitting step, The unevenness of the circuit board may be absorbed and the inclination of the circuit board with respect to the second fitting surface may be absorbed in the second layer.

In the inspection method according to an aspect of the present invention, the tip of the inspection probe provided on the second fitting support portion is used as the detection electrode, the tip of the inspection probe protrudes from the second fitting support surface, The distance between the detection electrodes and the electrodes to be inspected may be adjusted in the fitting step.

In the inspection method according to an aspect of the present invention, the distal end of the inspection probe is a probe pin pressed by the pressing member, so that the distance between the detection electrode and the electrode to be inspected may be adjusted in the fitting step .

According to the present invention, it is possible to provide an inspection jig, an inspection apparatus, and an inspection method capable of suppressing a reduction in the accuracy of the inspection value and a reduction in the repeat stability in the noncontact inspection of the circuit board.

1 is a side view schematically showing an inspection apparatus for a circuit board according to a first embodiment of the present invention together with a circuit board to be inspected.
Fig. 2 is a plan view showing the circuit board shown in Fig. 1. Fig.
Figs. 3 (a) and 3 (b) are plan views showing the sensor substrate shown in Fig. 1. Fig.
Fig. 4 is a side view showing a state in which the circuit board shown in Fig. 1 is sandwiched between the first and second fit-in support portions; Fig.
5 (a) and 5 (b) are a plan view showing a first modification of the elastic member shown in Fig. 1 and a sectional view showing a second modification. Fig.
6 is a side view schematically showing an inspection apparatus for a circuit board according to a second embodiment of the present invention together with a circuit board to be inspected.
7 is a plan view showing the circuit board shown in Fig.
8 is a plan view showing the inspection probe support shown in Fig.
FIG. 9A is a sectional view showing the inspection probe shown in FIG. 6; FIG.
9 (b), 9 (c), 9 (d) and 9 (e) are side views showing a modification of the inspection probe shown in FIG. 9 (a).
Fig. 10 is a side view showing a state in which the circuit board shown in Fig. 6 is sandwiched between the first fit-in support portion and the second fit-in support portion; Fig.
11 is a side view schematically showing an inspection apparatus for a circuit board according to a third embodiment of the present invention together with a circuit board to be inspected.
Fig. 12 is a side view showing a state in which the circuit board shown in Fig. 11 is sandwiched between the first fitting portion and the second fitting portion; Fig.

[First Embodiment]

Hereinafter, a first embodiment of the present invention will be described with reference to Figs. 1 to 5 (b). 1 is a side view schematically showing the entire configuration of an inspection apparatus 10 of a circuit board together with a circuit board FX1 to be inspected. 2 is a plan view of the circuit board FX1. 3 (a) and 3 (b) are plan views of the sensor substrate 121. FIG. 4 is a side view showing a state in which the circuit board FX1 is sandwiched between the first and second fitting supporting portions 110 and 120. FIG. 5 (a) and 5 (b) are diagrams showing variation of the configuration of the elastic member 112. Fig.

(Circuit board)

1 and 2, the circuit board FX1 to be inspected by the inspection apparatus 10 includes a substrate SB, a plurality of inspected electrodes EL, a plurality of wirings LD, a plurality of input electrodes EL ' And a protective member CL1.

The gas SB is an insulating thin film having a thickness of several micrometers to several hundreds of micrometers. The gas SB is formed of a material having insulation, flexibility, and heat resistance (for example, plastic such as polyimide or PET).

The electrodes to be inspected EL, the wiring LD and the input electrode EL '(hereinafter collectively referred to as " conductor pattern ") may be formed of a conductive thin film having a thickness of several micrometers to several hundreds of micrometers to be. The conductor pattern including the electrodes to be inspected EL is provided in the substrate SB. The conductor pattern is bonded to one surface of the base SB, for example, through an epoxy resin-based or acrylic resin-based adhesive. The conductor pattern is formed of, for example, copper foil.

As shown in Fig. 2, the electrodes to be inspected ELa, ELb, ... , ELf are the wirings LDa, LDb, ... Through the LDf, the input electrodes ELa ', ELb', ... , And ELf '. In Fig. 1, only the combination of the electrodes to be inspected ELa, the wiring LDa, and the input electrode ELa 'is shown for easy viewing.

As shown in Fig. 1, the protective member CL1 is laminated on the surface of the substrate SB provided with the electrodes EL to be inspected. The protection member CL1 protects the electrodes EL to be inspected of the circuit board FX1 from solder, heat, moisture, and the like. The protection member CL1 is formed of a material having an insulating property. Preferably, the protection member CL1 is formed of a material having flexibility and heat resistance. The protection member CL1 is formed of, for example, polyimide or plastic such as PET. The thickness of the protective member CL1 is several 탆 to several hundred 탆.

As shown in Figs. 1 and 2, the protection member CL1 is formed so as to cover the conductor pattern of the circuit board FX1 except for the upper side of the input electrode EL '. Above the input electrode EL ', a gap G' is formed. Thereby, the signal input means 125 of the second penetration supporting portion 120, which will be described later, can contact the input electrode EL '.

(Inspection apparatus)

1, the testing apparatus 10 includes a circuit board interposing support section 11, a test signal generating section 12, and an electrical signal measuring section 13. [

The circuit board interposing support portion 11 includes a test jig 100 and a driving device 130. [ The test signal generator 12 includes a test signal generator 160. The electric signal measuring section 13 includes a signal processing circuit 140, an A / D converter 150, and a measuring means 170. The test signal generator 160 is also connected to the measuring means 170. Thereby, as described later, the measurement means 170 can collectively control the generation of test signals and the measurement of electrical signals.

(Inspection jig)

The inspection jig 100 includes a first fitting support portion 110 having a first fitting face 113 and a second fitting fitting portion 120 having a second fitting face 124. The first fitting support portion 110 and the second fitting supporting portion 120 are arranged such that the first fitting face 113 and the second fitting face 124 are opposed to each other. The first and second fitting supporting portions 110 and 120 are held by the driving device 130 while keeping the first fitting supporting surface 113 and the second fitting supporting surface 124 parallel to each other, (The direction of movement is indicated by both the up and down arrows in Fig. 1). Thereby, the distance between the first fitting surface 113 and the second fitting surface 124 can be changed.

(Second fitting supporting portion)

The second fitting support portion 120 includes a sensor substrate 121 and a signal input means 125. A plurality of sensor electrodes (detection electrodes) 122 are provided on the sensor substrate 121 (only sensor electrodes 122a, 122b and 122c are shown in Fig. 1). The sensor electrode 122 is a conductor.

(Signal input means)

The signal input means 125 is electrically connected to the test signal generator 160. The signal input means 125 is, for example, a plurality of wire probes (only one wire probe is shown in FIG. 1 for ease of viewing). When the circuit board FX1 is disposed between the first and second fitting supporting portions 110 and 120, the plurality of wire probes are connected to the input electrodes ELa ', ELb', ... And ELf ', respectively, as shown in FIG.

The length of the plurality of wire probes is set to be slightly longer than the thickness (depth of the gap G ') of the protective member CL1. As a result, when the circuit board FX1 is held between the first and second fitting supporting portions 110 and 120 (see Fig. 4), the wire probes are elastically deformed, and the tips of the wire probes are connected to corresponding inputs Electrodes ELa ', ELb', ... , ELf '. Thus, each wire probe and the corresponding input electrode ELa ', ELb', ... , And ELf '. As a result, the test signal sent from the test signal generator 160 is input to the input electrodes ELa ', ELb', ..., ELb 'of the circuit board FX1. , ELf '.

(Sensor substrate)

1, when the circuit board FX1 is disposed between the first and second penetration supporting portions 110 and 120, the sensor substrate 121 is provided with the electrodes to be inspected ELa, ELb, ..., , And ELf from above (a region indicated by a broken line A).

3 (a) is a plan view of the sensor substrate 121 viewed from the side of the surface on which the sensor electrode 122 is provided. 3 (a), when the circuit board FX1 is disposed between the first penetration supporting portion 110 and the second penetration supporting portion 120, the sensor electrodes 122a, 122b, ..., The electrodes to be inspected ELa, ELb, ... , And ELf (regions indicated by broken lines Aa, Ab, ..., and Af), respectively. Thus, when the circuit board FX1 is held between the first and second fitting supporting portions 110 and 120 (see FIG. 4), the electrodes to be inspected ELa, ELb, ... ELf and the corresponding sensor electrodes 122a, 122b, ..., 122f capacitively couple with each other.

Further, the plurality of sensor electrodes 122 are shielded from each other electromagnetically. For example, a shield electrode 123 having a shape surrounding each of the sensor electrodes 122 is provided on the sensor substrate 121. When the sensor substrate 121 is provided on the second fitting supporting portion 120, the shield electrode 123 is grounded (see Fig. 1). With this configuration, each of the sensor electrodes 122 is capacitively coupled to the adjacent electrodes EL to be inspected (for example, the electrodes to be inspected ELa, ELc for the sensor electrode 122b), and unnecessary electric signals It is possible to prevent connection.

3B is a plan view of the sensor substrate 121 viewed from the opposite side of the surface on which the sensor electrode 122 is provided. As shown in Fig. 3 (b), the sensor electrodes 122a, 122b, ..., 122f are electrically connected to each other by wiring. A plurality of electrically connected sensor electrodes 122 are electrically connected to the signal processing circuit 140. The electrical signal detected by the sensor electrode 122 is sent to the signal processing circuit 140 (also, in Fig. 1, the electrical connection between the sensor electrode 122a and the signal processing circuit 140 Only).

3 (b), the sensor electrodes 122 and the wiring of the signal processing circuit 140 may not be connected to all the sensor electrodes 122 in common. For example, the sensor electrodes 122 may be divided into several groups (for example, groups 122a, 122b, and 122c, groups 122d, 122e, and 122f) and wired to the signal processing circuit 140 for each group .

Returning to Fig. 1, when the sensor substrate 121 is mounted on the second fitting portion 120, the surface of the sensor electrode 122 becomes flat with the second fitting surface 124. With this configuration, the surface of the sensor electrode 122 can be brought into contact with the surface of the protection member CL1 when the non-contact type inspection is performed.

(drive)

The driving device 130 is configured to move the first and second fitting supporting portions 110 and 120 in a direction perpendicular to the first fitting supporting surface 113 and the second fitting supporting surface 124 Direction direction arrow). Thereby, the circuit board FX1 is disposed between the first and second fitting supporting portions 110 and 120 spaced apart from each other, and then the first fitting supporting portion 110 and the second fitting supporting portion 120 are brought close to each other The circuit board FX1 is inserted and supported between the first and second fitting supporting portions 110 and 120 so as to perform the noncontact inspection in this state. Thereafter, the first fitting supporting portion 110 The circuit board FX1 that has been inspected can be recovered by separating the second fitting supporting portion 120 again.

(Test signal generator)

Returning to Fig. 1, the test signal generator 160 receives an instruction from the measuring means 170, generates a test signal, and transmits it to the signal input means 125. Fig. The test signal is, for example, a pulse signal of a predetermined period.

(Signal processing circuit)

The signal processing circuit 140 receives the electric signal detected by the sensor electrode 122, performs signal processing such as amplification, and transmits it to the A / D converter 150. [ The signal processing circuit 140 includes an analog signal amplification circuit formed of, for example, an OP amplifier or the like.

(A / D converter)

The A / D converter 150 performs a preprocessing so that the measuring means 170 can acquire an electric signal processed by the signal processing circuit 140. That is, the A / D converter 150 receives the analog signal processed by the signal processing circuit 140, converts it into a digital signal, and transmits it to the measuring means 170.

(Measuring means)

The measuring means 170 is formed including a computer system. The computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory or a hard disk. The measuring means 170 includes an interface capable of communicating with a device external to the computer system. The measuring means 170 collectively controls the operation of various devices constituting the inspection apparatus 10. [

The measuring means 170 instructs the test signal generator 160 to acquire the electric signal digitally converted by the A / D converter 150, while indicating the waveform and timing of the test signal to be generated.

(First fitting supporting portion)

The first fitting supporting portion 110 includes a supporting base 111 and an elastic member (inter-electrode distance adjusting portion) 112. The first fitting support portion 110 has a first fitting face 113.

(Elastic member)

The elastic member 112 is a sheet-like member formed of a material having elasticity. The size of the elastic member 112 is equal to or larger than the size of the sensor substrate 121. The thickness of the elastic member 112 is preferably a thickness capable of being elastically deformed to a maximum stroke or more equal to the sum of the concavities and convexities of the upper surface of the support table 111 and the undersurface of the sensor substrate 121, to be.

The elastic member 112 is provided on the first fitting supporting portion 110 so as to face the second fitting supporting surface 124. The region where the elastic member 112 is provided in the first fitting face 113 is a region facing the sensor substrate 121, that is, a region where the first fitting face 113 is viewed from above, As shown in FIG.

The elastic member 112 is provided on the support base 111 such that the surface of the elastic member 112 protrudes slightly from the first fitting face 113. The protruding height is such that the surface of the elastic member 112 becomes the same surface as the first fitting surface 113 when the circuit board FX1 is inserted and supported. As a result, when the circuit board FX1 is inserted and supported, the concavity and convexity of the upper surface of the support table 111 can be absorbed by the elastic member 112. [

As the material having elasticity, for example, an elastomer such as natural rubber or synthetic rubber, or a foamed plastic such as foamed urethane can be used. As the elastomer, various materials such as styrene butadiene rubber, isoprene rubber, butadiene rubber, chloroprene rubber, acrylonitrile butadiene rubber, butyl rubber, ethylene propylene rubber, urethane rubber and fluorine rubber can be used.

Conventionally, a support base 111 made of a metal or a resin material having a flat fitting surface has been used as the first fitting support portion 110. However, in order to planarize the fitting surface of the support table 111, irregularities of about several tens of micrometers in the thickness direction locally can not be avoided even if the surface is subjected to polishing or the like.

Particularly, when the circuit board FX1 is a flexible board, if the circuit board FX1 is supported by the support base 111 and the second fitting support portion 120, the circuit board FX1 is brought into close contact with the fitting surface of the support base 111. [ As a result, a concave portion (convex portion) is locally generated also on the upper surface of the protective member CL1 just above the concave portion (convex portion) of the fitting surface.

As a result, there is a fear that an air layer (air gap) is formed between the surface of the sensor substrate 121 and the protection member CL1 at the position where the recess is formed on the upper surface of the protection member CL1. Since the thickness of the protective member CL1 of the circuit board FX1 is several μm to several hundreds of μm, the average permittivity between the electrodes EL to be inspected and the sensor electrodes 122 just above the recesses on the fitting surface of the support table 111 is, It is lower than other positions. As a result, the electrical signal detected by the sensor electrode 122 immediately above the recessed portion of the fitting surface of the support table 111 becomes smaller than other positions. In addition, there is a possibility that an air layer (air gap) is formed likewise by the irregularities of the circuit board FX1 and the irregularities of the surface of the sensor substrate 121. [

According to the inspection apparatus 10 using the inspection jig 100 of the present embodiment, when the circuit board FX1 is held between the first and second fitting supporting portions 110 and 120, And the distance between the corresponding electrodes to be inspected EL are automatically adjusted by the pressing of the sensor substrate 121. [

As a result, the irregularities of the support base 111, the irregularities of the circuit board FX1, and the irregularities of the surface of the sensor substrate 121 (hereinafter sometimes referred to as " irregularities of the support base 111 & , The sensor electrode 122 can be brought into close contact with the protective member CL1, so that it is possible to suppress the accuracy of the inspection value and the decrease in the repeat stability.

More specifically, according to the inspection apparatus 10 using the inspection jig 100 of the present embodiment, when the sensor substrate 121 is pressed against the circuit board FX1, the elastic member 112 are elastically deformed. As a result, the concave and convex portions of the supporting table 111 and the like are absorbed by the elastic member 112. Thereby, since the circuit board FX1 can be suppressed from being bent following the protrusions and depressions of the support base 111, the upper surface of the protection member CL1 is kept flat. As a result, since the sensor electrode 122 can be brought into close contact with the protective member CL1, it is possible to suppress the accuracy of the inspection value and the decrease in the repetitive stability.

In this embodiment, as shown in Figs. 5A and 5B, the elastic member 112 may be formed of a plurality of different materials. Therefore, the sensor electrode 122 and the protection member CL1 can be brought into closer contact with each other as described below.

For example, as shown in Fig. 5A, the elastic member 112 may be formed of a different material depending on the area in the surface. Specifically, in the elastic member 112, the electrodes to be inspected ELa, ELb, ... , The position Aa, Ab, ... where ELf is disposed ... The first member 112b formed of a material having a relatively high modulus of elasticity and the second member 112b formed of a material having a relatively low modulus of elasticity 112a may be provided, respectively.

Depending on the configuration of the second fitting supporting portion 120 or the mechanism of the driving device 130, a pressure distribution depending on the position in the surface of the sensor substrate 121 may occur. This pressure distribution becomes more prominent when the sensor substrate 121 and the elastic member 112 have a somewhat large area. In this case, when the elastic member 112 is pressed by the sensor substrate 121, the degree of contraction depends on the position in the surface of the elastic member 112. As a result, even if the local irregularities of the first fitting surface 113 are absorbed by the elastic member 112, comprehensive deformation may occur due to the shrinkage non-uniformity of the elastic member 112. In this case also, the capacitance may be lowered or the capacitance may be unstable, and further, the accuracy of the inspection value and the repetitive stability may be reduced.

According to the configuration shown in Fig. 5A, the first member 112b formed of a material having a relatively high elastic modulus is disposed in a region limited to a region corresponding to a position where the electrodes to be inspected EL are arranged. As a result, since the area of the material having a relatively high elastic modulus is small, it is possible to reduce the above-mentioned comprehensive strain that occurs when the elastic member 112 is pressed by the sensor substrate 121. As a result, the protection member CL1 and the sensor electrode 122 can be made closer to each other just above the electrodes EL to be inspected.

Although the first member 112b is provided for each sensor electrode in the example shown in FIG. 5A, for example, the sensor electrode 122 may be divided into several groups (for example, 122a and 122b 122c, 122c, 122d, 122e, and 122f) and the first member 112b may be provided for each group.

5 (b), for example, the elastic member 112 may be formed of a different material in the thickness direction. Specifically, it may include a first layer 112c formed of a material having a relatively high elastic modulus and a second layer 112d formed of a material having a relatively low modulus of elasticity. The first layer 112c is brought into contact with the circuit board FX1 toward the first fitting supporting portion 110 side when the elastic member 112 is provided on the first fitting supporting portion 110. [

According to the configuration shown in FIG. 5B, the first layer 112c formed of a material having a relatively high elastic modulus is used as the layer contacting the circuit board FX1. When the circuit board FX1 is inserted and supported, the circuit board FX1 Can be absorbed. At the same time, when the circuit board FX1 is inserted and held by the second layer 112d formed of a material having a relatively low modulus of elasticity, the layer on the side of the first fitting supporting portion 110 can be formed, It is possible to absorb the inclination with respect to the first end 113.

In the present embodiment, the signal input means 125 is provided in the second fitting support portion 120, but the present invention is not limited to this configuration. For example, the signal input means 125 may be provided in the first fitting support portion 110. With this configuration, even when the input electrode EL 'is provided on the surface (the lower surface in FIG. 1) opposite to the test substrate EL and the substrate SB, a test signal is inputted to the input electrode EL' .

In the present embodiment, the signal input means 125 is a wire probe which contacts the input electrode EL ', but the present invention is not limited to this configuration. For example, the signal input means 125 may be an electrode opposing the input electrode EL ', like the sensor electrode 122. With this configuration, even when the input electrode EL 'is covered with the protection member CL1, the test signal is transmitted in a non-contact manner from the signal input means 125 capacitively coupled to the input electrode EL' It is possible to detect an electric signal in a non-contact manner by the sensor electrode 122 coupled to the sensor electrode 122. [

In the present embodiment, the signal input means 125 is a plurality of wire probes provided corresponding to each of the plurality of input electrodes EL ', but the present invention is not limited to this configuration. For example, the signal input means 125 may be a single wire probe that is movably installed in the second fitting support portion 120 and can be controlled by the measuring means 170. Thereby, it is not necessary to change the members constituting the signal input means 125 in accordance with the shape of the conductor pattern (arrangement of the plurality of input electrodes EL ').

In the present embodiment, both of the first fitting portion 110 and the second fitting portion 120 are movable, but the present invention is not limited to this configuration. For example, even if the first penetration support part 110 is fixed and the second penetration support part 120 is movable, or even if the second penetration support part 120 is fixed and the first penetration support part 110 is movable do. This reduces the manufacturing cost and the maintenance cost of the apparatus because the number of movable parts is reduced.

In this embodiment, the driving device 130 is configured so that the first fitting support portion 110 and the second fitting supporting portion 120 are orthogonal to the first fitting face 113 and the second fitting face 124, However, the present invention is not limited to this configuration. For example, it is possible to relatively move the first fitting support portion 110 and the second fitting supporting portion 120 in a direction parallel to the first fitting face 113 and the second fitting face 124, And a positioning means may be included. This makes it possible to position the first penetration supporting portion 110 and the second penetration supporting portion 120 so that the corresponding sensor electrode 122 is disposed immediately above the inspected electrode EL of the circuit board FX1, .

In the present embodiment, the elastic member 112 is disposed on the lower side of the circuit board FX1, and the sensor electrode 122 is disposed on the upper side of the circuit board FX1 (see Fig. 1). For example, the elastic member 112 may be disposed on the upper side of the circuit board FX1, and the sensor electrode 122 may be disposed on the lower side of the circuit board FX1. In one region of the circuit board FX1, an elastic member 112 is arranged on the lower side of the circuit board FX1, a sensor electrode 122 is arranged on the upper side of the circuit board FX1, The elastic member 112 may be disposed on the circuit board FX1, and the sensor electrode 122 may be disposed on the lower side of the circuit board FX1. Thereby, even when the electrodes EL to be inspected of the circuit board FX1 are provided on the side different from the input electrode EL ', the contactless inspection can be performed. Further, for example, even if the sensor electrode 122 is arranged on the surface side of the circuit board FX1 because there is an obstacle such as wiring between the surface of the circuit board FX1 and the electrode EL to be inspected, The non-contact inspection can be performed by arranging the sensor electrode 122 on the back side of the substrate FX1.

(method of inspection)

Hereinafter, a method of inspecting a circuit board using the inspection apparatus 10 of the present embodiment will be described. A method of inspecting a circuit board using the inspection apparatus 10 includes a placement step, a fitting step, a signal input step, a signal processing step, and a measurement step.

(Batch step)

In the arranging step, the circuit board FX1 is disposed between the first and second fitting supporting portions 110 and 120 spaced apart from each other. When the testing apparatus 10 includes the above-described positioning means, the first interposing supporting portion 110 and the second interposing supporting portion 110 are formed so that the corresponding sensor electrodes 122 are disposed immediately above the electrodes EL to be inspected, The position of the support portion 120 is adjusted.

(Fitting step)

In the fitting step, the first and second fitting supporting portions 110 and 120 are moved by using the driving device 130, and the first fitting supporting portion 110 and the second fitting supporting portion 120 are combined with each other, Supports insertion of FX1. At this time, the signal input means 125 is inserted into the gap G 'and contacts the input electrode EL'. Each of the sensor electrodes 122 is capacitively coupled to the corresponding electrodes under test EL.

In the fitting step, the distance between each of the sensor electrodes 122 and the corresponding electrode under test EL is automatically adjusted by the pressure of the sensor substrate 121. As a result, the sensor electrode 122 can be brought into close contact with the protective member CL1.

More specifically, when the sensor substrate 121 is pressed against the circuit board FX1, the elastic member 112 is elastically deformed by the pressure of the sensor substrate 121. [ As a result, the protrusions and depressions of the support base 111 are absorbed by the elastic member 112. Thereby, since the circuit board FX1 can be suppressed from being bent following the protrusions and depressions of the support base 111, the upper surface of the protection member CL1 is kept flat. As a result, the sensor electrode 122 comes into close contact with the protection member CL1.

When the elastic member 112 is formed of a plurality of different materials, it is possible to make the sensor electrode 122 and the protection member CL1 more closely contact with each other.

For example, when the elastic member 112 is formed of a different material depending on the area in the surface (refer to FIG. 5A), when the circuit board FX1 is inserted and held, The elastic deformation of the elastic member 112 is suppressed. As a result, it is possible to suppress the occurrence of comprehensive deformation, so that the adhesion between the sensor electrode 122 and the protection member CL1 can be enhanced.

Further, when the elastic member 112 is formed of a material different in the thickness direction (refer to FIG. 5 (b)), when the circuit board FX1 is inserted and held, the elastic member 112 is formed of a material having a relatively high elastic modulus The first layer 112c absorbs the irregularities of the circuit board FX1 and the second layer 112d formed of a material having a relatively low elastic modulus is applied to the first fitting face 113 of the entire circuit board FX1 It is possible to absorb the slope.

(Signal input step)

The measuring means 170 indicates to the test signal generator 160 the waveform or timing of the test signal.

The test signal generator 160 generates a test signal, transmits it to the signal input means 125, and inputs a test signal to the input electrode EL '. By the input of the test signal, the capacitor is formed by the electrodes EL to be inspected and the sensor electrode 122, and the voltage of the sensor electrode 122 changes.

(Signal processing step)

The signal processing circuit 140 receives the electrical signal detected by the voltage at the sensor electrode 122 and performs signal processing such as amplification. And transmits the electric signal obtained in the signal processing to the A / D converter 150. The A / D converter 150 performs preprocessing (digital conversion) so that the measuring means 170 can acquire the electric signal obtained in the signal processing.

(Measurement step)

The measuring means 170 acquires an electric signal that has been preprocessed by the A / D converter 150. By analyzing the data of the obtained electric signal together with the waveform and timing data of the test signal instructed to the test signal generator 160, it is possible to determine whether there is a disconnection between the inspected electrode EL and the input electrode EL ' . ≪ / RTI >

In the inspection method according to the present embodiment, the distance between each of the sensor electrodes 122 and the corresponding to-be-inspected electrode EL is automatically adjusted by pressing the sensor substrate 121. As a result, since the sensor electrode 122 can be brought into close contact with the protective member CL1, it is possible to suppress the precision of the inspection value and the repetitive stability in the noncontact inspection.

[Second Embodiment]

Hereinafter, a second embodiment of the present invention will be described with reference to Figs. 6 to 10. Fig. Hereinafter, the same elements as those of the first embodiment are denoted by the same reference numerals, and a detailed description thereof will be omitted.

6 is a side view schematically showing the entire configuration of the inspection apparatus 20 of the circuit board together with the circuit board FX2 to be inspected. 7 is a plan view of the circuit board FX2. 8 is a plan view of the inspection probe support portion 221. Fig. FIG. 9A is a cross-sectional view of an inspection probe, and FIGS. 9B to 9E are side views showing variation of an inspection probe. 10 is a side view showing a state in which the circuit board FX2 is sandwiched between the first and second fit-in support portions 110 and 220. FIG. A signal processing circuit 140, an A / D converter 150, a test signal generator 160, and a measuring unit 170, which are components common to the first embodiment, , Omit the city.

The second embodiment differs from the first embodiment in that the protective member CL2 of the circuit board FX2 to be inspected is thinly formed in the vicinity of the electrodes EL to be inspected and corresponding to this point, ) Includes an inspection probe 222. Therefore, the structure of the protection member CL2 and the configuration of the inspection probe 222 will be mainly described below.

(Circuit board)

6 and 7, the circuit board FX2 inspected by the inspection apparatus 20 includes a substrate SB, a plurality of inspected electrodes EL, a plurality of wirings LD, a plurality of input electrodes EL ' And a protective member CL2.

(Protective member)

The protective member CL2 includes a first protective layer CL21 laminated on the substrate SB and a second protective layer CL22 laminated on the first protective layer CL21.

The first protection layer CL21 forms the base of the protection member CL2 and protects the electrodes EL and the wiring LD to be inspected by soldering, heat, moisture and the like, and supports the second protection layer CL22. The first protective layer CL21 is formed of, for example, polyimide. The thickness of the first protective layer CL21 is several 탆 to several hundred 탆. The second protective layer CL22 is formed of, for example, plastic such as polyimide or PET. The thickness of the second protective layer CL22 is several 탆 to several hundred 탆. The second protective layer CL22 may be formed of another wiring layer or a shielding material.

The first protection layer CL21 and the second protection layer CL22 are removed in the vicinity of the input electrode EL '. Thereby, a gap G 'having the input electrode EL' on the bottom face is formed, and the signal input means 225 can make contact with the input electrode EL '. The configuration of the signal input means 225 may be the same as that of the signal input means 125 in the first embodiment.

In the vicinity of the inspected electrode EL, only the second protective layer CL22 is removed, and only the first protective layer CL21 covers the electrodes EL to be inspected. As a result, voids G (Ga, Gb, ..., Gf) having the top surface of the first protective layer CL21 as the bottom surface are formed on the top of the electrodes ELa, ELb, ..., ELf to be inspected. The depth of G is several 탆 to several hundred 탆, which is equal to the thickness of the second protective layer CL22.

(Second fitting supporting portion)

The inspection jig 200 according to the present embodiment includes a first penetration supporting portion 110 and a second penetration supporting portion 220. 6 and 10, a plurality of inspection probes (inter-electrode distance adjustment units) 222 and signal input means 225 are provided in the second fitting supporting portion 220. [ The tip end (detection electrode) 223 (see FIG. 9A) of the plurality of inspection probes 222 protrudes from the second fitting surface 224 of the second fitting support portion 220. The inspection probe 222 is provided on the second fitting supporting portion 220 so as to face the inspection target electrode EL when the circuit board FX2 is disposed between the first fitting supporting portion 110 and the second fitting supporting portion 220. [

(Inspection probe)

The tip 223 of the test probe 222 is reciprocatable in a direction substantially perpendicular to the second fitting surface 224. [ This allows the tip 223 of the inspection probe 222 to be brought into close contact with the first protective layer CL21 in accordance with the depth of the gap G since the inspection probe 222 has a constant stroke. As a result, it is possible to suppress the accuracy of the inspection value and the reduction of the repetitive stability in the noncontact inspection.

The tip 223 of the inspection probe 222 is a probe pin 2223 pressed by a spring (pressing member) 2222, for example. 9A, the inspection probe 222 is configured such that a pair of probe pins 2223 and 2224 pressed by, for example, a spring 2222 are mounted on a cylindrical housing 2221 Lt; / RTI > Thereby, when the inspection probe 222 is pressed in the up and down direction, the spring 2222 is shrunk, and the pair of probe pins 2223 and 2224 approach each other. The spring 2222 and the pair of probe pins 2223 and 2224 are formed of a conductive material (e.g., metal). Thereby, one probe pin 2223 and the other probe pin 2224 are electrically connected to each other with the spring 2222 interposed therebetween.

The cross-sectional diameter of the probe pin 2223 is several tens of micrometers to several hundreds of micrometers. As shown in Figs. 9 (b) to 9 (e), the probe pin 2223 can take various shapes. Since the probe pin 2223 is pressed by the spring 2222, the probe pin 2223 presses the first protective layer CL21. That is, the distance between each of the probe pins 2223 (tip 223) of the test probe 222 and the corresponding non-test electrode EL is automatically adjusted by the pressing force of the spring (pressing member) 2222. As a result, the probe pin 2223 (tip end 223) can securely come into close contact with the first protective layer CL21.

The capacitance of the parallel flat plate capacitor is proportional to the area of the electrode. In order to increase the capacitance of the capacitor formed by the probe pin 2223 and the EL EL to be inspected, the bottom area of the tip end of the probe pin 2223 As shown in FIG. For example, it is conceivable to form the probe pin 2223 into a columnar shape as shown in FIG. 9B (in this case, the corner portion of the probe pin 2223 may be flattened so as not to damage the protective member CL2) It is preferable to perform chamfering so as not to damage the substrate.

In general, the area of the inspecting electrode EL is approximately equal to the cross-sectional diameter of the probe pin 2223, and therefore, the configuration of FIG. 9B is the optimum configuration. 9 (c), if the probe pin 2223 is made in a piston shape and is inspected with a single probe pin 2223, It is also conceivable to enlarge the area facing the electrode EL.

9 (d) or the needle shape shown in Fig. 9 (e) can be used for noncontact inspection because they are capacitively coupled to the electrodes to be inspected to some extent. In order to prevent the corner portion from damaging the protective member CL2, the shape of FIG. 9 (d) is preferable to the shape of FIG. 9 (e).

A wire connected to the signal processing circuit 140 is wired to the probe pin 2224 as described later. For this reason, the shape of the probe pin 2224 may be a needle shape.

Referring back to Figs. 6 and 10, the inspection probe 222 is supported by the inspection probe support portion 221 provided below the second fitting support portion 220. [ The inspection probe support portion 221 is a plate-like member formed of, for example, an insulator such as plastic, and is mounted such that the inspection probe 222 traverses in the thickness direction.

The lengths of the inspection probes 222a, 222b, ..., 222f protruding from the inspection probe supporting portion 221 are the same as the lengths of the electrodes to be inspected ELa, ELb, ..., , Voids Ga, Gb, ... formed above the ELf ... , And the stroke of the inspection probe 222 is made to be a length corresponding to the depth of the gap G. In this case, 10, when the circuit board FX2 is held between the first fitting surface 113 and the second fitting surface 224, the tip end 223 of the inspection probe 222 is inclined, And is capacitively coupled to the electrodes EL to be inspected through the first protective layer CL21. As a result, an electrical signal can be detected in a noncontact manner.

The inspection probes 222a, 222b, ..., and 222f provided on the inspection probe support portion 221 when the inspection probe support portion 221 is viewed from the plane are arranged in the same plane as the first probe support portion 110, The electrodes to be inspected ELa, ELb, ... of the circuit board FX2 arranged between the two fit- , The area Aa, Ab, ... , And Af, respectively.

When the distance between adjacent inspection probes 222 is short, there is a possibility that the inspection probe 222 is also capacitively coupled to the adjacent electrodes to be inspected EL and connected to unnecessary electric signals. In order to prevent this, a plurality of inspection probes 222 are electromagnetically shielded from each other. For example, a shield electrode 226 having a shape surrounding each of the inspection probes 222 is provided in the inspection probe support portion 221. The shield electrode 226 is grounded when the inspection probe support portion 221 is provided in the second fitting support portion 220 (see FIG. 6).

As shown in Fig. 6, wires are wired in the probe pin 2224 on the opposite side of the circuit board FX2 of the inspection probe 222 provided in the inspection probe support portion 221. [ The wire is connected to the signal processing circuit 140. Thereby, the electric signal detected at the probe pin 2223 (leading end 223) is transmitted to the signal processing circuit 140 via the spring 2222 and the probe pin 2224 in the inspection probe 222 do.

The probe pins 2224 and the wiring of the signal processing circuit 140 may not be connected to all the probe pins 2224 in common. For example, the probe pins 2224 may be divided into several groups and wired to the signal processing circuit 140 for each group.

The configuration for connecting the probe pin 2224 to the signal processing circuit 140 is not limited to the above configuration. For example, when the inspection probe support portion 221 provided with the inspection probe 222 is installed in the second fitting support portion 220, the signal processing circuit 140 is connected to the position where the probe pin 2224 protrudes The auxiliary electrode may be disposed. The probe pins 2224 pressed by the springs 2222 are pressed against the respective probe probes 222 in order to press the auxiliary electrodes when the probe supporting portions 221 are installed in the second fitting supporting portions 220. [ It is possible to reliably make electrical contact between the corresponding auxiliary electrodes.

According to the inspection apparatus 20 using the inspection jig 200 of the present embodiment, the tip 223 (the probe pin 2223) of the inspection probe 222, which is inserted into the gap G formed above the inspection target electrode EL, ) Can be used as a detection electrode, the detection electrode can be brought into close contact with the first protection layer CL21 and capacitively coupled to the electrodes to be inspected. As a result, when the circuit board FX2 is jig supported, since the air layer (gap G) exists between the detection electrode and the inspection target electrode EL, the capacitance between both electrodes decreases and the accuracy of the inspection value decreases .

According to the inspection apparatus 20 using the inspection jig 200 of the present embodiment, when there is a step that can not be followed by the elastic member 112 in the vicinity of the sensor electrode 122 of the first embodiment, that is, The probe pin (detection electrode) 2223 can be brought into close contact with the first protective layer CL21 even when the sensor electrode 122 can not be brought into close contact with the protective member by the elastic member 112 alone. Therefore, it is possible to suppress the accuracy of the inspection value and the reduction of the repetitive stability in the non-contact inspection.

In the present embodiment, the electrodes to be inspected are inspected by one probe pin, but the present invention is not limited to this configuration. For example, for a large-area electrode, the inspection probe 222 is supported by the inspection probe support portion 221 such that a plurality of probe pins are disposed within the area. Further, these inspection probes 222 are electrically connected to each other. With this configuration, it is possible to transmit the electric signal detected by the wide area electrode to the signal processing circuit 140 together with the electric signal detected by the probe pin. Further, since the same probe pins (for example, the shape of Fig. 9 (b)) are arranged in different numbers in accordance with the area of the electrodes, probe pins having different shapes (for example, (c)). As a result, the manufacturing cost and the maintenance cost of the inspection apparatus can be reduced.

[Third embodiment]

Hereinafter, a third embodiment of the present invention will be described with reference to Figs. 11 and 12. Fig. Hereinafter, elements common to those of the first and second embodiments are denoted by the same reference numerals, and a detailed description thereof will be omitted.

11 is a side view schematically showing the entire configuration of the inspection apparatus 30 of the circuit board together with the circuit board FX2 to be inspected. 12 is a side view showing a state in which the circuit board FX2 is sandwiched between the first fitting portion 310 and the second fitting portion 220. [ 11 and 12, the drive unit 130, the signal processing circuit 140, the A / D converter 150, the test signal generator 160, and the measurement unit 170, which are components common to the first embodiment, , Omit the city.

The noncontact inspection may be performed under a high temperature environment (for example, 50 to 150 DEG C). In this case, if an elastic member formed of an elastomer is provided on the first fitting supporting portion, there is a possibility that the elastic member and the adhesive for fixing the elastic member to the first fitting supporting portion are melted and the inspection jig is damaged.

The inspection jig 300 according to the present embodiment includes a first penetration support portion 310 and a second penetration support portion 220. In the first fitting portion 310, no elastic member is used. The first penetration supporting portion 310 is, for example, a metal support plate whose upper surface is planarized. In this case, as described in the first embodiment, concaves and convexes on the order of several tens of micrometers may be generated on the upper surface of the first fitting support portion 310. However, irrespective of the presence or absence of the irregularities, the inspection probe provided on the second fitting supporting portion 220 appropriately elongates the probe pin when the second fitting supporting portion 220 is pressed against the circuit board FX2 (see Fig. 12) It can be brought into close contact with the protective member immediately above the corresponding inspected electrode. Therefore, it is possible to suppress the accuracy of the inspection value and the reduction of the repetitive stability in the non-contact inspection.

According to the inspection apparatus 30 using the inspection jig 300 according to the present embodiment, when the circuit board FX2 is inspected under a high-temperature environment, the sensor electrode is brought into close contact with the protective member only by using the inspection probe without using the elastic member . In this case, since the heat source for heating can be brought close to the first fitting support portion 310 as well as the second fitting support portion 220, the heating efficiency is good and the temperature can be easily controlled.

While the preferred embodiments of the present invention have been described with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these examples. The configurations and combinations of the constituent members shown in the above-described examples are merely examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

CL1, CL2: Protection member
EL (ELa, ELb, ..., ELf): ELF
FX1, FX2: Circuit board
SB: Gas
10, 20, 30: Inspection device
11: circuit board interposer
12: Test signal generator
13: Electrical signal measuring unit
100, 200, 300: inspection jig
110: first fitting support
112: elastic member (distance between electrodes)
112a: second member
112b: first member
112c: first layer
112d: second layer
113: first fitting surface
120, 220: a second fitting support
122, 122a, 122b, ... , 122f: sensor electrode (detection electrode)
124, 224: second fitting surface
222: Inspection probe (distance between electrodes)
223: tip (detection electrode)
2222: spring (pressing member)
2223: probe pin

Claims (15)

1. A non-contact type inspection jig for inserting a circuit board on which an insulated protective member is laminated on a surface of a base provided with a to-be-inspected electrode on a base body,
A first fitting support portion having a first fitting surface,
And a second fitting support portion having a second fitting face disposed opposite to the first fitting face and provided with a detection electrode on the second fitting face,
And the detection electrode is brought into close contact with the protective member when the circuit board is sandwiched between the first and second fitting portions so that the electrodes to be inspected and the detection electrode face each other, An electrode-to-electrode distance adjusting unit for adjusting a distance between the first and the second fitting supporting units is provided on at least one of the first fitting supporting portion and the second fitting supporting portion,
Wherein the inter-electrode distance adjusting section includes an elastic member formed of a plurality of different materials so as to have different elastic moduli. The method according to claim 1,
A first member having a relatively high elastic modulus is provided in a region of the elastic member corresponding to a position where the electrodes to be inspected are disposed when the circuit board is fitted and supported; And two members are provided, respectively. The method according to claim 1,
Wherein the elastic member includes a first layer having a relatively high elastic modulus and a second layer having a relatively low elastic modulus. The method according to claim 1,
Wherein the inter-electrode distance adjusting section includes an inspection probe provided in the second fitting support section,
Wherein the detection electrode includes a tip of the inspection probe,
Wherein the tip of the inspection probe is protruded from the second fitting surface and is reciprocable in a direction substantially perpendicular to the second fitting surface. 5. The method of claim 4,
Wherein a tip of the inspection probe is a probe pin pressed by a pressing member. A circuit board interposer supporting unit including the non-contact type inspection jig according to any one of claims 1 to 5,
A test signal generator for generating a test signal to be input to the electrodes to be inspected;
And an electric signal measuring unit for measuring an electric signal detected by said detecting electrode. A circuit board in which an inspected electrode is provided on a base body and an insulating protective member is laminated on a surface of the base provided with the electrodes to be inspected is provided with a first interposing supporting portion having a first interposing supporting surface, And a second fitting support portion provided with a detection electrode on the second fitting support face, the fitting projection having a second fitting face disposed to be opposed to the second fitting face,
A signal input step of inputting a test signal to the electrodes to be inspected;
And a measuring step of measuring an electric signal detected by a detection electrode disposed opposite to the electrode to be inspected through the protection member,
The distance between the detection electrode and the electrode to be inspected is adjusted so that the detection electrode is brought into close contact with the protective member in the fitting step,
Characterized in that, in the fitting step, an elastic member formed of a plurality of different materials so as to have different elastic modulus adjusts the distance between the detection electrode and the electrode to be inspected. 8. The method of claim 7,
A first member having a relatively high elastic modulus is provided in a region of the elastic member corresponding to a position where the electrodes to be inspected are disposed when the circuit board is fitted and supported; The elastic deformation of the elastic member is suppressed in a region other than the region corresponding to the position where the electrodes to be inspected are arranged when the circuit board is fitted in the fitting step, . 8. The method of claim 7,
Wherein the elastic member includes a first layer having a relatively high modulus of elasticity and a second layer having a relatively low modulus of elasticity so that irregularities of the circuit board are absorbed in the first layer in the fitting step, Wherein the inclination of the circuit board with respect to the second fitting surface is absorbed. 8. The method of claim 7,
Wherein a tip end of an inspection probe provided on the second fitting support portion is used as the detection electrode and a tip end of the inspection probe protrudes from the second fitting supporting surface and is reciprocated in a direction substantially perpendicular to the second fitting supporting surface Whereby the distance between the detection electrode and the electrode to be inspected is adjusted in the fitting step. 11. The method of claim 10,
Wherein a distance between the detecting electrode and the electrode to be inspected is adjusted in the fitting step by the tip of the inspection probe being a probe pin pressed by the pressing member. delete delete delete delete

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