KR20160062123A - Electronic component supply device and electronic component mounting device - Google Patents

Abstract

The electronic component feeding device includes a carrier tape (15), a plurality of component receiving portions (17) provided on the carrier tape (15) with a first gap in the tape feeding direction, and a plurality of component receiving portions The component storage tape 1 including the cover tape 6 adhered to the carrier tape is intermittently transferred to the component withdrawing position. The electronic component supply device includes a first component withdrawing portion 210 and a second component withdrawing portion 210 installed at the component withdrawing position with the first gap in the tape transport direction and the first component withdrawing portion 210 And a cover member (12) covering the component housing portion provided between the first component withdrawing portion (210) and the second component withdrawing portion (210).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component supply apparatus,

The present invention relates to an electronic component supply apparatus and an electronic component mounting apparatus.

BACKGROUND ART [0002] Japanese Patent Application Laid-Open No. 2006-245034 (Patent Document 1) is known as a background art in this technical field. A component mounting apparatus for pulling out a component from a tape feeder and mounting the component on a substrate is described in this special articulated beam. The component mounting apparatus is provided with a transfer head having a set of suction nozzles arranged in parallel to the tape transfer direction of the tape feeder and simultaneously drawing out a plurality of components arranged in the tape transfer direction. One set of suction nozzles is arranged in the tape feeding direction such that the interval between two neighboring nozzles is equal to the interval between two neighboring components in the tape feeder.

The electronic component mounting apparatus is required to improve the working efficiency. In order to respond to this request, it is necessary to shorten the time for handling the electronic component, for example, the operation time of the head.

In the component mounting apparatus of Patent Document 1, since two neighboring components can be simultaneously drawn out from each of the plurality of suction nozzles, it is possible to shorten the time for drawing the component. However, in order to further shorten the take-out time of the component, it is necessary to increase the number of the suction nozzles arranged in the radial direction, thereby enlarging the head. Further, it is necessary to widen the component drawing-out hole of the tape feeder in the tape feeding direction, and there is a possibility that the component may be ejected when the tape is moved.

Japanese Patent Application Laid-Open No. 2006-245034

It is an object of the present invention to provide a technique capable of improving working efficiency and supplying electronic components stably in an electronic component supplying apparatus and an electronic component mounting apparatus using the same.

An electronic component supply device according to an aspect of the present invention includes: a carrier tape; a plurality of component accommodating portions provided on the carrier tape with a first gap in the tape transport direction; A first component withdrawing portion provided with the first gap in the tape transport direction at the component withdrawing position and a second component withdrawing portion provided at the first transporting direction in the tape transport direction at the component withdrawing position, And a lid member that covers the component storage portion provided between the first component withdrawing portion and the second component withdrawing portion.

According to another aspect of the present invention, there is provided an electronic component mounting apparatus comprising: a linear actuator capable of moving in a linear direction; a rotary device rotatable about a rotary shaft; a control board for controlling the linear device and the rotary device; A component holding unit including a rotating device and a housing in which the control board is incorporated; a component adsorption mounting unit coaxially attached to the rotary shaft of the rotary device provided in the component handling unit; and a plurality of component handling units arranged And an electronic component feeding device which has a head, a first moving device for moving the head, and a plurality of component withdrawing parts in the tape feeding direction and intermittently feeds the component storing tape to the component withdrawing position, And are disposed in alignment with the positions of the plurality of component withdrawing portions.

The objects, features and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings.

1 is a diagram showing a first example of an electronic component supply apparatus according to the present embodiment.
Fig. 2 is an enlarged top view showing a part of the electronic component supply apparatus when viewed from arrow 1 shown in Fig. 1; Fig.
3 is a sectional view taken along the line III-III shown in Fig.
Fig. 4 is a diagram showing a second example of the electronic component supply device in the present embodiment.
Fig. 5 is an enlarged top view showing a part of the electronic component supply apparatus when viewed from arrow 2 shown in Fig. 4; Fig.
6 is a sectional view taken along the line VI-VI shown in Fig.
7 is a sectional view taken along line VII-VII shown in Fig.
Fig. 8 is a top view and a side view showing a first example of the component feeding unit of the electronic component feeding device in this embodiment. Fig.
Fig. 9 is a top view and a side view showing a second example of the component transferring unit.
10 is a top view and a side view showing a third example of the component transferring unit.
Fig. 11 is a top view and a side view showing a first example of a direct-current motor for operating the component conveyance unit and its component conveyance unit.
Fig. 12 is a top view and a side view showing a second example of the component feeder and the linear motor.
Fig. 13 is a top view and a side view showing a first example of a component feeding unit for moving a component storing tape of the electronic component supplying apparatus in this embodiment. Fig.
14 is a top view and a side view showing a second example of the component transferring unit.
15 is a view for explaining an operation of pulling out an electronic component from the component storage tape.
16 is a view for explaining the operation waveform of the component conveyance unit.
17 is a perspective view showing a configuration of a part handling portion mounted in the electronic component mounting apparatus in this embodiment.
18 is a perspective view showing a first example of the positional relationship of a head in which a plurality of electronic parts supply devices and part handling parts in this embodiment are arranged.
19 is a plan view showing a first example of the positional relationship between the electronic component supply device and the head.
20 is a perspective view showing a second example of the positional relationship between the electronic component supply device and the head.
21 is a plan view showing a second example of the positional relationship between the electronic component supply device and the head.
22 is a perspective view showing a third example of the positional relationship of the head in which a plurality of component adsorption mounting portions are arranged in the electronic component supply device and the component handling portion.
23 is a plan view showing a third example of the positional relationship between the electronic component supply device and the head.
Fig. 24 is a side view showing a first example of the pull-out operation of the electronic parts of the first and second part suction chucking attachment portions in the present embodiment, Fig. 24 (a) And Fig. 24 (b) is a side view showing the pulling-out operation of the electronic parts of the second component sucking and mounting portion.
Fig. 25 is a side view showing a second example of the pulling-out operation of the electronic parts of the first and second part suction chucking portions; Fig. 25 (a) is a view showing the movement of the first and second chucking- And Fig. 25 (b) is a side view showing the drawing operation of the electronic parts of the first and second component adsorption mounting portions.
Fig. 26A is a side view showing the position of an image pickup unit provided in the component suction mount portion and the electronic component supply device in this embodiment, and Fig. 26B is a side view showing the image pickup of the component suction mount.
Fig. 27 is a view for explaining a positioning method of the component suction attachment portion based on the information captured by the imaging section. Fig.
Fig. 28 is a view for explaining the operation of the component adsorption mounting portion. Fig.
29 is a view for explaining the operation of the component adsorption mounting portion.
30 is a process chart showing an operation flow of the component adsorption mounting section.
31 is a view for explaining a method of acquiring the operation state of the component suction mount.
32 is a top view showing an example of an electronic component mounting apparatus according to the present embodiment.
Fig. 33 is a perspective view showing the constitution of a component storage tape of the electronic component supply device in this embodiment. Fig.

In the following embodiments, for the sake of convenience, when necessary, they are divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other, and one is in the relationship of a modification of some or all of the other, a detailed description, a supplementary explanation, and the like.

In addition, when referring to the number (including the number, the numerical value, the amount, the range, etc.) of elements and the like in the following embodiments, excluding the case where it is specifically stated and the case where the number is clearly limited to a specific number And the number is not limited to the specific number, and may be equal to or more than a specific number.

It is needless to say that the constituent elements (including the element step and the like) in the following embodiments are not necessarily essential except for the case where it is specifically stated and the case where it is considered to be essential in principle .

In addition, when "A is made up", "A is made up", "A is included", and "A is included", except for the case where only the element is specified, It is not necessary to say that it is not excluded. Likewise, when referring to the shape, positional relationship, and the like of constituent elements in the following embodiments, it is to be understood that, unless otherwise specified or in principle, And the like. This also applies to the above numerical values and ranges.

In the drawings used in the following embodiments, hatching may be given even in a plan view in order to make the drawings easier to see. In the entire drawings for explaining the following embodiments, those having the same function are given the same reference numerals in principle and description of repetition thereof will be omitted. Hereinafter, the present embodiment will be described in detail with reference to the drawings.

<Examples>

An electronic component mounting apparatus (chip mounter) for arranging electronic components on a printed circuit board to manufacture an electronic circuit board is provided with an electronic component supplying apparatus (a tape feeder). Further, the electronic component mounting apparatus includes a head for taking out the electronic component supplied by the electronic component supplying apparatus, moving the electronic component onto the printed board, and arranging the electronic component at a predetermined position.

The electronic component supply device has a function of moving the component storage tape containing the electronic component to the component withdrawing position and a function of exposing the electronic component contained in the component storage tape so that the head can take out the electronic component. Since the electronic component mounting apparatus handles various electronic components, a plurality of electronic component supply apparatuses are mounted on the electronic component mounting apparatus corresponding to the electronic components to be handled.

Such an electronic component mounting apparatus is required to improve the working efficiency, that is, the number of electronic circuit boards to be manufactured per unit time. In order to meet this demand, it is necessary to shorten the time for handling the electronic component, that is, the operation time of the head. Here, the operating time of the head is determined by the time required to withdraw the electronic component from the electronic component supply device, the time to move the withdrawn electronic component onto the printed board, the time to place the electronic component on the printed board, And then moves to the electronic component supply device.

As a means for shortening the operation time of the head, the present inventors have studied to shorten the time taken to withdraw the electronic component from the electronic component supply device. In order to shorten the time taken to withdraw the electronic component from the electronic component supply device, it is necessary to take out a plurality of electronic components from the electronic component supply device by one electronic component withdrawing operation. Therefore, it is important to take out a plurality of electronic components from the electronic component supply device in a short time and accurately.

«Electronic component supply device»

(One). Configuration of electronic parts supply device

1 to 3 and Fig. 33, a first example of the electronic component supply apparatus of the present embodiment will be described. Fig. 1 is a diagram showing a first example of an electronic component supply apparatus 10 according to the present embodiment. Fig. 2 is an enlarged top view showing a part of the electronic component supply apparatus 10 as viewed from arrow 1 shown in Fig. 3 is a sectional view taken along the line III-III shown in Fig. 33 is a perspective view showing the constitution of the component storing tape of the electronic component supplying apparatus 10. Fig.

As shown in Fig. 1, the electronic component supply apparatus 10 includes a component storage tape 1 for storing electronic components and a storage tape reel 2 for winding component storage tape 1. As shown in Fig. 33, the component storage tape 1 is provided with a carrier tape 15 and a cover tape 6. As shown in Fig. The carrier tape 15 includes a plurality of component accommodating portions 17 for accommodating electronic components and a transfer hole 16 for transferring power for moving the component accommodating tapes 1. [ The cover tape 6 is affixed to the carrier tape 15 so as to cover the plurality of component storage portions 17 and prevents the electronic components stored in the component storage portion 17 from popping up from the component storage portion 17 .

The electronic component supplying apparatus 10 is also provided with a component transferring section 3 for intermittently transferring the component storing tape 1 to a component withdrawing position, an electronic component exposing section 7 and an electronic component exposing section 7, A cover tape transferring section 8 for transferring the cover tape 6, and a cutter section 4. The electronic component exposing portion 7 exposes the electronic component housed in the component housing portion 17 so that the electronic component can be taken out from the component withdrawing position to the upstream side (the storage tape reel 2) in the tape transport direction. The cutter portion 4 cuts the carrier tape 15 after the electronic component is taken out.

The operation of the electronic component supplying apparatus 10 is as follows.

First, the component storage tape 1 wound on the storage tape reel 2 is transported in the direction of the arrow Dir1 by the transporting unit 3 while being supported by a guide (not shown). The electronic component exposure section 7 provided between the storage tape reel 2 and the transfer section 3 is moved from the carrier tape 15 holding the electronic component to the component housing section 17 ) To peel off the electronic component. The exposed electronic component is held at the tip of the component suction mount 9 by moving the component suction mount 9 up and down as indicated by the arrow Dir4. The means for holding the electronic component at the distal end of the component suction mount 9 is, for example, vacuum holding using vacuum pressure or a chuck mechanism for mechanically holding the electronic component.

The peeled cover tape 6 is moved in the direction of the arrow Dir3 by the cover tape feeding section 8 and stored in a storage box (not shown). The cover tape transferring section 8 is formed in a reel shape, for example, as a storage tape reel, and the reel is rotated by the drive source to wind the cover tape 6. The carrier tape 15 from which the cover tape 6 has been peeled is moved to the cutter portion 4 in the direction of the arrow Dir2 and is cut by the cutter portion 4. [ The cut tape 5a is only the carrier tape 15 because the cover tape 6 is separated by the electronic component exposing portion 7.

2, the electronic component supplying apparatus 10 is provided with the electronic part exposing portion 7 and the component pressing portion 12 in the direction in which the component storing tape 1 moves (the direction of the arrow Dir2; the tape conveying direction) Respectively. The two component withdrawing holes, the first component withdrawing hole 13, and the second component withdrawing hole 14, which are the first component withdrawing portion and the second component withdrawing portion, are disposed apart from each other in the direction of the arrow Dir2 . When the component storage tape 1 is moved in the direction of the arrow Dir2, the cover tape 6 is moved in the direction different from the direction in which the component storage tape 1 moves (in the direction of the arrow Dir3) Move. As a result, the electronic component housed in the component storage tape 1 is exposed and can be taken out, and moves to the component withdrawing position. The component pressing portion 12 functions as a lid member for preventing the electronic component from protruding when the component storage tape 1 is moved. In other words, the component pressing portion 12 is a member that covers the upper surface of the component housing portion 17 between the first and second component drawing holes 13, 14. [

As shown in Fig. 3, the first and second component drawing holes 13 and 14 are disposed apart from each other in the tape feeding direction. The distance P (pitch; first interval) between the first component withdrawing hole 13 and the second component withdrawing hole 14 is equal to the integer 1 of the arrangement pitch of the component accommodating portion 17 provided on the component storage tape 1 , 2, 3, ...) times. It is preferable that a plurality of the component attracting and attaching portions 9 shown in Fig. 1 are arranged in accordance with the distance P between the first and second component taking-out holes 13, 14.

As described above, by forming the two component drawing-out holes 13 and 14 in the direction in which the component storing tape 1 moves, it becomes possible to simultaneously draw out two electronic components. In the above description, the number of the component drawing holes is two, but three or more component drawing holes may be formed in the direction of the arrow Dir2. By forming a plurality of component drawing holes in this way, it becomes possible to take out the plurality of electronic components from the electronic component supplying apparatus 10 continuously without moving the component adsorption mounting section 9 at the same time, Time can be shortened.

Next, a second example of the electronic component supplying apparatus 10 of this embodiment will be described with reference to Figs. 4 to 7. Fig. The basic configuration is the same as that described above with reference to Figs. 1 to 3, so that different points will be described. Fig. 4 is a diagram showing a second example of the electronic component supply apparatus 10 in the present embodiment. 5 is an enlarged top view showing a part of the electronic component supply apparatus 10 as viewed from the arrow 2 shown in Fig. 6 is a sectional view taken along the line VI-VI shown in Fig. 7 is a sectional view taken along line VII-VII shown in Fig.

As shown in Fig. 4, the electronic component exposed portion 20 is disposed along the direction in which the component storage tape 1 moves (in the direction of the arrow Dir1). The electronic component exposed portion 20 has means for exposing the electronic component without detaching the cover tape (see Fig. 33) of the component storage tape 1 from the carrier tape (see Fig. 33) . The component withdrawal completion tape 18 made of only the cover tape and the carrier tape is pulled out by the component suction attachment portion 9 and is moved in the direction of the arrow Dir2 and cut by the cutter portion 4. [ At this time, the cut tape 5b is composed of a cover tape and a carrier tape.

As shown in Fig. 5, the electronic component exposing unit 20 includes a cutter 19 for cutting the cover tape, and a cover tape cut by the cutter 19 from the carrier tape, And a cover tape opening 21 for opening the cover tape. The cover tape protecting the electronic component when the component storage tape 1 has moved and reached the cutter 19 is moved in the direction orthogonal to the direction in which the component storage tape moves (direction of the arrow Dir2) by the cutter 19 As shown in FIG. The cover tape cut at the center in the outline and separated into two pieces is unfolded by the cover tape opening 21 so as not to protrude into the component draw-out holes 13 and 14. That is, the cover tape opening 21 spreads the cover tape in the direction orthogonal to the tape transport direction on the surface on which the component accommodating portion 17 of the component storage tape 1 is formed. The first and second component draw-out holes 13 and 14 are arranged in the direction in which the component storage tape 1 moves (in the direction of the arrow Dir2) and at the downstream side of the electronic component exposed portion 20. A component pressing part (not shown) which functions as a lid member for preventing the electronic component from protruding when the component storing tape 1 is moved is provided between the first component drawing-out hole 13 and the second component drawing- (Not shown).

5 shows a configuration in which the second component drawing-out hole 14 is arranged in the cover tape opening 21 and the first component drawing-out hole 13 is arranged in the component pressing portion 12. [ Instead, a plurality of component drawing holes may be formed in the component pressing portion 12. The cover tape opening 21 and the component pressing portion 12 are integrally formed to expand the cover tape and to widen the cover tape and to protect the electronic component from protruding in place of the cover tape. Out port of the component.

As shown in Fig. 6, the first and second component drawing-out holes 13 and 14 are disposed apart from each other. The distance P (pitch) between the first component withdrawing hole 13 and the second component withdrawing hole 14 is set to be a constant of the arrangement pitch of the component accommodating portion 17 provided on the component storage tape 1 , 3, ...) times. It is preferable that a plurality of the component attracting and mounting portions 9 shown in Fig. 4 described above are arranged in accordance with the distance P (pitch) between the first and second component drawing holes 13, 14.

As shown in Fig. 7, the cover tape 6, whose center is roughly cut off by the cutter 19 shown in Fig. 5, is connected to the carrier tape 15 at one end by the cover tape opening 21 And is spread out on both sides of the cover tape opening 21 so as not to interfere with the component drawing-out hole 14. The electronic component 22 can be taken out by spreading and spreading the cover tape 6 so as not to interfere with the component withdrawing hole 14. [

As described above, the same effect as the first example of the electronic component supplying apparatus can be obtained also in the second example of the electronic component supplying apparatus.

(2). The component transferring part for moving the component storage tape

8 to 10, the component transferring unit 3 for moving the component storage tape 1 of this embodiment will be described. Fig. 8 is a top view and a side view showing a first example of the component transferring unit 3 of the electronic component supplying apparatus 10 according to the present embodiment. Fig. 9 is a top view and a side view showing a second example of the component transferring unit. 10 is a top view and a side view showing a third example of the component transferring unit.

8 to 10 illustrate the electronic component-exposed portion 20 described above with reference to Figs. 4 to 7, but the electronic component-exposed portion 7 described above with reference to Figs. 1 to 3 . Further, although two component drawing holes are formed, three or more component drawing holes may be formed.

First, a first example of the component feeding section 3 for moving the component storing tape 1 of the electronic component supplying apparatus 10 will be described. 8, in order to move the component storing tape 1, the electronic component supplying apparatus 10 includes a first component transferring section 23 provided corresponding to the first component drawing hole 13, And a link member 25 for connecting the first component transferring section 23 and the second component transferring section 24 to each other. The first component transferring section 23 and the second component transferring section 24 are engaged with the transfer holes (see Fig. 33) provided on the component storage tape 1, Or it may be a roller-like shape which gives a driving force for pressing and coming into contact with the component storing tape 1. In the first example, the power for driving the first component conveying section 23 and the second component conveying section 23 is transmitted to either one of them. This power is given from a direct-drive motor described later.

The center of rotation of the first component transferring part 23 and the center of the first component drawing-out hole 13 (the intersection of the diagonal line if the shape of the hole is elliptical) are in the same plane perpendicular to the moving direction of the component storing tape 1 Or in two adjacent planes perpendicular to the direction in which the component storage tape 1 is moved. Similarly, the center of rotation of the second component feed portion 24 and the center of the second component draw-out hole 14 (the intersection of the diagonal lines if the hole shape is elliptical) are orthogonal to the moving direction of the component storage tape 1 Plane or within two adjacent planes perpendicular to the direction in which the component storage tape 1 is moved. The link member 25 is arranged so that the first component transfer section 23 is rotated in the direction of the arrow Dir5 and the second component transfer section 24 is synchronously rotated in the direction of the arrow Dir6.

By constituting the means for moving the component storage tape 1 as described above, there is the following advantage. That is, by providing the first and second component transfer sections 23 and 24 for providing a driving force for moving the component storage tape 1 immediately below each of the component draw-out holes 13 and 14, It is possible to realize the transfer accuracy of the component storage tape 1 equivalent to the movement accuracy of the component transfer sections 23 and 24. This can avoid the influence of the resistance force acting on the component storage tape 1 in the opposite direction to the movement direction (the running resistance of the guide and the resistance force acting when pulling out the component storage tape 1 from the storage tape reel) Because. Since the driving force for moving the component storage tape 1 can be given by a plurality of component transfer parts such as the first and second component transfer parts 23 and 24, It is possible to move in the direction of Dir2.

Next, a second example of the component feeding section 3 for moving the component storing tape 1 of the electronic component supplying apparatus 10 will be described.

9, the structure of the second example is almost the same as the structure of the first example shown in Fig. 8 described above, but the first component transferring part 23 and the second component transferring part 24 are connected to the gear 27 . The first component transferring part 23 and the second component transferring part 24 incorporate gears (not shown) that mesh with the gears 27. The positional relationship between the first component withdrawing hole 13 and the first component transferring section 23 and the positional relationship between the second component withdrawing hole 14 and the second component transferring section 24 are the same as in the first example . Also in the second example, the power for driving the first component conveying section 23 and the second component conveying section 23 is transmitted to either one of them.

Next, a third example of the component feeding unit 3 for moving the component storing tape 1 of the electronic component supplying apparatus 10 will be described.

As shown in Fig. 10, the structure of the third example is almost the same as the structure of the first example shown in Fig. 8 described above. However, the structure of the third example is the same as that of the first example shown in Fig. A link member 31 connecting the first component transferring section 23 and the second component transferring section 24 to the first component transferring section 23, And a power transmitting member (32) for transmitting the power. A connecting pin 35 is attached to the first component transferring section 23 and the connecting pin 35 is fitted to the fitting slot 34 provided at one end of the power transmitting member 32. When the power transmitting member 32 reciprocates in the direction of the arrow Dir7, when the power transmitting member 32 moves in one direction, the power transmitting member 32 transmits power to the first component feeding portion 23, and when the power transmitting member 32 moves in the other direction, The connecting pin 35 does not transmit the power to the first component transferring part 23 by the movement of the connecting pin 34. That is, the first component transferring section 23 intermittently transfers the component storage tape 1. [

(3). A power source for driving the component conveying unit

11 and 12, a power source for driving the component conveying section 3 of the present embodiment will be described. 11 is a top view and a side view showing a first example of a component feeder of the electronic component feeding device 10 and a linear motor 39 for operating the component feeder in this embodiment. 12 is a top view and a side view showing a second example of the linear motor.

First, a first example of a power source for driving the component transferring portion of the electronic component supplying apparatus 10 will be described.

As shown in Fig. 11, the power source includes a direct-current motor 39 that is provided for the component conveyance unit shown in Fig. 8 and includes the motor stator 37 and the motor mover 38, And a power transmitting member (36) for transmitting the power to the first component feeder (23). The direct-drive motor 39 imparts a driving force to the first component conveying section 23. When the motor mover 38 of the direct-drive motor 39 reciprocates in the direction of the arrow Dir7, the first component feeder 23 is rotated in the direction of the arrow Dir5, The transfer unit 24 also rotates in synchronization with the first component transfer unit 23.

Next, a second example of the power source for driving the component transferring portion of the electronic component supplying apparatus 10 will be described.

As shown in Fig. 12, the power transmission member 32 for transmitting the power of the direct-drive motor 39 and the direct-drive motor 39 to the first component transfer unit 23 is provided in the component transfer unit shown in Fig. The direct-drive motor 39 is composed of a motor stator 37 and a motor mover 38. The motor mover 38 reciprocates in the direction of the arrow Dir7 so that the fitting slot 34 of the power transmitting member 32 intermittently transmits power to the connecting pin 35 provided on the first component transferring portion 23 . Therefore, the first component feeding section 23 can move the component storing tape 1 intermittently in the direction of the arrow Dir2. The first component transfer unit 23 incorporates a one-way clutch 33 that transmits rotational force only in one direction. Therefore, the first component feeding portion 23 rotates in the direction of the arrow Dir5, but does not rotate in the reverse direction. Since the second component transfer unit 24 is connected to the first component transfer unit 23 by the link member 31, the second component transfer unit 24 rotates in synchronization with the rotation of the first component transfer unit 23.

A direct-drive motor is suitable as the motor mounted on the electronic component supply apparatus 10 shown in Figs. 11 and 12 described above. The reason is as follows.

The electronic component supplying apparatus 10 of the present embodiment has a plurality of component drawing holes, for example, component drawing holes 13 and 14 in the direction in which the component storing tape 1 moves. Further, in order to stably stop the component storage tape 1 at the component withdrawing position with the plurality of component withdrawing holes, the component conveying member, for example, the first and second component conveying members 23, 24 are installed. Therefore, a motor having a larger driving force than that of a conventional electronic component supplying apparatus having a single component transferring unit is required.

Further, the electronic component supply apparatus 10 has a width substantially equal to the width of the component storage tape (the length in the direction perpendicular to the direction in which the component storage tape moves on the surface on which the component storage portions of the component storage tape are formed) (For example, the width of the component storage tape is 8 mm). This is because, if the width of the electronic component supplying apparatus 10 can be narrowed, more electronic component supplying apparatuses 10 can be arranged in a predetermined space, and many types of electronic components can be handled at one time. As a result, the time for replacing the electronic component can be eliminated, and the operation time is shortened. On the other hand, the speed at which the electronic component supplying device 10 supplies electronic components is required to be increased, and the motor output tends to become larger.

As described above, the motor is required to be smaller in size, higher in output, and higher in speed, but a conventional electronic component supply device uses a rotary motor. The rotation motor does not directly rotate the component transferring part due to restriction in the width direction, but uses a worm gear or the like to convert the power shaft into an orthogonal direction and use it. Therefore, high output is possible, but it is difficult to increase the speed.

On the other hand, the direct-drive motor can be made thin because the coils disposed on the plane and the magnets arranged on the plane are arranged in the direction orthogonal to the plane. It is also possible to increase the output by increasing the number of coils and magnets while maintaining a thin shape.

Although not described here, a direct-drive motor 39 may be disposed on the component transferring portion shown in Fig.

(4). A component transferring part for moving the component storage tape to the component withdrawing position

With reference to Figs. 13 and 14, description will be given of the component conveyance unit that moves the component storage tape 10 to the component withdrawal position. 13 is a top view and a side view showing a first example of a component transferring portion for moving the component storage tape 10 to the component drawing holes 13 and 14. Fig. 14 is a top view and a side view showing a second example of the component transferring unit.

The electronic component supplying apparatus 10 shown in Fig. 13 has the basic structure of the electronic component supplying apparatus 10 shown in Fig. 11 described above, and a power transmitting member 40 for transmitting the power of the direct- (A second power transmitting member) and a third component transferring unit 41. The third component conveying section 41 is provided on the upstream side in the tape conveying direction at the component withdrawing position.

The electronic component supplying apparatus 10 shown in Fig. 14 has the basic structure of the electronic component supplying apparatus 10 shown in Fig. 12 described above, and a power transmitting member 40 (not shown) for transmitting the power of the direct- And a third component feeder 41 incorporating a one-way clutch 44 for transmitting rotational force in one direction. A connecting pin 45 is attached to the third component feeding section 41. The connecting pin 45 is fitted to the fitting slot 46 provided at one end of the power transmitting member 40. A power transmitting member 36 (first power transmitting member) is connected to a downstream end of the motor mover 38 of the direct-drive motor 39. A power transmitting member 40 is provided at the upstream end of the motor mover 38 It is connected.

13, the direct-drive motor 39 reciprocates in the direction of the arrow Dir7 so that the power of the direct-drive motor 39 is transmitted to the third component feeder 41 by the power transmitting member 40, . As a result, the third component feeder 41 rotates intermittently in the direction of the arrow Dir8. Since the third component conveying section 41 and the first component conveying section 23 are connected to the direct-drive motor 39 by the power transmitting member 36 (first power transmitting member) and the power transmitting member 40, They work synchronously.

Similarly, in the above-described electronic component supply apparatus 10 shown in Fig. 14, the direct-drive motor 39 is reciprocated in the direction of the arrow Dir7 so that the power of the direct-drive motor 39 is transmitted to the third component- (41). As a result, the third component feeder 41 rotates intermittently in the direction of the arrow Dir8. Since the third component conveying section 41 and the first component conveying section 23 are connected to the direct-drive motor 39 by the power transmitting member 32 (first power transmitting member) and the power transmitting member 40, Operate in synchronization.

The operation of moving the component storage tape 1 is as follows.

The component storage tape 1 is moved to the third component transfer section 41 along the guide (not shown). At this time, a sensor for detecting the leading end of the component storage tape 1 may be arranged, and the direct-drive motor 39 may automatically start operation based on the detection result of the sensor. Further, a switch for starting the direct-drive motor 39 may be provided, and the operation of the direct-drive motor 39 may be started manually. The component storing tape 1 moved by the third component transferring unit 41 further moves by the second component transferring unit 24 and stops at the position where the electronic component can be taken out by the first component transferring unit 23. [ At this time, the direct-drive motor 39 may be stopped at a timing when it is detected by the sensor (not shown) for detecting the electronic component that the leading electronic component has arrived at the position of the component withdrawing hole 13. [

Although not described here, the basic structure of the electronic component feeder 10 in which the direct-drive motor 39 is disposed in the component conveyance unit shown in Fig. 9 described above and the power of the direct- The power transmitting member 40 and the third component transferring unit 41 may be provided.

(5). Operation of electronic component supply device

An example of the operation of the electronic component supplying apparatus 10 of the present embodiment will be described with reference to Figs. 15 and 16. Fig. 15 is a view for explaining an operation of pulling out an electronic component from the component storage tape 10. Fig. 16 is a diagram for explaining the operation waveform of the component feeding section 3 of the electronic component feeding apparatus 10. Fig.

In the operation of the electronic component supplying apparatus 10 shown in Fig. 15, it is assumed that there are N (N = 3) component receiving portions 17 between the two component drawing holes. A black circle () shows a state in which the electronic component is contained in the component housing part 17, and a white circle (◯) shows a state in which the electronic component is not contained in the component housing part 17.

First, the component storage tape 1 is moved to the position of the first component transferring part 23 by the third component transferring part 41 described using the above-described FIG. 13 or 14, for example, Movement &quot; state. Here, two electronic parts at the positions of the first and second component drawing-out holes 13 and 14 are pulled out, as in &quot; (1) drawing part &quot;.

When the withdrawal of the two electronic components is completed, the component storage tape 1 is also moved by the storage pitch of the electronic components stored in the component storage tape 1, that is, the arrangement pitch δL of the component storage portion 17, (2) Move &quot;. When the movement is completed, two electronic parts at the positions of the first and second component drawing holes 13 and 14 are pulled out, as in &quot; (2) Drawing part &quot;.

When the withdrawal of the two electronic components is completed, the component storage tape is moved by delta L, resulting in the state of &quot; (3) shifting &quot;. When the movement is completed, two pieces of electronic parts at the positions of the first and second part drawing-out holes 13 and 14 are pulled out, as in &quot; (3) Pulling out parts &quot;.

When the withdrawal of the two electronic components is completed, the component storage tape is moved by delta L, resulting in the state of &quot; (4) moving &quot;. When the movement is completed, two pieces of electronic parts at the positions of the first and second part drawing-out holes 13 and 14 are pulled out, as in &quot; (4) This is the reason why the number of times of the number N existing within the length corresponding to the distance P (first interval) between the first component drawing-out hole 13 and the second component drawing-out hole 14 is set at the pitch of? 1) intermittently. In the example of Fig. 15, the number of component receiving portions 17 between the first and second component drawing holes 13 and 14 is N = 3, so that three intermittent feeding operations are performed in the first mode.

(N + 1) x 2 electronic components is completed, the second mode for intermittently feeding the component storage tape by? L x (N + 2) is executed as indicated by "(5) (1) movement &quot; described above by the intermittent transfer of the second mode. Hereinafter, the same operation is repeated to fetch the electronic component from the component storage tape.

As shown in FIG. 16, after the electronic component is taken out, the component transfer section moves the component storage tape by? L by the fine movement pattern 47 (first mode). Then, after pulling out (N + 1) x 2 electronic components, the component storing tape is moved by? L x (N + 2) by the coarse operation pattern 48 (second mode). By repeating this operation, the electronic parts housed in the component storage tape are sequentially taken out.

As described above, it is possible to shorten the time for drawing out the electronic parts by simultaneously or successively drawing the electronic parts at a plurality of places in the direction in which the part storing tape moves. In addition, since a plurality of electronic components can be drawn out simultaneously or sequentially, the operation of the present embodiment can be operated for a longer period of time as compared with the operation time of the component transferring section when the electronic components are continuously drawn one by one. That is, it is possible to move the component accommodating tape to reduce the maximum conveying speed of the component conveying unit and suppress the occurrence of vibration.

«Electronic component mounting device»

(One). Part handling section

An example of the part handling portion 100 included in the electronic component mounting apparatus 150 of the present embodiment will be described with reference to Fig. 17 is a perspective view showing a configuration of the part handling portion 100. Fig. In addition, a housing (a member for fixing and covering a part handling part) is omitted for explaining the internal structure of the parts handling part 100. [

The part handling portion 100 is an actuator capable of linear reciprocating motion in the direction of the arrow 3 and rotational motion around the axis 1a. The component handling portion 100 includes a linear motion device 102, a rotary device 101, a movable member 108 for connecting the linear device 102 and the rotary device 101, a rotary device 101, And a control board (not shown) for controlling the operation of the controller 102.

The linear motion device 102 that linearly reciprocates in the direction of arrow 3 includes a rotary motor 103, a screw shaft 106 connected to the rotary shaft of the rotary motor 103, and a nut 107 inserted into the screw shaft 106 . The screw shaft 106 and the nut 107 constitute a ball screw in combination. The rotation axis of the rotation motor 103, the rotation axis of the screw shaft 106 and the movement center axis of the nut 107 are arranged coaxially with the axis 1b. The rotary motor 103 is fixed to a housing (not shown). When the rotary shaft of the rotary motor 103 rotates about the axial line 1b, the screw shaft 106 rotates. When the screw shaft 106 rotates, the rotational motion of the screw shaft 106 is converted into a linear motion, so that the nut 107 linearly moves in the direction of the axis 1b.

The rotary device 101 includes a rotary motor 104, a shaft 105 connected to the rotary shaft of the rotary motor 104, and a component suction mount 9 connected to the shaft 105. The component adsorption mounting portion 9 is attached to the shaft 105 in the same axis as the axis 1a of the rotary device 101. [ The rotary shaft of the rotary motor 104 rotates about the axis 1a and rotates the shaft 105 and the component suction mount 9 about the axis 1a. The rotating device 101 can move linearly in the direction of the axis 1a and is supported by a guide (not shown).

The axis 1a and the axis 1b are parallel. The nut 107 of the linear motion device 102 and the rotary motor 104 of the rotary device 101 are connected by the movable member 108. When the nut 107 linearly moves in the direction of the axis 1b as the rotary motor 103 rotates, the rotary device 101 linearly moves together with the movable member 108 in the direction of the axis 1a.

As described above, since the component handling portion 100 includes the linear motion device 102 that linearly reciprocates in the direction of the arrow 3, the component adsorption mounting portion 9 attached to the end of the shaft 105 allows the component It is possible to draw out the tape 1 and to arrange the electronic parts on the printed board. Further, the electronic component holding method for drawing out the electronic component may be vacuum suction using, for example, a vacuum force.

The rotating device 101 provided in the part handling portion 100 can control the attitude (placement angle) of the electronic component by rotating the electronic component drawn out from the component storing tape 1 around the axis 1a. The component handling portion 100 is configured such that the thickness in the direction of the arrow 4 is small and the axis 1a which is the rotational axis of the rotating device 101 is located in the direction of the arrow 5 in the width direction of the housing (Close to one of the housing walls in the direction of arrow 5). Therefore, when the adjacent shafts 105 are arranged close to each other, it is preferable that the part-handling portion 100 is brought close to the housing wall in the direction of the arrow 4 and the housing walls seen from the direction of the arrow 5 are close to each other.

In the present embodiment, the linear motion device 102 has been described as an example of a combination of a ball screw mechanism and a rotary motor as a means for performing linear motion. However, the coil and the magnet may be arranged in a plane to form a mover and a stator Or a linear motor. Further, the mover of the linear motor and the rotating device may be connected and interlocked.

(2). head

18 and 19, a first example of the head 200 on which the component adsorption mounting portion 9 of this embodiment is disposed will be described. Figs. 18 and 19 are schematic diagrams showing a first example of the positional relationship of the head 200 in which a plurality of the electronic component supplying apparatus 10 and the part handling portion 100 are arranged.

As shown in Fig. 18, a plurality of parts handling portions 100 are arranged in the X direction (N pieces are arranged in Fig. 18). Further, a plurality of parts handling portions 100 are arranged in the Y direction (tape feeding direction in which the component storing tape moves). 18 shows an example in which a group of component handling units is constituted by arranging two component handling units 100 in the Y direction such that the neighboring component adsorption mounting units 9 are close to each other. These first group of component handling units are arranged in parallel in N sets in the X direction. A plurality of the electronic component supplying apparatuses 10 are arranged in the X direction (two units are arranged in Fig. 18). Each of the electronic component supplying apparatuses 10 has a plurality of component drawing holes 210 (a plurality of component drawing portions) in the Y direction (two component drawing holes are shown in Fig. 18). The head 200 has a plurality of part handling parts 100 disposed thereon. The parts handling portion 100 is arranged in a plurality of directions in the direction of the arrow 4 shown in Fig. 17, and is arranged so that the wall surfaces of the housing seen from the direction of the arrow 5 are close to each other. The head 200 is moved in the X and Y directions by a moving device (first moving device), not shown.

As described above, according to the head 200 of the first example, it is possible to arrange the component adsorption mounting portions 9 provided in the component handling portion 100 in a lattice form. It is possible to dispose the part-handling portion 100 in correspondence with each of the component drawing-out holes 210 of the plurality of arranged electronic component supplying apparatuses 10 have.

In addition, the electronic component supplying device 10 is configured to allow the electronic component contained in the component storage tape 1 to be drawn out, move the electronic component up to the component drawing-out hole 210, The head 200 can vertically draw a plurality of electronic components in the X direction at the same time or in a short period of time by making the component adsorption mount 9 up and down. At this time, other electronic parts can be taken out in a short time by loading the kind of the component storing tape 1 differently for each electronic component supplying apparatus 10. [ In addition, by loading the same kind of the component storing tape 1 into the plurality of electronic component supplying apparatuses 10, the same kind of electronic component can be taken out in a short time.

Further, the part-handling portion 100 arranged in the Y-direction moves up and down the component adsorption mounting portion 9, whereby the head 200 can continuously draw out a plurality of electronic components in the Y-direction simultaneously or in a short time. At this time, it is possible to simultaneously take out a plurality of parts of the same type at a time or in a short time.

Further, by vertically moving the component adsorption mount 9 in the X and Y directions, a plurality of electronic components in the X and Y directions can be taken out simultaneously or in a short time. Therefore, as shown in Fig. 18, when the part handling portion 100 is disposed, the operation time for continuously taking out other electronic parts simultaneously or in a short time is shortened.

As shown in Fig. 19, the head 200 includes a head frame 201 connecting a plurality of part-handling portions 100. As shown in Fig. A plurality of part handling portions 100 are attached to the head frame 201 having a plurality of holes 202 for allowing the part suction mount 9 to move. Each component handling portion 100 is arranged so as to be able to draw out the electronic component from the component drawing-out hole 210 of the electronic component supplying device 10. [ The head 200 moves in the direction of the arrow Dir9 and stops at a position where the parts drawing-out hole 210 and the component suction mount 9 coincide with each other to take out the electronic component. By arranging as described above, the dimension of the head 200 in the X direction can be made small.

Next, a second example of the head in which the component suction attachment portion 9 of the present embodiment is disposed will be described with reference to Figs. 20 and 21. Fig. Figs. 20 and 21 are schematic diagrams showing a second example of the positional relationship of the head 200 in which a plurality of the electronic part supply apparatus 10 and the part-handling portion 100 are arranged.

20, a plurality of parts handling portions 100 are arranged in the X direction (direction perpendicular to the tape conveying direction). In Fig. 20, there is shown an example in which a group of parts handling part groups are constituted by arranging two part handling parts 100 in the X direction so that the neighboring parts attracting and mounting part 9 is close to each other. Further, a plurality of parts handling portions 100 are arranged in the Y direction. 20 shows an example in which the first group of component handling portions are arranged in three sets in the Y direction. A plurality of the electronic component supplying apparatuses 10 are arranged in the X direction (two units are arranged in Fig. 20). Each of the electronic component feeding apparatuses 10 has a plurality of component drawing-out holes 210 (a plurality of component drawing-out portions) in the Y direction (two component drawing-out holes are shown in Fig. 20). The head 200 has a plurality of part handling parts 100 disposed thereon. The parts handling portion 100 is arranged in a plurality of directions in the direction of the arrow 4 shown in Fig. 17 and is arranged so that the wall surfaces of the housing seen from the direction of the arrow 5 are close to each other.

As described above, according to the head 200 of the second example, similarly to the first example described above using Fig. 18, by loading the kind of the component storing tape 1 differently for each electronic component supplying apparatus 10, The operation time for continuously taking out the components simultaneously or in a short time is shortened. In addition, by loading the same number of the component storage tapes 1 on the plurality of electronic component supplying apparatuses 10, the operation time for continuously taking out the same kind of electronic components simultaneously or in a short time is shortened.

As shown in Fig. 21, the head 200 includes a head frame 201 connecting a plurality of part-handling parts 100. As shown in Fig. A plurality of part handling portions 100 are attached to the head frame 201 having a plurality of holes 202 for allowing the part suction mount 9 to move. Each component handling portion 100 is arranged so as to be able to draw out the electronic component from the component drawing-out hole 210 of the electronic component supplying device 10. [ The head 200 moves in the direction of the arrow Dir9 and stops at a position where the parts drawing-out hole 210 and the component suction mount 9 coincide with each other to draw out the electronic component. By arranging as described above, the dimension of the head 200 in the Y direction can be made small.

Next, a third example of the head 200 on which the component adsorption mounting portion 9 of this embodiment is disposed will be described with reference to Figs. 22 and 23. Fig. Figs. 22 and 23 are schematic diagrams showing a third example of the positional relationship of the head in which a plurality of the electronic component supplying apparatus 10 and the component adsorption mounting section 9 are arranged. The head 200 of the third example includes the rotary head 203 as the head.

As shown in Fig. 22, the rotary head 203 has a plurality of component adsorption mounting portions 9, and is configured to rotate in the direction of the arrow Dir11 around the axis 2. [ The plurality of component adsorption mounting portions 9 are arranged at predetermined angular intervals on a circumference with the axis 2 as a center. The component suction mount 9 can be reciprocated in the direction of the arrow Dir10 by a driving unit (not shown). A plurality of electronic component supplying devices 10 are arranged in the X direction (two electronic component supplying devices 10 are arranged in Fig. 22). Each of the electronic component supplying apparatuses 10 has a plurality of component drawing holes 210 in the Y direction (direction in which the component carrying tape moves) (two component drawing holes are shown in Fig. 22).

As shown in Fig. 23, the rotary head 203 is attached to the head frame 201. Fig. The head frame 201 has a hole for allowing the part suction mount 9 to be rotated in the direction of the arrow Dir11 in FIG. 22 and reciprocating in the direction of the arrow Dir10. The distance P (pitch) in the Y direction of the neighboring component suction mount 9 is equal to the center-to-center distance of the component takeout hole 210 neighboring the electronic component supply device 10 in the Y direction. 23, the distances P (pitch) of the neighboring component adsorption mounts 9 and the distances between the centers of the neighboring component withdrawing holes 210 are equal to each other. However, Pitch). The rotary head 203 moves in the direction of the arrow Dir9 and stops at a position where the parts drawing-out hole 210 and the component suction mount 9 coincide with each other to take out the electronic component.

By arranging as described above, the rotating head 203 can continuously draw out a plurality of electronic parts simultaneously or in a short time.

(3). Operation of parts suction mount

24 (a) and 24 (b), a first example of the drawing operation of the electronic parts of the component adsorption mounting portion of this embodiment will be described. Fig. 24 (a) shows the movement of the first and second component adsorption mounting portions 9a and 9b directly above the component drawing holes and the drawing operation of the electronic components of the first component adsorption mounting portion 9a FIG. Fig. 24 (b) is a side view showing the drawing operation of the electronic part of the second part suction mount section 9b. Figs. 24 (a) and 24 (b) show an operation of continuously pulling out the electronic parts from the component drawing holes arranged in the direction in which the component storing tape 1 moves in a short time. Since the electronic component supplying apparatus 10 is as described with reference to Fig. 11, the detailed description is omitted.

The first component adsorption mounting portion 9a and the second component adsorption mounting portion 9b move in the direction of the arrow Dir12 and are positioned directly above the component drawing-out hole of the electronic component supplying apparatus 10 as shown in Fig. 24 (a) . At this time, the position at which the distal end portions of the first component suction mount portion 9a and the second component suction mount portion 9b move is not in contact with the maximum protruded portion on the movement path until reaching the electronic component supply apparatus 10 (L1), which is the height of the convex portion plus a predetermined clearance height. In addition, the movement in the direction of the arrow Dir12 is realized by a moving device (not shown) for moving the head 200.

When the first component suction mount 9a is moved to take out the electronic component, the second component suction mount 9b is moved to the second standby position L2 close to the component drawing hole than the first standby position L1 Move. The second standby position L2 may be a position where the tip end portion of the second component suction mount 9b is in contact with the electronic component supply device 10 plus a predetermined clearance height.

Subsequently, as shown in Fig. 24 (b), when the first component suction attachment portion 9a is moved to suck up and withdraw the electronic component, the second component suction attachment portion 9b is moved to the second standby position L2 To the component drawing-out hole to draw out the electronic component. The second component adsorption mounting portion 9b, which has attracted and drawn out the electronic component, moves to the first standby height L1 and moves to mount the electronic component on the printed board.

As described above, since the second component suction mount 9b moves from the first standby position L1 to the second standby position L2 while the first component suction mount 9a is performing the suction drawing operation, It is possible to shorten the moving distance when the component suction attachment portion 9b sucks and withdraws the electronic component. Therefore, it is possible to shorten the operation time for drawing out the electronic parts.

Next, with reference to Figs. 25A and 25B, a second example of the drawing operation of the electronic parts of the component suction mounting portion of the present embodiment will be described. 25 (a) is a side view showing the movement of the first and second component adsorption mounting portions 9a and 9b directly above the component drawing holes, and Fig. 25 (b) is a side view showing the first and second component adsorption mounting portions 9a and 9b Fig. 5 is a side view showing the drawing operation of the electronic component of Fig. 25 (a) and 25 (b) show an operation of simultaneously pulling out the electronic parts from a plurality of part drawing holes arranged in a direction in which the component storing tape 1 moves (two in Figs. 25 (a) and 25 Respectively. Since the electronic component supplying apparatus 10 is the same as that described with reference to Fig. 11, detailed description thereof will be omitted.

25 (a), the first component adsorption mounting section 9a and the second component adsorption mounting section 9b are moved in the direction in which the component storage tape of the electronic component supply apparatus 10 moves, Are positioned directly above the component drawing holes of the apparatus (10). At this time, the position at which the distal end portions of the first component suction mount portion 9a and the second component suction mount portion 9b move is not in contact with the maximum protruded portion on the movement path until reaching the electronic component supply apparatus 10 (See Fig. 24 (a)), which is obtained by adding a predetermined clearance height to the convex portion height.

Subsequently, as shown in Fig. 25 (b), the first component adsorption mount 9a and the second component adsorption mount 9b start to move simultaneously from the first standby position L1 to adsorb the electronic component And returns to the first standby position L1. And then moves to mount the electronic component on the printed circuit board.

As described above, it is possible to shorten the working time by pulling out the electronic parts at the same time by the first part suction attachment part 9a and the second part suction attachment part 9b.

(4). The image-

26 (a) and 26 (b), the image pickup section 204 provided in the electronic component supply apparatus 10 of this embodiment will be described. Fig. 26A is a side view showing the position of the imaging section 204 provided in the electronic component supply apparatus 10, and Fig. 26B is a side view showing the shape of the imaging of the component absorption mounting section 9. Fig. The configuration of the electronic component supplying apparatus 10 is the same as that described above with reference to FIG. 11 and FIG. 24 described above, and thus a detailed description thereof will be omitted.

The electronic component supply device 10 is a direction in which the component storage tape 1 moves, and the image pickup unit 204 is mounted on the downstream side of the component transfer unit. The image pickup section 204 is constituted by, for example, an image pickup device and a lighting device. The component storage tape 1 changes the advancing direction by about 90 degrees after passing through the component transferring section so as not to interfere with the imaging section 204. [ The positional relationship between the imaging section 204 and the component drawing-out hole is set in advance.

26A, the first component adsorption mount 9a and the second component adsorption mount 9b move in the direction of the arrow Dir13 and enter the component withdrawal holes formed in the electronic component supply device 10, As shown in Fig. At this time, as shown in Fig. 26 (b), the second component suction mount 9b is picked up by the image pickup unit 204 from below while moving. Similarly, the first component suction mount 9a is also picked up by the image pickup unit 204 from below while moving. The picked-up information is stored by an information holding unit (not shown).

Next, a positioning method of the component adsorption mounting portion 9 of this embodiment will be described with reference to Fig. Fig. 27 is a view for explaining a positioning method of the component adsorption mounting section 9 based on the information captured by the imaging section 204. Fig. The configuration of the electronic component supply device 10 and the head 200 is based on the configuration described above with reference to FIG. 19, and thus a detailed description thereof will be omitted.

The head 200 includes a moving device 205 (second moving device) that supports the part handling portion 100. [ Each of the part handling portions 100 is attached to the moving device 205 so as to be movable in the X direction and the Y direction indicated by the arrow Dir14. Further, the mobile device 205 is fixed to the head frame 201. An imaging section 204 is mounted on each of the electronic component supply apparatuses 10. The electronic component mounting apparatus 150 includes a controller (not shown) for performing operation control, arithmetic processing, and the like of each section. The controller includes a control unit for functionally controlling the operation of the image pickup unit 204 and the moving device 205 and a control unit for controlling the operations of the image pickup unit 204 and the image pickup unit 204, And a calculation unit for calculating the output value.

As described above, the head 200 is moved and each of the component adsorption mounting portions 9 is positioned at the position of the corresponding component drawing-out hole 210. Before being positioned, each of the component adsorption mounts 9 passes over each of the imaging sections 204. At this time, the controller of the controller operates the imaging unit 204 to pick up an image of the component suction mount 9 (step P1). The picked-up image is subjected to image processing, and the position information of the component suction mount 9 is extracted (step P2). Based on the extracted information, the calculator of the controller calculates the central position for handling the electronic component of the component adsorption mount 9 (step P3). Then, the calculating unit compares the calculated positional information and an initial value calculated in advance from the positional relationship between the imaging unit 204 and the component drawing hole 210 (step P4). The calculating unit calculates the positional shift amount of the component suction mount 9 from the comparison result (step P5). The control unit of the controller outputs a movement command to each of the mobile devices 205 based on the calculated positional displacement (Step P6). As a result of the operation of the moving device 205 based on the moving instruction to the moving device 205, the positional relationship between the component suction mount portion 9 and the component drawing-out hole 210 can stably attract and withdraw the electronic component .

As described above, by mounting the imaging section 204 on the electronic component supplying apparatus 10 and attaching the moving apparatus 205 to the component handling section 100 mounted on the head 200, And the position of the component drawing hole 210 can be accurately matched. By accurately matching the position of the component suction mount 9 with the position of the component withdrawal hole 210, it is possible to stably attract and withdraw the electronic component, thereby improving the productivity and reliability of the electronic component mounting apparatus. The imaging unit 204 may also be used when the electronic component is moved onto a printed circuit board. In this case, it is possible to determine the presence or absence of the electronic component, to determine the type of the electronic component, and to detect the attitude of the electronic component based on the sensed information. This makes it possible to improve the production quality of the electronic component mounting apparatus by the presence or absence of drawing out of the electronic component, the prevention of the mispositioning of the electronic component, the determination of the attitude of the non-positionable electronic component, and the attitude correction of the electronic component.

(5). How to place electronic components

A method of arranging electronic components by the electronic component mounting apparatus 150 of this embodiment will be described with reference to Figs. 28 and 29. Fig. Figs. 28 and 29 are views for explaining the operation of the component adsorption mounting section 9 in this embodiment. Fig. The controller of the electronic component mounting apparatus 150 further includes an operation control section for controlling the operation of the component suction mount section 9. [ The operation control section calculates the atmospheric height of the component adsorption mounting section 9 from the arrangement information when the electronic components are arranged on the printed board, the electronic component information of the electronic components, the arrangement order of the electronic components, and the warp information of the printed board do. Then, the operation control section operates the component adsorption mounting section 9 on the basis of the standby height of the component adsorption mounting section 9

The head 200 having the part suction mount 9 places the electronic component 22 on the printed board 152 in a predetermined order and path. It is assumed that the predetermined order and path are arrows (1) to (7).

The operation control section of the present embodiment sets the second waiting position with respect to the electronic component 22 having the highest height on the route when the electronic component 22 is disposed along the route, And moves the position from the first standby position to the second standby position. For example, in the path of the arrow 1, the first stand-by height corresponds to the standby position of the component suction mount 9 (FIG. 9) after the electronic component 22 is taken out from the electronic component supply apparatus 10 ). Specifically, in the second standby position, the position of the component suction mount 9 is set to be smaller than the height of the component suction mount 9 with reference to the electronic component 22 having the highest height among the electronic components 22 already arranged on the movement route It is a position with a clearance height. Each will be described along the path from the arrow 1 to the arrow 7.

In the case of the path of the arrow 1, the first stand-by position is the height when the electronic component 22 is pulled out from the electronic component feeder 10. Four electronic components 22 are already arranged on the path of the arrow 1, and the electronic component 22 having the highest height among the four electronic components 22 is the second and fourth in the passing order. Therefore, the operation control unit sets the second standby position higher than the reference height by the margin height? By using the second and fourth heights as a reference, (9). After that, the electronic component 22 is positioned by positioning at a position to be placed.

Then, in the case of the path of the arrow 2, the first standby position is the second standby height set in the arrow (1). In addition, five electronic components 22 are already arranged on the path of the arrow 2, and the electronic component 22 having the highest height among them is the third in the passing order. Therefore, the operation control unit newly sets a second standby position that is higher than the reference height by the margin height? By the lower surface of the electronic component 22 disposed with the third height as a reference, . After that, the electronic component 22 is positioned by positioning at a position to be placed.

Then, in the case of the path of the arrow 3, the first standby position is the second standby height set in the arrow (2). On the path of the arrow 3, one electronic component 22 is already arranged. The operation control section newly sets the second standby position higher than the reference height by the clearance height delta on the basis of the height of the electronic component 22, 9). After that, the electronic component 22 is positioned by positioning at a position to be placed.

Then, in the case of the path of the arrow 4, the first waiting position is the second waiting height set in the arrow (3). In addition, three electronic components 22 are already arranged on the path of the arrow 4, and the electronic component 22 having the highest height among the three electronic components 22 is the first and second in the passing order. Therefore, the operation control unit newly sets a second standby position that is higher than the reference height by the clearance height delta, on the basis of the first and second heights, The position of the mounting portion 9 is changed. After that, the electronic component 22 is positioned by positioning at a position to be placed.

Then, in the case of the path of arrow 5, the first stand-by position is the second stand-by height set in arrow (4). In addition, two electronic components 22 are already arranged on the path of the arrow 5, and the electronic component 22 having the highest height is the second in the order of passage. Therefore, the operation control unit newly sets the second standby position, which is higher than the reference height by the clearance height? By the lower surface of the electronic component 22 to be disposed based on the second height, .

In the case of the arrow 5, the height of the electronic component 22 having the highest height among the electronic components 22 already disposed on the path is the same as that on the previous path. Therefore, the second standby position set by the arrow 4 becomes the same as the second standby position newly set in the arrow 5, and the position of the component suction mount 9 remains fixed (unchanged). Thereafter, the electronic component 22 is positioned by positioning at a position to be disposed.

Then, in the case of the path of the arrow 6, the first stand-by position is the second stand-by height set in the arrow (5). In addition, four electronic components 22 are arranged on the path of the arrow 6, and the electronic component 22 having the highest height among the four electronic components 22 is the first and third in the passage order. Therefore, the operation control unit newly sets a second standby position that is higher than the reference height by the clearance height delta, on the basis of the first and third heights, The position of the mounting portion 9 is changed.

In the case of the arrow 6, the height of the electronic component 22 having the highest height among the electronic components 22 already disposed on the path is the same as that on the previous path. Therefore, the second standby position set by the arrow 5 becomes the same as the second standby position newly set by the arrow 6, and the position of the component suction mount 9 remains fixed (unchanged). After that, the electronic component is positioned by positioning at a position to be placed.

Then, in the case of the path of the arrow 7, the first stand-by position is the second stand-by height set in the arrow (6). The path of the arrow 7 is a path for returning to the electronic component supply device. Therefore, the operation control section newly sets the second standby position in which the position of the end face of the component adsorption mounting section 9 is higher than the position of the highest position on the route by the clearance height?, And the component adsorption mounting section 9 ). Thereafter, the head 200 is positioned at the component withdrawing position and the withdrawing operation of the electronic component 22 is started.

Next, the operation flow of the component adsorption mounting section 9 of the present embodiment will be described with reference to the flowchart of Fig.

First, before the electronic component is placed on the printed board, the controller accepts input of the arrangement information of the electronic component from the user (step S1). Next, input of information such as the type and shape (width, depth, height) of the electronic component is received (step S2). Subsequently, the controller creates an electronic component placement procedure that minimizes the time for placing the electronic components (step S3). Next, the operation control section calculates the atmospheric height of the component adsorption mounting section 9 based on the presence and height information of the electronic components already arranged on the path along which the component adsorption mounting section 9 moves (step S4). As shown in Fig. 28, when the printed board 152 has a warp of height H, warp information of the printed board is input (step S5). The operation control unit corrects the atmospheric height calculated at step S4 on the basis of the warp information of the printed board inputted at step S5 (step S6). The operation control section changes the position of the component adsorption mounting section 9 on the basis of the standby height corrected in step S6 (step S7). Thereafter, the head 200 is moved by the aforementioned moving device (first moving device) (step S8), and the electronic parts are placed (step S9). Next, it is judged whether or not the head 200 has completed the arrangement of all the electronic components (step S10), and if all of the electronic parts are not arranged (no), the process returns to step S7 to prepare for the next electronic part placement. If all of the electronic components are disposed (YES), the process moves to the electronic component supply device to start the drawing operation of the electronic component (step S11).

As described above, according to the present embodiment, the position of the component adsorption mounting portion 9 can be changed according to the route in which the electronic component is disposed (since the component adsorption mounting portion can minimize the amount of movement when arranging the electronic components) The time for disposing the electronic parts can be shortened. Further, by receiving the warp information of the printed board, the position of the component suction mount can be set regardless of the state of the printed board, so that the electronic component can be stably placed and the time for arranging the electronic component can be shortened .

(6). A method of acquiring the operation state of the component suction mount

A method of acquiring the operation state of the component adsorption mounting section 9 of the present embodiment will be described with reference to Fig.

The electronic component mounting apparatus 150 of the embodiment shown in Fig. 31 includes a sensor for detecting the operating state of the part handling unit 100. [ A head suitable for the electronic component supply apparatus 10 mounts a plurality of part-handling sections 100. It is necessary to detect the operating state of each part handling portion 100 by using the sensor and to judge whether or not the electronic parts are stably arranged. However, if there are many devices to judge the presence or absence of the above-mentioned abnormality, the wiring for transmitting information becomes troublesome, and wiring may cause a new obstacle.

Therefore, the electronic component mounting apparatus 150 of the present embodiment includes a state display device 207 for displaying information obtained from the sensor on the end surface of the part handling portion 100 and displaying the result of the determination, An information reading device 206 for reading information from the component suction mount section 9 and an operation control section for controlling the operation of the component suction mount section 9. [ The status display device 207 may be constituted by a light emitting element which displays the status of the status in good or bad, and also has a function of converting the information on the presence or absence of the status into graphic information such as a two-dimensional bar code and displaying the converted graphic information . The information reading device 206 may be an image pickup device (e.g., a CCD camera or the like) having an image processing function corresponding to the status display device 207 and may be a barcode reader capable of reading a two-dimensional barcode. The operation control section operates the component suction mount section 9 based on the information.

(7). Configuration of electronic component mounting apparatus

An example of the electronic component mounting apparatus 150 of this embodiment will be described with reference to Fig. 32 is a top view showing an example of the electronic component mounting apparatus 150. Fig.

The electronic component mounting apparatus 150 includes a base 159 and an electronic component supplying apparatus for supplying various electronic components to the lead-out positions of the respective electronic components on the base 159 is detachably mounted on the component supplying section 153 Are arranged and fixed in a plurality of possible positions. A substrate conveying conveyor 151 is provided between the opposed part supply unit 153 and the opposed part supply unit 153. The substrate conveying conveyor 151 includes a conveying unit for conveying the printed board 152 and a printed board holding unit for positioning and holding the printed board 152 conveyed from the direction of arrow F at a predetermined position. The substrate conveying conveyor 151 conveys the printed board 152 in the direction of the arrow G after the electronic parts are mounted on the printed board 152.

A pair of long X-beams 155 are provided in the same direction as the direction in which the printed board 152 is conveyed. At both ends of the X-beam 155, for example, an actuator (not shown) such as a linear motor is attached. The X-beam 155 is supported so as to be movable along the Y-beam 157 in a direction perpendicular to the direction in which the printed substrate 152 is conveyed. The X-beam 155 can pass between the component supply unit 153 and the printed board 152 by the actuator. The X beam 155 is provided with a head 154 having a plurality of part handling portions for moving along the X beam 155 in the longitudinal direction of the X beam 155 by the actuator.

A recognition camera 156 and a nozzle storage unit 158 are disposed between the component supply unit 153 and the substrate transfer conveyor 151. [

The recognition camera 156 is for acquiring part information and positional deviation information of the electronic parts sucked by the head 154 in the component supply unit 153. [ By detecting the electronic component by the recognition camera 156, it is possible to confirm the positional shift amount and the rotation angle of the adsorbed electronic component in the substrate transport direction and the direction orthogonal to the substrate transport direction. It is also possible to check whether or not the electronic component is adsorbed by imaging. When the X beam 155 and Y beam 157 move in parallel to move from the component supply unit 153 to the printed board 152, the head 154 passes over the recognition camera 156, And obtains positional displacement information.

The nozzle storage portion 158 is a place for storing a plurality of suction nozzles (not shown) attached to the head 154, which is necessary for adsorbing and mounting various electronic components. When instructed to attach the suction nozzle corresponding to the electronic component, the head 154 moves independently to the nozzle storage part 158 by operating the X beam 155 and the Y beam 157 independently, and the suction nozzle is exchanged do.

Although the invention made by the present inventors has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.

Claims (20)

A component storage tape including a carrier tape, a plurality of component storage portions provided on the carrier tape with a first gap in the tape transport direction, and a cover tape attached to the carrier tape to cover the plurality of component storage portions, An electronic component supply apparatus for intermittently transporting an electronic component,
At the component withdrawing position,
A first component withdrawing portion and a second component withdrawing portion provided with the first gap in the tape transport direction,
And a lid member covering the component housing portion provided between the first component withdrawing portion and the second component withdrawing portion. The method according to claim 1,
A direct-
Further comprising: a component feeding unit that is given a driving force by said direct-drive motor to carry said component storing tape. The method according to claim 1,
A cover tape feeding part for feeding the cover tape,
Further comprising an electronic component-exposed portion which is disposed on an upstream side of the component withdrawing position in the tape conveying direction and exposes an electronic component accommodated in the component accommodating portion of the component accommodating tape,
And the electronic part exposing section peels the cover tape from the carrier tape and moves the peeled cover tape to the cover tape transfer section. The method according to claim 1,
Further comprising an electronic component-exposed portion which is disposed on an upstream side of the component withdrawing position in the tape conveying direction and exposes an electronic component accommodated in the component accommodating portion of the component accommodating tape,
The electronic component-
A cutter for cutting the cover tape;
And a cover tape opening portion for spreading the cut cover tape so that the cover tape open and expands in a direction orthogonal to the tape conveying direction on the surface on which the plurality of component storage portions of the component storage tape is formed to expose the electronic component, . The method according to claim 1,
A first component conveying section provided corresponding to the first component withdrawing section,
Further comprising a second component transferring portion provided in correspondence with the second component withdrawing portion,
The first component transfer section is disposed so that the center of the first component withdrawing section and the rotational center of the first component transfer section are located in the same plane perpendicular to the tape transfer direction,
And the second component transfer section is disposed such that the center of the second component withdrawing section and the rotational center of the second component transfer section are located in the same plane orthogonal to the tape transfer direction. 6. The method of claim 5,
Further comprising a link member connecting the first component transfer unit and the second component transfer unit,
And power is transmitted to any one of the first and second component transferring parts. 6. The method of claim 5,
Further comprising a gear that connects the first component transfer unit and the second component transfer unit,
And power is transmitted to any one of the first and second component transferring parts. 6. The method of claim 5,
Further comprising a link member connecting the first component transfer unit and the second component transfer unit,
Wherein power is transmitted to the first component conveyance section, and the first component conveyance section incorporates a member for transmitting a rotational force in one direction. The method according to claim 1,
A first component conveying section provided corresponding to the first component withdrawing section,
A second component transferring section provided corresponding to the second component withdrawing section,
Further comprising a direct-drive motor for imparting a driving force to the first component transfer unit,
The first component transfer section is disposed so that the center of the first component withdrawing section and the rotational center of the first component transfer section are located in the same plane perpendicular to the tape transfer direction,
The second component transfer section is disposed so that the center of the second component withdrawing section and the rotational center of the second component transfer section are located in the same plane orthogonal to the tape transfer direction,
Wherein the electronic component supply device further comprises a member for connecting the first component transfer unit and the second component transfer unit. 10. The method of claim 9,
Wherein the member is a link member connecting the first component transferring section and the second component transferring section. 10. The method of claim 9,
Power is transmitted to the first component transfer unit,
Wherein the member is a link member connecting the first component transferring section and the second component transferring section,
Wherein power is transmitted to the first component conveyance section, and the first component conveyance section incorporates a member for transmitting a rotational force in one direction. The method according to claim 1,
A first component conveying section provided corresponding to the first component withdrawing section,
A second component transferring section provided corresponding to the second component withdrawing section,
A third component transferring portion provided on an upstream side of the tape withdrawing direction at the component withdrawing position,
A linear motor for imparting a driving force to the first component feeder and the third component feeder,
A first power transmitting member for connecting the first component feeder and the linear motor to transmit power,
Further comprising a second power transmitting member for connecting the third component transferring unit and the linear motor to transmit power,
The first component transfer section is disposed so that the center of the first component withdrawing section and the rotational center of the first component transfer section are located in the same plane perpendicular to the tape transfer direction,
The second component transfer section is disposed so that the center of the second component withdrawing section and the rotational center of the second component transfer section are located in the same plane orthogonal to the tape transfer direction,
Wherein the electronic component supply device further comprises a member for connecting the first component transfer unit and the second component transfer unit. 13. The method of claim 12,
Wherein the first and second component transferring parts are configured to transfer,
A first mode in which the component accommodating tape is intermittently fed at an array pitch? L of the component accommodating portions by the number of times N of the component accommodating portions existing within a length corresponding to the first gap,
and the second mode for intermittently feeding the component accommodating tape at a length corresponding to? L x (N + 2). A control board for controlling the linear actuator and the rotary actuator; and a housing incorporating the linear actuator, the rotary actuator, and the control board A part-
A component adsorption mounting portion coaxially attached to the rotary shaft of the rotary device provided in the component handling portion,
A head arranged with a plurality of said part-handling portions,
A first moving device for moving the head;
And an electronic component feeding device which has a plurality of component withdrawing portions in the tape feeding direction and intermittently feeds the component storing tape to the component withdrawing position,
And the component suction attachment portion is disposed in alignment with the positions of the plurality of component withdrawing portions. 15. The method of claim 14,
A plurality of said parts handling parts,
A plurality of part-handling parts are arranged in the tape conveying direction so that the part-to-be-loaded parts are adjacent to each other,
Wherein the one set of part-handling portion groups are arranged in parallel with a plurality of sets in a direction orthogonal to the tape conveying direction on a surface on which the component storing tape moves. 15. The method of claim 14,
A plurality of said parts handling parts,
And the plurality of part handling portions are arranged in a direction orthogonal to the tape transport direction on the surface on which the component storage tape moves so that the adjacent component suction mount portions are adjacent to each other,
Wherein the one set of part-handling part groups are arranged in parallel in a plurality of sets in the tape transport direction. 15. The method of claim 14,
Wherein said head has a head frame connecting said plurality of said part-handling portions. 15. The method of claim 14,
A second moving device that supports the part handling part and moves the part handling part in a plane perpendicular to a direction in which the moving device moves,
An image pickup section for picking up an image of the component suction mount,
A calculating section for calculating a position shift amount of the component withdrawing section provided in the component adsorption mounting section and the electronic component supplying apparatus using the information picked up by the imaging section,
And a control section for operating said second moving device on the basis of said position shift amount. 15. The method of claim 14,
Further comprising an operation control section for controlling the operation of the component suction attachment section,
The operation control unit,
Calculating the atmospheric height of the component adsorption mounting portion from the arrangement information when the electronic component is arranged on the printed board, the electronic component information of the electronic component, the arrangement order of the electronic components, and the warp information of the printed board,
And the component attracting and mounting portion is operated based on the atmospheric height of the component attracting and mounting portion. 15. The method of claim 14,
A sensor for detecting an operating state of the part handling portion,
A status display device for displaying information acquired from the sensor,
An information reading device for reading the information;
Further comprising an operation control section for controlling the operation of the component suction attachment section,
And the operation control section operates the component adsorption mounting section based on the information.

Images