KR101887151B1 - Diffusion bonding apparatus - Google Patents

Abstract

The present invention relates to a diffusion bonding apparatus, which uniformly heats the entire bonding surface of a body to be bonded to minimize a heating time and prevent an unbonded defect so as to provide excellent bonding quality. According to the present invention, the diffusion bonding apparatus comprises: a chamber having a bonding space to bond a body to be bonded; a first pressing electrode to press one surface of the body to be bonded and to be electrically connected; a second pressing electrode formed to face the first pressing electrode to press or support the other surface of the body to be bonded, and being electrically connected; a first heating body formed between the first pressing electrode and the body to be bonded to be heated by electric conduction of the first pressing electrode; a second heating body formed between the second pressing electrode and the body to be bonded to be heated by electric conduction of the second pressing electrode; a third heating body physically in contact with the first and second heating bodies on a side direction of the body to be bonded, and heating by electrically connecting to the first and second heating bodies; and power supply unit to apply the electricity between the first and second pressing electrodes.

Description

[0001] Diffusion bonding apparatus [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diffusion bonding apparatus, and more particularly, to a diffusion bonding apparatus capable of achieving excellent bonding quality by uniformly heating a bonding surface of a bonded object to minimize heating time and preventing unfavorable bonding.

In general, solid phase bonding is a technique of unifying the bonded body in a solid state unlike the conventional fusion welding. This technology is a technique that can maximize the characteristics of integrated parts by minimizing the occurrence of defects in the joints by preserving the inherent characteristics of the bonded body by preventing or minimizing the melting of the bonded body. The development of new metal materials such as composite materials and the development of high-tech industries have led to the development of the solid-state welding technology, which is why the existing fusion welding technology requires materials that can not be bonded, materials with complex shapes, high quality and precision It becomes possible to join the material to be welded.

Such solid-state bonding techniques include friction bonding using friction heat, brazing using an inserted metal, and diffusion bonding using atom diffusion phenomenon. The diffusion bonding is a method of bonding in a solid state by applying a pressure to such a degree as not to cause large plastic deformation of the bonded body at a high temperature at which the bonded body is not melted.

At this time, temperature, pressing force and the like are controlled according to the degree of allowable plastic deformation of the bonded object, and the minimum temperature, pressing force, and heating time are applied so that sufficient bonding is ensured for minimizing thermal deformation of most bonded products. In particular, ultra-precision products such as molds designed for cooling channels are classified as defective even if only 0.1 mm of thermal deformation is generated.

However, such a conventional diffusion bonding apparatus has a problem in that it takes a long time to place the heater in the chamber wall and charge the bonded body therein. That is, since the heating is started by radiant heat at the edge of the joining portion (the surface portion of the member to be bonded) and the heat is conducted to the inside of the cold, it is in thermal contact with the upper and lower pressing members that maintain the pressing state. It was necessary to simultaneously perform the heating operation.

Therefore, in order to heat the bonded body, not only the upper and lower pressing bodies but also all the components in the chamber must be heated at the same time, and therefore, the high temperature state must be maintained for 2 hours or more. In this case, there is a problem in that excessive joining and thermal deformation at the surface portion of the product, which is exposed to radiant heat, can not be avoided in order for the heat to be transferred to the inside and complete bonding to the center of the body.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, and it is an object of the present invention to provide a heating element capable of generating heat by the application of the upper and lower pressing electrodes on the upper and lower sides and side surfaces of the member to be bonded, And it is an object of the present invention to provide a diffusion bonding apparatus capable of preventing a thermal deformation or an excessive bonding at the time of diffusion bonding of a bonded object by heating more uniformly by heating. However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, a diffusion bonding apparatus is provided. The diffusion bonding apparatus includes: a chamber in which a bonding space to which a bonded body is bonded is formed; A first pressurizing electrode which can pressurize one side of the bonded object and to be electrically energized; A second pressing electrode formed opposite to the first pressing electrode to press or support the other surface of the bonded object and to be electrically energized; A first heating element formed between the first pressing electrode and the member to be bonded and capable of generating heat by energization of the first pressing electrode; A second heating element formed between the second pressing electrode and the member to be bonded and capable of generating heat by energization of the second pressing electrode; A third heating element which is formed on the side of the bonded body so as to be in physical contact with the first heating element and the second heating element and which is energized with the first heating element and the second heating element to generate heat; And a power unit for applying electricity between the first pressurizing electrode and the second pressurizing electrode.

The diffusion bonding apparatus may further include a first insulating layer formed on a contact surface between the bonded object and the first heating element so that the bonded object and the first heating element are not energized when the bonded object is a metal material .

The diffusion bonding apparatus may further include a second insulating layer formed on a contact surface between the bonded object and the second heating element so that the bonded object and the second heating element are not energized when the bonded object is a metal material .

In the diffusion bonding apparatus, the first heating element may be formed of a carbon-based or graphite system so that heat can be easily generated by energization of the first pressing electrode.

In the diffusion bonding apparatus, the first pressing electrode may be made of a copper-based alloy.

In the diffusion bonding apparatus, the first pressurizing electrode may include a coolant flow passage formed inside the first pressurizing electrode and capable of flowing a coolant so as to prevent overheating during energization.

And a sensing unit for sensing a temperature of at least one of the first heating element, the second heating element and the third heating element in the diffusion bonding apparatus, wherein the sensing unit senses the sensed temperature, The amount of current flowing between the first pressing electrode and the second pressing electrode can be adjusted.

In the diffusion bonding apparatus, the sensing unit may be an infrared thermometer capable of measuring a surface temperature of at least one of the first heating element, the second heating element, and the third heating element.

In the diffusion bonding apparatus, the second heating element and the third heating element may be integrally formed.

According to an embodiment of the present invention as described above, a heating element capable of generating heat by the energization of the upper and lower pressing electrodes is formed on the upper side, the lower side and the side surface of the bonded object, It is possible to cause more uniform heating on the surface. Thus, heat diffusion and excessive bonding due to unbonded or excessive heating can be prevented during the diffusion bonding of the members to be bonded,

In addition, it is possible to realize a diffusion bonding apparatus capable of manufacturing a highly accurate diffusion bonded product such as a metal mold in which IT parts and channels are designed, by achieving short bonding time and prevention of non-bonding defects simultaneously by uniform heating of the bonded object. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view schematically showing a diffusion bonding apparatus according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing a diffusion bonding apparatus according to another embodiment of the present invention.
3 is a cross-sectional view schematically showing a diffusion bonding apparatus according to another embodiment of the present invention.
4 is a cross-sectional view schematically showing a diffusion bonding apparatus according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a cross-sectional view schematically showing a diffusion bonding apparatus 100 according to an embodiment of the present invention.

1, a diffusion bonding apparatus 100 according to an embodiment of the present invention includes a chamber 10, a first pressurizing electrode 20, a second pressurizing electrode 30, A first heating element 40, a second heating element 50, a third heating element 60, and a power source 70. The first heating element 40, the second heating element 50,

As shown in Fig. 1, the chamber 10 may be formed with a bonding space to which the bonded object 1 can be bonded. More specifically, the chamber 10 accommodates the first pressing electrode 20, the second pressing electrode 30, the first heating element 40, the second heating element 50, and the third heating element 60 inside thereof And may be a structure having appropriate strength and durability in which the bonding space in which the bonded object 1 can be bonded is formed.

The chamber 10 is a vacuum chamber capable of forming a vacuum in a bonding space to which the member 1 to be bonded can be bonded and is provided with a vacuum environment, a hydrogen environment, a nitrogen environment or a mixed environment of hydrogen and nitrogen It is possible to form various reducing atmosphere. Therefore, it is possible to induce a more rapid solid-phase bonding reaction of the bonded object 1 in the bonding space of the chamber 10.

As shown in Fig. 1, the first pressurizing electrode 20 can pressurize one side of the member 1 to be electrically connected. The second pressurizing electrode 30 is formed so as to face the first pressurizing electrode 20 so that the other surface of the bonded object 1 can be pressed or supported and electricity can be conducted.

More specifically, the first pressurizing electrode 20 and the second pressurizing electrode 30 may be formed of a copper (Cu) alloy so as to facilitate current flow. For example, the first pressurized electrode 20 and the second pressurized electrode 30 are formed of a high-conductivity copper-based alloy and have a specific resistance of 1.72 to 2.0 mu OMEGA .cm according to the alloy component, , 50, and 60, and the first and second pressing electrodes 20 and 30 themselves may not generate heat.

The first pressurized electrode 20 and the second pressurized electrode 30 serve not only to flow current to the heat generating elements 40, 50 and 60 but also to facilitate the operation of the bonded object 1 during diffusion bonding of the bonded object 1. [ It is also possible to pressurize the bonded object 1 so that the bonded body 1 can be bonded to the bonded body 1. For example, the first pressing electrode 20 may press only one surface of the member 1 to be bonded depending on the characteristics of the member 1 to be bonded, and when a high pressing force is required, And the second pressing electrode 30 can press the other surface of the member 1 to be bonded.

1, the first heating element 40 is formed between the first pressing electrode 20 and the member to be bonded 1 and can generate heat by energization of the first pressing electrode 20. The second heating element 50 is formed between the second pressing electrode 30 and the member to be bonded 1 and can generate heat by energization of the second pressing electrode 30.

At this time, the first heating element 40 and the second heating element 50 are physically contacted to the sidewall of the bonded object 1 so that the bonded object 1 can be simultaneously heated in all directions. The first heating element 40 And the third heating element 60 which is electrically connected to the second heating element 50 and can generate heat.

Therefore, the first heating element 40 is formed on the upper surface of the member 1 to be bonded, the second heating element 50 is formed on the lower surface of the joined body 1, and the second heating element 50 is formed to surround both sides of the non- The third heating element 60 is formed, and the bonded body 1 can be heated at the same time in all directions to perform diffusion bonding.

More specifically, the first heating element 40, the second heating element 50 and the third heating element 60 can be easily heated by the energization of the first pressing electrode 20 and the second pressing electrode 30 , A carbon-based or graphite system having a specific resistance of 0.05 to 0.15? 占. M.

For example, the first heating element 40, the second heating element 50, and the third heating element 60 may be formed to have a specific resistance of 0.1 OMEGA .cm or a carbon-based or graphite- After the bonded object 1 requiring bonding is charged between the second heating elements 50, pressure is applied to the bonded object 1 using the first pressing electrode 20 and the second pressing electrode 30 The first heating element 40, the second heating element 50 and the third heating element 60 can be heated by applying direct electricity.

At this time, the first pressurizing electrode 20 and the second pressurizing electrode 30, which apply a current and transmit the pressure, are formed of a copper-based alloy having a low specific resistance, and the exothermic heat is generated by the first heat generating element 40 2 heating element 50 and the third heating element 60, and the self-heating of the bonded object 1, which is the object to be bonded, may hardly occur.

The first heating element 40, the second heating element 50, and the second heating element 40 are electrically connected to the first heating element 40 and the second heating element 50 by conduction and radiation, respectively, because the bonded object 1 is being pressed by the first pressing electrode 20 and the second pressing electrode 30, The heat is transferred from the third heating element 60 to the bonded object 1 and the bonded portion of the bonded object 1 is heated to be diffusion bonded.

1, the diffusion bonding apparatus 100 according to an embodiment of the present invention is configured such that when the member 1 to be bonded is a metal, the bonded body 1 and the first heating element 40 are not energized The first insulating layer 80 may be formed on the contact surface between the member to be bonded 1 and the first heating element 40.

For example, the first insulating layer 80 may be formed of a boron nitride insulating coating on the surface of the first heating element 40 in contact with the member 1 to be bonded, which is a metallic member. However, the present invention is not limited thereto, and other insulating materials having excellent insulating properties such as alumina can be used.

For example, when a current is passed through the nearest distance, when a current is applied through the first pressing electrode 20 and the second pressing electrode 30 when the member 1 to be bonded is a metallic member, the current flows through the third heating element There is a case that the third heating element 60 does not generate heat and the bonded body 1 itself can generate heat.

1, a first insulating layer 80 is formed on the contact surface between the member to be bonded 1 and the first heating element 40 so that the first pressing electrode 20 and the second pressing The current path C may be formed such that the current flows in the order of the first heating element 40, the third heating element 60 and the second heating element 50 when the current is applied through the electrode 30. [

Therefore, the first heating element 40, the second heating element 50 and the third heating element 60 surrounding the bonded object 1 are induced to generate heat while preventing the heating of the bonded object 1 itself, The heat is transferred from the first heating element 40, the second heating element 50 and the third heating element 60 to the member to be bonded 1 by radiation and the bonding portion of the member 1 to be bonded is heated so as to be guided to the diffusion bonding have. At this time, as shown in FIG. 1, the power source unit 70 can apply electricity between the first pressing electrode 20 and the second pressing electrode 30.

1, the first pressurizing electrode 20 or the second pressurizing electrode 30 is connected to the first pressurizing electrode 20 or the second pressurizing electrode 30 And a refrigerant flow path R formed in the inside of the refrigerant flow path and through which the refrigerant can flow. Therefore, the pressure electrodes 20, 30 in contact with the heating elements 40, 50, 60 can be prevented from being excessively overheated, and the pressure electrodes 20, 30 can be protected.

1, the power supply unit 70 includes a sensing unit 71 that senses the temperature of at least one of the first heating element 40, the second heating element 50, and the third heating element 60, And the amount of current flowing between the first pressing electrode 20 and the second pressing electrode 30 can be adjusted based on the temperature sensed by the sensing unit 71. [ More specifically, the sensing unit 71 may be an infrared thermometer capable of measuring a surface temperature of at least one of the first heating element 40, the second heating element 50, and the third heating element 60.

For example, since the first heating element 40 or the second heating element 50 must flow a current directly, the temperature of the first heating element 40 or the second heating element 50 can be controlled by using an infrared thermometer rather than a thermocouple, It is possible to control the amount of current applied to the pressing electrodes 20 and 30 by the power supply unit 70 according to the surface temperature to control the heating.

The refrigerant flow path R or the sensing portion 71 is not necessarily included in the diffusion bonding apparatus 100 according to an embodiment of the present invention and may be applied to the working conditions of the material to be welded 1 Accordingly, it can be selectively applied to the diffusion bonding apparatus 100.

The diffusion bonding apparatus 100 according to an embodiment of the present invention includes the heating elements 40 and 50 which can generate heat by the energization of the pressure electrodes 20 and 30 on the upper side, , 60 are formed on the surface of the bonded object 1 to heat the bonded object 1 in all directions so as to cause more uniform heating on the bonded surface of the bonded object 1. As a result, it is possible to prevent thermal deformation and excessive bonding due to unbonded or excessive heating during the diffusion bonding of the member 1 to be bonded. Further, due to the uniform heating of the bonded object 1, It is possible to easily manufacture a highly accurate diffusion bonded product such as a metal mold in which IT parts and channels are designed.

2 is a cross-sectional view schematically showing a diffusion bonding apparatus 200 according to another embodiment of the present invention.

2, the diffusion bonding apparatus 200 according to another embodiment of the present invention is a diffusion bonding apparatus according to another embodiment of the present invention, in which the bonded body 1 and the second heating element 50 are not energized when the bonded object 1 is a metal, And a second insulating layer 90 formed on a contact surface between the member to be bonded 1 and the second heating element 50. Here, since the second insulating layer 90 may have the same configuration and function as the first insulating layer 80 of the diffusion bonding apparatus 100 according to the embodiment of the present invention shown in FIG. 1, The description is omitted.

The contact surface between the member 1 and the first heating element 40 and the contact surface between the member 1 and the second heating element 50 are insulated from each other and the bonded object 1 The first heating element 40, the second heating element 50 and the third heating element 60 surrounding the member to be bonded 1 can be induced to generate heat while preventing the heating element itself from generating heat.

Thereby, heat is transferred from the first heating element 40, the second heating element 50 and the third heating element 60 to the bonded object 1 by conduction and radiation and the bonded portion of the bonded object 1 is heated, . ≪ / RTI >

2, the first pressurizing electrode 20 or the second pressurizing electrode 30 may be provided with a first pressurizing electrode 20 or a second pressurizing electrode 30 And a refrigerant flow path R formed in the inside of the refrigerant flow path and through which the refrigerant can flow. Therefore, the pressure electrodes 20, 30 in contact with the heating elements 40, 50, 60 can be prevented from being excessively overheated, and the pressure electrodes 20, 30 can be protected.

2, the power supply unit 70 includes a sensing unit 71 that senses a temperature of at least one of the first heating element 40, the second heating element 50, and the third heating element 60, And the amount of current flowing between the first pressing electrode 20 and the second pressing electrode 30 can be adjusted based on the temperature sensed by the sensing unit 71. [ More specifically, the sensing unit 71 may be an infrared thermometer capable of measuring a surface temperature of at least one of the first heating element 40, the second heating element 50, and the third heating element 60.

For example, since the first heating element 40 or the second heating element 50 must flow a current directly, the temperature of the first heating element 40 or the second heating element 50 can be controlled by using an infrared thermometer rather than a thermocouple, It is possible to control the amount of current applied to the pressing electrodes 20 and 30 by the power supply unit 70 according to the surface temperature to control the heating.

Therefore, the diffusion bonding apparatus 200 according to another embodiment of the present invention is provided with the heating elements 40, 50 (which can generate heat by the energization of the pressing electrodes 20, 30) on the upper side, , 60 are formed on the surface of the bonded object 1 to heat the bonded object 1 in all directions so as to cause more uniform heating on the bonded surface of the bonded object 1. As a result, it is possible to prevent thermal deformation and excessive bonding due to unbonded or excessive heating during the diffusion bonding of the member 1 to be bonded. Further, due to the uniform heating of the bonded object 1, It is possible to easily manufacture a highly accurate diffusion bonded product such as a metal mold in which IT parts and channels are designed.

3 is a cross-sectional view schematically showing a diffusion bonding apparatus 300 according to another embodiment of the present invention.

3, the diffusion bonding apparatus 300 according to another embodiment of the present invention may be configured such that the widths of the first heating element 40 and the second heating element 50 are wide, 1) can be simultaneously subjected to diffusion bonding.

More specifically, as the first heating element 40 and the second heating element 50 are made of a carbon-based or graphite-based material, when a plurality of the objects 1 to be bonded are charged, a carbon-based or graphite- Since the temperature deviation of the members 1 to be bonded according to the image position is within 2 degrees, the plurality of members 1 to be bonded can be heated to a uniform temperature.

Therefore, the diffusion bonding apparatus 300 according to another embodiment of the present invention can reduce diffusion bonding time and cost by performing the diffusion bonding of a plurality of the members 1 to be bonded simultaneously.

4 is a cross-sectional view schematically showing a diffusion bonding apparatus 400 according to another embodiment of the present invention.

As shown in FIG. 4, in the diffusion bonding apparatus 400 according to another embodiment of the present invention, the second heating element 50 and the third heating element 60 may be integrally formed. Therefore, the second heating element 50 and the third heating element 60 can be formed as a single body, thereby increasing the convenience of assembling and separating the diffusion bonding apparatus 400.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: chamber
20: first pressing electrode
30: second pressure electrode
40: first heating element
50: second heating element
60: Third heating element
70:
100, 200, 300, 400: diffusion bonding apparatus

Claims (9)

A chamber in which a bonding space to which the bonded object is bonded is formed;
A first pressurizing electrode which can pressurize one side of the bonded object and to be electrically energized;
A second pressing electrode formed opposite to the first pressing electrode to press or support the other surface of the bonded object and to be electrically energized;
A first heating element formed between the first pressing electrode and the member to be bonded and capable of generating heat by energization of the first pressing electrode;
A second heating element formed between the second pressing electrode and the member to be bonded and capable of generating heat by energization of the second pressing electrode;
A third heating element which is formed on the side of the bonded body and is heated by being energized with the first heating element and the second heating element;
A power unit for applying electricity between the first pressurizing electrode and the second pressurizing electrode; And
And a first insulating layer formed on a contact surface of the bonded body and the first heating element so that the bonded body and the first heating element are not energized when the bonded body is a metal,
The third heating element
A first heating element and a second heating element which are formed on the side of the bonded object to be physically contacted with the first heating element and the second heating element so that the bonded object can be simultaneously heated in all directions,
Wherein the first insulating layer
Wherein the insulating coating is formed on the surface of the first heating element which is in contact with the bonded object which is a metallic material. delete The method according to claim 1,
A second insulating layer formed on a contact surface between the bonded body and the second heating element so that the bonded body and the second heating element are not energized when the bonded body is a metal;
Further comprising a diffusion bonding apparatus. The method according to claim 1,
Wherein the first heating element
Wherein the first and second electrodes are made of carbon or graphite so that heat can be easily generated by energization of the first pressurizing electrode. The method according to claim 1,
Wherein the first pressing electrode is made of a copper-based alloy. The method according to claim 1,
The first pressurizing electrode may include:
A refrigerant passage formed inside the first pressurizing electrode and capable of flowing a refrigerant so as to prevent overheating during energization;
And the diffusion bonding device. The method according to claim 1,
The power supply unit,
And a sensing unit for sensing a temperature of at least one of the first heating element, the second heating element, and the third heating element,
And controls the amount of current flowing between the first pressing electrode and the second pressing electrode based on the temperature sensed by the sensing unit. 8. The method of claim 7,
The sensing unit includes:
Is an infrared ray temperature meter capable of measuring the surface temperature of at least one of the first heating element, the second heating element and the third heating element. The method according to claim 1,
And the second heat generating element and the third heat generating element are integrally formed.

Images