KR102046294B1 - LED module and method of manufacturing the same and liquid crystal display device including LED module - Google Patents

LED module and method of manufacturing the same and liquid crystal display device including LED module Download PDF

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Publication number
KR102046294B1
KR102046294B1 KR1020120100459A KR20120100459A KR102046294B1 KR 102046294 B1 KR102046294 B1 KR 102046294B1 KR 1020120100459 A KR1020120100459 A KR 1020120100459A KR 20120100459 A KR20120100459 A KR 20120100459A KR 102046294 B1 KR102046294 B1 KR 102046294B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
flexible cable
led module
pin
Prior art date
Application number
KR1020120100459A
Other languages
Korean (ko)
Other versions
KR20140034983A (en
Inventor
김규봉
강민재
Original Assignee
엘지디스플레이 주식회사
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Priority to KR1020120100459A priority Critical patent/KR102046294B1/en
Publication of KR20140034983A publication Critical patent/KR20140034983A/en
Application granted granted Critical
Publication of KR102046294B1 publication Critical patent/KR102046294B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

The present invention provides a printed circuit board having a pad; A plurality of LEDs mounted on the printed circuit board; The present invention provides an LED module including a flexible cable corresponding to the pad and having a lead configured to directly contact the pad through soldering.

Description

LED module and method of manufacturing the same and a liquid crystal display device including the LED module

The present invention relates to an LED module, and more particularly, to a liquid crystal display device including an LED module, a method of manufacturing the same, and an LED module.

Liquid crystal display devices (LCDs), which are used for TVs and monitors due to their high contrast ratio and are advantageous for displaying moving images, have optical anisotropy and polarization characteristics. The principle of image implementation by

Such a liquid crystal display device is an essential component of a liquid crystal panel bonded through a liquid crystal layer between two substrates facing each other, and realizes a difference in transmittance by changing an arrangement direction of liquid crystal molecules with an electric field in the liquid crystal panel. .

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. On the other hand, LEDs having high efficiency and high brightness characteristics have recently been widely used as light sources for liquid crystal displays.

The LED is mounted on a printed circuit board to form an LED module and emits light by receiving a driving current from the outside. The printed circuit board is equipped with a connector, a flexible cable is inserted into the connector, and the drive current is transmitted through the flexible cable.

As such, in the related art, as a separate connector is formed on the printed circuit board for LEDs, component costs for this are generated, resulting in an increase in manufacturing cost of the LED module and the liquid crystal display.

The present invention has a problem to provide a method that can reduce the manufacturing cost of the LED module.

In order to achieve the above object, the present invention provides a pad and a printed circuit board; A plurality of LEDs mounted on the printed circuit board; The present invention provides an LED module including a flexible cable corresponding to the pad and having a lead configured to directly contact the pad through soldering.

Here, the printed circuit board and the flexible cable may be configured, and may include alignment means for aligning the positions of the printed circuit board and the flexible cable.

The alignment means may correspond to each other and may be pins and holes respectively formed on different ones of the printed circuit board and the flexible cable.

In another aspect, the present invention comprises the steps of aligning a flexible printed circuit board with a plurality of LEDs mounted and pads formed, and a lead corresponding to the pad; It provides an LED module manufacturing method comprising the step of soldering the lead and pad in the alignment state.

Here, after the alignment step, the step of positioning and fixing the flexible cable between the first and second jig facing each other, the soldering may be performed in the fixed state.

The first and second jig may be configured to expose the area where the solder is made in the flexible cable.

The printed circuit board and the flexible cable may be aligned using pins and holes corresponding to each other and configured in different ones of the printed circuit board and the flexible cable, respectively.

In another aspect, the present invention and the liquid crystal panel for displaying an image; A plurality of LEDs for supplying light to the liquid crystal panel; A printed circuit board on which the plurality of LEDs are mounted and on which pads are formed; The present invention provides a liquid crystal display device including a flexible cable corresponding to the pad and having a lead directly contacting the pad through soldering.

Here, the printed circuit board and the flexible cable may be configured, and may include alignment means for aligning the positions of the printed circuit board and the flexible cable.

The alignment means may correspond to each other and may be pins and holes respectively formed on different ones of the printed circuit board and the flexible cable.

In the present invention, the flexible cable is directly coupled to the printed circuit board for the LED through the solder surface mounting technology. Accordingly, the flexible cable connector mounted on the conventional board can be deleted.

Therefore, the cost of the connector parts can be reduced, and as a result, the manufacturing cost of the LED module and the liquid crystal display device can be reduced.

In addition, it is possible to configure the alignment means for alignment between the flexible cable and the printed circuit board. In such a case, it is possible to effectively prevent the occurrence of poor contact between the pad and the lead.

1 is an exploded perspective view schematically showing a liquid crystal display device including an LED module according to an embodiment of the present invention.
2 is a view showing an LED module and a flexible cable according to an embodiment of the present invention.
Figure 3 is a photograph showing a state in which the LED module and the flexible cable is coupled through soldering according to an embodiment of the present invention.
4 schematically illustrates a mounting apparatus used to mount a flexible cable on a printed circuit board according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is an exploded perspective view schematically showing a liquid crystal display device including an LED module according to an embodiment of the present invention, Figure 2 is a view showing an LED module and a flexible cable according to an embodiment of the present invention, Figure 3 The LED module and the flexible cable according to the embodiment of the present invention are photographs showing a state of being coupled through soldering.

1 and 2, a liquid crystal display device 100 according to an exemplary embodiment of the present invention includes a liquid crystal panel 120, a backlight unit 130, a main supporter 140, a top case 150, It may include a bottom case 160.

The liquid crystal panel 120 displays an image. The liquid crystal panel 120 includes first and second substrates 121 and 122 bonded to each other with the liquid crystal layer interposed therebetween.

The first substrate is an array substrate, and a pixel in which a plurality of gate lines and data lines cross each other and is arranged in a matrix form is defined.

A thin film transistor (TFT) is formed as a switching element connected to the gate wiring and the data wiring. The thin film transistor is connected to the pixel electrode formed in each pixel.

On the other hand, the second substrate 122, which is the opposite substrate facing the first substrate 121, has a color filter of red, green, and blue, for example, corresponding to each pixel. And a black matrix covering the color filter and covering the non-display elements such as the gate line, the data line, and the thin film transistor.

As such, the second substrate 122 having the color filter corresponds to the color filter substrate. The second substrate 121 may further include a common electrode covering the color filter and the black matrix.

As described above, the liquid crystal molecules are arranged in the liquid crystal layer according to the electric field generated by the pixel electrode and the common electrode, thereby displaying an image.

On the other hand, the liquid crystal panel 120 having the configuration as described above as an example, other various liquid crystal panel may be used. For example, an in-plane switching type liquid crystal panel may be used in which the pixel electrode and the common electrode are formed on the first substrate 121 and are substantially parallel to the substrate surface.

Although not shown, polarizers may be attached on the outer surfaces of the first and second substrates 121 and 122 to selectively transmit only light having a specific polarization.

The backlight unit 130 corresponds to a configuration for supplying light to the liquid crystal panel 120. As the backlight unit 130, an edge type backlight unit having a light source disposed outside the liquid crystal panel 120 or a direct type backlight unit disposed behind the liquid crystal panel 120 when viewed in plan view. This can be used. In the embodiment of the present invention, for convenience of description, the edge type backlight unit 130 is taken as an example.

The backlight unit 130 may include an LED module 200, a light guide plate 133, a reflector plate 131, and an optical sheet 135.

The LED module 200 is disposed in one direction, that is, a printed circuit board (PCB) extending along the length direction of the light receiving surface of the light guide plate 133 and along the extension direction of the printed circuit board (PCB) on the printed circuit board (PCB). Can include multiple LEDs.

Various types of printed circuit boards may be used as the printed circuit board (PCB). For example, a metal core printed circuit board (MCPCB) may be used as a metal PCB having a excellent heat dissipation function using a metal as a base, but is not limited thereto. When MCPCB is used, an insulating layer is formed on a base layer made of a metal material, and a wiring pattern is formed on the insulating layer.

As such, when the MCPCB is used as a printed circuit board (PCB), since the base layer is made of a metal material, it is possible to effectively dissipate heat generated from the LED.

The plurality of LEDs may be configured as white LEDs emitting white light, or may be configured as red, green, and blue LEDs, but are not limited thereto.

Such an LED is connected to a wiring pattern formed on a printed circuit board (PCB), and receives a driving current to emit light.

On the other hand, the LED module 200 may include a flexible cable 210 mounted directly on the printed circuit board (PCB). In the flexible cable 210, a plurality of wiring patterns are configured to serve, for example, a driving current or the like as a driving signal applied through the driving board to the printed circuit board (PCB) side. FFC (flexible flat cable) may be used as the flexible cable.

The connection relationship between the above-described printed circuit board (PCB) and the flexible cable 210 will be described in more detail below.

The light guide plate 133 is supplied with the light emitted from the LED disposed along the light incident surface. Light incident on the light guide plate 133 is uniformly spread to the entire surface of the light guide plate 133 while providing light to the front surface of the light guide plate 133 by total reflection.

Here, in order to provide a more efficient surface light source, a pattern having a specific shape may be formed on at least one of the front and rear surfaces of the light guide plate 133.

The reflective plate 131 is positioned on the rear surface of the light guide plate 133. Accordingly, the light emitted through the rear surface of the light guide plate 133 may be reflected toward the liquid crystal panel 120, thereby improving luminance.

The plurality of optical sheets 135 are positioned on the front surface of the light guide plate 133. For example, the plurality of optical sheets 135 may include a diffusion sheet and at least one light collecting sheet, for example, a prism sheet. The plurality of optical sheets 135 may diffuse and / or condense the light emitted through the light guide plate 133 to provide a higher quality uniform surface light source to the liquid crystal panel 120.

The liquid crystal panel 120 and the backlight unit 130 as described above may be modularized by being combined with members such as the top case 150, the bottom case 160, the main supporter 140, and the like.

The top case 150 may have a rectangular frame having a cross section bent in, for example, a shape to cover the top and side edges of the liquid crystal panel 120. The front of the top case 150 is opened, through which the image implemented in the liquid crystal panel 120 can be displayed to the outside.

The bottom case 160 corresponds to a configuration in which the liquid crystal panel and the backlight units 120 and 130 are seated on an upper surface of the bottom case 160 and are the basis for assembling the structure of the liquid crystal display device 100. The bottom case 160 may have a rectangular plate shape and four edges thereof may be vertically bent at a predetermined height.

The main supporter 140 surrounds the edges of the liquid crystal panel 120 and the backlight unit 130, and may be assembled to the top case and the bottom case 150 and 160. The main supporter 140 may accommodate the liquid crystal panel 120 and the backlight unit 130 to support and protect them.

Hereinafter, the coupling relationship between the printed circuit board (PCB) and the flexible cable 210 of the LED module 200 according to the embodiment of the present invention will be described in more detail with reference to FIGS. 2 and 3.

The pad area PR is defined on one surface of the printed circuit board PCB, and a plurality of pads PD may be formed in the pad area PR. The plurality of pads PD are configured at the end of the wiring pattern formed on the printed circuit board PCB, and correspond to an input terminal for receiving a driving signal for driving the LED.

One end of the flexible cable 210 has a lead LD contacted with the pad PD. The lead LD is configured at the end of the wiring pattern formed on the flexible cable 210 for transmitting the LED driving signal, and corresponds to an output terminal for outputting the LED driving signal to the corresponding pad PD. Accordingly, the LED driving signal can be transmitted through the contact between the leads and the pads LD and PD corresponding to each other.

Meanwhile, in the embodiment of the present invention, the flexible cable 210 is mounted on the printed circuit board (PCB) through surface mounting technology (SMT) using soldering.

Accordingly, the leads and pads LD and PD corresponding to each other may be firmly fixed to each other by a soldering material, as shown in FIG. 3.

As such, in the embodiment of the present invention, the flexible cable 210 is directly coupled to the printed circuit board (PCB) through a surface mounting technique using soldering. As a result, the flexible cable connector mounted on the printed circuit board can be deleted.

Therefore, the cost of the connector parts can be reduced, and as a result, the manufacturing cost of the LED module and the liquid crystal display device can be reduced.

Meanwhile, as described above, in mounting the flexible cable 210 directly to the printed circuit board (PCB), alignment means for mounting the flexible cable 210 in the correct position may be configured.

In this regard, in order for the pads and leads PD and LD corresponding to each other to be correctly coupled, it may be desirable to perform position alignment between the flexible cable 210 and the printed circuit board PCB. To this end, the alignment cable corresponding to each other may be configured in the flexible cable 210 and the printed circuit board (PCB).

For example, pins 231 and holes 232 corresponding to each other may be used as the alignment means, and each of them may be configured on a different one of the flexible cable and the printed circuit board 210 (PCB). For example, the pin 231 may be configured in the printed circuit board (PCB) and the hole 232 may be configured in the flexible cable 210. In this case, through the combination of the pin 231 and the hole 232, the pad and the leads (PD, LD) can be aligned.

As such, if soldering is performed while the alignment between the pads and the leads PD and LD is completed, contact failure between the pads and the leads PD and LD may be effectively prevented during surface mounting.

Hereinafter, a method of mounting the flexible cable 210 on a printed circuit board (PCB) will be described with reference to FIG. 4. 4 is a view schematically illustrating a mounting apparatus used to mount a flexible cable on a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 4, the mounting apparatus 300 may be used to directly mount the flexible cable 210 to a printed circuit board (PCB). The mounting apparatus 300 may include the first and second jigs 310 facing each other. 320, a transfer means 330, and soldering equipment.

The first and second jigs 310 and 320 correspond to the components located above and below, respectively. In the soldering process, the flexible cable 210 may be placed between the first and second jigs 310 and 320 and pressed by the first and second jigs 310 and 320. As such, the first and second jigs 310 and 320 may prevent the flow of the flexible cable 210 and also prevent the bending of the flexible cable 210.

In addition, the first and second jigs 310 and 320 may be configured to expose the region where the solder LD is formed, that is, the region where the lead LD is formed. As a result, the brazing material 220 may function to prevent a phenomenon in which the solder material 220 overflows to another area and is overcharged.

Soldering equipment can be used, for example, a soldering iron as a configuration for soldering the leads and pads LD and PD. Meanwhile, in the soldering apparatus, an injection hole for injecting a soldering material into a region where soldering is performed may be formed.

The transfer means 330 corresponds to a configuration for transferring a printed circuit board (PCB). For example, in a state in which the flexible cable 210 is placed on one surface of a printed circuit board (PCB), the transfer means 330 moves the printed circuit board (PCB) to the first and second jigs 310 and 320 for the soldering process. You can move between. When the soldering process is completed, the transfer means 330 may move the printed circuit board PCB to the outside of the first and second jigs 310 and 320.

Hereinafter, a method of mounting the flexible cable 210 on a printed circuit board (PCB) using the mounting apparatus 300 as described above will be described.

First, the flexible cable 210 is placed on one surface of a printed circuit board (PCB) on which a pad (PD) is formed to be primarily coupled. Here, it is preferable that a process of aligning the flexible cable and the printed circuit board 210 (PCB) using the pins and holes 231 and 232 as the aforementioned alignment means is performed.

Meanwhile, before the flexible cable 210 is primarily coupled to the printed circuit board (PCB), a process for removing foreign matters on the surface of the printed circuit board (PCB) may be performed using a cleaning liquid such as flux. have.

In a state where the flexible cable and the printed circuit board 210 are aligned, the printed circuit board (PCB) is moved by using the transfer means 330, so that the flexible cable 210 has the first and second jigs 310 and 320. ) In between. Here, the flexible cable 210 can be fixed by moving at least one of the first and second jigs 310 and 320 in a direction facing each other.

In a state in which the flexible cable 210 is fixed by the first and second jigs 310 and 320, the soldering apparatus is used to perform the soldering process. Here, the soldering process may be simultaneously performed on all of the pads and leads PD and LD, or may be sequentially performed according to the arrangement order. In this case, when sequentially performed according to the arrangement order, the soldering equipment may be moved relative to the printed circuit board PCB along the placement direction of the pad PD (or lead LD) to perform the soldering process. It becomes possible.

Through the soldering process, the flexible cable 210 can be directly mounted on the printed circuit board (PCB).

Meanwhile, after the soldering process is performed, a process of curing the brazing material may be performed.

In addition, a cleaning process may be performed on the printed circuit board (PCB) in which the soldering process is completed, to remove foreign substances in the soldering portion. This cleaning process can be carried out using a cleaning liquid such as, for example, Isoparaffinic Hydrocarbon.

As described above, according to the embodiment of the present invention, the flexible cable is directly coupled to the printed circuit board for the LED through the solder surface mounting technology. Accordingly, the flexible cable connector mounted on the conventional printed circuit board can be deleted.

Therefore, the cost of the connector parts can be reduced, and as a result, the manufacturing cost of the LED module and the liquid crystal display device can be reduced.

In addition, it is possible to configure the alignment means for alignment between the flexible cable and the printed circuit board. In such a case, it is possible to effectively prevent the occurrence of poor contact between the pad and the lead.

Embodiment of the present invention described above is an example of the present invention, it is possible to change freely within the scope included in the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and their equivalents.

210: flexible cable 231: pin
233: hole PCB: printed circuit board
PD: Pad LD: Lead
PR: Pad Area

Claims (13)

A printed circuit board having pads formed thereon;
A plurality of LEDs mounted on the printed circuit board;
A flexible cable corresponding to the pad and having a lead directly contacting the pad by soldering
Including,
Alignment means for aligning the position of the printed circuit board and the flexible cable, one to one correspond to each other and are provided with pins and holes respectively formed on different ones of the printed circuit board and the flexible cable,
The pin is formed to protrude vertically upward on one surface of the printed circuit board on which the pad is formed,
The hole inserted into the pin is formed to vertically penetrate the plane of the flexible cable,
The pin and the hole, the coupling state is fixed
LED module.
delete delete Arranging a printed circuit board on which a plurality of LEDs are mounted and pads are formed, and a flexible cable including leads corresponding to the pads;
Soldering the leads and pads in alignment
Including,
The printed circuit board and the flexible cable are aligned by using pins and holes corresponding to each other one-to-one and configured in different ones of the printed circuit board and the flexible cable,
The pin is formed to protrude vertically upward on one surface of the printed circuit board on which the pad is formed,
The hole inserted into the pin is formed to vertically penetrate the plane of the flexible cable,
The pin and the hole are fixed after the soldering step
LED module manufacturing method.
The method of claim 4, wherein
After the aligning, positioning and fixing the flexible cable between the first and second jigs facing each other,
The soldering is performed in a fixed state
LED module manufacturing method.
The method of claim 5,
The first and second jigs are configured to expose an area where the solder is made in the flexible cable.
LED module manufacturing method.
delete A liquid crystal panel displaying an image;
A plurality of LEDs for supplying light to the liquid crystal panel;
A printed circuit board on which the plurality of LEDs are mounted and on which pads are formed;
A flexible cable corresponding to the pad and having a lead directly contacting the pad by soldering
Including,
Alignment means for aligning the position of the printed circuit board and the flexible cable, one to one correspond to each other and are provided with pins and holes respectively formed on different ones of the printed circuit board and the flexible cable,
The pin is formed to protrude vertically upward on one surface of the printed circuit board on which the pad is formed,
The hole inserted into the pin is formed to vertically penetrate the plane of the flexible cable,
The pin and the hole, the coupling state is fixed
LCD display device.
delete delete The method of claim 1,
The pin protrudes perpendicular to the plane of one of the printed circuit board and the flexible cable,
The hole vertically penetrates the other one of the printed circuit board and the flexible cable
LED module.
The method of claim 4, wherein
The pin protrudes perpendicular to the plane of one of the printed circuit board and the flexible cable,
The hole vertically penetrates the other one of the printed circuit board and the flexible cable
LED module manufacturing method.
The method of claim 8,
The pin protrudes perpendicularly from the plane of one of the printed circuit board and the flexible cable,
The hole vertically penetrates the plane of the other of the printed circuit board and the flexible cable.
LCD display device.
KR1020120100459A 2012-09-11 2012-09-11 LED module and method of manufacturing the same and liquid crystal display device including LED module KR102046294B1 (en)

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KR1020120100459A KR102046294B1 (en) 2012-09-11 2012-09-11 LED module and method of manufacturing the same and liquid crystal display device including LED module

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Application Number Priority Date Filing Date Title
KR1020120100459A KR102046294B1 (en) 2012-09-11 2012-09-11 LED module and method of manufacturing the same and liquid crystal display device including LED module

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KR20140034983A KR20140034983A (en) 2014-03-21
KR102046294B1 true KR102046294B1 (en) 2019-11-20

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Publication number Priority date Publication date Assignee Title
KR20180009406A (en) 2016-07-18 2018-01-29 삼성디스플레이 주식회사 Printed board assembly and display device having the same

Citations (1)

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Publication number Priority date Publication date Assignee Title
KR200391493Y1 (en) 2005-04-07 2005-08-04 주식회사 아이에스시테크놀러지 Circuit connecting apparatus using integrated silicone contactor

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Publication number Priority date Publication date Assignee Title
KR101363720B1 (en) * 2007-01-24 2014-02-18 엘지디스플레이 주식회사 Connector and liquid crystal display device having the same
DE102008006130A1 (en) * 2008-01-25 2009-07-30 Atg Luther & Maelzer Gmbh Module for a parallel tester for testing printed circuit boards
KR100983082B1 (en) * 2008-04-22 2010-09-17 세종메탈 주식회사 Penetrating-type connector for combining into metal PCB, and LED lighting module having the same
KR101286980B1 (en) * 2008-09-23 2013-07-16 엘지디스플레이 주식회사 Liquid crystal display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200391493Y1 (en) 2005-04-07 2005-08-04 주식회사 아이에스시테크놀러지 Circuit connecting apparatus using integrated silicone contactor

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