KR101929072B1 - 종료점 검출을 위한 스펙트럼 피쳐의 적응적 추적 - Google Patents

종료점 검출을 위한 스펙트럼 피쳐의 적응적 추적 Download PDF

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Publication number
KR101929072B1
KR101929072B1 KR1020137030560A KR20137030560A KR101929072B1 KR 101929072 B1 KR101929072 B1 KR 101929072B1 KR 1020137030560 A KR1020137030560 A KR 1020137030560A KR 20137030560 A KR20137030560 A KR 20137030560A KR 101929072 B1 KR101929072 B1 KR 101929072B1
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South Korea
Prior art keywords
polishing
substrate
sequence
layer
values
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Korean (ko)
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KR20140025471A (ko
Inventor
제프리 드루 데이비드
도미니크 제이. 벤베뉴
보구슬로우 에이. 스웨데크
해리 큐. 리
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020137030560A 2011-04-20 2012-04-17 종료점 검출을 위한 스펙트럼 피쳐의 적응적 추적 Active KR101929072B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/090,972 2011-04-20
US13/090,972 US8751033B2 (en) 2008-11-14 2011-04-20 Adaptive tracking spectrum features for endpoint detection
PCT/US2012/033969 WO2012145336A2 (en) 2011-04-20 2012-04-17 Adaptively tracking spectrum features for endpoint detection

Publications (2)

Publication Number Publication Date
KR20140025471A KR20140025471A (ko) 2014-03-04
KR101929072B1 true KR101929072B1 (ko) 2018-12-13

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KR1020137030560A Active KR101929072B1 (ko) 2011-04-20 2012-04-17 종료점 검출을 위한 스펙트럼 피쳐의 적응적 추적

Country Status (4)

Country Link
US (1) US8751033B2 (https=)
JP (1) JP6030122B2 (https=)
KR (1) KR101929072B1 (https=)
WO (1) WO2012145336A2 (https=)

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US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9011202B2 (en) 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9289875B2 (en) 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
US9482610B2 (en) * 2012-11-12 2016-11-01 Applied Materials, Inc. Techniques for matching spectra
US20140141696A1 (en) 2012-11-21 2014-05-22 Applied Materials, Inc. Polishing System with In-Sequence Sensor
US8992286B2 (en) 2013-02-26 2015-03-31 Applied Materials, Inc. Weighted regression of thickness maps from spectral data
US9056383B2 (en) * 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
TWI675721B (zh) * 2013-07-11 2019-11-01 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6275421B2 (ja) * 2013-09-06 2018-02-07 株式会社荏原製作所 研磨方法および研磨装置
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
KR102534756B1 (ko) * 2014-07-16 2023-05-18 어플라이드 머티어리얼스, 인코포레이티드 증착 이전에 측정이 이루어지는 폴리싱
TWI807987B (zh) 2016-11-30 2023-07-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
TWI828706B (zh) * 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
TWI848121B (zh) * 2019-06-10 2024-07-11 日商東京威力科創股份有限公司 基板處理裝置、基板檢查方法及記錄媒體
JP7536039B2 (ja) * 2019-12-13 2024-08-19 株式会社荏原製作所 基板洗浄装置、研磨装置、バフ処理装置、基板洗浄方法、基板処理装置、および機械学習器
JP7671297B2 (ja) 2020-06-24 2025-05-01 アプライド マテリアルズ インコーポレイテッド 圧電圧力制御によるキャリアヘッドの研磨
US11794302B2 (en) 2020-12-15 2023-10-24 Applied Materials, Inc. Compensation for slurry composition in in-situ electromagnetic inductive monitoring
JP7585357B2 (ja) * 2021-03-03 2024-11-18 アプライド マテリアルズ インコーポレイテッド 分光モニタリング用の機械学習システム向けにトレーニングスペクトルにラベル付けするためのインシトゥモニタリング
US11919121B2 (en) 2021-03-05 2024-03-05 Applied Materials, Inc. Control of processing parameters during substrate polishing using constrained cost function

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Also Published As

Publication number Publication date
WO2012145336A2 (en) 2012-10-26
JP6030122B2 (ja) 2016-11-24
WO2012145336A3 (en) 2013-03-14
US20110256805A1 (en) 2011-10-20
KR20140025471A (ko) 2014-03-04
JP2014512690A (ja) 2014-05-22
US8751033B2 (en) 2014-06-10

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