KR101859957B1 - Electronic component supply device and electronic component mounting device - Google Patents
Electronic component supply device and electronic component mounting device Download PDFInfo
- Publication number
- KR101859957B1 KR101859957B1 KR1020167011130A KR20167011130A KR101859957B1 KR 101859957 B1 KR101859957 B1 KR 101859957B1 KR 1020167011130 A KR1020167011130 A KR 1020167011130A KR 20167011130 A KR20167011130 A KR 20167011130A KR 101859957 B1 KR101859957 B1 KR 101859957B1
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- South Korea
- Prior art keywords
- component
- tape
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- electronic component
- electronic
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/10—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with devices for breaking partially-cut or perforated webs, e.g. bursters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/44—Moving, forwarding, guiding material
- B65H2301/443—Moving, forwarding, guiding material by acting on surface of handled material
- B65H2301/4432—Moving, forwarding, guiding material by acting on surface of handled material by means having an operating surface contacting only one face of the material, e.g. roller
- B65H2301/44324—Rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5112—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
- B65H2301/51122—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2403/00—Power transmission; Driving means
- B65H2403/50—Driving mechanisms
Abstract
The electronic component feeding device includes a carrier tape (15), a plurality of component receiving portions (17) provided on the carrier tape (15) with a first gap in the tape feeding direction, and a plurality of component receiving portions The component storage tape 1 including the cover tape 6 adhered to the carrier tape is intermittently transferred to the component withdrawing position. The electronic component supply device includes a first component withdrawing portion 210 and a second component withdrawing portion 210 installed at the component withdrawing position with the first gap in the tape transport direction and the first component withdrawing portion 210 And a cover member (12) covering the component housing portion provided between the first component withdrawing portion (210) and the second component withdrawing portion (210).
Description
The present invention relates to an electronic component supply apparatus and an electronic component mounting apparatus.
BACKGROUND ART [0002] Japanese Patent Application Laid-Open No. 2006-245034 (Patent Document 1) is known as a background art in this technical field. A component mounting apparatus for pulling out a component from a tape feeder and mounting the component on a substrate is described in this special articulated beam. The component mounting apparatus is provided with a transfer head having a set of suction nozzles arranged in parallel to the tape transfer direction of the tape feeder and simultaneously drawing out a plurality of components arranged in the tape transfer direction. One set of suction nozzles is arranged in the tape feeding direction such that the interval between two neighboring nozzles is equal to the interval between two neighboring components in the tape feeder.
The electronic component mounting apparatus is required to improve the working efficiency. In order to respond to this request, it is necessary to shorten the time for handling the electronic component, for example, the operation time of the head.
In the component mounting apparatus of
It is an object of the present invention to provide a technique capable of improving working efficiency and supplying electronic components stably in an electronic component supplying apparatus and an electronic component mounting apparatus using the same.
An electronic component supply device according to an aspect of the present invention includes: a carrier tape; a plurality of component accommodating portions provided on the carrier tape with a first gap in the tape transport direction; A first component withdrawing portion provided with the first gap in the tape transport direction at the component withdrawing position and a second component withdrawing portion provided at the first transporting direction in the tape transport direction at the component withdrawing position, And a lid member that covers the component storage portion provided between the first component withdrawing portion and the second component withdrawing portion.
According to another aspect of the present invention, there is provided an electronic component mounting apparatus comprising: a linear actuator capable of moving in a linear direction; a rotary device rotatable about a rotary shaft; a control board for controlling the linear device and the rotary device; A component holding unit including a rotating device and a housing in which the control board is incorporated; a component adsorption mounting unit coaxially attached to the rotary shaft of the rotary device provided in the component handling unit; and a plurality of component handling units arranged And an electronic component feeding device which has a head, a first moving device for moving the head, and a plurality of component withdrawing parts in the tape feeding direction and intermittently feeds the component storing tape to the component withdrawing position, And are disposed in alignment with the positions of the plurality of component withdrawing portions.
The objects, features and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings.
1 is a diagram showing a first example of an electronic component supply apparatus according to the present embodiment.
Fig. 2 is an enlarged top view showing a part of the electronic component supply apparatus when viewed from
3 is a sectional view taken along the line III-III shown in Fig.
Fig. 4 is a diagram showing a second example of the electronic component supply device in the present embodiment.
Fig. 5 is an enlarged top view showing a part of the electronic component supply apparatus when viewed from
6 is a sectional view taken along the line VI-VI shown in Fig.
7 is a sectional view taken along line VII-VII shown in Fig.
Fig. 8 is a top view and a side view showing a first example of the component feeding unit of the electronic component feeding device in this embodiment. Fig.
Fig. 9 is a top view and a side view showing a second example of the component transferring unit.
10 is a top view and a side view showing a third example of the component transferring unit.
Fig. 11 is a top view and a side view showing a first example of a direct-current motor for operating the component conveyance unit and its component conveyance unit.
Fig. 12 is a top view and a side view showing a second example of the component feeder and the linear motor.
Fig. 13 is a top view and a side view showing a first example of a component feeding unit for moving a component storing tape of the electronic component supplying apparatus in this embodiment. Fig.
14 is a top view and a side view showing a second example of the component transferring unit.
15 is a view for explaining an operation of pulling out an electronic component from the component storage tape.
16 is a view for explaining the operation waveform of the component conveyance unit.
17 is a perspective view showing a configuration of a part handling portion mounted in the electronic component mounting apparatus in this embodiment.
18 is a perspective view showing a first example of the positional relationship of a head in which a plurality of electronic parts supply devices and part handling parts in this embodiment are arranged.
19 is a plan view showing a first example of the positional relationship between the electronic component supply device and the head.
20 is a perspective view showing a second example of the positional relationship between the electronic component supply device and the head.
21 is a plan view showing a second example of the positional relationship between the electronic component supply device and the head.
22 is a perspective view showing a third example of the positional relationship of the head in which a plurality of component adsorption mounting portions are arranged in the electronic component supply device and the component handling portion.
23 is a plan view showing a third example of the positional relationship between the electronic component supply device and the head.
Fig. 24 is a side view showing a first example of the pull-out operation of the electronic parts of the first and second part suction chucking attachment portions in the present embodiment, Fig. 24 (a) And Fig. 24 (b) is a side view showing the pulling-out operation of the electronic parts of the second component sucking and mounting portion.
Fig. 25 is a side view showing a second example of the pulling-out operation of the electronic parts of the first and second part suction chucking portions; Fig. 25 (a) is a view showing the movement of the first and second chucking- And Fig. 25 (b) is a side view showing the drawing operation of the electronic parts of the first and second component adsorption mounting portions.
Fig. 26A is a side view showing the position of an image pickup unit provided in the component suction mount portion and the electronic component supply device in this embodiment, and Fig. 26B is a side view showing the image pickup of the component suction mount.
Fig. 27 is a view for explaining a positioning method of the component suction attachment portion based on the information captured by the imaging section. Fig.
Fig. 28 is a view for explaining the operation of the component adsorption mounting portion. Fig.
29 is a view for explaining the operation of the component adsorption mounting portion.
30 is a process chart showing an operation flow of the component adsorption mounting section.
31 is a view for explaining a method of acquiring the operation state of the component suction mount.
32 is a top view showing an example of an electronic component mounting apparatus according to the present embodiment.
Fig. 33 is a perspective view showing the constitution of a component storage tape of the electronic component supply device in this embodiment. Fig.
In the following embodiments, for the sake of convenience, when necessary, they are divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other, and one is in the relationship of a modification of some or all of the other, a detailed description, a supplementary explanation, and the like.
In addition, when referring to the number (including the number, the numerical value, the amount, the range, etc.) of elements and the like in the following embodiments, excluding the case where it is specifically stated and the case where the number is clearly limited to a specific number And the number is not limited to the specific number, and may be equal to or more than a specific number.
It is needless to say that the constituent elements (including the element step and the like) in the following embodiments are not necessarily essential except for the case where it is specifically stated and the case where it is considered to be essential in principle .
In addition, when "A is made up", "A is made up", "A is included", and "A is included", except for the case where only the element is specified, It is not necessary to say that it is not excluded. Likewise, when referring to the shape, positional relationship, and the like of constituent elements in the following embodiments, it is to be understood that, unless otherwise specified or in principle, And the like. This also applies to the above numerical values and ranges.
In the drawings used in the following embodiments, hatching may be given even in a plan view in order to make the drawings easier to see. In the entire drawings for explaining the following embodiments, those having the same function are given the same reference numerals in principle and description of repetition thereof will be omitted. Hereinafter, the present embodiment will be described in detail with reference to the drawings.
<Examples>
An electronic component mounting apparatus (chip mounter) for arranging electronic components on a printed circuit board to manufacture an electronic circuit board is provided with an electronic component supplying apparatus (a tape feeder). Further, the electronic component mounting apparatus includes a head for taking out the electronic component supplied by the electronic component supplying apparatus, moving the electronic component onto the printed board, and arranging the electronic component at a predetermined position.
The electronic component supply device has a function of moving the component storage tape containing the electronic component to the component withdrawing position and a function of exposing the electronic component contained in the component storage tape so that the head can take out the electronic component. Since the electronic component mounting apparatus handles various electronic components, a plurality of electronic component supply apparatuses are mounted on the electronic component mounting apparatus corresponding to the electronic components to be handled.
Such an electronic component mounting apparatus is required to improve the working efficiency, that is, the number of electronic circuit boards to be manufactured per unit time. In order to meet this demand, it is necessary to shorten the time for handling the electronic component, that is, the operation time of the head. Here, the operating time of the head is determined by the time required to withdraw the electronic component from the electronic component supply device, the time to move the withdrawn electronic component onto the printed board, the time to place the electronic component on the printed board, And then moves to the electronic component supply device.
As a means for shortening the operation time of the head, the present inventors have studied to shorten the time taken to withdraw the electronic component from the electronic component supply device. In order to shorten the time taken to withdraw the electronic component from the electronic component supply device, it is necessary to take out a plurality of electronic components from the electronic component supply device by one electronic component withdrawing operation. Therefore, it is important to take out a plurality of electronic components from the electronic component supply device in a short time and accurately.
«Electronic component supply device»
(One). Configuration of electronic parts supply device
1 to 3 and Fig. 33, a first example of the electronic component supply apparatus of the present embodiment will be described. Fig. 1 is a diagram showing a first example of an electronic
As shown in Fig. 1, the electronic
The electronic
The operation of the electronic
First, the
The peeled
2, the electronic
As shown in Fig. 3, the first and second
As described above, by forming the two component drawing-out
Next, a second example of the electronic
As shown in Fig. 4, the electronic component exposed
As shown in Fig. 5, the electronic
5 shows a configuration in which the second component drawing-out
As shown in Fig. 6, the first and second component drawing-out
As shown in Fig. 7, the
As described above, the same effect as the first example of the electronic component supplying apparatus can be obtained also in the second example of the electronic component supplying apparatus.
(2). The component transferring part for moving the component storage tape
8 to 10, the
8 to 10 illustrate the electronic component-exposed
First, a first example of the
The center of rotation of the first
By constituting the means for moving the
Next, a second example of the
9, the structure of the second example is almost the same as the structure of the first example shown in Fig. 8 described above, but the first
Next, a third example of the
As shown in Fig. 10, the structure of the third example is almost the same as the structure of the first example shown in Fig. 8 described above. However, the structure of the third example is the same as that of the first example shown in Fig. A
(3). A power source for driving the component conveying unit
11 and 12, a power source for driving the
First, a first example of a power source for driving the component transferring portion of the electronic
As shown in Fig. 11, the power source includes a direct-
Next, a second example of the power source for driving the component transferring portion of the electronic
As shown in Fig. 12, the
A direct-drive motor is suitable as the motor mounted on the electronic
The electronic
Further, the electronic
As described above, the motor is required to be smaller in size, higher in output, and higher in speed, but a conventional electronic component supply device uses a rotary motor. The rotation motor does not directly rotate the component transferring part due to restriction in the width direction, but uses a worm gear or the like to convert the power shaft into an orthogonal direction and use it. Therefore, high output is possible, but it is difficult to increase the speed.
On the other hand, the direct-drive motor can be made thin because the coils disposed on the plane and the magnets arranged on the plane are arranged in the direction orthogonal to the plane. It is also possible to increase the output by increasing the number of coils and magnets while maintaining a thin shape.
Although not described here, a direct-
(4). A component transferring part for moving the component storage tape to the component withdrawing position
With reference to Figs. 13 and 14, description will be given of the component conveyance unit that moves the
The electronic
The electronic
13, the direct-
Similarly, in the above-described electronic
The operation of moving the
The
Although not described here, the basic structure of the
(5). Operation of electronic component supply device
An example of the operation of the electronic
In the operation of the electronic
First, the
When the withdrawal of the two electronic components is completed, the
When the withdrawal of the two electronic components is completed, the component storage tape is moved by delta L, resulting in the state of " (3) shifting ". When the movement is completed, two pieces of electronic parts at the positions of the first and second part drawing-out
When the withdrawal of the two electronic components is completed, the component storage tape is moved by delta L, resulting in the state of " (4) moving ". When the movement is completed, two pieces of electronic parts at the positions of the first and second part drawing-out
(N + 1) x 2 electronic components is completed, the second mode for intermittently feeding the component storage tape by? L x (N + 2) is executed as indicated by "(5) (1) movement " described above by the intermittent transfer of the second mode. Hereinafter, the same operation is repeated to fetch the electronic component from the component storage tape.
As shown in FIG. 16, after the electronic component is taken out, the component transfer section moves the component storage tape by? L by the fine movement pattern 47 (first mode). Then, after pulling out (N + 1) x 2 electronic components, the component storing tape is moved by? L x (N + 2) by the coarse operation pattern 48 (second mode). By repeating this operation, the electronic parts housed in the component storage tape are sequentially taken out.
As described above, it is possible to shorten the time for drawing out the electronic parts by simultaneously or successively drawing the electronic parts at a plurality of places in the direction in which the part storing tape moves. In addition, since a plurality of electronic components can be drawn out simultaneously or sequentially, the operation of the present embodiment can be operated for a longer period of time as compared with the operation time of the component transferring section when the electronic components are continuously drawn one by one. That is, it is possible to move the component accommodating tape to reduce the maximum conveying speed of the component conveying unit and suppress the occurrence of vibration.
«Electronic component mounting device»
(One). Part handling section
An example of the
The
The
The
The axis 1a and the axis 1b are parallel. The
As described above, since the
The
In the present embodiment, the
(2). head
18 and 19, a first example of the
As shown in Fig. 18, a plurality of
As described above, according to the
In addition, the electronic
Further, the part-handling
Further, by vertically moving the
As shown in Fig. 19, the
Next, a second example of the head in which the component
20, a plurality of
As described above, according to the
As shown in Fig. 21, the
Next, a third example of the
As shown in Fig. 22, the
As shown in Fig. 23, the
By arranging as described above, the
(3). Operation of parts suction mount
24 (a) and 24 (b), a first example of the drawing operation of the electronic parts of the component adsorption mounting portion of this embodiment will be described. Fig. 24 (a) shows the movement of the first and second component
The first component
When the first
Subsequently, as shown in Fig. 24 (b), when the first component
As described above, since the second
Next, with reference to Figs. 25A and 25B, a second example of the drawing operation of the electronic parts of the component suction mounting portion of the present embodiment will be described. 25 (a) is a side view showing the movement of the first and second component
25 (a), the first component
Subsequently, as shown in Fig. 25 (b), the first
As described above, it is possible to shorten the working time by pulling out the electronic parts at the same time by the first part
(4). The image-
26 (a) and 26 (b), the
The electronic
26A, the first
Next, a positioning method of the component
The
As described above, the
As described above, by mounting the
(5). How to place electronic components
A method of arranging electronic components by the electronic
The
The operation control section of the present embodiment sets the second waiting position with respect to the
In the case of the path of the
Then, in the case of the path of the
Then, in the case of the path of the
Then, in the case of the path of the
Then, in the case of the path of
In the case of the
Then, in the case of the path of the
In the case of the
Then, in the case of the path of the
Next, the operation flow of the component
First, before the electronic component is placed on the printed board, the controller accepts input of the arrangement information of the electronic component from the user (step S1). Next, input of information such as the type and shape (width, depth, height) of the electronic component is received (step S2). Subsequently, the controller creates an electronic component placement procedure that minimizes the time for placing the electronic components (step S3). Next, the operation control section calculates the atmospheric height of the component
As described above, according to the present embodiment, the position of the component
(6). A method of acquiring the operation state of the component suction mount
A method of acquiring the operation state of the component
The electronic
Therefore, the electronic
(7). Configuration of electronic component mounting apparatus
An example of the electronic
The electronic
A pair of
A
The
The
Although the invention made by the present inventors has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.
Claims (20)
At the component withdrawing position,
A first component withdrawing portion and a second component withdrawing portion provided with the first gap in the tape transport direction,
A lid member covering the component housing portion provided between the first component withdrawing portion and the second component withdrawing portion;
A first component conveying section provided corresponding to the first component withdrawing section and having the first rotation center and adapted to convey the component storage tape as it is rotated in the first rotation center direction,
A second component that is provided in correspondence with the second component withdrawing portion and has a second rotation center and is rotated in the same direction in synchronism with the first component transfer portion in the second rotation center direction, And an electronic component feeder.
Further comprising a direct-drive motor,
Wherein the first component transferring section and the second component transferring section are provided with a driving force by the linear motor to carry the component storing tape.
A cover tape feeding part for feeding the cover tape,
Further comprising an electronic component-exposed portion which is disposed on an upstream side of the component withdrawing position in the tape conveying direction and exposes an electronic component accommodated in the component accommodating portion of the component accommodating tape,
And the electronic part exposing section peels the cover tape from the carrier tape and moves the peeled cover tape to the cover tape transfer section.
Further comprising an electronic component-exposed portion which is disposed on an upstream side of the component withdrawing position in the tape conveying direction and exposes an electronic component accommodated in the component accommodating portion of the component accommodating tape,
The electronic component-
A cutter for cutting the cover tape;
And a cover tape opening portion for spreading the cut cover tape so that the cover tape open and expands in a direction orthogonal to the tape conveying direction on the surface on which the plurality of component storage portions of the component storage tape is formed to expose the electronic component, .
The first component transfer section is disposed so that the center of the first component withdrawing section and the first rotation center of the first component transfer section are located in the same plane orthogonal to the tape transfer direction,
And the second component transfer section is disposed so that the center of the second component withdrawing section and the second rotation center of the second component transfer section are located in the same plane orthogonal to the tape transfer direction.
Further comprising a link member connecting the first component transfer unit and the second component transfer unit,
And power is transmitted to any one of the first and second component transferring parts.
Further comprising a gear that connects the first component transfer unit and the second component transfer unit,
And power is transmitted to any one of the first and second component transferring parts.
Further comprising a link member connecting the first component transfer unit and the second component transfer unit,
Wherein power is transmitted to the first component conveyance section, and the first component conveyance section incorporates a member for transmitting a rotational force in one direction.
Further comprising a direct-drive motor for imparting a driving force to the first component transfer unit,
The first component transfer section is disposed so that the center of the first component withdrawing section and the first rotation center of the first component transfer section are located in the same plane orthogonal to the tape transfer direction,
The second component conveying portion is disposed so that the center of the second component withdrawing portion and the second rotation center of the second component conveying portion are located in the same plane perpendicular to the tape conveying direction,
Wherein the electronic component supply device further comprises a member for connecting the first component transfer unit and the second component transfer unit.
Wherein the member is a link member connecting the first component transferring section and the second component transferring section.
Wherein the member is a link member connecting the first component transferring section and the second component transferring section,
Wherein power is transmitted to the first component conveyance section, and the first component conveyance section incorporates a member for transmitting a rotational force in one direction.
A third component transferring portion provided on an upstream side of the tape withdrawing direction at the component withdrawing position,
A linear motor for imparting a driving force to the first component feeder and the third component feeder,
A first power transmitting member for connecting the first component feeder and the linear motor to transmit power,
Further comprising a second power transmitting member for connecting the third component transferring unit and the linear motor to transmit power,
The first component transfer section is disposed so that the center of the first component withdrawing section and the first rotation center of the first component transfer section are located in the same plane orthogonal to the tape transfer direction,
The second component conveying portion is disposed so that the center of the second component withdrawing portion and the second rotation center of the second component conveying portion are located in the same plane perpendicular to the tape conveying direction,
Wherein the electronic component supply device further comprises a member for connecting the first component transfer unit and the second component transfer unit.
Wherein the first and second component transferring parts are configured to transfer,
A first mode in which the component storage tape is intermittently fed at an array pitch? L of the component storage portions by the number of times N of the component storage portions existing within a length corresponding to the first interval,
and a second mode for intermittently feeding the component storage tape at a length corresponding to? L x (N + 2).
A component adsorption mounting portion coaxially attached to the rotary shaft of the rotary device provided in the component handling portion,
A head arranged with a plurality of said part-handling portions,
A first moving device for moving the head;
The electronic component feeding apparatus according to any one of claims 1 to 13, further comprising a plurality of component withdrawing portions in the tape feeding direction, intermittently feeding the component storing tape to the component withdrawing position,
And the component suction attachment portion is disposed in alignment with the positions of the plurality of component withdrawing portions.
A plurality of said parts handling parts,
A plurality of part-handling parts are arranged in the tape conveying direction so that the part-to-be-loaded parts are adjacent to each other,
Wherein the one set of part-handling portion groups are arranged in parallel with a plurality of sets in a direction orthogonal to the tape conveying direction on a surface on which the component storing tape moves.
A plurality of said parts handling parts,
And the plurality of part handling portions are arranged in a direction orthogonal to the tape transport direction on the surface on which the component storage tape moves so that the adjacent component suction mount portions are adjacent to each other,
Wherein the one set of part-handling part groups are arranged in parallel in a plurality of sets in the tape transport direction.
Wherein said head has a head frame connecting said plurality of said part-handling portions.
A second moving device that supports the part handling part and moves the part handling part in a plane perpendicular to a direction in which the moving device moves,
An image pickup section for picking up an image of the component suction mount,
A calculating section for calculating a position shift amount of the component withdrawing section provided in the component adsorption mounting section and the electronic component supplying apparatus using the information picked up by the imaging section,
And a control section for operating said second moving device on the basis of said position shift amount.
Further comprising an operation control section for controlling the operation of the component suction attachment section,
The operation control unit,
Calculating the atmospheric height of the component adsorption mounting portion from the arrangement information when the electronic component is arranged on the printed board, the electronic component information of the electronic component, the arrangement order of the electronic components, and the warp information of the printed board,
And the component attracting and mounting portion is operated based on the atmospheric height of the component attracting and mounting portion.
A sensor for detecting an operating state of the part handling portion,
A status display device for displaying information acquired from the sensor,
An information reading device for reading the information;
Further comprising an operation control section for controlling the operation of the component suction attachment section,
And the operation control section operates the component adsorption mounting section based on the information.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2013-252014 | 2013-12-05 | ||
JP2013252014A JP6293469B2 (en) | 2013-12-05 | 2013-12-05 | Electronic component supply device and electronic component mounting device |
PCT/JP2014/082146 WO2015083801A1 (en) | 2013-12-05 | 2014-12-04 | Electronic component supply device and electronic component mounting device |
Publications (2)
Publication Number | Publication Date |
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KR20160062123A KR20160062123A (en) | 2016-06-01 |
KR101859957B1 true KR101859957B1 (en) | 2018-05-21 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020167011130A KR101859957B1 (en) | 2013-12-05 | 2014-12-04 | Electronic component supply device and electronic component mounting device |
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JP (1) | JP6293469B2 (en) |
KR (1) | KR101859957B1 (en) |
CN (1) | CN105684567B (en) |
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JP6840223B2 (en) * | 2017-03-07 | 2021-03-10 | ヤマハ発動機株式会社 | How to hold the component mounting device and board |
CN110832961B (en) * | 2017-08-01 | 2021-04-27 | 雅马哈发动机株式会社 | Material belt far-end processing method, clamp for material belt far-end processing and material belt far-end processing device |
JP6836661B2 (en) | 2017-10-31 | 2021-03-03 | ヤマハ発動機株式会社 | Parts supply equipment and parts mounting equipment |
JP7113222B2 (en) * | 2018-02-21 | 2022-08-05 | パナソニックIpマネジメント株式会社 | COMPONENT SUPPLY APPARATUS, COMPONENT MOUNTING APPARATUS, AND MOUNTING BOARD MANUFACTURING METHOD |
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JP4479616B2 (en) * | 2005-07-13 | 2010-06-09 | パナソニック株式会社 | Tape feeder |
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JP2009238821A (en) * | 2008-03-26 | 2009-10-15 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting device |
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JP2003078291A (en) | 2001-09-03 | 2003-03-14 | Matsushita Electric Ind Co Ltd | Method and apparatus for component mounting as well as parts cassette |
JP2005026261A (en) * | 2003-06-30 | 2005-01-27 | Matsushita Electric Ind Co Ltd | Device and method for mounting electronic component |
JP2013150020A (en) * | 2009-01-27 | 2013-08-01 | Hitachi High-Tech Instruments Co Ltd | Component supply device |
JP2013157349A (en) * | 2012-01-26 | 2013-08-15 | Murata Mfg Co Ltd | Tape feeder, method of using tape feeder and take-up reel |
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CN105684567B (en) | 2019-01-01 |
WO2015083801A1 (en) | 2015-06-11 |
CN105684567A (en) | 2016-06-15 |
KR20160062123A (en) | 2016-06-01 |
JP6293469B2 (en) | 2018-03-14 |
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