CN217763267U - Car light and vehicle - Google Patents
Car light and vehicle Download PDFInfo
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- CN217763267U CN217763267U CN202222215403.0U CN202222215403U CN217763267U CN 217763267 U CN217763267 U CN 217763267U CN 202222215403 U CN202222215403 U CN 202222215403U CN 217763267 U CN217763267 U CN 217763267U
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Abstract
The application relates to the field of vehicle accessories, in particular to a vehicle lamp and a vehicle. The vehicle lamp comprises a lamp body and a semiconductor refrigerator; the main body part of the semiconductor refrigerator is positioned outside the shell of the lamp body; the semiconductor refrigerator is arranged at the mounting hole, and a semiconductor refrigeration piece of the semiconductor refrigerator is arranged in the mounting hole so as to dissipate heat of the heating element of the lamp body. The application provides a car light is through setting up the semiconductor cooler in the casing outside, can not occupy casing inner space, and the radiating efficiency is higher.
Description
Technical Field
The application relates to the field of vehicle accessories, in particular to a vehicle lamp and a vehicle.
Background
At present, lamps of vehicles tend to be miniaturized, and the power of lamp light sources is gradually increased. The traditional car lamp heat dissipation scheme is that a light source is cooled by using aluminum cooling fins, the cooling fins are heavy in weight, occupy a large space in a car lamp and are low in heat dissipation efficiency, and the traditional heat dissipation scheme is difficult to meet the heat dissipation requirement of the car lamp.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a car light and vehicle, the car light is provided with the semiconductor cooler and dispels the heat to heating element, does not occupy the space in the car light, and the radiating efficiency is higher.
The application provides a vehicle lamp, which comprises a lamp body and a semiconductor refrigerator;
the main body part of the semiconductor refrigerator is positioned outside the shell of the lamp body;
the semiconductor refrigerator is arranged at the mounting hole, and a semiconductor refrigeration piece of the semiconductor refrigerator is arranged in the mounting hole so as to dissipate heat of the heating element of the lamp body.
In the above technical solution, further, a seal ring is disposed on the outer side of the housing in the circumferential direction of the mounting hole, and the seal ring is clamped between the housing and the main body of the semiconductor cooler.
In the above technical scheme, further, a sealing groove is formed in the circumferential direction of the mounting hole, the sealing ring is mounted in the sealing groove, and the height of the sealing ring is higher than the depth of the sealing groove.
In the above technical solution, further, the heat exchanger further comprises a temperature equalizing plate;
the temperature equalizing plate is positioned in the shell, and the shape of the temperature equalizing plate is matched with the inner contour of the shell;
the surface of one side of the temperature-equalizing plate is connected with the semiconductor refrigerating sheet, and the surface of the other side of the temperature-equalizing plate is opposite to the heating element.
In the above technical solution, further, the temperature equalization plate covers an upper half of the housing.
In the above technical solution, further, a temperature control switch is further included;
the temperature control switch is arranged in the shell;
when the temperature in the shell is higher than the preset temperature, the temperature control switch is in communication connection with the semiconductor refrigerator to control the semiconductor refrigerator to be started;
when the temperature in the shell is lower than the preset temperature, the temperature control switch is in communication connection with the semiconductor refrigerator to control the semiconductor refrigerator to be turned off.
In the above technical solution, further, the housing includes a lamp housing located at the front and a lamp housing located at the rear;
the lampshade is buckled with the lamp shell, and the lamp shell is provided with the mounting hole;
the lampshade is made of transparent materials, so that light rays emitted by the light-emitting element in the lamp shell can be emitted from the lampshade.
In the above technical solution, further, the main body portion of the semiconductor refrigerator includes a heat conducting copper sheet and a fan, and the heat conducting copper sheet is located between the semiconductor refrigeration sheet and the fan.
The application also provides a vehicle, which comprises the lamp.
Compared with the prior art, the beneficial effects of this application do:
the application provides a car light includes lamp body and semiconductor cooler. The semiconductor refrigerator is used for cooling the light emitting element of the vehicle lamp by heat dissipation by utilizing the characteristic that the semiconductor can exchange heat rapidly on two sides after being electrified. The semiconductor refrigerator mainly comprises two parts: the semiconductor refrigerator comprises a main body part and a semiconductor refrigeration piece, wherein the main body part comprises a heat conduction copper sheet and a fan, and the heat conduction copper sheet is located between the semiconductor refrigeration piece and the fan. After the semiconductor refrigerating sheet exchanges heat with the heating element in the lamp body, the heat is dissipated by the fan and the radiator.
The main body part of the semiconductor refrigerator is positioned outside the shell of the lamp body; the top of the shell is provided with a mounting hole, the semiconductor refrigerator is mounted at the mounting hole, and a semiconductor refrigeration piece of the semiconductor refrigerator is arranged in the mounting hole to dissipate heat of the heating element of the lamp body.
Specifically, the main body of the semiconductor refrigerator is large in size, and the semiconductor chilling plate is relatively small in size. The main body part of the semiconductor refrigerator is arranged outside the shell, so that the internal space of the shell is not occupied. In the mounting hole that the casing was seted up was arranged in to the semiconductor refrigeration piece, the internal surface of platelike semiconductor refrigeration piece can too not bulge the casing, also can too much occupy the space in the casing.
The application also provides a vehicle comprising the lamp. Based on the above analysis, the vehicle also has the above beneficial effects, which are not described herein again.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic cross-sectional structural view of a vehicle lamp provided in the present application;
FIG. 2 is a schematic structural diagram of a housing provided herein;
fig. 3 is a schematic view of the internal structure of the housing provided in the present application;
fig. 4 is an external structural schematic diagram of the vehicle lamp provided by the present application.
In the figure: 101-a lamp body; 102-a semiconductor refrigerator; 103-a body portion; 104-semiconductor refrigerating sheet; 105-a housing; 106-mounting holes; 107-sealing groove; 108-temperature-equalizing plate; 109-lamp shade; 110-lamp envelope.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example one
Referring to fig. 1 to 4, the present application provides a vehicle lamp including a lamp body 101 and a semiconductor cooler 102. The semiconductor cooler 102 utilizes the characteristic of rapid heat exchange between both sides of the semiconductor after being electrified to cool the light emitting elements of the vehicle lamp. The semiconductor cooler 102 mainly includes two parts: the semiconductor refrigerator comprises a main body part 103 of the semiconductor refrigerator 102 and a semiconductor refrigeration piece 104, wherein the main body part 103 of the semiconductor refrigerator 102 comprises a heat-conducting copper sheet and a fan, and the heat-conducting copper sheet is positioned between the semiconductor refrigeration piece 104 and the fan. The semiconductor cooling fins 104 exchange heat with the heating elements in the lamp body 101, and then dissipate the heat using a fan and a heat sink.
The main body 103 of the semiconductor cooler 102 is located outside the housing 105 of the lamp body 101; the top of the housing 105 is opened with a mounting hole 106, the semiconductor refrigerator 102 is mounted at the mounting hole 106, and the semiconductor refrigeration sheet 104 of the semiconductor refrigerator 102 is placed in the mounting hole 106 to dissipate heat of the heating element of the lamp body 101.
Specifically, the main body 103 of the semiconductor cooler 102 is large in size, while the semiconductor cooler 104 is relatively small in size. The main body 103 of the semiconductor cooler 102 is disposed outside the housing 105, and does not occupy the internal space of the housing 105. The semiconductor refrigeration piece 104 is arranged in the mounting hole 106 formed in the shell 105, and the surface of the plate-shaped semiconductor refrigeration piece 104 does not protrude out of the inner surface of the shell 105 too much and does not occupy too much space in the shell 105.
After the semiconductor cooler 102 is powered on, the surface of the semiconductor cooling plate 104 can be rapidly cooled. The mounting hole 106 is opened at the top of the housing 105, and hot air generated by heat generated by the heating element is diffused upward and can be cooled at the semiconductor cooling plate 104 of the mounting hole 106, so that a rapid heat dissipation effect can be realized.
In an alternative embodiment, a sealing ring is arranged on the outer side of the housing 105 in the circumferential direction of the mounting hole 106, and the sealing ring is clamped between the housing 105 and the main body 103 of the semiconductor cooler 102. The sealing member can seal a gap between the housing 105 and the main body 103 of the semiconductor cooler 102, and prevent heat from overflowing to the vehicle body to affect other devices.
Specifically, a sealing groove 107 is formed in the circumferential direction of the mounting hole 106, the sealing ring is mounted in the sealing groove 107, and the sealing groove 107 can be used for mounting and positioning the sealing ring to prevent the sealing ring from moving. The height of the sealing ring is higher than the depth of the sealing groove 107, and the main body 103 of the semiconductor refrigerator 102 can extrude the sealing ring, so that the sealing ring is deformed under pressure to fill the gap, and the sealing effect is more reliable.
Optionally, the shape of the sealing ring, the shape of the mounting hole 106 and the shape of the semiconductor chilling plate 104 are adapted. As shown in fig. 1 and 2, the semiconductor chilling plate 104 is square and has arc transition at four corners; correspondingly, the mounting hole 106 is a square hole, and four corners of the mounting hole are arc-shaped; the sealing groove 107 is also surrounded to form a square structure with four arc-shaped corners.
In an optional scheme of this embodiment, the vehicular lamp further includes a temperature equalization plate 108; the temperature equalizing plate 108 is positioned in the shell 105, and the shape of the temperature equalizing plate 108 is matched with the inner contour of the shell 105; one side plate surface of the temperature equalizing plate 108 is connected with the semiconductor chilling plate 104, and the other side plate surface of the temperature equalizing plate 108 is opposite to the heating element.
In this embodiment, the vapor chamber 108 with a large area is located in the housing 105, and can cover the heat generating region, and the vapor chamber can conduct heat to the semiconductor cooling fins, so as to uniformly cool the temperature in the housing 105 to a suitable temperature. The shape of the vapor chamber 108 is adapted to the inner contour of the housing 105, so that the space occupation of the vapor chamber 108 can be reduced. As shown in fig. 3, the inner contour of the housing 105 with the mounting hole 106 is arc-shaped, and the temperature equalizing plate 108 is also arc-shaped correspondingly.
Specifically, the temperature equalization plate 108 covers the upper half of the housing 105, i.e., the temperature equalization plate 108 can cover the range where the hot air rises, so that the heat can be transferred in time.
In an optional scheme of the embodiment, the vehicle lamp further comprises a temperature control switch; the temperature control switch is arranged in the shell 105; when the temperature-controlled switch detects that the temperature inside the housing 105 is higher than a preset temperature (an operating temperature of the electronic components, which may be a range value), the temperature-controlled switch is in communication with the semiconductor cooler 102 to control the semiconductor cooler 102 to be turned on, and the semiconductor cooler 102 operates to dissipate heat inside the housing 105.
When the temperature in the housing 105 is lower than the preset temperature, the temperature controlled switch is in communication with the semiconductor refrigerator 102 to control the semiconductor refrigerator 102 to be turned off, so that the power can be saved.
Example two
The vehicle lamp in the second embodiment is an improvement on the basis of the above embodiment, technical contents disclosed in the above embodiment are not described repeatedly, and the contents disclosed in the above embodiment also belong to the contents disclosed in the second embodiment.
Referring to fig. 4, in an alternative embodiment, the housing 105 includes a lamp housing 109 at the front and a lamp housing 110 at the rear; the lamp cover 109 is buckled with the lamp housing 110, the lamp cover 109 and the lamp housing 110 enclose to form an accommodating space, and the electrical component is installed in the accommodating space. Generally, the lamp housing 110 is a main structure of the housing 105, and has a larger size, and most of the electrical components are located in the lamp housing 110, i.e. the top of the lamp housing 110 is opened with a mounting hole 106 for fixing the semiconductor cooler 102.
The lamp housing 109 is made of a transparent material so that light emitted from the light emitting element in the lamp housing 110 can be emitted from the lamp housing 109, thereby realizing the illumination function of the vehicle lamp.
Specifically, as shown in fig. 4, the lamp housing 109 has a disk shape; the lamp housing 110 is in a circular truncated cone shape, and the size of the lamp housing 110 is gradually enlarged in the direction close to the lamp shade 109, that is, the shape of the lamp housing 110 is adapted to the condition of light divergence, so that the illumination range of the vehicle lamp is wider.
EXAMPLE III
The third embodiment of the present application provides a vehicle, including the vehicle lamp of any one of the above embodiments, and therefore, all the beneficial technical effects of the vehicle lamp of any one of the above embodiments are achieved, and the details are not repeated herein.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the scope of the technical solutions of the embodiments of the present application. Moreover, those of skill in the art will understand that although some embodiments herein include some features included in other embodiments, not others, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Claims (9)
1. A vehicular lamp characterized by comprising a lamp body (101) and a semiconductor cooler (102);
the main body part (103) of the semiconductor refrigerator (102) is positioned outside the shell (105) of the lamp body (101);
the top of the shell (105) is provided with a mounting hole (106), the semiconductor refrigerator (102) is mounted at the mounting hole (106), and a semiconductor refrigeration piece (104) of the semiconductor refrigerator (102) is arranged in the mounting hole (106) to dissipate heat of a heating element of the lamp body (101).
2. The vehicular lamp according to claim 1, wherein a seal ring is provided in a circumferential direction of the mounting hole (106) outside the housing (105), and the seal ring is sandwiched between the housing (105) and a main body portion (103) of the semiconductor cooler (102).
3. The vehicular lamp according to claim 2, wherein a sealing groove (107) is formed in the circumferential direction of the mounting hole (106), the sealing ring is mounted in the sealing groove (107), and the height of the sealing ring is higher than the depth of the sealing groove (107).
4. The vehicular lamp according to claim 1, further comprising a temperature equalizing plate (108);
the temperature equalizing plate (108) is positioned in the shell (105), and the shape of the temperature equalizing plate (108) is matched with the inner contour of the shell (105);
one side plate surface of the temperature equalizing plate (108) is connected with the semiconductor refrigerating sheet (104), and the other side plate surface of the temperature equalizing plate (108) is opposite to the heating element.
5. Automotive light according to claim 4, characterized in that said vapor chamber (108) covers the upper half of said shell (105).
6. The vehicular lamp according to claim 1, further comprising a temperature-dependent switch;
the temperature control switch is arranged in the shell (105);
when the temperature in the shell (105) is higher than a preset temperature, the temperature control switch is in communication connection with the semiconductor refrigerator (102) to control the semiconductor refrigerator (102) to be started;
when the temperature in the shell (105) is lower than the preset temperature, the temperature-controlled switch is in communication connection with the semiconductor refrigerator (102) to control the semiconductor refrigerator (102) to be turned off.
7. Automotive light according to claim 1, characterized in that the housing (105) comprises a lampshade (109) at the front and a lamp housing (110) at the rear;
the lampshade (109) is buckled with the lamp shell (110), and the lamp shell (110) is provided with the mounting hole (106);
the lampshade (109) is made of transparent materials, so that light rays emitted by the light-emitting element in the lamp shell (110) can be emitted from the lampshade (109).
8. The vehicular lamp according to claim 1, wherein the main body portion (103) of the semiconductor cooler (102) comprises a thermally conductive copper sheet and a fan, the thermally conductive copper sheet being located between the semiconductor cooler sheet (104) and the fan.
9. A vehicle characterized by comprising the lamp according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222215403.0U CN217763267U (en) | 2022-08-22 | 2022-08-22 | Car light and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222215403.0U CN217763267U (en) | 2022-08-22 | 2022-08-22 | Car light and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217763267U true CN217763267U (en) | 2022-11-08 |
Family
ID=83880867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222215403.0U Active CN217763267U (en) | 2022-08-22 | 2022-08-22 | Car light and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217763267U (en) |
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2022
- 2022-08-22 CN CN202222215403.0U patent/CN217763267U/en active Active
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