KR101924241B1 - Cmp 패드 컨디셔닝 공구 - Google Patents

Cmp 패드 컨디셔닝 공구 Download PDF

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Publication number
KR101924241B1
KR101924241B1 KR1020137015870A KR20137015870A KR101924241B1 KR 101924241 B1 KR101924241 B1 KR 101924241B1 KR 1020137015870 A KR1020137015870 A KR 1020137015870A KR 20137015870 A KR20137015870 A KR 20137015870A KR 101924241 B1 KR101924241 B1 KR 101924241B1
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KR
South Korea
Prior art keywords
tool
cmp pad
conditioning
diamond
preform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020137015870A
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English (en)
Korean (ko)
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KR20130132480A (ko
Inventor
개리 이 룰랜드
찰스 랠리
토마스 찰스 이슬리
제임스 그레이엄
마크 슈바이처
Original Assignee
다이아몬드 이노베이션즈, 인크.
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Application filed by 다이아몬드 이노베이션즈, 인크. filed Critical 다이아몬드 이노베이션즈, 인크.
Publication of KR20130132480A publication Critical patent/KR20130132480A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020137015870A 2010-12-20 2011-12-20 Cmp 패드 컨디셔닝 공구 Expired - Fee Related KR101924241B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424870P 2010-12-20 2010-12-20
US61/424,870 2010-12-20
PCT/US2011/065970 WO2012088004A2 (en) 2010-12-20 2011-12-20 Cmp pad conditioning tool

Publications (2)

Publication Number Publication Date
KR20130132480A KR20130132480A (ko) 2013-12-04
KR101924241B1 true KR101924241B1 (ko) 2018-11-30

Family

ID=45953217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015870A Expired - Fee Related KR101924241B1 (ko) 2010-12-20 2011-12-20 Cmp 패드 컨디셔닝 공구

Country Status (8)

Country Link
US (1) US20120171935A1 (https=)
EP (1) EP2655015A2 (https=)
JP (1) JP6022477B2 (https=)
KR (1) KR101924241B1 (https=)
CN (1) CN103269831B (https=)
AU (1) AU2011349393B2 (https=)
SG (1) SG190811A1 (https=)
WO (1) WO2012088004A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101916492B1 (ko) * 2011-03-07 2018-11-07 엔테그리스, 아이엔씨. 화학 및 기계적 평탄화 패드 컨디셔너
CN104684686A (zh) * 2012-08-02 2015-06-03 3M创新有限公司 具有精确成形特征部的研磨元件、用其制成的研磨制品及其制造方法
SG11201500800XA (en) 2012-08-02 2015-04-29 3M Innovative Properties Co Abrasive element precursor with precisely shaped features and method of making thereof
JP6715006B2 (ja) 2012-08-02 2020-07-01 スリーエム イノベイティブ プロパティズ カンパニー 精密に成形された構造部を有する研磨物品及びその作製方法
SG11201608134YA (en) * 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
DE112017001938T5 (de) * 2016-04-06 2019-01-17 M Cubed Technologies, Inc. Diamantverbundwerkstoff-Konditionierer für ein CMP-Tuch
WO2018204556A1 (en) 2017-05-02 2018-11-08 M Cubed Technologies, Inc. Inert gas-assisted laser machining of ceramic-containing articles
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法
KR102880334B1 (ko) 2021-11-26 2025-10-31 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법
CN117798840A (zh) * 2023-12-28 2024-04-02 苏州赛尔科技有限公司 一种划片刀预切板及其制备方法与应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US5106393A (en) * 1988-08-17 1992-04-21 Australian National University Diamond compact possessing low electrical resistivity
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US20030109204A1 (en) * 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
KR100636793B1 (ko) * 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Ｃｍｐ 패드용 컨디셔너
EP1944125B1 (en) * 2005-08-25 2012-01-25 Hiroshi Ishizuka Tool with sintered body polishing surface and method of manufacturing the same
JP4791121B2 (ja) 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7815495B2 (en) * 2007-04-11 2010-10-19 Applied Materials, Inc. Pad conditioner
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法
JP5311178B2 (ja) * 2007-10-15 2013-10-09 株式会社ニコン 研磨装置及び研磨装置における研磨パッドのドレス方法
WO2009064345A2 (en) * 2007-11-14 2009-05-22 Saint-Gobain Abrasives, Inc. A chemical mechanical planarization pad conditioner and methods of forming thereof
US20090224370A1 (en) 2008-03-10 2009-09-10 Slutz David E Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
JP2010125567A (ja) * 2008-11-28 2010-06-10 Mitsubishi Materials Corp Ｃｍｐパッドコンディショナー
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법

Also Published As

Publication number Publication date
US20120171935A1 (en) 2012-07-05
WO2012088004A2 (en) 2012-06-28
JP6022477B2 (ja) 2016-11-09
AU2011349393B2 (en) 2016-11-10
AU2011349393A1 (en) 2013-06-06
CN103269831B (zh) 2017-06-09
WO2012088004A3 (en) 2012-12-13
SG190811A1 (en) 2013-07-31
KR20130132480A (ko) 2013-12-04
EP2655015A2 (en) 2013-10-30
CN103269831A (zh) 2013-08-28
JP2014504458A (ja) 2014-02-20

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