KR20110022921A - LED light with cooling cooler - Google Patents

LED light with cooling cooler Download PDF

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Publication number
KR20110022921A
KR20110022921A KR1020090080436A KR20090080436A KR20110022921A KR 20110022921 A KR20110022921 A KR 20110022921A KR 1020090080436 A KR1020090080436 A KR 1020090080436A KR 20090080436 A KR20090080436 A KR 20090080436A KR 20110022921 A KR20110022921 A KR 20110022921A
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South Korea
Prior art keywords
led
housing
heat
cooling cooler
heat dissipation
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Korean (ko)
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KR101110125B1 (en
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강성린
김영일
박종복
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주식회사 케이에스비
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 엘이디 조명등에 관한 것으로, 사용상태에서 엘이디 발열로 인한 하우징 내부의 온도 상승을 최소화할 수 있도록 함으로써 하우징 내부의 과열로 인한 엘이디의 수명 저하를 방지할 수 있도록 하는 냉각 쿨러를 구비하는 엘이디 조명등에 관한 것이다.The present invention relates to an LED lighting lamp, LED lighting lamp having a cooling cooler to prevent the degradation of the life of the LED due to overheating inside the housing by minimizing the temperature rise inside the housing due to the LED heat in use state It is about.

본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등(A)은,The LED illuminating lamp (A) provided with the cooling cooler by this invention,

저면에 엘이디(11)가 연속 배열되고 상면에 엘이디(11)로부터의 발열을 방출하는 방열블럭(12)이 마련된 기판(10)과;A substrate (10) having a heat dissipation block (12) for dissipating heat generated from the LED (11) on the bottom and the LEDs (11) continuously arranged;

상기 기판(10)을 수용하는 것으로, 몸체(20') 외측의 일면에 내부로의 통기를 위한 통공(21)이 마련된 하우징(20)과;A housing 20 for accommodating the substrate 10 and having a through-hole 21 for venting therein to one surface outside the body 20 ';

상기 하우징(20)의 통공(21)상에 결합되는 것으로, 하우징(20) 내부로의 외기 공급을 위한 송풍팬(31) 하부에 일정한 간격으로 연속되는 방열판(32)이 마련되고, 방열판(32) 하부에 상측 절곡부(33')가 각 방열판(32)의 중간부를 관통하고 하측 절곡부(33")가 기판(10)상의 방열블럭(12) 상면에 밀접하는 열전도판(33)이 마련된 냉각 쿨러(30);로 이루어지는 것을 특징으로 하는 것이다.Coupled to the through-hole 21 of the housing 20, the heat dissipation plate 32 is provided in the lower portion of the blowing fan 31 for supplying outside air into the housing 20 at regular intervals, the heat dissipation plate 32 The upper bent part 33 'penetrates the middle part of each heat sink 32, and the lower bent part 33' is provided with the heat conduction plate 33 which is in close contact with the upper surface of the heat dissipation block 12 on the board | substrate 10). Cooling cooler 30; characterized by consisting of.

Description

냉각 쿨러를 구비하는 엘이디 조명등{ led lighting lamp with a cooler }LED lighting lamp with a cooler}

본 발명은 엘이디 조명등에 관한 것으로, 더욱 상세하게는 사용상태에서 엘이디 발열로 인한 하우징 내부의 온도 상승을 최소화할 수 있도록 함으로써 하우징 내부의 과열로 인한 엘이디의 수명 저하를 방지할 수 있도록 하는 냉각 쿨러를 구비하는 엘이디 조명등에 관한 것이다.The present invention relates to an LED lamp, and more particularly to a cooling cooler that can prevent the rise of the life of the LED due to overheating inside the housing by minimizing the temperature rise inside the housing due to the LED heat in use state It relates to an LED lighting lamp to be provided.

가정, 사업장, 도로 등 각종의 장소 및 각종의 장치에는 조명등이 마련된다.Lighting is provided in various places such as homes, workplaces, roads, and various devices.

이와 같은 조명등은 광원의 점등에 의해 야간에 시야를 확보할 수 있도록 하는데, 일반 전구와 같은 기존의 광원은 시야 확보는 가능하였으나 수명이 짧아 수시로 교체해 주어야만 하는 번거로움이 따르는 문제가 있었다.Such lighting is to ensure the vision at night by the lighting of the light source, the conventional light source, such as a general light bulb was able to secure the field of view, but there was a problem that has to be replaced from time to time has a short life.

상기와 같은 기존 광원을 사용하는 조명등의 문제를 해소하고자 엘이디를 광원으로 하는 엘이디 조명등이 제안된바 있다.In order to solve the problem of the lighting using the conventional light source as described above has been proposed LED lighting using the LED as a light source.

엘이디 조명등은 광원 즉, 엘이디 자체의 부피가 기존의 일반 전구 등에 비 해 월등히 작으면서도 광량이 풍부할 뿐만 아니라 수명이 길어 그 보급이 빠르게 늘고 있는 실정이다.LED lighting is a situation that the volume of the light source, that is, the LED itself is much smaller than the conventional light bulbs, but the amount of light is not only abundant, but the life is long, and its spread is rapidly increasing.

그러나 엘이디는 사용과정에서 발열이 상당하여 하우징 내부의 과열 상태가 장기간 지속될 경우 엘이디의 애초 수명을 유지하지 못하게 되는 문제가 있었다.However, the LED has a significant heat generation during use, there is a problem that can not maintain the original life of the LED when the overheating state inside the housing for a long time.

상기의 이유로 엘이디 조명등에는 하우징 내부의 과열 방지를 위한 냉각 수단이 마련되어 왔다.For this reason, LED lighting has been provided with a cooling means for preventing overheating inside the housing.

그러나 기존의 하우징 내부의 과열 방지를 위한 냉각 수단은 냉각 효율이 떨어지는 것이어서 하우징 내부의 과열 방지 효과가 기대에 미치지 못하는 문제가 있었다.However, the conventional cooling means for preventing overheating inside the housing has a problem that the cooling efficiency is inferior and the overheating prevention effect inside the housing does not meet expectations.

이러한 이유로 엘이디 조명등 사용자들은 엘이디 수명이 장기간 유지될 수 있는 제품을 요구하고 있으나, 현재까지의 엘이디 조명등은 여전히 사용자들의 요구를 만족시키지 못하고 있는 실정이다.For this reason, LED lighting users require a product that can maintain the LED life for a long time, but LED lighting until now does not meet the needs of users.

본 발명은 상기와 같은 실정을 감안하여 안출한 것으로, 사용상태에서 엘이디 발열로 인한 하우징 내부의 온도 상승을 최소화할 수 있도록 함으로써 하우징 내부의 과열로 인한 엘이디의 수명 저하를 방지할 수 있도록 하는 냉각 쿨러를 구비하는 엘이디 조명등을 제공하는데 그 목적이 있는 것이다.The present invention has been made in view of the above situation, by using a cooling cooler that can minimize the rise in the temperature of the interior of the housing due to the heat generated by the LED in use to prevent the degradation of the life of the LED due to overheating inside the housing The purpose is to provide an LED lighting having a.

상기의 목적을 달성하기 위한 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등은,LED lighting having a cooling cooler according to the present invention for achieving the above object,

저면에 엘이디가 연속 배열되고, 상면에 엘이디로부터의 발열을 방출하는 방열블럭이 마련된 기판과;A substrate on which an LED is continuously arranged on a bottom surface, and a heat dissipation block for dissipating heat generated by the LED on an upper surface thereof;

상기 기판을 수용하는 것으로, 몸체 외측의 일면에 내부로의 통기를 위한 통공이 마련된 하우징과;A housing accommodating the substrate and having a through hole for venting to the inside on one surface of the outside of the body;

상기 하우징의 통공상에 결합되는 것으로, 하우징 내부로의 외기 공급을 위한 송풍팬 하부에 일정한 간격으로 연속되는 방열판이 마련되고, 방열판 하부에 상측 절곡부가 각 방열판의 중간부를 관통하고 하측 절곡부가 기판상의 방열블럭 상면에 밀접하는 열전도판이 마련된 냉각 쿨러;로 이루어지는 것을 특징으로 하는 것이다.It is coupled to the through-hole of the housing, the heat dissipation plate is provided in the lower portion of the blower fan for supplying the outside air into the housing at regular intervals, and the upper bent portion penetrates the middle portion of each heat sink plate and the lower bent portion is formed on the substrate. It is characterized in that consisting of; a cooling cooler provided with a heat conducting plate in close contact with the upper surface of the heat radiation block.

본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등은, 냉각 쿨러에 방열판을 관통하고 방열블럭과 밀접하는 열전도판이 마련된 것이어서 엘이디로부터의 발열이 기판상의 방열블럭과 냉각 쿨러의 열전도판을 거쳐 방열판에 직접적으로 고르게 전달된 후 송풍팬 작동에 의한 외기 유입에 의해 급속히 냉각될 수 있는 것인 바, 엘이디 발열로 인한 하우징 내부의 온도 상승을 최소화할 수 있어 하우징 내부의 과열로 인한 엘이디의 수명 저하를 방지할 수 있게 되는 것이다.The LED lighting lamp having the cooling cooler according to the present invention has a heat conduction plate which penetrates the heat sink and is in close contact with the heat dissipation block. After being delivered evenly, it can be rapidly cooled by the inflow of outside air by the operation of the blower fan. The temperature rise inside the housing due to the heat of the LED can be minimized, and the life of the LED due to the overheating of the housing can be prevented. Will be.

이하, 첨부 도면에 의거하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings in more detail as follows.

도 1은 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등의 구성을 설명하기 위한 분리사시도이고, 도 2는 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등의 내부 구조를 설명하기 위한 단면도이며, 도 3은 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등에서 냉각 쿨러를 통한 냉각을 설명하기 위한 작동상태도이다.1 is an exploded perspective view for explaining the configuration of the LED lamp having a cooling cooler according to the present invention, Figure 2 is a cross-sectional view for explaining the internal structure of the LED lamp having a cooling cooler according to the present invention, Figure 3 Is an operating state diagram for explaining the cooling through the cooling cooler in the LED lighting having a cooling cooler according to the present invention.

도 1 및 도 2에 도시된 바와 같이 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등(A)은 기판(10)과, 하우징(20)과, 냉각 쿨러(30)로 이루어진다.1 and 2, the LED lamp A having the cooling cooler according to the present invention includes a substrate 10, a housing 20, and a cooling cooler 30. As shown in FIG.

상기 기판(10)은 저면에 엘이디(11)가 연속 배열된 것이고, 상면에 엘이디(11)로부터의 발열을 방출하는 방열블럭(12)이 마련된 것이다.In the substrate 10, the LEDs 11 are continuously arranged on the bottom surface, and a heat dissipation block 12 for dissipating heat generated from the LEDs 11 is provided on the top surface of the substrate 10.

이와 같은 기판(10)에서 방열블럭(12)은 상면이 일정한 높이로 된 것이라면 통상의 어떠한 것을 사용하여도 무방하므로 상세한 설명은 생략하는 바이다.The heat dissipation block 12 of the substrate 10 as described above may be used as long as the upper surface is a constant height, so detailed description thereof will be omitted.

상기 하우징(20)은 기판(10)을 수용하는 것으로, 몸체(20') 외측의 일면에 내부로의 통기를 위한 통공(21)이 마련된 것이다.The housing 20 accommodates the substrate 10 and has a through-hole 21 for venting to the inside on one surface of the outside of the body 20 '.

이와 같은 하우징(20)에서 통공(21)은 몸체(20') 외측의 일면이라면 어느 곳이라도 무방하나 가급적 몸체(20')의 상면 중앙에 마련되는 것이 바람직하다.In the housing 20, the through-hole 21 may be any one of the outer surface of the body 20 ', but is preferably provided in the center of the upper surface of the body 20'.

하우징(20)의 통공(21)이 몸체(20')의 상면 중앙에 마련됨으로써 하우징(20) 내부로 외기가 유입될 때 하우징(20) 내부 공간 전체에 외기가 고르게 전달될 수 있게 된다.The through-hole 21 of the housing 20 is provided in the center of the upper surface of the body 20 'so that when the outside air flows into the housing 20, the outside air can be evenly transmitted to the entire interior space of the housing 20.

상기 냉각 쿨러(30)는 하우징(20)의 통공(21)상에 결합되는 것으로, 하우징(20) 내부로의 외기 공급을 위한 송풍팬(31) 하부에 일정한 간격으로 연속되는 방열판(32)이 마련된 것이고, 방열판(32) 하부에 상측 절곡부(33')가 각 방열판(32)의 중간부를 관통하고 하측 절곡부(33")가 기판(10)상의 방열블럭(12) 상면에 밀접하는 열전도판(33)이 마련된 것이다.The cooling cooler 30 is coupled to the through-hole 21 of the housing 20, the heat dissipation plate 32 is continuous at regular intervals in the lower portion of the blowing fan 31 for supplying the outside air into the housing 20 The upper bent part 33 'penetrates the middle part of each heat sink 32 below the heat sink 32, and the lower bent part 33 "is the heat conduction which is in close contact with the upper surface of the heat dissipation block 12 on the board | substrate 10. The plate 33 is provided.

이와 같은 냉각 쿨러(30)에서 열전도판(33)은 알루미늄 또는 구리와 같이 열 전도도가 높은 금속으로 되는 것이 바람직하다.In the cooling cooler 30, the heat conductive plate 33 is preferably made of a metal having high thermal conductivity such as aluminum or copper.

냉각 쿨러(30)의 열전도판(33)이 알루미늄 또는 구리와 같이 열전도도가 높은 금속으로 됨으로써 기판(10)상의 방열블럭(12)으로부터 전달되는 열이 열전도판(33)을 거쳐 방열판(32)으로 신속하고 고르게 전달될 수 있게 된다.The heat conduction plate 33 of the cooling cooler 30 is made of a metal having high thermal conductivity, such as aluminum or copper, so that heat transferred from the heat dissipation block 12 on the substrate 10 passes through the heat conduction plate 33. Can be delivered quickly and evenly.

한편, 열전도판(33)의 하측 절곡부(33")에는 기판(10)상의 방열블럭(12)과의 결합을 위한 고정편(34)이 마련되는 것이 바람직히다.On the other hand, the lower bent portion 33 "of the heat conduction plate 33 is preferably provided with a fixing piece 34 for coupling with the heat dissipation block 12 on the substrate 10.

열전도판(33)의 하측 절곡부(33")에 기판(10)상의 방열블럭(12)과의 결합을 위한 고정편(34)이 마련됨으로써 고정편(34)과 방열블럭(12) 간의 볼트를 체결을 통해 방열블럭(12)과 냉각 쿨러(30)의 결합이 간단하면서도 견고하게 이루어질 수 있게 된다.A bolt between the fixing piece 34 and the heat dissipation block 12 is provided by a fixing piece 34 for coupling with the heat dissipation block 12 on the substrate 10 at the lower bent portion 33 ″ of the heat conduction plate 33. Through fastening, the coupling of the heat dissipation block 12 and the cooling cooler 30 can be made simple and robust.

상기와 같은 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등(A)을 통한 하우징(20) 내부의 과열 방지에 관하여 상세히 설명하면 다음과 같다.The overheat prevention of the inside of the housing 20 through the LED lamp A having the cooling cooler according to the present invention as described above will be described in detail as follows.

기판(10)상의 엘이디(11)가 점등된 상태로 될 때 엘이디(11)로부터의 발열은 기판(10) 상면에 위치하는 방열블럭(12)으로 전달된다.When the LED 11 on the substrate 10 is turned on, heat generated from the LED 11 is transferred to the heat radiation block 12 located on the upper surface of the substrate 10.

이때, 방열블럭(12) 상면에는 냉각 쿨러(30)에 마련된 열전도판(33)의 하측 절곡부(33") 저면이 밀접한 상태이므로 방열블럭(12)으로부터의 열은 즉시 열전도 판(33) 전체로 전해지게 되는데, 하측 절곡부(33")가 방열블럭(12)에 밀접하는 열전도판(33)의 상측 절곡부(33')는 각각의 방열판(32) 중간을 관통하고 있으므로 열전도판(33)으로 전해진 열은 열전도판(33)의 상측 절곡부(33')를 통해 각각의 방열판(32) 전체에 직접적으로 전해지게 된다.At this time, since the bottom surface of the lower bent portion 33 "of the heat conduction plate 33 provided in the cooling cooler 30 is in close contact with the heat dissipation block 12, the heat from the heat dissipation block 12 is immediately transferred to the entire heat conduction plate 33. The upper bent part 33 'of the heat conduction plate 33 whose lower bent part 33 "is in close contact with the heat dissipation block 12 passes through the middle of each heat dissipation plate 32. The heat transmitted to) is directly transmitted to each of the heat sinks 32 through the upper bent portion 33 ′ of the heat conduction plate 33.

한편, 냉각 쿨러(30)의 방열판(32) 상부에는 송풍팬(31)이 마련되어 있는바, 냉각 쿨러(30)의 방열판(32)으로 방열블럭(12)으로부터의 열이 전해지는 상태에서 송풍팬(31)이 작동하게 되면 도 3에 도시된 바와 같이 하우징(20) 외부의 외기 즉, 하우징(20) 내부 공기에 비해 상대적으로 온도가 낮은 공기가 방열판(32)에 직접 미치게 되므로 외기와 맞닿게 되는 각각의 방열판(32)이 냉각되며 하우징(20) 내부의 온도 상승을 최소화할 수 있게 된다.On the other hand, the blower fan 31 is provided above the heat sink 32 of the cooling cooler 30, and the blower fan is in a state in which heat from the heat dissipation block 12 is transferred to the heat sink 32 of the cooling cooler 30. When the 31 is operated, as shown in FIG. 3, outside air outside the housing 20, that is, air having a lower temperature than the air inside the housing 20 directly extends to the heat sink 32, is brought into contact with the outside air. Each heat sink 32 is cooled to minimize the temperature rise inside the housing 20.

상기와 같이 냉각 쿨러(30)의 열전도판(33)을 통해 방열블럭(12)의 열을 방열판(32)으로 직접적으로 전달한 이후 송풍팬(31)의 외기 송풍으로써 방열판(32)을 냉각하는 본 발명은 단순히 하우징(20) 내부로 외기를 유입시켜 하우징(20) 내부를 냉각하는 것에 비해 신속하게 냉각 효과를 보일 수 있는 것이므로 하우징(20) 내부의 과열로 인한 엘이디(11)의 수명 저하를 방지할 수 있어 엘이디(11)를 애초 수명대로 장기간 사용할 수 있게 되는 것이다.As described above, the heat of the heat dissipation block 12 is directly transferred to the heat dissipation plate 32 through the heat conduction plate 33 of the cooling cooler 30. Since the present invention can show a cooling effect quickly compared to simply cooling the inside of the housing 20 by simply introducing outside air into the housing 20, the life of the LED 11 due to overheating inside the housing 20 is prevented. It is possible to use the LED (11) for a long time as the original life.

이상에서 설명한 바와 같은 본 발명은 상기한 실시예에 한정되지 아니하므로 청구범위에서 청구하는 본 발명의 요지를 벗어나지 않는 범위 안에서 변경 가능한 것이며, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Since the present invention as described above is not limited to the above-described embodiments, it can be changed within the scope not departing from the gist of the present invention claimed in the claims, such changes are within the claims described.

도 1은 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등의 구성을 설명하기 위한 분리사시도1 is an exploded perspective view for explaining the configuration of the LED lighting having a cooling cooler according to the present invention

도 2는 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등의 내부 구조를 설명하기 위한 단면도Figure 2 is a cross-sectional view for explaining the internal structure of the LED lighting having a cooling cooler according to the present invention

도 3은 본 발명에 의한 냉각 쿨러를 구비하는 엘이디 조명등에서 냉각 쿨러를 통한 냉각을 설명하기 위한 작동상태도Figure 3 is an operating state for explaining the cooling through the cooling cooler in the LED lamp having a cooling cooler according to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10 : 기판 11 : 엘이디10: substrate 11: LED

12 : 방열블럭 20 : 하우징12: heat dissipation block 20: housing

20' : 몸체 21 : 통공20 ': body 21: through hole

30 : 냉각 쿨러 31 : 송풍팬30: cooling cooler 31: blowing fan

32 : 방열판 33 : 열전도판32: heat sink 33: heat conduction plate

33' : 상측 절곡부 33 " : 하측 절곡부33 ': upper bend 33 ": lower bend

34 : 고정편 A : 엘이디 조명등34: fixed piece A: LED lighting

Claims (3)

저면에 엘이디가 연속 배열되고 상면에 엘이디로부터의 발열을 방출하는 방열블럭이 마련된 기판과;A substrate on which a bottom is arranged in series and a heat dissipation block for dissipating heat generated by the LED on the top surface; 상기 기판을 수용하는 것으로, 몸체 외측의 일면에 내부로의 통기를 위한 통공이 마련된 하우징과;A housing accommodating the substrate and having a through hole for venting to the inside on one surface of the outside of the body; 상기 하우징의 통공상에 결합되는 것으로, 하우징 내부로의 외기 공급을 위한 송풍팬 하부에 일정한 간격으로 연속되는 방열판이 마련되고, 방열판 하부에 상측 절곡부가 각 방열판의 중간부를 관통하고 하측 절곡부가 기판상의 방열블럭 상면에 밀접하는 열전도판이 마련된 냉각 쿨러;로 이루어지는 것을 특징으로 하는 냉각 쿨러를 구비하는 엘이디 조명등.It is coupled to the through-hole of the housing, the heat dissipation plate is provided in the lower portion of the blower fan for supplying the outside air into the housing at regular intervals, and the upper bent portion penetrates the middle portion of each heat sink plate and the lower bent portion is formed on the substrate. LED cooling light having a cooling cooler comprising a; a cooling cooler provided with a heat conducting plate in close contact with the upper surface of the heat dissipation block. 제1항에 있어서,The method of claim 1, 상기 냉각 쿨러에 마련되는 열전도판은 알루미늄 또는 구리로 되는 것을 특징으로 하는 냉각 쿨러를 구비하는 엘이디 조명등.The LED lamp having a cooling cooler, characterized in that the heat conducting plate provided in the cooling cooler is made of aluminum or copper. 제1항에 있어서,The method of claim 1, 상기 냉각 쿨러에 마련되는 열전도판의 하측 절곡부에는 기판상의 방열블럭과의 결합을 위한 고정편이 마련되는 것을 특징으로 하는 냉각 쿨러를 구비하는 엘이디 조명등.LED lighting lamp having a cooling cooler, characterized in that the fixing portion for coupling with the heat dissipation block on the substrate is provided in the lower bent portion of the heat conduction plate provided in the cooling cooler.
KR1020090080436A 2009-08-28 2009-08-28 LED light with cooling cooler Expired - Fee Related KR101110125B1 (en)

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CN102410461A (en) * 2011-12-13 2012-04-11 常州杰天车辆配件厂 Long strip LED (light emitting diode) lamp
CN104344265A (en) * 2014-11-28 2015-02-11 浙江晶日照明科技有限公司 Passive type fan structure lamp
CN105317721A (en) * 2014-08-04 2016-02-10 冠昱铨科技股份有限公司 LED control device and LED lighting equipment with LED control device
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CN102410461A (en) * 2011-12-13 2012-04-11 常州杰天车辆配件厂 Long strip LED (light emitting diode) lamp
CN105317721A (en) * 2014-08-04 2016-02-10 冠昱铨科技股份有限公司 LED control device and LED lighting equipment with LED control device
CN104344265A (en) * 2014-11-28 2015-02-11 浙江晶日照明科技有限公司 Passive type fan structure lamp
CN104344265B (en) * 2014-11-28 2017-03-29 浙江晶日照明科技有限公司 A kind of passive fan structure light fixture
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