KR101878185B1

KR101878185B1 - Light emitting diode array substrate and liquid crystal display device having the same

Info

Publication number: KR101878185B1
Application number: KR1020150169211A
Authority: KR
Inventors: 이준호
Original assignee: 엘지디스플레이 주식회사
Priority date: 2015-11-30
Filing date: 2015-11-30
Publication date: 2018-07-13
Also published as: KR20170063162A

Abstract

The LED array substrate according to an embodiment of the present invention and the liquid crystal display device having the LED array substrate according to an embodiment of the present invention form a protective insulating layer at the end of the LED array substrate, such as a wavy pattern, Can be dispersed.
As a result, cracking of the pad portion during the clamping operation of the LED array can be prevented, and the defective rate can be lowered to improve the quality.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting diode array substrate, and a liquid crystal display device having the same. BACKGROUND OF THE INVENTION [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode (LED) array substrate, and more particularly, to an LED array substrate using an LED as a light source and a liquid crystal display device having the same.

In recent information society, the importance of display devices as visual information delivery media is getting more emphasized, and in order to take a major position in the future, it is necessary to meet requirements such as low power consumption, thinning, light weight, and high image quality.

The display device includes a cathode ray tube (CRT), an electroluminescence (EL), a light emitting diode (LED), a vacuum fluorescent display (VFD) A non-light emitting type in which light can not be emitted, such as a light emitting type such as a field emission display (FED), a plasma display panel (PDP), and a liquid crystal display (LCD) .

The liquid crystal display device is an apparatus for displaying an image using the optical anisotropy of a liquid crystal, and is superior in visibility compared to a conventional cathode-ray tube and has a smaller average power consumption than a cathode-ray tube of the same screen size, have.

Hereinafter, a general liquid crystal display device will be described.

In general, a liquid crystal display device can display a desired image by individually supplying data signals according to image information to pixels arranged in a matrix form, and adjusting light transmittance of pixels.

Accordingly, a liquid crystal display device includes a liquid crystal panel in which pixels are arranged in a matrix form, a driver for driving the pixels, and a backlight unit for supplying light to the liquid crystal panel.

The liquid crystal panel is composed of a color filter substrate bonded to each other so as to keep a uniform cell gap therebetween, and a liquid crystal layer formed in a cell gap between the array substrate and the color filter substrate and the array substrate.

Upper and lower polarizers are attached to the outside of the liquid crystal panel, respectively. At this time, the lower polarizer polarizes the light passing through the backlight unit, and the upper polarizer polarizes the light passing through the liquid crystal panel.

Specifically, the backlight unit is provided with an LED array for emitting light on one side of the light guide plate, and a reflection plate is provided on the back surface of the light guide plate.

Therefore, the light emitted from the LED array is incident on the side of the light guide plate of the transparent material, and the reflection plate disposed on the back side of the light guide plate reflects the light transmitted to the back side of the light guide plate toward the optical sheets on the upper side of the light guide plate, .

A liquid crystal panel including a color filter substrate and an array substrate is mounted on the upper part of the backlight unit thus configured through a guide panel and a lower cover is coupled to the lower part to constitute a liquid crystal display device.

At this time, generally, a LED array printed circuit board (PCB) which drives an LED array has a 2-coverlay structure, and a heat radiation tape is attached to the back surface thereof and attached to the lower cover.

FIG. 1 is an exemplary view showing a phenomenon in which a pad portion crack occurs during a general LED array clamping operation.

1, a main board 25 is attached to a rear surface of a lower cover of a vehicle liquid crystal display device, and the LED array PCB 20 is fastened to the main board 25, .

At this time, considering the cost and the degree of design freedom, the integrated PCB is a flexible printed circuit board (FPCB) integrated type, and the LED array PCB 20 is directly fastened to the PCB connector portion 26 Therefore, it has an unfavorable structure to prevent cracks in the pad part when fastening the LED array.

That is, the LED array PCB 20 is inserted into the PCB connector portion 26 during the LED array fastening operation and is inserted / separated many times for precise fastening. At this time, at the boundary between the pad portion and the wiring portion, A disconnection of the pad due to the cause is generated.

Accordingly, a failure such as lighting failure of the liquid crystal panel may occur, which may occur even during rework due to the failure of the main board 25. [

SUMMARY OF THE INVENTION It is an object of the present invention to provide an LED array substrate and a liquid crystal display device having the LED array substrate, which can prevent a pad portion from cracking during an LED array fastening operation.

Other objects and features of the present invention will be described in the following description of the invention and the claims.

The LED array substrate according to one embodiment includes an engagement portion and an array portion in which an LED is mounted. The coupling portion includes a pad portion on which a plurality of pads are arranged and a wiring portion on which a plurality of signal lines to be individually connected to the plurality of pads are disposed on one surface of the base film, And a protection insulating layer provided so as to cover a portion excluding the negative exposed portion and having a jagged end portion. The plurality of pads include first and second pads alternately arranged, and each of the first and second pads includes first and second edges which are parallel to each other and connected to corresponding signal lines of the plurality of signal lines do. The first overlap area of the protective insulating layer overlapping with the first pad gradually decreases from the first edge of the first pad to the second edge of the first pad and the second overlap area of the second overlap of the protective insulating layer, The area gradually increases from the first edge of the second pad closer to the second edge of the first pad to the second edge of the second pad.

The liquid crystal display according to one embodiment includes a backlight unit including the above-described LED array substrate and a liquid crystal panel provided on the backlight unit.

The plurality of pads and the plurality of signal lines are made of the copper foil layer provided on the first surface of the base film, and the LED array substrate according to one embodiment includes the second copper foil layer provided on the second surface of the base film, A second protective insulating layer provided on the second surface of the base film to cover the layer, and a reinforcing layer provided on the second protective insulating layer.

The LED array substrate according to an embodiment is provided with at least one of a base film and a copper foil layer, between a copper foil layer and a protective insulating layer, between a base film and a second copper foil layer, and between a second copper foil layer and a second protective insulating layer An adhesive layer may further be included.

The exposed area of the first pad progressively increases from the first edge of the first pad to the second edge of the first pad and the exposed area of the second pad is increased from the first edge of the second pad to the second edge of the second pad, And then gradually decreases.

The inclined direction of the first boundary line forming the boundary between the first overlap area where the first pad and the protective insulating layer overlap and the exposed area of the first pad is different from the second overlap area in which the second pad and the protective insulating layer overlap, May be opposite to the oblique direction of the second boundary line between the exposed areas of the two pads.

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The protective insulating layer is composed of a lower protective insulating layer and an upper protective insulating layer, and the lower protective insulating layer extends further toward the pad portion than the upper protective insulating layer, so that a part of the surface thereof can be exposed. The shape of the end of the lower protective insulating layer overlapping with the first pad and the shape of the end of the upper protective insulating layer overlap with each other, Can be the same.

The protective insulating layer may further include a second thickness layer extending from the first thickness layer toward the pad portion and having a thickness less than the first thickness layer. The shape of the end of the second thickness layer of the protective insulating layer overlapping with the first pad is the same as the shape of the end of the first thickness layer overlapping with the first pad or the shape of the end of the first thickness layer overlapping with the second pad, The shape of the end of the second thickness layer of the protective insulating layer overlapping the pad may be the same as the shape of the end of the first thickness layer overlapping with the second pad or the shape of the end of the first thickness layer overlapping with the first pad.

The lower protective insulating layer and the upper protective insulating layer may be composed of a single layer having a step difference.

As described above, the LED array substrate and the liquid crystal display device having the LED array substrate according to an embodiment of the present invention disperse the tensile force and the stress acting on the pad portion of the LED array substrate, . This provides the effect of improving the quality by lowering the defect rate.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exemplary view showing a phenomenon in which a crack in a pad portion occurs in a general LED array clamping operation. FIG.
2 is an exploded perspective view illustrating the structure of a liquid crystal display device according to an exemplary embodiment of the present invention.
FIG. 3 is a rear view schematically showing a structure of an LED array substrate in the liquid crystal display according to the embodiment of the present invention shown in FIG. 2; FIG.
FIGS. 4A and 4B are schematic views showing a cross-sectional structure of a pad portion and a wiring portion of the LED array substrate shown in FIG. 3. FIG.
FIG. 5A is an enlarged rear view of a fastening portion of the LED array substrate according to the first embodiment of the present invention; FIG.
5B is an enlarged rear view of the fastening portion of the LED array substrate of the comparative example.
6 is a table showing an example of the reliability test result of the LED array substrate.
7A and 7B are rear views of an enlarged view of a fastening portion of an LED array substrate according to a second embodiment of the present invention;
8A and 8B are enlarged rear views of fastening portions of an LED array substrate according to a third embodiment of the present invention;

Hereinafter, exemplary embodiments of an LED array substrate and a liquid crystal display device having the same according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification. The dimensions and relative sizes of the layers and regions in the figures may be exaggerated for clarity of illustration.

It will be understood that when an element or layer is referred to as being another element or "on" or "on ", it includes both intervening layers or other elements in the middle, do. On the other hand, when a device is referred to as "directly on" or "directly above ", it does not intervene another device or layer in the middle.

The terms spatially relative, "below," "lower," "above," "upper," and the like, And may be used to easily describe the correlation with other elements or components. Spatially relative terms should be understood to include, in addition to the directions shown in the drawings, terms that include the different directions of the elements in use, or in operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. &Quot; comprise "and / or" comprising ", as used in the specification, means that the presence of stated elements, Or additions.

2 is an exploded perspective view illustrating the structure of a liquid crystal display device according to an exemplary embodiment of the present invention.

2, a liquid crystal display device according to an embodiment of the present invention includes a liquid crystal panel 110 for injecting liquid crystal between a color filter substrate 105 and an array substrate 115 to output an image, A backlight unit 140 installed on the back surface of the liquid crystal panel 110 to emit light over the entire surface of the liquid crystal panel 110 and a lower cover 150 for accommodating the liquid crystal panel 110 and the backlight unit 140 .

The liquid crystal panel 110 includes a color filter substrate 105 and a color filter substrate 105. The color filter substrate 105 is arranged so that pixels are arranged in a matrix form to output an image, And a liquid crystal layer formed in a cell gap between the array substrate 115 and the liquid crystal layer.

Although not shown in detail, a common electrode and a pixel electrode are formed on the liquid crystal panel 110 in which the color filter substrate 105 and the array substrate 115 are bonded together to apply an electric field to the liquid crystal layer, The liquid crystal of the liquid crystal layer is rotated by dielectric anisotropy according to the electric field between the common electrode and the pixel electrode so that light is transmitted or blocked for each pixel to display a character or an image .

At this time, a switching element such as a thin film transistor (TFT) is separately provided in the pixels to control the voltage of the data signal applied to the pixel electrode on a pixel-by-pixel basis.

That is, a gate line and a data line are vertically and horizontally arranged on the array substrate 115 to define a pixel region, and a thin film transistor, which is a switching element, is formed in a crossing region between the gate line and the data line.

The thin film transistor includes a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode.

The color filter substrate 105 includes a color filter composed of a plurality of sub-color filters that implement the colors of red, green, and blue, a black matrix that separates sub-color filters and blocks light transmitting through the liquid crystal layer, Filter and an overcoat layer formed over the black matrix.

A polarizing plate is attached to each of the outer sides of the color filter substrate 105 and the array substrate 115. The lower polarizing plate polarizes the light transmitted through the backlight unit 140 and the upper polarizing plate transmits light passing through the liquid crystal panel 110 / RTI >

The lower cover 150 includes a bottom and a plurality of side portions. The floor can have a square shape. The side portions may extend vertically to have a predetermined height from each edge of the bottom. The edges of the side portions adjacent to each other can be connected to each other. The space surrounded by the side portions and the bottom forms a storage space in which the liquid crystal panel 110 and the backlight unit 140 are housed.

The guide panel 145 mounts the liquid crystal panel 110 on the inner step portion and supports and fixes the liquid crystal panel 110 with the light shielding tape 146 and surrounds the backlight unit 140 with the inner wall.

The liquid crystal panel 110 including the color filter substrate 105 and the array substrate 115 is mounted on the upper part of the backlight unit 140 through the guide panel 145 and the lower cover 150 is coupled to the lower part thereof Thereby constituting a liquid crystal display device.

A backlight unit 140 according to an exemplary embodiment of the present invention includes a light source plate 122 including a light source 122 for generating light on one side of a light guide plate 142, And a reflector 141 is provided on the back surface of the light guide plate 142. [

A plurality of optical sheets 143 for irradiating the liquid crystal panel 110 with improved efficiency of light emitted from the light guide plate 142 may be disposed on the upper surface of the light guide plate 142. [

However, the present invention is not limited to the structure of the above-described backlight unit 140, and any backlight unit 140 having any structure can be applied to the liquid crystal display device according to the present invention.

The light guide plate 142 receives light from the light source 122 and guides the light to the liquid crystal panel 110 side. At this time, the light provided from the light source 122 is provided as an incident surface of the light guide plate 142. This incidence surface faces one of the side portions of the lower cover 150. That is, the light source 122 is located on one side of the lower cover 150, and the light incident surface of the light guide plate 142 faces the light emitting surface of the light source 122.

The light guide plate 142 may be made of PMMA (polymethyl methacrylate) or PC (polycarbonate) plastic.

The reflection plate 141 is positioned between the bottom of the lower cover 150 and the back surface of the light guide plate 142. The reflection plate 141 reflects the light from the light source 122 and the light from the light guide plate 142 to the liquid crystal panel 110 side.

At this time, the light source 122 is a means for emitting light. For example, a cold cathode fluorescent lamp (CCFL), a hot cathode fluorescent lamp (HCFL), an external electroluminescence lamp (EEFL) But is not limited thereto. Hereinafter, for the sake of convenience of explanation, the LED 122 is used as the light source 122.

LEDs as the light source 122 may be red, green and blue LEDs that emit red, green and blue monochromatic lights, or LEDs that emit white light.

In the case of an LED array emitting monochromatic light, monochromatic LEDs of red, green, and blue are alternately arranged at regular intervals, monochromatic light emitted therefrom is mixed into white light, and then supplied to the liquid crystal panel 110, In the case of an LED array, a plurality of LEDs are arranged at regular intervals to supply white light to the liquid crystal panel 110.

In this case, the white light LED may be composed of a blue LED emitting blue light and a phosphor emitting yellow light by absorbing blue monochromatic light, and the blue monochromatic light output from the blue LED and the yellow monochromatic light emitted from the phosphor are mixed, To the liquid crystal panel 110. [

The LED array may comprise a light emitting package having at least one LED.

The LED array is mounted on the LED array substrate 120 such that the light exit surface faces the incident surface of the light guide plate 142. [

The LED array substrate 120 may be installed between the incident surface of the light guide plate 142 and the side surface of the guide panel 145 or the lower cover 150. For example, the LED array substrate 120 may be attached to the side surface of the lower cover 150 through a heat dissipation tape (not shown).

The LED array substrate 120 may include a plurality of power lines (not shown) and electrical components (not shown) for transmitting power to the light source 122.

Hereinafter, for convenience of explanation, the LED array substrate 120 is divided into a fastening part 123 fastened to the main board 125 and an array part 121 in which the LED array is mounted by the light source 122.

The main board 125 may be mounted on the rear surface of the lower cover 150. In this case, the LED array substrate 120 (not shown) may be formed through the holes 150a and 125a formed in the lower cover 150 and the main board 125, Can be fastened to the main board 125.

The light source 122 is connected to the main board 125 through a coupling part 123, and can receive light and emit light.

The light emitted from the light source 122 is incident on the side surface of the light guide plate 142 of the transparent material and the reflection plate 141 disposed on the back surface of the light guide plate 142 reflects light transmitted through the light guide plate 142, The light is reflected toward the optical sheets 143 on the upper surface to reduce light loss and improve the uniformity.

At this time, the optical sheets 143 include a diffuser sheet and an upper and a lower prism sheet, and a protective sheet may be added.

The prism sheet condenses light from the light guide plate 142, and the diffusion sheet diffuses the light from the prism sheet, and the protective sheet serves to protect the prism sheet and the diffusion sheet. Light passing through the protective sheet is provided to the liquid crystal panel 110 side.

For example, the backlight unit 140 having the above-described structure can be attached and fixed to the liquid crystal panel 110 by the light shielding tape 146, and is housed in the bottom of the lower cover 150 located at the bottom. Particularly, the shielding tape 146 not only attaches and fixes the liquid crystal panel 110 and the backlight unit 140 but also leaks light emitted from the backlight unit 140 through the side surface of the liquid crystal panel 110 You can also play the role of blocking out.

Hereinafter, an LED array substrate according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a rear view schematically showing the structure of an LED array substrate in the liquid crystal display according to the embodiment of the present invention shown in FIG. 2; FIG.

4A and 4B are schematic views showing a cross-sectional structure of a pad portion and a wiring portion of the LED array substrate shown in FIG.

5A is an enlarged rear view of the fastening portion of the LED array substrate according to the first embodiment of the present invention. 5B is an enlarged rear view of the fastening portion of the LED array substrate of the comparative example.

3, the LED array substrate 120 according to the embodiment of the present invention includes a coupling part 123 fastened to a main board, an array part 121 in which an LED array is mounted by a light source 122, &Lt; / RTI >

A plurality of LEDs are mounted on the array portion 121 of the LED array substrate 120. At this time, electrodes (not shown) connected to the LEDs and supplying driving signals may be provided in the array regions of the plurality of LEDs in the array unit 121. The plurality of electrodes are provided with driving signals from a plurality of signal lines 123b formed on the LED array substrate 120. [

The plurality of signal lines 123b extend to one end of the coupling part 123 and are connected to a plurality of pads 123a provided on the pad part.

That is, the fastening part 123 of the LED array substrate 120 can be divided into a pad part and a wiring part, and the pad part has a plurality of pads 123a to be bonded to the PCB connector part of the main board, And a plurality of signal lines 123b may be disposed to receive signals and power from the main board through the pads 123a.

At this time, the LED array substrate 120 according to the embodiment of the present invention may be formed of a flexible printed circuit board (FPCB) having a copper foil layer therein.

4A, 4B and 5A and 5B, the LED array substrate 120 according to the embodiment of the present invention, which is formed of FPCB, includes an insulating base film 120a, And the protective insulating layers 120f and 120h formed on and under the copper foil layers 120c and 120d and the copper foil layers 120c and 120d.

For reference, a PCB is made by pressing a copper foil on one or both sides of an insulating plate such as a phenol resin or an epoxy resin, forming a pattern (wiring) according to the circuit, removing unnecessary parts by removing the copper foil, . A through hole for penetrating the lead of the component or a via for connecting the wiring between the upper part and the lower part is plated on the PCB, and a photo solder resist is formed on the upper and lower parts. PSR) ink to complete the PCB.

In addition, FPCB is an electronic component developed with miniaturization and light weight of electronic products, and has excellent workability, heat resistance, rust resistance and chemical resistance, and is a core component of all electronic products. And displays such as audio equipment, camcorders, printers, liquid crystal displays, satellite equipment, military equipment, and medical equipment.

The FPCB is capable of three-dimensional wiring by itself, is capable of reducing the size and weight of the device, and has high durability against repeated bending. In addition, high-density wiring is possible, and there is no wiring error, assembly is good, and reliability is high.

The FPCB has a single side and a double side, and in the case of a double side structure, the component density can be increased at the same size when the component is mounted as compared with the sectional structure.

The base film 120a may be formed of an insulating material such as polyimide (PI), polyester (PET), or glass epoxy.

The copper foil layers 120c and 120d constituting the plurality of upper signal lines and the lower signal lines 123b may be made of a copper component and subjected to exposure, development, corrosion, and peeling processes on the lower and upper surfaces of the base film 120a .

Here, a plurality of pads 123a are provided in the pad portion of the same layer of the plurality of lower signal lines 123b.

A first adhesive layer 120b may be provided as a bonding agent between the base film 120a and the copper foil layers 120c and 120d.

A first protective insulating layer 120f and a second protective insulating layer 120h may be provided on the top or bottom of the first adhesive layer 120b.

The first and second protective insulating layers 120f and 120h have a film shape as a cover layer and cover and protect a plurality of upper signal lines and lower signal lines 123b.

The first and second protective insulating layers 120f and 120h may be made of a material such as PI.

The first and second protective insulating layers 120f and 120h are partially open at the pad portion so that the plurality of pads 123a may be exposed to the outside.

That is, in the wiring portion, the cover layer that is the first and second protective insulating layers 120f and 120h covers the entire surface, while the pad portion is opened so that the plurality of pads 123a can be exposed to the outside.

A second adhesive layer 120e may be provided as a bonding agent between the copper foil layers 120c and 120d and the first and second protective insulating layers 120f and 120h.

The first adhesive layer 120b and the second adhesive layer 120e may be made of an epoxy resin A of bisphenol-A, an epoxy resin B of novolak, a curing agent of an amine, A flame retardant of Aluminum Trihydroxide (ATH), a rubber of Nitrile-Butadiene rubber (NBR), etc. may be used.

A stiffener 120g may be further provided on the first protective insulating layer 120f of the upper layer for controlling the thickness of the coupling portion and preventing PI breakage when the connector portion is inserted.

The LED array substrate 120 according to the embodiment of the present invention is characterized in that a jagged pattern such as a wavy pattern is formed on the lower coverlay layer, that is, the second protective insulating layer 120h.

That is, referring to FIG. 5A, the first embodiment of the present invention forms a second protective insulating layer 120h at the end of the fastening part of the LED array substrate with jagged edges such as a wavy pattern, And the stress is dispersed.

In this case, it can be seen that the stress acts on the pad 123a in various directions (see the arrows) due to the thickness difference as the ends of the second protective insulating layer 120h are jagged. Therefore, cracking of the pad portion during the clamping operation of the LED array can be prevented, and the defective ratio can be lowered to improve the quality.

5B, in the case of the comparative example in which the second protective insulating layer 20h is formed in the shape of a straight line at the end, stress acts on the pad 23a in the same direction at the end (see the arrows shown) have.

6 is a diagram showing an example of the reliability test result of the LED array substrate.

The purpose of the reliability test is to select a structure favorable to the crack of the pad portion of the LED array substrate, and the criterion is whether or not microcracks are generated in the process of forcibly inserting and separating the LED array substrate into the PCB connector portion. That is, the number of times the forcible insertion and detachment process was carried out until the microcrack occurred was recorded.

Referring to FIG. 6, a comparative example in which a protective insulating layer is formed in a shape of a straight line at the fastening portion of the LED array substrate, and an embodiment in which a protective insulating layer is formed in a wavy pattern are tested.

As a result of the test of No. 5 (# 1 to # 5), it can be seen that the minimum value of the comparative example is 9 at the maximum value of 3, and the fine crack occurs at an average of 5.2 times.

On the other hand, in the case of the embodiment, it is seen that the minimum value is 15 times the maximum value, 23 times, and the fine crack occurs at an average of 19 times. That is, it can be confirmed that the reliability is improved by increasing the number of times from about 5.2 times to 19 times by about 13.8 times (~ 365% increase).

For example, assuming an average of three times of the tightening progress, the defective incidence rate is 3.75%, and in the case of the embodiment, the defective rate is 3.75% since it is 0%.

The shape of the end of the protective insulating layer may be any shape as long as it is jagged in addition to the wave pattern as in the first embodiment of the present invention so long as the tensile force and the stress acting on the LED pad portion are dispersed in various directions.

7A and 7B are enlarged rear views of a fastening part of an LED array substrate according to a second embodiment of the present invention.

In this case, FIG. 7A illustrates a case where the end of the protective insulating layer has a prism mountain shape, and FIG. 7B illustrates a case of having a shape of a taekwondo pattern.

As described above, the LED array substrate according to the second embodiment of the present invention can be composed of a fastening part fastened to the main board and an array part in which the LED array is mounted as a light source.

A plurality of LEDs are mounted on the array portion of the LED array substrate. At this time, the array unit may include an electrode connected to each LED and supplying a driving signal to the mounting region of each of the plurality of LEDs. A plurality of electrodes are provided with driving signals from a plurality of signal lines formed on the LED array substrate.

The plurality of signal lines extend to one end of the coupling portion and are connected to a plurality of pads provided on the pad portion.

7A and 7B, the fastening portion of the LED array substrate can be divided into a pad portion and a wiring portion. The pad portion is provided with a plurality of pads 223a to be bonded to the PCB connector portion of the main board, The wiring part may be provided with a plurality of signal lines 223b receiving signals and power from the main board through the pads 223a.

At this time, the LED array substrate according to the second embodiment of the present invention may be formed of an FPCB having a copper foil layer therein.

Although not shown in detail, the LED array substrate according to the second embodiment of the present invention, which is composed of FPCB as described above, includes an insulating base film, a copper foil layer 220c and a copper foil layer 220c formed on the base film, And a protective insulating layer 220h formed on the upper and lower sides.

The base film may be made of an insulating material such as PI, PET, or glass epoxy.

The copper foil layer 220c constituting the plurality of upper signal lines and the lower signal line 223b may be formed of a copper component and may be formed through exposure, development, corrosion, and peeling processes on the base film and the lower surface, respectively.

Here, a plurality of pads 223a are provided in the pad portion of the same layer of the plurality of lower signal lines 223b.

Between the base film and the copper foil layer 220c, a first adhesive layer may be provided as a bonding agent.

A first protective insulating layer and a second protective insulating layer 220h may be provided on the top or bottom of the first adhesive layer.

The first and second protective insulating layers 220h have a film shape as a cover layer and cover and protect a plurality of upper signal lines and lower signal lines 223b.

The first and second protective insulating layers 220h may be made of a material such as PI.

A part of the first and second protective insulating layers 220h may be exposed at the pads to expose the plurality of pads 223a to the outside.

That is, in the wiring portion, the cover layer that is the first and second protective insulating layers 220h covers the entire surface, while the pad portion is open so that the plurality of pads 223a can be exposed to the outside.

A second adhesive layer may be provided as a bonding agent between the copper foil layer 220c and the first and second protective insulating layers 220h.

The first adhesive layer and the second adhesive layer may be made of epoxy resin A of the non-phenol A, epoxy resin B of the novolak, amine curing agent, flame retardant of the phosphate or alumina trihydrate, rubber of the acrylonitrile butadiene rubber and the like.

Further, a reinforcing layer may be further provided on the first protective insulating layer of the upper layer for controlling the thickness of the coupling portion and preventing PI breakage when the connector portion is inserted.

The LED array substrate according to the second embodiment of the present invention is characterized in that a jagged pattern is formed on the lower coverlay layer, that is, the second protective insulating layer 220h, such as a prism mountain or a teak pattern.

That is, according to the second embodiment of the present invention, the second protective insulating layer 220h is formed at the end of the fastening part of the LED array substrate such that the end is jagged like a prism mountain or a taekwondo pattern so that tensile force and stress Direction.

However, the present invention is not limited to the above-described shape, and any shape can be applied as long as the ends of the protective insulating layer are jagged so that tensile force and stress acting on the LED pad portion are dispersed in various directions.

The ends of the protective insulation layer of the present invention may be regularly jagged as described above, or irregularly jagged.

In the meantime, the present invention is more effective in preventing cracks of the LED pad portion if the jagged shape such as a wave pattern is formed more than once with a step, which will be described in detail through a third embodiment of the present invention.

8A and 8B are enlarged rear views of a fastening part of an LED array substrate according to a third embodiment of the present invention.

Here, FIG. 8A illustrates a case where a jagged shape such as the same wave pattern is formed twice with a step difference, and FIG. 8B illustrates an example where two different wave patterns are formed with a step difference twice.

As described above, the LED array substrate according to the third embodiment of the present invention can be composed of a fastening part fastened to the main board and an array part in which the LED array is mounted as a light source.

8A and 8B, the fastening portion of the LED array substrate can be divided into a pad portion and a wiring portion. The pad portion is provided with a plurality of pads 323a to be bonded to the PCB connector portion of the main board, The wiring part may be provided with a plurality of signal lines 323b receiving signals and power from the main board through the pads 323a.

At this time, the LED array substrate according to the third embodiment of the present invention may be formed of an FPCB having a copper foil layer inside.

Although not shown in detail, the LED array substrate according to the third embodiment of the present invention, which is composed of FPCB as described above, includes an insulating base film, a copper foil layer 320c and a copper foil layer 320c formed on the base film, And protection insulating layers 320h 'and 320h' formed on the upper and lower sides.

The copper foil layer 320c constituting the plurality of upper signal lines and the lower signal line 323b may be formed of a copper component and may be formed through exposure, development, corrosion, and peeling processes on the base film and the lower surface, respectively.

Here, a plurality of pads 323a are provided on the pad portions of the same layer of the plurality of lower signal lines 323b.

A first adhesive layer may be provided as a bonding agent between the base film and the copper foil layer 320c.

A first protective insulating layer and a second protective insulating layer 320h 'and 320h' may be provided on the top or bottom of the first adhesive layer.

The first and second protective insulating layers 320h 'and 320h' 'have a film shape as a coverlay layer and cover and protect a plurality of upper signal lines and lower signal lines 323b.

The first and second protective insulating layers 320h 'and 320h' may be formed of a material such as PI.

A part of the first and second protective insulating layers 320h 'and 320h' 'is opened in the pad portion, so that the plurality of pads 323a can be exposed to the outside.

That is, in the wiring portion, the cover layer which is the first and second protective insulating layers 320h 'and 320h' covers the entire surface, while the pad portion is opened to expose the plurality of pads 323a to the outside .

A second adhesive layer may be provided as a bonding agent between the copper foil layer 320c and the first and second protective insulating layers 320h 'and 320h ".

The LED array substrate according to the third embodiment of the present invention is characterized in that a jagged shape such as a wave pattern is formed on the lower coverlay layer, that is, the second protective insulating layers 320h 'and 320h' ' .

That is, in the third embodiment of the present invention, the second protective insulating layers 320h 'and 320h' are jagged at the ends of the LED array substrate, such as a wavy pattern, so that tensile force and stress acting on the LED pad portion And is dispersed in various directions.

However, the present invention is not limited to the aforementioned wave pattern, and any shape can be applied as long as the ends of the protective insulating layer are jagged to disperse tensile force and stress acting on the LED pad part in various directions.

At this time, the second protective insulating layers 320h 'and 320h' 'may be formed of a double layer of the second protective insulating layer 320h' as a lower layer and the second protective insulating layer 320h 'as an upper layer. In this case, the second protective insulating layer 320h 'of the lower layer may extend further toward the pad portion than the second protective insulating layer 320h "of the upper layer, The layer 320h 'and the second protective insulating layer 320h' in the upper layer have steps and may have ends of the same shape (in the case of FIG. 8a) or different ends (in the case of FIG. 8b) .

However, the present invention is not limited thereto, and the second protective insulating layers 320h 'and 320h' may be formed as a single layer. In this case, the first and second protective insulating layers 320h 'And the second protective insulating layer 320h' may be located.

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

120: LED array substrate 120a: base film
120b and 120e: adhesive layers 120c, 220c, 320c and 120d:
120f: first protective insulating layer 120g: reinforcing layer
120h, 220h, 320h ', 320h ": the second protective insulating layer
123a, 223a, and 323a: pads 123b, 223b, and 323b:

Claims

And an array portion on which a coupling portion and a plurality of light emitting diodes (LEDs) are mounted,
The fastening portion
A plasma display device comprising: a base film; a plurality of pads disposed on one surface of the base film; and a wiring portion in which a plurality of signal lines individually connected to the plurality of pads are disposed, And a protection insulating layer provided to cover a portion of the pad portion excluding the exposed portion and having a jagged end portion,
Wherein the plurality of pads include first and second pads alternately arranged, wherein each of the first and second pads is connected to a corresponding one of the plurality of signal lines, Edge,
Wherein the protective insulating layer further comprises a second thickness layer extending from the first thickness layer toward the pad portion and having a thickness less than the first thickness layer,
The first overlap area of the first thickness layer of the protective insulation layer overlapping with the first pad progressively decreases from the first edge of the first pad to the second edge of the first pad, The third overlapping area of the second thickness layer of the protective insulation layer overlapping with the first pad gradually increases from the first edge of the first pad to the second edge of the first pad,
Wherein a second overlapping area of the first thickness layer of the protective insulating layer overlapping the second pad extends from a first edge of the second pad proximate a second edge of the first pad to a second edge of the second pad The fourth overlap area of the second thickness layer of the protective insulation layer overlapping with the second pad gradually decreases from the first edge of the second pad to the second edge of the second pad, LED array substrate.

The method according to claim 1,
Wherein the plurality of pads and the plurality of signal lines comprise a copper foil layer provided on a first surface of the base film,
A second copper layer provided on a second surface of the base film,
A second protective insulating layer provided on a second surface of the base film to cover the second copper layer,
And a reinforcing layer provided on the second protective insulating layer.

3. The method of claim 2,
A bonding layer provided on at least one of the base film and the copper foil layer, between the copper foil layer and the protective insulating layer, between the base film and the second copper foil layer, and between the second copper foil layer and the second protective insulating layer Further comprising an LED array substrate.

The method according to claim 1,
Wherein an exposed area of the first pad gradually decreases from a first edge of the first pad to a second edge of the first pad,
Wherein an exposed area of the second pad gradually increases from a first edge of the second pad to a second edge of the second pad.

5. The method of claim 4,
The inclination direction of the first boundary line forming the boundary between the first overlapping area and the third overlapping area is opposite to the inclination direction of the second boundary line forming the boundary between the second overlapping area and the fourth overlapping area ,
Wherein an inclined direction of a third boundary line that is a boundary between the first overlapping area of the first pad and the second thickness layer of the protective insulating layer and the exposed area of the first pad, Wherein the second thickness layer of the insulating layer is opposite to the oblique direction of the fourth boundary line that is the boundary between the overlapping fourth overlap area and the exposed area of the second pad.

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A backlight unit installed on a back surface of the liquid crystal panel;
A lower cover for accommodating the liquid crystal panel and the backlight unit; And
The liquid crystal display device according to any one of claims 1 to 5, which is provided inside the lower cover and supplies light to the liquid crystal panel.

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