JP4987839B2 - Heating device - Google Patents

Description

  The present invention relates to an electric resistance heating type heating apparatus used for heat treatment of various electronic equipment components and semiconductor materials.

  Various heating systems used for heat treatment of electronic equipment parts and semiconductor materials have been proposed in the past, but they are provided on a heater base made of aluminum nitride as related to the present invention. There is a ceramic heater having a structure in which a resistance heating material is disposed in the formed heating element embedded groove and an aluminum nitride heater cover is superposed on the upper surface (see, for example, Patent Document 1).

JP 2005-011769 A

  The ceramic heater described in Patent Document 1 is excellent in that a leak current does not occur between the resistance heating materials during high-temperature heating because the surface of the resistance heating material and the heating element embedded groove are covered with a film of an electrically insulating material. ing. However, since a coating of an electrically insulating material is interposed between the base material and the heater cover and the resistance heating element, the heat conduction efficiency from the resistance heating element to the base material and the heater cover is poor, and the heating state is not good. May be uniform.

  The problem to be solved by the present invention is to provide a heating device that is excellent in uniform heating properties and durability and that does not cause an electrical short circuit.

The heating device of the present invention is in a state where a plurality of electrically insulating base materials stacked in a close contact state and a groove formed in at least one surface in a contact region between the electrically insulating base materials are filled. includes a fused resistor heating member, wherein the look-containing resistance heating material silicon or silicon compound, the electrically insulating substrate, formed of a ceramic mainly containing aluminum nitride, the electrically insulating base The groove part formed in at least one part of the outer periphery of the contact area | region of materials is fuse | melted in the state filled with the resistance heating material containing a silicon or a silicon compound . Here, the resistance heating material refers to a material having a property of generating Joule heat by flowing an electric current.

  With such a configuration, the resistance heating material fused in a state filled in the concave grooves of the electrically insulating base material strongly bonds the electrically insulating base materials laminated in a close contact state. The heat of the resistance heating material is transmitted to the electrically insulating substrate without unevenness, and an excellent uniform heating property is obtained. In addition, the resistance heating material is fused in a state of being filled with no gap between the concave groove of one of the electrical insulating substrates and the other electrical insulating substrate. There is no cracking or cracking on the surface, and the durability is excellent. Furthermore, since the resistance heating material can be fused in a state where it is filled in a groove formed in advance in an electrically insulating material, the resistance heating element can be accurately placed at a predetermined position, and the fusion process There is no electrical short circuit caused by the exudation or diffusion of the resistance heating element.

Furthermore, the electrically insulating substrate, by forming a ceramic mainly containing aluminum nitride, aluminum nitride, good adhesion to the resistance heating material containing silicon or silicon compounds, thermal conductivity is high Therefore, the uniform heating property is improved and the energy efficiency is also improved.

Furthermore, by having fused in a state filled with resistive heating material containing silicon or silicon compound on at least a portion which is formed in groove portion of the outer periphery of the contact area between the electrically insulating substrate, electrically insulating Since at least a part of the outer periphery of the contact region between the substrates is joined by the resistance heating material, the adhesion between the electrically insulating substrates is increased and the durability is improved.

On the other hand , fusion is performed in a state where a resistance heating material containing silicon or a silicon compound is filled in a through hole formed so as to reach the contact region between the electrically insulating substrates from the outer surface of the electrically insulating substrate. You can also. With such a configuration, the resistance heating material fused in the state of being filled in the through hole exhibits the function of joining the overlapping electrically insulating substrates, so that the electrically insulating substrates are in close contact with each other. Power is increased and durability is improved.

  According to the present invention, it is possible to provide a heating device that is excellent in uniform heating property and durability and that does not generate an electrical short circuit.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view showing a heating apparatus according to a first embodiment of the present invention, FIG. 2 is a front view of the heating apparatus shown in FIG. 1, FIG. 3 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a cross-sectional view taken along the line BB in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line CC in FIG.

  As shown in FIGS. 1-4, the heating apparatus 10 of 1st Embodiment joins the several electrically insulating base materials 11 and 12 laminated | stacked in the close contact state, and the electrically insulating base materials 11 and 12 mutually. Therefore, the resistance heating material 13 is melted and filled in the concave groove 15 of the electrically insulating base material 11, and the resistance heating material 13 contains silicon or a silicon compound. The resistance heating material 13 includes a concave groove 15 formed in one electrical insulating base material 11 in a contact region 14 between the electrical insulating base materials 11 and 12, and a part of the lower surface 12c of the other electrical insulating base material 12. It is fused in a state filled with no gap in the space surrounded by. The electrically insulating base materials 11 and 12 are formed of ceramics whose main component is aluminum nitride. Moreover, the resistance heating material 13a was filled in the groove portion 11a formed over the entire circumference of one electrical insulating base material 11 of the outer periphery 14a of the contact region 14 between the electrical insulating base materials 11 and 12. It is fused in a state. The resistance heating material 13 a has the same composition as the resistance heating material 13.

  As shown in FIGS. 3 and 5, the concave groove 15 formed in the upper surface 11 c of the electrically insulating substrate 11, which is a contact region 14 between the electrically insulating substrates 11 and 12, is a continuous curve having no intersecting portion. The end portions 15a and 15b are located inside the groove portion 11a. Further, as shown in FIG. 4, through holes 12a and 12b are respectively opened at positions facing the end portions 15a and 15b of the groove 15a in the electrically insulating base material 12, and these through holes 12a and 12b are respectively provided. The rod-shaped energizing members 16a and 16b are respectively inserted into the. The lower ends of the current-carrying members 16a and 16b are connected to the resistance heating material 13 in the ends 15a and 15b of the groove 15. The outer peripheries of the energizing members 16a and 16b are covered with a resistance heating material 13b. The resistance heating material 13 b has the same composition as the resistance heating material 13.

  When power is supplied from an external power source (not shown) using the current-carrying members 15 and 16 protruding from the electrical insulating base 12 as current-carrying terminals, the resistance heating material 13 generates heat, and the electrical insulating bases 11 and 12 are heated. By placing a heated object (not shown) on the upper surface 12h of the upper electrically insulating substrate 12, the heated object can be heat-treated. In the heating device 10, the laminated electrical insulating base materials 11 and 12 are strongly bonded to each other by the resistance heating material 13 that is fused in a state of being filled in the concave grooves 15 of the electrical insulating base material 11. Therefore, the heat of the resistance heating material 13 is transmitted to the electrical insulating base materials 11 and 12 without unevenness, and the temperature distribution on the upper surface 12h of the electrical insulating base material 12 becomes uniform. Therefore, an object to be heated (not shown) placed on the upper surface 12h of the insulating substrate 12 can be heated uniformly.

  In addition, the resistance heating material 13 is filled in the space surrounded by the concave groove 15 on the upper surface 11b of one electrical insulating base material 11 and a part of the lower surface 12c of the other electrical insulating base material 12 without any gap. Since it is fused in a state, the resistance heating body 13 does not crack or break during energization heat generation, and is excellent in durability. Furthermore, since the resistance heating material 13 can be fused in a state where the groove 15 formed in advance in the electrical insulating material 11 is filled with no gap, the resistance heating element 13 can be accurately arranged at a predetermined position. In addition, there is no electrical short circuit caused by the exudation or diffusion of the resistance heating element 13 in the fusion process.

  Since the electrically insulating base materials 11 and 12 are made of ceramics mainly composed of aluminum nitride, the adhesiveness with the resistance heating material 13 containing silicon or silicon compound is good and the heat conductivity is high. This is effective in improving the heating performance and energy efficiency.

  As shown in FIG. 3 to FIG. 5, the heat generating material 13 a is filled in the groove portion 11 a formed along the outer periphery 14 a of the contact region 14 between the electrically insulating base materials 11 and 12, and is fused. As a result, the entire outer periphery 14a of the contact region 14 between the electrically insulating base materials 11 and 12 is joined by the resistance heating material 13a, so that the electrically insulating base materials 11 and 12 are strongly joined and durable. Excellent in properties. Moreover, since the contact area 14 between the electrically insulating base materials 11 and 12 is kept in a sealed state in which gas and liquid cannot enter from the outside, the heating device 10 can also be liquid-cleaned. Furthermore, as shown in FIG. 2, if the ground 17 is wired from the resistance heating material 13a, charging of the electrically insulating base materials 11 and 12 can be avoided.

  Next, the manufacturing process of the heating device 10 will be described with reference to FIG. FIG. 6 is a schematic view showing a manufacturing process of the heating apparatus shown in FIG. As shown in FIG. 6A, a groove 15 is provided on the upper surface 11c of the electrically insulating substrate 11, and a groove portion 11a is formed along the outer periphery of the outer periphery 11c. Then, as shown in FIG. 6B, the groove 15 is filled with a paste-like resistance heating material 13m that is melted and sintered by heat treatment and becomes the resistance heating material 13 (see FIG. 3).

  As the resistance heating material 13m, "a paste formed by mixing a metal powder of Si-7% Ti-5% Mo alloy composition (wt%) and an alcohol solution of PVP (polyvinylpyrrolidone)", "Si- A paste formed by mixing a metal powder of 10% Ni alloy composition (wt%) and an alcohol solution of PVP (polyvinylpyrrolidone) "or" a metal powder of Si-7% Cr alloy composition (wt%) and PVP (polyvinyl chloride). A paste formed by mixing an alcohol solution of pyrrolidone) is suitable, but is not limited thereto.

  Next, as shown in FIG. 6C, after the electrically insulating base material 12 is overlaid on the upper surface 11c of the electrically insulating base material 11, and the resistance heating material 13m is filled in the groove portion 11a without a gap. Then, it is charged into the vacuum heating furnace 18 and heated to about 1300 to 1400 ° C. As a result, the resistance heating material 13m is melted and sintered, and becomes the resistance heating materials 13 and 13a, and is fused in the groove 15 and the groove portion 11a, thereby completing the heating device 10 shown in FIG. If the current-carrying members 16a and 16b shown in FIG. 4 are inserted into the through holes 12a and 12b of the electrically insulating substrate 12 in the stage of filling the groove 11a with the resistance heating material 13m, FIG. Through this process, the resistance heating material 13 is connected to be energized.

  Next, another embodiment of the present invention will be described with reference to FIGS. 7 is a plan view showing a heating device according to a second embodiment of the present invention, FIG. 8 is a front view of the heating device shown in FIG. 7, FIG. 9 is a sectional view taken along line DD in FIG. 7, and FIG. It is the EE sectional view taken on the line. 11 is a plan view showing a heating device according to a third embodiment of the present invention, FIG. 12 is a front view of the heating device shown in FIG. 11, and FIG. 13 is a sectional view taken along line FF in FIG. 7 to 13, the parts denoted by the same reference numerals as those in FIGS. 1 to 6 are parts having the same structure and function as the constituent parts of the heating device 10, and the description thereof is omitted.

  As shown in FIGS. 7 to 10, the heating device 20 of the second embodiment joins a plurality of electrically insulating base materials 21 and 22 stacked in close contact with each other and the electrically insulating base materials 21 and 22. Therefore, the resistance heating material 13 fused in a state of being filled in the concave groove 15 of the electrically insulating base material 21 is provided. A plurality of through holes 23 extending from the outer surface (upper surface 21 h) of the electrically insulating base material 22 to the contact region 14 between the electrically insulating base materials 21 and 22 are opened near each corner. A concentric concave portion 24 is formed on the upper surface 21 c of the electrically insulating substrate 22. The resistance heating material 13a is filled in the through holes 23 and the recesses 24 without any gaps. As described above, the resistance heating material 13a contains silicon or a silicon compound, and is formed by sintering a resistance heating material 13m (see FIG. 6).

  In the heating apparatus 20, the resistance heating material 13 a fused in a state of being filled in the through holes 23 of the electrical insulating base material 22 and the recesses 24 of the electrical insulating base material 21 overlaps with each other. Since the function which joins 21 and 22 is exhibited, the adhesive force of the electrically insulating base materials 21 and 22 is high, and durability is also excellent. Further, if the ground 17 is wired from the resistance heating material 13a in the through hole 23, charging of the electrically insulating base materials 21, 22 and the like can be avoided.

  As shown in FIGS. 11 to 13, in the heating device 30 of the third embodiment, a plurality of electrically insulating base materials 31 and 32 stacked in a close contact state and the electrically insulating base materials 31 and 32 are joined to each other. For this purpose, a resistance heating material 13 fused in a state of being filled in the concave groove 15 of the electrically insulating base material 31 is provided. In the state where the groove portions 31a and 32a formed over the entire circumference of both the electrical insulating base materials 31 and 32 are filled in the outer peripheral edge 14a of the contact region 14 between the electrical insulating base materials 31 and 32. The resistance heating material 13a is fused. The resistance heating material 13 a has the same composition as the resistance heating material 13.

  While the heating device 10 shown in FIG. 1 and the heating device 20 shown in FIG. 7 are both square in plan view, the shape in plan view of the heating device 30 shown in FIG. 11 is circular. Therefore, it is suitable for a case where an object to be heated (not shown) having a circular shape in plan view is placed on the upper surface 32h of the electrically insulating substrate 32 and heat-treated. In addition, since the planar view shape of the electrically insulating base material which comprises the heating apparatus which concerns on this invention is not limited to a square or a circle, it can be set as the shape suitable for the shape of to-be-heated material.

  The heat treatment apparatus of the present invention can be widely used in the electronic / electric industry or the machine parts industry as a heat treatment means for various electronic equipment parts and semiconductor materials.

It is a top view which shows the heating apparatus which is 1st Embodiment of this invention. It is a front view of the heating apparatus shown in FIG. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is CC sectional view taken on the line in FIG. It is a schematic diagram which shows the manufacturing process of the heating apparatus shown in FIG. It is a top view which shows the heating apparatus which is 2nd Embodiment of this invention. It is a front view of the heating apparatus shown in FIG. It is the DD sectional view taken on the line in FIG. It is the EE sectional view taken on the line in FIG. It is a top view which shows the heating apparatus which is 3rd Embodiment of this invention. It is a front view of the heating apparatus shown in FIG. It is the FF sectional view taken on the line in FIG.

Explanation of symbols

10, 20, 30 Heating device 11, 12, 21, 22, 31, 32 Electrically insulating substrate 11a, 31a, 32a Groove 11c, 21c Upper surface 12a, 12b, 23 Through hole 12c Lower surface 12h, 22h, 32h Upper surface 13, 13a, 13b Resistance heating material 13m Resistance heating material 14 Contact area 14a Outer periphery 15 Concave groove 15a, 15b End portion 16a, 16b Current-carrying member 17 Ground 18 Vacuum heating furnace 24 Recess

Claims (2)

A plurality of electrically insulating base materials stacked in close contact with each other, and a resistance heating material fused in a state of being filled in a concave groove formed on at least one surface in a contact region between the electrically insulating base materials When the equipped, it viewed including the resistive heating material is silicon or a silicon compound,
The electrically insulating substrate is formed of ceramics mainly composed of aluminum nitride,
A heating apparatus comprising: a groove portion formed on at least a part of an outer periphery of a contact region between the electrically insulating substrates; and a fusion heating material filled with a resistance heating material containing silicon or a silicon compound . A fusion-bonded state in which a resistance heating material containing silicon or a silicon compound is filled in a through hole formed so as to reach a contact region between the electrically insulating substrates from the outer surface of the electrically insulating substrate. 1 Symbol placement of the heating device.

Images