CN111322534A - LED lamp aluminium alloy - Google Patents
LED lamp aluminium alloy Download PDFInfo
- Publication number
- CN111322534A CN111322534A CN202010241578.1A CN202010241578A CN111322534A CN 111322534 A CN111322534 A CN 111322534A CN 202010241578 A CN202010241578 A CN 202010241578A CN 111322534 A CN111322534 A CN 111322534A
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- CN
- China
- Prior art keywords
- led lamp
- aluminum substrate
- layer heat
- peltier
- conducting aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention relates to an LED lamp aluminum profile which comprises an LED lamp strip and an LED lamp driving module, wherein the LED lamp strip is electrically connected with the LED lamp driving module to form a conductive loop, the LED lamp strip further comprises an upper-layer heat-conducting aluminum substrate, a Peltier, a lower-layer heat-conducting aluminum substrate, a digital temperature sensor and a controller, the LED lamp strip and the temperature sensor are arranged on the upper surface of the upper-layer heat-conducting aluminum substrate, the cold end of the Peltier is arranged on the lower surface of the upper-layer heat-conducting aluminum substrate, the hot end of the Peltier is arranged on the upper surface of the lower-layer heat-conducting aluminum substrate, a through hole is formed in the lower-layer heat-conducting aluminum substrate along the length direction of the lower-layer heat-conducting aluminum substrate, two openings of. The electronic components are connected in a matching way. This LED lamp aluminium alloy can initiatively dispel the heat.
Description
Technical Field
The invention relates to an aluminum profile of an LED lamp.
Background
The aluminum profile is a metal material having light weight (2.7g/cm3), excellent corrosion resistance and thermal conductivity. The aluminum profile is widely applied to the field of lamps as an aluminum substrate, the LED is arranged on the aluminum substrate, on one hand, the aluminum substrate plays a role in fixing and supporting, and on the other hand, heat generated when the LED works and is lighted is quickly conducted and dissipated through the aluminum substrate. For example, a common aluminum substrate such as a high-efficiency heat dissipation LED aluminum substrate and a lamp disclosed in chinese patent application publication No. CN103453492A, applied on 29/05/2012, includes a plate body for welding LEDs, the plate body is provided with a plurality of heat dissipation grooves, heat generated by LED lighting is conducted to the plate body through pads on the plate body, the heat on the plate body is conducted along the heat dissipation grooves, air between the heat dissipation grooves is heated, hot air rises upwards, and cold air under the plate body is supplemented upwards, so that an air convection circulation is formed, and heat exchange between the plate body and the air is accelerated, thereby achieving heat dissipation of the LEDs.
The inventor indicates that the heat dissipation method of the high-efficiency heat dissipation LED aluminum substrate is a passive heat dissipation method, and the temperature of the aluminum substrate is uncontrollable, that is, after the temperature of the plate body rises, an air convection circulation is formed between the heat dissipation grooves, the temperature of the aluminum substrate is closely related to the temperature of the environment and the power of the LEDs, and if the aluminum substrate cannot dissipate heat in time, the service life of the LEDs is shortened, and even the LEDs are burned. This is unfavorable for some use scenes that require the LED steady operation, for example LED light in the tunnel, the traffic is big in the tunnel, and difficult the change after the LED light burns out, and the replacement cost is high.
Disclosure of Invention
Therefore, in order to solve the above problems, the present invention provides an aluminum profile for an LED lamp capable of actively dissipating heat.
In order to achieve the purpose, the invention adopts the following technical scheme: an LED lamp aluminum profile comprises an LED lamp strip and an LED lamp driving module, wherein the LED lamp strip is electrically connected with the LED lamp driving module to form a conductive loop, the LED lamp strip further comprises an upper-layer heat-conducting aluminum substrate, a Peltier, a lower-layer heat-conducting aluminum substrate, a digital temperature sensor and a controller, the LED lamp strip and the temperature sensor are arranged on the upper surface of the upper-layer heat-conducting aluminum substrate, the cold end of the Peltier is arranged on the lower surface of the upper-layer heat-conducting aluminum substrate, the hot end of the Peltier is arranged on the upper surface of the lower-layer heat-conducting aluminum substrate, a through hole is formed in the lower-layer heat-conducting aluminum substrate along the length direction of the lower-layer heat-conducting aluminum substrate, two openings of the through;
the controller comprises an AC-DC power supply module, a microprocessor and a solid-state relay, wherein the input end of the AC-DC power supply module is connected with a mains supply, the power supply end of the microprocessor and the input end of the solid-state relay are respectively and electrically connected with the output end of the AC-DC power supply module, the control end of the solid-state relay, the LED lamp driving module and the digital temperature sensor are respectively and electrically connected with different I/O ends of the microprocessor, and the output end of the solid-state relay is connected with a Peltier to form a conductive loop.
Furthermore, a plurality of radiating fins are arranged on the lower surface of the lower-layer heat-conducting aluminum substrate.
Furthermore, a plurality of heat conduction fins are arranged on the inner side wall of the through hole of the lower heat conduction aluminum substrate, which is positioned on one side close to the Peltier.
By adopting the technical scheme, the invention has the beneficial effects that: according to the LED lamp aluminum profile, the digital temperature sensor is arranged on the upper surface of the upper-layer heat-conducting aluminum substrate and used for detecting the temperature of the upper-layer heat-conducting aluminum substrate when the LED lamp strip works, and the Peltier is arranged between the upper-layer heat-conducting aluminum substrate and the lower-layer heat-conducting aluminum substrate. When the LED lamp strip is used, the temperature threshold value of the upper surface of the upper-layer heat-conducting aluminum substrate (for example, the temperature threshold value of the upper surface of the upper-layer heat-conducting aluminum substrate is set to be 65 ℃ according to the working temperature of the LED lamp strip) and the normal working temperature (for example, 25 ℃) are set in the microprocessor in advance, if the temperature of the upper surface of the upper-layer heat-conducting aluminum substrate exceeds the set temperature threshold value, the microprocessor controls the solid-state relay to be conducted, and after the Peltier is electrified, the cold end is refrigerated to rapidly cool the upper-layer. The heat that the hot end produced when the Peltier circular telegram is conducted and is cooled off to the inside coolant oil of lower floor's heat conduction aluminium base board, and the coolant oil has big specific heat capacity, can effectively cool off the hot junction of Peltier. Furthermore, the lower surface of the lower-layer heat-conducting aluminum substrate is provided with a plurality of radiating fins, so that the lower-layer heat-conducting aluminum substrate can quickly radiate heat. Furthermore, a plurality of heat-conducting fins are arranged on the inner side wall, close to the Peltier, of the through hole of the lower heat-conducting aluminum substrate, so that heat generated by the hot end of the Peltier is quickly conducted into the cooling oil.
Drawings
FIG. 1 is an exploded view of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of an embodiment of the present invention;
FIG. 3 is a block diagram of the circuit connections of an embodiment of the present invention.
Detailed Description
The invention will now be further described with reference to the accompanying drawings and detailed description.
Referring to fig. 1, 2 and 3, the present embodiment provides an LED lamp aluminum profile, which includes an LED lamp strip 10, an LED lamp driving module 20, an upper layer heat-conducting aluminum substrate 1, a peltier element 2, a lower layer heat-conducting aluminum substrate 3, a sealing gasket 4, a sealing gasket 5, a digital temperature sensor 6, and a controller 7. The Peltier 2 is an existing electronic component, the Peltier 2 is provided with a cold end and a hot end, the cold end of the Peltier 2 absorbs heat for refrigeration when the Peltier 2 is electrified, and the hot end generates heat. The controller 7 comprises a microprocessor 71, an AC-DC power module 72 and a solid-state relay 73, in this embodiment, preferably, the microprocessor uses an AT89C51 single chip microcomputer, and the AC-DC power module 72 is configured to convert the commercial power into +5V direct current. All the electronic components are existing equipment.
The LED lamp strip 10 and the digital temperature sensor 6 are both arranged on the upper surface of the upper-layer heat-conducting aluminum substrate 1, and the digital temperature sensor 6 is used for detecting the temperature of the upper surface of the upper-layer heat-conducting aluminum substrate 1. The lower surface of lower floor's heat conduction aluminium base board 3 is provided with a plurality of radiating fin 31, a through-hole 30 has been seted up along 3 length direction of lower floor's heat conduction aluminium base board in the aluminium base board 3 of lower floor, be provided with a plurality of heat conduction fins 32 on being located the inside wall that is close to peltier 2 one side in the through-hole 30 of lower floor's heat conduction aluminium base board 3, sealed 4 and sealed 5 adoption rubber pads of pad, sealed 4 and sealed 5 two openings that block up through-hole 30 of pad make the through-hole in form the enclosure space, pack in the enclosure space and be filled with coolant oil (earlier with sealed 4 one opening that blocks up through-hole 30 of pad, another opening of the sealed 5 shutoff.
The LED lamp strip 10 and the digital temperature sensor 6 are arranged on the upper surface of the upper-layer heat-conducting aluminum substrate 1, the cold end of the Peltier 2 is bonded on the lower surface of the upper-layer heat-conducting aluminum substrate 1 through heat-conducting silica gel, and the hot end of the Peltier 2 is bonded on the upper surface of the lower-layer heat-conducting aluminum substrate 3 through heat-conducting silica gel. The input end of the AC-DC power module 72 is connected with commercial power, the power end of the microprocessor 71 and the input end of the solid-state relay 73 are respectively and electrically connected with the output end of the AC-DC power module 72, the control end of the solid-state relay 73, the LED lamp driving module 11 and the digital temperature sensor 6 are respectively and electrically connected with different I/O ends of the microprocessor 71, and the output end of the solid-state relay 73 is connected with the Peltier 2 to form a conductive loop.
The operating temperature of a typical LED strip is set to 65 ℃. The temperature threshold of the upper surface of the upper-layer heat-conducting aluminum substrate 1 is set to 65 ℃ in advance in the microprocessor 71, and the normal working temperature of the LED lamp strip is set to 25 ℃. If the temperature of the upper surface of the upper-layer heat-conducting aluminum substrate 1 exceeds 65 ℃, the microprocessor 71 controls the solid-state relay 73 to be conducted, and after the Peltier 2 is electrified, the cold end cools to quickly cool the upper-layer heat-conducting aluminum substrate 1 and keep the temperature at 25 ℃. The heat that the hot end produced when Peltier 2 circular telegram is conducted cools off to the inside coolant oil of lower floor's heat conduction aluminium base board 3, and the coolant oil has big specific heat capacity, can effectively cool off Peltier 2's hot end.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (3)
1. The utility model provides a LED lamp aluminium alloy, includes LED lamp area and LED lamp drive module, LED lamp area is connected with LED lamp drive module electricity and is formed conductive loop, its characterized in that: the LED lamp strip and the temperature sensor are arranged on the upper surface of the upper-layer heat-conducting aluminum substrate, the cold end of the Peltier is arranged on the lower surface of the upper-layer heat-conducting aluminum substrate, the hot end of the Peltier is arranged on the upper surface of the lower-layer heat-conducting aluminum substrate, a through hole is formed in the lower-layer heat-conducting aluminum substrate along the length direction of the lower-layer heat-conducting aluminum substrate, two openings of the through hole are respectively sealed by a sealing gasket to form a sealed space in the through hole, and cooling oil is filled in the sealed space;
the controller comprises an AC-DC power supply module, a microprocessor and a solid-state relay, wherein the input end of the AC-DC power supply module is connected with a mains supply, the power supply end of the microprocessor and the input end of the solid-state relay are respectively and electrically connected with the output end of the AC-DC power supply module, the control end of the solid-state relay, the LED lamp driving module and the digital temperature sensor are respectively and electrically connected with different I/O ends of the microprocessor, and the output end of the solid-state relay is connected with a Peltier to form a conductive loop.
2. The LED lamp aluminum profile as claimed in claim 1, characterized in that: the lower surface of the lower-layer heat-conducting aluminum substrate is provided with a plurality of radiating fins.
3. The LED lamp aluminum profile as claimed in claim 1 or 2, characterized in that: and a plurality of heat conduction fins are arranged on the inner side wall of the through hole of the lower heat conduction aluminum substrate, which is positioned at one side close to the Peltier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010241578.1A CN111322534A (en) | 2020-03-31 | 2020-03-31 | LED lamp aluminium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010241578.1A CN111322534A (en) | 2020-03-31 | 2020-03-31 | LED lamp aluminium alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111322534A true CN111322534A (en) | 2020-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010241578.1A Pending CN111322534A (en) | 2020-03-31 | 2020-03-31 | LED lamp aluminium alloy |
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| Country | Link |
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| CN (1) | CN111322534A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202501429U (en) * | 2012-03-26 | 2012-10-24 | 上海绿潜新能源科技有限公司 | High-efficiency high-power light-emitting diode (LED) lamp radiator |
| KR20120134172A (en) * | 2011-06-01 | 2012-12-12 | 엘지디스플레이 주식회사 | Led assembly and liquid crystal display device including thereof |
| CN203190136U (en) * | 2013-03-18 | 2013-09-11 | 林智勇 | Large-power liquid cooling LED lamp |
| CN204372865U (en) * | 2014-12-19 | 2015-06-03 | 深圳市新昂威照明有限公司 | A kind of high-power LED lamp cooling device |
| CN105451635A (en) * | 2013-08-23 | 2016-03-30 | 奥林巴斯株式会社 | Light source device and endoscope device |
| CN109802194A (en) * | 2019-01-17 | 2019-05-24 | 重庆大学 | Based on Peltier effect and heat pipe cooling battery pack and its thermal management algorithm |
-
2020
- 2020-03-31 CN CN202010241578.1A patent/CN111322534A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120134172A (en) * | 2011-06-01 | 2012-12-12 | 엘지디스플레이 주식회사 | Led assembly and liquid crystal display device including thereof |
| CN202501429U (en) * | 2012-03-26 | 2012-10-24 | 上海绿潜新能源科技有限公司 | High-efficiency high-power light-emitting diode (LED) lamp radiator |
| CN203190136U (en) * | 2013-03-18 | 2013-09-11 | 林智勇 | Large-power liquid cooling LED lamp |
| CN105451635A (en) * | 2013-08-23 | 2016-03-30 | 奥林巴斯株式会社 | Light source device and endoscope device |
| CN204372865U (en) * | 2014-12-19 | 2015-06-03 | 深圳市新昂威照明有限公司 | A kind of high-power LED lamp cooling device |
| CN109802194A (en) * | 2019-01-17 | 2019-05-24 | 重庆大学 | Based on Peltier effect and heat pipe cooling battery pack and its thermal management algorithm |
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Application publication date: 20200623 |