KR20120134172A - Led assembly and liquid crystal display device including thereof - Google Patents

Led assembly and liquid crystal display device including thereof Download PDF

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Publication number
KR20120134172A
KR20120134172A KR1020110052911A KR20110052911A KR20120134172A KR 20120134172 A KR20120134172 A KR 20120134172A KR 1020110052911 A KR1020110052911 A KR 1020110052911A KR 20110052911 A KR20110052911 A KR 20110052911A KR 20120134172 A KR20120134172 A KR 20120134172A
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KR
South Korea
Prior art keywords
printed circuit
circuit board
liquid crystal
led assembly
thermal conductivity
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Application number
KR1020110052911A
Other languages
Korean (ko)
Inventor
이대흥
홍진우
민병삼
전현우
Original Assignee
엘지디스플레이 주식회사
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Priority to KR1020110052911A priority Critical patent/KR20120134172A/en
Publication of KR20120134172A publication Critical patent/KR20120134172A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The present invention relates to an LED assembly and a liquid crystal display including the same.
The liquid crystal display of the present invention includes a cover bottom; A reflection plate located inside the cover bottom; A light guide plate positioned on the reflecting plate; An LED assembly disposed on an inner side surface of the cover bottom; A plurality of optical sheets positioned on the light guide plate; A liquid crystal panel positioned on the plurality of optical sheets; A top cover disposed on the liquid crystal panel and coupled to the cover bottom, wherein the LED assembly is electrically connected to a plurality of LEDs and the plurality of LEDs, and is formed of a printed circuit board made of a copper thin film and an organic layer. The printed circuit board may further include a thermal conductivity improving material for improving thermal conductivity.

Description

LED assembly and liquid crystal display including the same {LED ASSEMBLY AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THEREOF}

The present invention relates to an LED assembly and a liquid crystal display including the same, and more particularly, to an LED assembly and a liquid crystal display including the same.

Recently, as the information society develops, the demand for the display field is increasing in various forms, and in response, various flat panel display devices, for example, liquid crystal, which have features such as thinning, light weight, and low power consumption Liquid crystal display devices, plasma display panel devices, electroluminescent display devices, and the like have been studied.

Among these, the liquid crystal display is one of the most widely used flat panel display devices, and includes a liquid crystal layer between the two substrates and the two substrates on which the pixel electrode and the common electrode are formed.

Such a liquid crystal display determines an orientation of liquid crystal molecules of a liquid crystal layer according to an electric field generated by a voltage applied to an electrode, and controls polarization of incident light to display an image.

The liquid crystal display device does not have a light emitting device, and thus a separate light source must be provided. The light source is called a backlight unit (BLU).

Here, as a light source of the backlight unit, a light emitting diode (LED) having small size, low power consumption, high reliability, and the like is widely used.

In general, the backlight unit may be broadly classified into a side type backlight unit and a direct type backlight unit.

In the side type backlight unit, the LED assembly is disposed on the side of the liquid crystal display to supply light to the liquid crystal panel through the reflection plate and the light guide plate, and the thickness of the side backlight unit is mainly used in a notebook or the like.

On the other hand, in the direct type backlight unit, the LED assembly is disposed on the back of the liquid crystal display, and the light is irradiated to the front of the liquid crystal panel through the backlight unit, so that high level is possible, and is mainly used in LCD TVs. .

In this case, the LED assembly in the case of the side type backlight unit mainly uses a metal printed circuit board.

1 illustrates a typical LED assembly.

As shown in FIG. 1, the LED assembly 50 includes a plurality of LEDs 54 and a metal printed circuit board 52.

A plurality of light emitting diodes (LEDs) 54 emit light having a red (R), green (G), and blue (B) color toward the light incident surface of the light guide plate (not shown). When turned on, white light by color mixing can be realized.

Metal printed circuit boards 52 are formed such that a plurality of LEDs 54 are spaced apart from each other at predetermined intervals.

In addition, the metal printed circuit board 52 is disposed on the side of the liquid crystal display (not shown) according to the driving signal, and then lighted to the liquid crystal panel (not shown) through the reflecting plate (not shown) and the light guide plate (not shown). To supply.

Although not shown, the LED assembly 50 may include a power supply unit (not shown) for supplying power to the plurality of LEDs 54.

The LED 54 used in the LED assembly 50 is a high brightness LED, which is accompanied by high heat in the process of converting electrical energy into light energy.

At this time, when the temperature of the LED is above a certain temperature (junction temperature), the efficiency of light emitted from the LED is significantly reduced.

Therefore, the LED must be mounted on a material that can easily dissipate heat generated while driving the LED, and a printed circuit board made of metal is mainly used.

2 is a cross-sectional view of a general metal printed circuit board.

As shown in FIG. 2, the metal printed circuit board 52 includes a metal base substrate 52a, an insulating and adhesive layer 52b, and a copper thin film 52c.

The metal base substrate 52a mainly uses a material having excellent thermal conductivity to effectively dissipate heat to the outside. The metal base substrate 52a mainly has a heat dissipation property so that the metal printed circuit board 52 has a thermal conductivity of 1 W / mK or more. Good aluminum, aluminum and iron alloys are used.

The insulating and adhesive layer 52b has a lower thermal conductivity than the metal base substrate 52a or the copper thin film 52c (for example, the thermal conductivity is 0.3 W / mK in the case of prepreg), and the metal printing It electrically insulates the plurality of LEDs 54 attached to the circuit board 52.

The insulation and adhesion layer 52b has better heat dissipation as the thickness thereof is smaller, but since the withstand voltage is lowered, the one having a thickness of 80 to 100 μm is generally used.

The copper thin film 52c is a layer in which a circuit for driving a plurality of LEDs 54 is printed by forming a desired pattern.

Since the metal printed circuit board 52 is a metal substrate, it takes a long time when cutting, and the temperature must be increased in order to mount the LED during the surface mount technology (SMT) process.

In addition, there is a drawback that there is no resilience against bending as the mold is designed, and the material cost is high and the weight is heavy.

In order to solve the shortcomings of the metal printed circuit board, the use of an organic material printed circuit board can be considered. The organic material printed circuit board has a poor heat dissipation performance compared to the metal printed circuit board, so it is used in an LED assembly that mounts a high brightness LED. There is a problem that it is difficult to apply.

The present invention is to solve the above problems, to provide an LED assembly to which an organic material printed circuit board is applied to improve the heat dissipation by inserting a thermal conductivity improving material into the organic material printed circuit board and a liquid crystal display device comprising the same. The purpose.

An LED assembly for achieving the above object, a plurality of LEDs; Electrically connected to the plurality of LEDs, consisting of a printed circuit board consisting of a copper thin film and an organic layer, the organic layer is made of glass fiber or paper or epoxy resin, or phenol resin, a thermal conductivity improving material for improving thermal conductivity It characterized in that it further comprises.

The printed circuit board may further include a plurality of holes formed to penetrate the copper thin film and the organic layer.

Here, the printed circuit board, at least one surface may be composed of the copper thin film.

Preferably, the printed circuit board may have a thickness of 0.1 mm to 2.0 mm.

A liquid crystal display device for achieving the above object includes a cover bottom; A reflection plate located inside the cover bottom; A light guide plate positioned on the reflecting plate; A plurality of optical sheets positioned on the light guide plate; A liquid crystal panel positioned on the plurality of optical sheets; An LED assembly for supplying light to the liquid crystal panel; A top cover disposed on the liquid crystal panel and coupled to the cover bottom, wherein the LED assembly is electrically connected to a plurality of LEDs and the plurality of LEDs, and is formed of a printed circuit board made of a copper thin film and an organic layer. The printed circuit board may further include a thermal conductivity improving material for improving thermal conductivity.

The printed circuit board may further include a plurality of holes formed to penetrate the copper thin film and the organic layer.

The organic layer may be made of glass fiber or paper or epoxy resin, or phenol resin.

Here, the printed circuit board, at least one surface may be composed of the copper thin film.

Preferably, the printed circuit board may have a thickness of 0.1 mm to 2.0 mm.

LED assembly manufacturing method according to a preferred embodiment of the present invention for achieving the above object comprises the steps of forming a printed circuit board consisting of a copper thin film and an organic layer; And forming a plurality of LEDs on the printed circuit board so as to be spaced apart from each other by a predetermined interval, and inserting a heat conduction improving material for improving thermal conductivity in the printed circuit board.

Here, the method of manufacturing an LED assembly according to a preferred embodiment of the present invention may further include forming a plurality of holes through the copper thin film and the organic layer in the printed circuit board.

In addition, the plurality of holes may be formed by a PTH or STH method.

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, the method including: forming a liquid crystal panel; Forming a backlight unit comprising an LED assembly; Arranging the backlight unit and the liquid crystal panel on the cover bottom, and combining the cover bottom and the top cover, wherein the LED assembly includes a copper thin film and an organic layer to improve thermal conductivity. It is characterized in that for the thermal conductivity improving material is added.

Herein, the method of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention may further include forming a plurality of holes through the copper thin film and the organic layer in the printed circuit board.

The plurality of holes may be formed by a PTH or STH method.

As described above, in the liquid crystal display device according to the present invention, the heat dissipation of the organic material printed circuit board is equal to the heat dissipation of the metal printed circuit board by applying the organic material printed circuit board into which the thermal conductivity improving material is inserted when manufacturing the LED assembly. It is possible to improve the cutting time and the SMT process temperature of the printed circuit board.

In addition, since organic materials are cheaper and lighter than metals, they are advantageous for handling in the process, and production costs can be reduced, thereby increasing the productivity of the LED assembly.

1 illustrates a typical LED assembly.
2 is a cross-sectional view of a general metal printed circuit board.
3 is an exploded perspective view of a liquid crystal display according to a preferred embodiment of the present invention.
4 to 7 schematically show cross-sections of various organic material printed circuit boards.
8 is a cross-sectional view of an organic material printed circuit board according to a preferred embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

3 is an exploded perspective view of a liquid crystal display device according to an exemplary embodiment of the present invention, and FIGS. 4 to 7 schematically illustrate cross-sectional views of various organic material printed circuit boards.

As shown in FIG. 3, the liquid crystal display device 100 includes a liquid crystal panel 130, a backlight unit 160, a cover bottom 170, and a top cover 180.

The liquid crystal panel 130 plays a key role in image expression, and includes a first substrate 110 and a second substrate 120 bonded to each other with a liquid crystal layer interposed therebetween.

In this case, the area of one edge of the first substrate 110 is larger than that of the second substrate 120, and a plurality of gate wirings (not shown) and data wiring (not shown) are formed at one edge of the first substrate 110. A driving circuit 115 for applying a signal may be formed.

The first substrate 110 is commonly referred to as an array substrate, and a plurality of gate wirings (not shown) and data wirings (not shown) intersect with each other to define a pixel area Pixel.

In addition, a thin film transistor (not shown), which is a switching element, is provided in each pixel region (not shown) so as to correspond to the pixel electrode (not shown) in one-to-one correspondence.

The second substrate 120 is commonly referred to as a color filter substrate, and a color filter layer (not shown) and a black matrix (not shown) are formed on an inner surface thereof.

Here, the color filter layer (not shown) includes red, green, and blue color filter patterns (not shown) corresponding to red, green, and blue pixel areas (not shown).

In addition, the black matrix (not shown) covers red, green, and blue color filter patterns (not shown), and non-display elements such as gate wiring (not shown), data wiring (not shown), and thin film transistor (not shown). It serves to hide.

In addition, the second substrate 120 includes a color common layer (not shown) covering the color filter layer (not shown) and the black matrix (not shown).

In addition, polarizing plates (not shown) for selectively transmitting only specific light are attached to the outer surfaces of the first substrate 110 and the second substrate 120, respectively.

Referring to the driving of the liquid crystal panel 130, first, as a control signal of a gate driver is scanned and transmitted for each gate wiring (not shown), the thin film transistor (not shown) is turned on.

The pixel voltage is transferred to the pixel electrode (not shown) of the selected pixel region (not shown) while the thin film transistor (not shown) is turned on.

As a result, the arrangement direction of the liquid crystal molecules of the liquid crystal layer (not shown) is changed by an electric field formed between the pixel electrode (not shown) and the common electrode (not shown), and various images are generated by using the change in the light transmittance. Is displayed.

The backlight unit 160 includes a reflective plate 142, a light guide plate 144, an LED assembly 150, and a plurality of optical sheets 146, and serves to supply light to the liquid crystal panel 130.

In general, the backlight unit 160 may be broadly classified into a side type backlight unit and a direct type backlight unit, and the LCD 100 according to the present invention may include an LED on an inner side surface of the cover bottom 170. A side backlight is used where assembly 150 is placed.

The reflection plate 142 is disposed inside the cover bottom 170, and the light guide plate 144 is disposed on the reflection plate 142.

The reflector 142 uses a plate having a high light reflectance, and when light incident from the plurality of LEDs 154 passes through the rear surface of the light guide plate 144, the reflector 142 is reflected toward the liquid crystal panel 130 to improve the brightness of the light. .

In the light guide plate 144, the light incident from the plurality of LEDs 154 is totally reflected, thereby continuing to diffuse the light evenly on the light guide plate 144 to provide a surface light source to the liquid crystal panel 130. Can be.

The light guide plate 144 may have a pattern having a specific shape on the rear surface to supply a uniform surface light source to the liquid crystal panel 130.

The LED assembly 150 is arranged on one side of the light guide plate 144 and includes a plurality of LEDs 154 and an organic material printed circuit board 152.

In this case, the plurality of light emitting diodes (LEDs) 154 may emit light having red (R), green (G), and blue (B) colors toward the light incident surface of the light guide plate 144.

When the RGB LEDs are turned on at the same time, white light may be realized by color mixing. The white light may be transferred to the liquid crystal panel through the light guide plate 144 and the plurality of optical sheets 146.

The plurality of LEDs 154 may be disposed on one surface of the organic material printed circuit boards 152 at predetermined intervals.

The organic material printed circuit board 152 may be formed of a copper thin film 152a and an organic layer 152b.

The organic layer 152b may be made of glass fiber or paper or epoxy resin, phenol resin, or the like.

For example, the organic layer 152b of the first organic material printed circuit board FR-1 is composed of paper and phenol resin, and the organic layer 152b of the second organic material printed circuit board FR-1 is woven glass. It consists of woven glass fiber and epoxy resin.

The organic layer 152b of the third organic material printed circuit board (CEM-3) is made of woven glass fiber, non woven glass fiber, and epoxy resin, and the fourth organic material. The organic layer 152b of the printed circuit board FR-4 is made of woven glass fiber and epoxy resin.

The first organic material printed circuit board FR-1 to the fourth organic material printed circuit board FR-4 are exemplary, and the LED assembly 152 according to the present invention has a thermal conductivity by inserting a thermal conductivity improving material. It can be manufactured by applying another type of organic material printed circuit board with improved.

The thermal conductivity of the organic material printed circuit board 152 may be improved by inserting a thermal conductivity improving material into the organic layer 152b. Such heat conduction improving material may be a metal alloy or the like.

In other words, the LED assembly 150 of the present invention may be manufactured by applying a printed circuit board in which a heat conduction improving material is inserted into a conventional organic material printed circuit board.

As a result, the low thermal conductivity, which is a disadvantage of the conventional organic material printed circuit board, can be improved to 1W / mK or more.

Therefore, even if an organic material printed circuit board is applied, 0.1W class or higher LEDs can be applied because the thermal conductivity can be increased to lower the heat of the LED anode.

On the other hand, the organic material printed circuit board 152 is applicable to both single-sided printed circuit board or double-sided printed circuit board according to the number of copper thin film 152a.

In general, thermal conductivity is proportional to the coefficient of thermal conductivity and inversely proportional to the distance between the materials to which heat is conducted.

Therefore, the metal has a lower thermal conductivity coefficient than that of the organic material, and therefore, a metal printed circuit board (52 of FIG. 1) was used in an LED assembly (50 of FIG. 1) in which a high brightness LED is mounted.

However, in the present invention, as the thermal conductivity improving material is inserted into the organic material printed circuit board 152, the thermal conductivity becomes large, and as a result, the thermal conductivity is improved.

In addition to the method of increasing the thermal conductivity, the thermal conductivity may be improved by reducing the distance between materials conducting heat.

To this end, a plurality of holes (not shown) penetrating the copper thin film 152a and the organic layer 152b may be formed in the organic material printed circuit board 152 to improve thermal conductivity.

Meanwhile, although the thermal conductivity improving material is inserted into the organic layer 152b in the present invention, the copper thin film 152a of the lower portion of the organic material printed circuit board 152 is removed to be inserted into the organic layer 152b. It is also possible.

By forming a plurality of holes (not shown) or by applying a thermal conductivity improving material to the lower end of the organic layer 152b, the thickness of the organic material printed circuit board 152 may be changed to 0.1 mm to 2.0 mm.

Therefore, the distance between the materials conducting heat is reduced, thereby improving the thermal conductivity of the organic material printed circuit board 152.

The LED assembly 150 may receive various driving signals for driving a plurality of LEDs through an external driving driver to supply light to the liquid crystal panel.

Although not shown, the LED assembly 150 may include a power supply unit (not shown) for supplying power to the plurality of LEDs 154. The power supply unit (not shown) serves to supply power to the plurality of LEDs 154.

In the present invention, by manufacturing the LED assembly 150 using the organic material printed circuit board 152 with improved thermal conductivity, cutting time and SMT process of the printed circuit board compared to the case of applying the conventional metal printed circuit board 52 The temperature can be improved.

In this case, SMT is an abbreviation of Surface Mount Technology. Surface mounting technology refers to a mounting method in which a lead (pin out of a part) of a part is attached to the surface with solder or the like without being inserted into a hole of a printed circuit board.

In addition, since the organic material printed circuit board 152 uses an organic material which is cheaper and lighter than metal, it is advantageous in handling during the process and the production cost can be reduced, thereby increasing the productivity of the LED assembly 150.

The cover bottom 170 serves as an overall skeleton, and the LED assembly 150 is disposed on an inner side surface of the cover bottom 170 according to the present invention.

In addition, the reflection plate 142 is positioned inside the cover bottom 170, and the light guide plate 144 and the plurality of optical sheets 146 are disposed in the upper portion of the reflecting plate 142, and the upper portion of the plurality of optical sheets 146. A liquid crystal panel 130 including a first substrate 110 and a second substrate 120 bonded to each other with a liquid crystal layer (not shown) therebetween is disposed.

After the liquid crystal panel 130 and the backlight unit 160 are disposed inside the cover bottom 170, the liquid crystal display module is completed by combining the cover bottom 170 and the top cover 180.

The liquid crystal display device 100 may further include a rectangular frame (not shown) positioned on the cover bottom 170 and covering the edges of the liquid crystal panel 130 and the backlight unit 160. Can be.

As shown in FIG. 4, the first organic material printed circuit board FR-1 is a double-sided printed circuit board composed of two copper foils 152a, and an organic layer 152b composed of paper and phenol resin. It includes.

As shown in FIG. 5, the second organic material printed circuit board (CEM-1) includes two copper thin films (Cu Foil) 152a, an organic layer composed of woven glass fibers and epoxy resin. 152b.

In addition, as shown in FIG. 6, the third organic material printed circuit board (CEM-3) includes two copper foils (Cu Foil) 152a, woven glass fibers and non-woven glass fibers ( and an organic layer 152b composed of non woven glass fiber) and epoxy resin.

As shown in FIG. 7, the fourth organic material printed circuit board FR-4 includes two copper foils 152a, an organic layer made of woven glass fibers, and an epoxy resin. 152b.

The thermal conductivity may be improved as compared with the conventional organic material printed circuit board by inserting a filler made of a thermal conductivity improving material in the organic layer 152b of the organic material printed circuit board.

For example, thermal conductivity may be improved by compressing the organic layer 152b by mixing aluminum (Al), copper (Cu) with woven glass fibers, epoxy resin, or the like.

The first organic material printed circuit board FR-1 to the fourth organic material printed circuit board FR-4 are exemplary, and the LED assembly 152 according to the present invention inserts a thermal conductivity improving material to improve thermal conductivity. It can be fabricated by applying other types of improved organic material printed circuit boards.

In addition, a plurality of holes may be further included to improve heat dissipation of the organic material printed circuit board, which will be described in detail with reference to FIG. 8.

8 is a cross-sectional view of an organic material printed circuit board according to a preferred embodiment of the present invention.

As shown in FIG. 8, the organic material printed circuit board 152 includes two copper thin films 152a, an organic layer 152b, and a plurality of holes.

The organic material printed circuit board 152 may be the first organic material printed circuit board FR-1 to the fourth organic material printed circuit board FR-4 shown in FIGS. 4 to 7.

In general, thermal conductivity is proportional to the coefficient of thermal conductivity and inversely proportional to the distance between the materials to which heat is conducted.

Therefore, the organic material printed circuit board 152 of the present invention improves thermal conductivity by increasing a thermal conductivity coefficient as the thermal conductivity improving material is inserted.

The thermal conductivity improving material may be inserted into the organic layer 152b of the organic material printed circuit board 152, or may be inserted into the organic layer 152b by removing the copper thin film 152a under the organic material printed circuit board 152. You may.

When the layer in which the thermal conductivity improving material is inserted is positioned under the organic material printed circuit board 152, the thickness of the organic material printed circuit board 152 may be narrowed to improve thermal conductivity.

In addition, a plurality of holes penetrating the copper thin film 152a and the organic layer 152b may be formed in the organic material printed circuit board 152 of the present invention.

The hole formation method can be largely divided into a plate-thought-hole (PTH) method and a silver-thought-hole (STH) method, and a plurality of holes in the present invention may be formed by any method.

The metal alloy 153 may be printed inside the plurality of holes, and heat emitted from the LED through the printed metal alloy 153 may be more easily conducted through the plurality of holes. Can be.

The embodiments of the present invention as described above are merely illustrative, and those skilled in the art can make modifications without departing from the gist of the present invention. Accordingly, the protection scope of the present invention includes modifications of the present invention within the scope of the appended claims and equivalents thereof.

100: liquid crystal display 110: first substrate
120: second substrate 130: liquid crystal panel
160: backlight unit 146: optical sheet
142: reflector 144: light guide plate

Claims (15)

A plurality of LEDs;
Is electrically connected to the plurality of LEDs, consisting of a printed circuit board consisting of a copper thin film and an organic layer,
The organic layer is composed of glass fiber or paper or epoxy resin, or phenol resin, LED assembly, characterized in that further comprises a heat conduction improving material for improving the thermal conductivity.
The method of claim 1,
The printed circuit board,
The LED assembly further comprises a plurality of holes formed to penetrate the copper thin film and the organic layer.
The method of claim 1,
The printed circuit board,
LED assembly, characterized in that at least one surface is composed of the copper thin film.
The method of claim 1,
LED assembly, characterized in that the thickness of the printed circuit board is 0.1mm ~ 2.0mm.
Covertum;
A reflection plate located inside the cover bottom;
A light guide plate positioned on the reflecting plate;
A plurality of optical sheets positioned on the light guide plate;
A liquid crystal panel positioned on the plurality of optical sheets;
An LED assembly for supplying light to the liquid crystal panel;
Located on the liquid crystal panel includes a top cover coupled to the cover bottom,
The LED assembly includes a plurality of LEDs and a printed circuit board electrically connected to the plurality of LEDs, the printed circuit board including a copper thin film and an organic layer, and the printed circuit board further includes a thermal conductivity improving material for improving thermal conductivity. Liquid crystal display device characterized in that.
The method of claim 5,
The printed circuit board,
And a plurality of holes formed to penetrate the copper thin film and the organic layer.
The method according to claim 6,
The organic layer,
A liquid crystal display device comprising glass fiber or paper or epoxy resin, or phenol resin.
The method of claim 5,
The printed circuit board,
And at least one surface of the copper thin film.
The method of claim 5,
And a thickness of the printed circuit board is 0.1 mm to 2.0 mm.
Forming a printed circuit board comprising a copper thin film and an organic layer;
Forming a plurality of LEDs on the printed circuit board so as to be spaced apart by a predetermined interval;
And inserting a thermal conductivity improving material to improve thermal conductivity in the printed circuit board.
The method of claim 10,
And forming a plurality of holes through the copper thin film and the organic layer in the printed circuit board.
The method of claim 11,
The plurality of holes are LED assembly manufacturing method, characterized in that formed by the PTH or STH method.
Forming a liquid crystal panel;
Forming a backlight unit comprising an LED assembly;
Arranging the backlight unit and the liquid crystal panel on an upper cover bottom, and combining the cover bottom and the top cover;
The LED assembly includes:
A method of manufacturing a liquid crystal display device, characterized in that a thermal conductivity improving material is added to a printed circuit board made of a copper thin film and an organic layer to improve thermal conductivity.
The method of claim 13,
And forming a plurality of holes through the copper thin film and the organic layer in the printed circuit board.
15. The method of claim 14,
And the plurality of holes are formed by a PTH or STH method.
KR1020110052911A 2011-06-01 2011-06-01 Led assembly and liquid crystal display device including thereof KR20120134172A (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10061157B2 (en) 2015-08-06 2018-08-28 Samsung Display Co., Ltd. Backlight unit and display apparatus including the same
KR20190082683A (en) * 2019-04-29 2019-07-10 위인호 Transparent LED display to display the video content on the transparent LED screen and output digital information
CN111322534A (en) * 2020-03-31 2020-06-23 福建省闽发铝业股份有限公司 LED lamp aluminium alloy

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10061157B2 (en) 2015-08-06 2018-08-28 Samsung Display Co., Ltd. Backlight unit and display apparatus including the same
KR20190082683A (en) * 2019-04-29 2019-07-10 위인호 Transparent LED display to display the video content on the transparent LED screen and output digital information
CN111322534A (en) * 2020-03-31 2020-06-23 福建省闽发铝业股份有限公司 LED lamp aluminium alloy

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