CN106102437B - Feeding of chip mounter device - Google Patents

Feeding of chip mounter device Download PDF

Info

Publication number
CN106102437B
CN106102437B CN201610775987.3A CN201610775987A CN106102437B CN 106102437 B CN106102437 B CN 106102437B CN 201610775987 A CN201610775987 A CN 201610775987A CN 106102437 B CN106102437 B CN 106102437B
Authority
CN
China
Prior art keywords
burning
flash
window
feeding
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610775987.3A
Other languages
Chinese (zh)
Other versions
CN106102437A (en
Inventor
周继禹
Original Assignee
周继禹
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 周继禹 filed Critical 周继禹
Priority to CN201610775987.3A priority Critical patent/CN106102437B/en
Publication of CN106102437A publication Critical patent/CN106102437A/en
Application granted granted Critical
Publication of CN106102437B publication Critical patent/CN106102437B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B69/00Unpacking of articles or materials, not otherwise provided for

Abstract

The present invention provides a kind of feeding of chip mounter device, which includes: web feed module, binder lid, burning module and burning connection component.Web feed module includes web feed track, for conveying Flash.Binder is covered on the web feed track, and the binder lid includes dyestripping window, for tearing the encapsulating film in the Flash.Burning connection component is set to the top position of the dyestripping window of the binder lid, after the Flash circulates to the dyestripping window and tears encapsulating film, the burning output end of the burning module is electrically connected by the burning connection component with the burning input terminal of the Flash;And the burning output end of the burning module and the burning input terminal of the Flash are disconnected after the completion of burning.

Description

Feeding of chip mounter device
Technical field
The present invention relates to chip mounter technical field more particularly to a kind of feeding of chip mounter devices.
Background technique
In current encapsulation technology, burning if desired is carried out to Flash, needs from the package to take out Flash, and will Flash is put into corresponding fixture.After Flash is in place, preset software program is written in Flash replication tool. After burning finishes, by Flash from taking out and be reentered into packaging in fixture.And subsequent surface mount process still needs Flash is taken out from the package again.Unpack dress and repacking so repeatedly, the cost is relatively high for consuming, and entire raw It is also relatively low to produce efficiency.
Summary of the invention
Present invention solves the technical problem that be to provide it is a kind of the burning process of Flash can be incorporated into it is surface-pasted Feeding stage improves production efficiency, reduces the feeding of chip mounter device of production cost to reduce process.
The technical solution that the present invention solves above-mentioned technical problem is to provide a kind of feeding of chip mounter device, the feeding of chip mounter Device includes:
Web feed module comprising web feed track, for conveying Flash;
Binder lid is set on the web feed track, and the binder lid includes dyestripping window, is used for the Flash In encapsulating film tear;
Burning connection component, set on the top position of the dyestripping window of the binder lid, when the Flash circulates to described Dyestripping window and after tearing encapsulating film, the burning connection component is by the burning input terminal of the Flash and burning module The electrical connection of burning output end;And it is after the completion of burning that the burning output end of the burning module and the burning of the Flash is defeated Enter end and disconnects electrical connection.
Preferably, the binder lid is also provided with: for the Flash on burning connection component and the web feed track into The burning window of row connection, and the feeding window for chip mounter suction nozzle feeding;Conveying direction with the web feed module is With reference to the feeding window is located at after the dyestripping window, and the burning window is located at the feeding window and tears with described Between film window.
Preferably, the burning connection component includes: to be electrically connected with the burning output end of the burning module and can be with institute The burning for stating Flash inputs end in contact or isolated contact pin, for driving the burning input of the contact pin and the Flash to terminate Touching or isolated contact pin driving assembly.
Preferably, the contact pin driving assembly includes: electromagnetic relay, and after the Flash is by dyestripping described in control Electromagnetic relay obtains control module electric and that the electromagnetic relay power-off is controlled after the completion of burning;Wherein, the electromagnetism after The controlled end of electric appliance is connect with the control signal output of the control module, and the output end of the electromagnetic relay is inserted with described Needle connection;When the electromagnetic relay obtains electric, the output end of electromagnetic relay drives the contact pin close to and with the Flash Burning input port connection;When electromagnetic relay power-off, the output end of electromagnetic relay drives the contact pin mobile simultaneously It is disconnected with the burning input port of the Flash.
Preferably, feeding of chip mounter device further includes for by the encapsulating film unreeling mechanism of the encapsulating film backrush;The envelope Film unreeling mechanism is filled close to the dyestripping window.
Feeding of chip mounter device provided by the invention, the feeding of chip mounter device at binder lid by increasing burning connection group Part, so that Flash, after dyestripping window is torn encapsulating film, burning connection component can be by the burning output end of burning module It is electrically connected with the burning input terminal of Flash, is burned onto software so that Flash can be completed on feeding of chip mounter device In the middle of Flash.After burning is completed, burning connection component is defeated by the burning of the burning output end of burning module and Flash Enter end and disconnect electrical connection, so that Flash can be by the suction nozzle institute feeding of subsequent chip mounter.The present invention can be in feeding stage Burning process is completed, carries out software burning without assembly line is in addition opened up, to greatly increase the efficiency of entire production process, And reduce the cost of equipment.
Detailed description of the invention
Fig. 1 is the module diagram of one embodiment of feeding of chip mounter device of the present invention;
Fig. 2 is the top view of binder lid in feeding of chip mounter device of the present invention;
Fig. 3 is the module diagram of binder lid and burning connection component in feeding of chip mounter device of the present invention;
Fig. 4 is the module diagram of another embodiment of feeding of chip mounter device of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Below by specific embodiment combination attached drawing, invention is further described in detail.
With reference to Fig. 1 ~ 3, Fig. 1 is the module diagram of one embodiment of feeding of chip mounter device of the present invention;Fig. 2 is patch of the present invention The top view of binder lid in machine feed appliance;Fig. 3 is the module of binder lid and burning connection component in feeding of chip mounter device of the present invention Schematic diagram.One embodiment of the invention provides a kind of feeding of chip mounter device, which includes: web feed module 1, pressure Expect lid 2 and burning connection component 3.
Web feed module 1 includes web feed track 11, for conveying Flash.It should be noted that web feed Web feed track 11 in module 1 is in circulating rolling, and Flash is transported to discharge port by feeding port.The suction of chip mounter Mouth can draw Flash from discharge outlet, to carry out next step surface mount process.The web feed rail of web feed module 1 Road 11 can be belt or others are able to drive Flash by the transport assembly of feeding port to discharge port.Web feed module 1 Power Component 12 can be the Power Components such as drive motor, as long as its be able to drive endless belt rotation.
Binder lid 2 is positioned approximately at the discharge outlet of feeding of chip mounter device.The main function of binder lid 2 is for by Flash In encapsulating film tear so that Flash is exposed, in order to which subsequent progress software burning and chip mounter suction nozzle 5 are drawn etc. Process.In the present embodiment, binder lid 2 offers dyestripping window 21.The encapsulating film of Flash is from dyestripping window 21 and Flash Separation, so that Flash is exposed, so that burning module 4 can carry out software burning to Flash.Burning completes it Flash afterwards can draw for chip mounter suction nozzle 5, to carry out the surface mounting operation of next step.In order to enable dyestripping process, burning Record module can work simultaneously with chip mounter suction nozzle 5, and to improve production efficiency, further, binder lid 2 is also had additional: For the burning window 22 that the Flash on burning connection component 3 and web feed track 11 is attached, and for chip mounter suction nozzle 5 The feeding window 23 of feeding.It is reference, feeding with the conveying direction of web feed module 1 in the present embodiment for convenience of statement Window 23 is located at after dyestripping window 21, and burning window 22 is between feeding window 23 and dyestripping window 21.Flash is being torn After film window 21 and encapsulation UF membrane, as the circulation of web feed track 11 to burning window 22 carries out burning.Burning completes it Afterwards, Flash is circulated in turn to feeding window 23, for 5 feeding of chip mounter suction nozzle.Binder lid 2 adds two windows, so that dyestripping Process, burning module and chip mounter suction nozzle 5 can work at the same time, to improve whole working efficiency.
Burning module 4 is used to software program being burned onto Flash.In the present embodiment, burning module 4 is to be located at chip mounter Controller outside feed appliance.The controller can be dedicated replication tool, and preset software program is burned onto Flash In the middle.It is connected between the burning output end of burning module 4 and the burning input terminal of Flash by burning connection component 3.? In the present embodiment, after Flash is torn encapsulating film, burning connection component 3 by the burning output end of burning module 4 with The burning input terminal of Flash is electrically connected.Then burning module 4 restarts burning program, can be realized and is burned onto software program In Flash.In order not to interfere subsequent chip mounter to draw Flash, in the present embodiment, after software burning is completed, burn The burning output end of burning module 4 is then electrically connected by record connection component 3 with the disconnection of the burning input terminal of Flash, so that burning Flash after the completion, that is, negotiable to feeding window 23, is drawn by chip mounter suction nozzle 5.Specifically, burning connection component 3 wraps End in contact or isolated contact pin 31 are included: being electrically connected with the burning output end of burning module 4 and can input with the burning of Flash, and For driving contact pin 31 to input end in contact or isolated contact pin driving assembly 32 with the burning of Flash.It circulates when recognizing Flash To burning window 22, contact pin driving assembly 32 drive contact pin 31 close to Flash burning input terminal and make burning input terminal with The burning output end of burning module 4 is electrically connected.After burning module 4 completes burning, contact pin driving assembly 32 drives contact pin 31 The burning input terminal of Flash is left, and is restored to original position, so that the burning of the burning input terminal of Flash and burning module 4 It records output end and disconnects electrical connection, to facilitate subsequent chip mounter feeding.It should be noted that contact pin driving assembly 32 is used as contact pin 31 driving assembly, for driving 31 shift position of contact pin.In the present embodiment, contact pin driving assembly 32 includes: electromagnetism relay Device 321, and control electromagnetic relay 321 after Flash is by dyestripping and obtain electric and break when burning controls electromagnetic relay 321 after the completion The control module 322 of electricity.Wherein, the controlled end of electromagnetic relay 321 is connect with the control signal output of control module 322, The output end of electromagnetic relay 321 is connect with contact pin 31.When electromagnetic relay 321 must be electric, the output end of electromagnetic relay 321 It drives contact pin 31 close and is connect with the burning input port of Flash.When electromagnetic relay 321 powers off, electromagnetic relay 321 Output end drives contact pin 31 mobile and disconnects with the burning input port of Flash.It should be noted that electromagnetic relay 321 Controlled end is low voltage control end, and when control module 322 exports high level, electromagnetic relay 321 obtains electric and generates magnetic field, so that Sheet metal is sucked, at this point, contact pin 31 also pushes therewith, so that the burning with Flash inputs end in contact, so that burning mould The burning output end of block 4 is electrically connected with the burning input terminal of Flash.After burning is completed, control module 322 then exports low electricity It is flat, so that 321 power loss of electromagnetic relay, sheet metal rebound, to drive contact pin 31 to move up, so that the burning of burning module 4 Record output end is electrically connected with the disconnection of the burning input terminal of Flash.
Feeding of chip mounter device provided by the invention, the feeding of chip mounter device at binder lid 2 by increasing burning connection group Part 3, so that Flash, after dyestripping window 21 is torn encapsulating film, burning connection component 3 can be by the burning of burning module 4 Output end is electrically connected with the burning input terminal of Flash, so that Flash is can be completed on feeding of chip mounter device by software burning To Flash.After burning is completed, burning connection component 3 is by the burning output end of burning module 4 and the burning of Flash It records input terminal and disconnects electrical connection, so that Flash can be by the suction nozzle institute feeding of subsequent chip mounter.The present invention can be in feeding Stage completes burning process, software burning is carried out without assembly line is in addition opened up, to greatly increase entire production process Efficiency, and reduce the cost of equipment.
With reference to Fig. 4, Fig. 4 is the module diagram of another embodiment of feeding of chip mounter device of the present invention.Further, patch Machine feed appliance further includes for by the encapsulating film unreeling mechanism 6 of encapsulating film backrush.Encapsulating film unreeling mechanism 6 is close to dyestripping window 21.In order to enable the encapsulating film of Flash can be recycled effectively after being torn, in the present embodiment, in binder lid 2 Encapsulating film unreeling mechanism 6 is nearby arranged in dyestripping window 21.Encapsulating film unreeling mechanism 6 returns the encapsulating film being separated Volume, to avoid being scattered on assembly line by isolated encapsulating film.
The above content is specific embodiment is combined, further detailed description of the invention, and it cannot be said that this hair Bright specific implementation is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, it is not taking off Under the premise of from present inventive concept, a number of simple deductions or replacements can also be made.

Claims (4)

1. a kind of feeding of chip mounter device characterized by comprising
Web feed module comprising web feed track, for conveying Flash;
Binder lid is set on the web feed track, and the binder lid includes dyestripping window, for will be in the Flash Encapsulating film is torn;
Burning connection component, set on the top position of the dyestripping window of the binder lid, when Flash circulation to the dyestripping Window and after tearing encapsulating film, the burning connection component is by the burning input terminal of the Flash and the burning of burning module Output end electrical connection;And by the burning input terminal of the burning output end of the burning module and the Flash after the completion of burning Disconnect electrical connection;
The binder lid is also provided with: the burning being attached for the Flash on burning connection component and the web feed track Record window, and the feeding window for chip mounter suction nozzle feeding;It is reference with the conveying direction of the web feed module, it is described to take Material window is located at after the dyestripping window, and the burning window is between the feeding window and the dyestripping window.
2. feeding of chip mounter device as described in claim 1, which is characterized in that the burning connection component includes: and the burning It records the burning output end electrical connection of module and end in contact or isolated contact pin can be inputted with the burning of the Flash, for driving The contact pin inputs end in contact or isolated contact pin driving assembly with the burning of the Flash.
3. feeding of chip mounter device as claimed in claim 2, which is characterized in that the contact pin driving assembly includes: electromagnetism relay Device, and control the electromagnetic relay after the Flash is by dyestripping and obtain electric and control the electromagnetism relay after the completion of burning The control module of device power-off;Wherein, the control signal output of the controlled end of the electromagnetic relay and the control module connects It connects, the output end of the electromagnetic relay is connect with the contact pin;When the electromagnetic relay obtains electric, electromagnetic relay it is defeated Outlet drives the contact pin close and connect with the burning input port of the Flash;When electromagnetic relay power-off, electromagnetism The output end of relay drives the contact pin mobile and disconnects with the burning input port of the Flash.
4. feeding of chip mounter device as claimed in any one of claims 1 to 3, which is characterized in that further include for by the encapsulation The encapsulating film unreeling mechanism of film backrush;The encapsulating film unreeling mechanism is close to the dyestripping window.
CN201610775987.3A 2016-08-31 2016-08-31 Feeding of chip mounter device Active CN106102437B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610775987.3A CN106102437B (en) 2016-08-31 2016-08-31 Feeding of chip mounter device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610775987.3A CN106102437B (en) 2016-08-31 2016-08-31 Feeding of chip mounter device

Publications (2)

Publication Number Publication Date
CN106102437A CN106102437A (en) 2016-11-09
CN106102437B true CN106102437B (en) 2019-08-09

Family

ID=57224140

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610775987.3A Active CN106102437B (en) 2016-08-31 2016-08-31 Feeding of chip mounter device

Country Status (1)

Country Link
CN (1) CN106102437B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156514A (en) * 2004-11-26 2006-06-15 Hitachi High-Tech Instruments Co Ltd Component supplying device
CN101719356A (en) * 2009-11-27 2010-06-02 福建捷联电子有限公司 Programming method for programming EDID simultaneously on liquid crystal display multiinterface
CN101790302A (en) * 2009-01-27 2010-07-28 株式会社日立高新技术仪器 Parts feeder
JP4714256B2 (en) * 2008-11-05 2011-06-29 ヤマハ発動機株式会社 Parts supply device
CN203072310U (en) * 2012-12-30 2013-07-17 曹挺 Feeder gland structure of chip mounter
CN203503554U (en) * 2013-09-10 2014-03-26 贵州航天电器股份有限公司 Online programming sequential relay used for sequential control output
CN204882811U (en) * 2015-07-15 2015-12-16 深圳市华沃表计科技有限公司 Online quick automatic record, functional test integrated device of burning of PCBA
CN105824675A (en) * 2016-03-24 2016-08-03 深圳市科美集成电路有限公司 Circuit board burning tool, system and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2843018Y (en) * 2005-09-28 2006-11-29 雅马哈发动机株式会社 Electronic component supply device
CN101477828B (en) * 2008-11-18 2012-05-23 台达电子电源(东莞)有限公司 Automatic IC burning machine
JP6035514B2 (en) * 2012-11-28 2016-11-30 パナソニックIpマネジメント株式会社 Tape feeder
JP6293469B2 (en) * 2013-12-05 2018-03-14 ヤマハ発動機株式会社 Electronic component supply device and electronic component mounting device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156514A (en) * 2004-11-26 2006-06-15 Hitachi High-Tech Instruments Co Ltd Component supplying device
JP4714256B2 (en) * 2008-11-05 2011-06-29 ヤマハ発動機株式会社 Parts supply device
CN101790302A (en) * 2009-01-27 2010-07-28 株式会社日立高新技术仪器 Parts feeder
CN101719356A (en) * 2009-11-27 2010-06-02 福建捷联电子有限公司 Programming method for programming EDID simultaneously on liquid crystal display multiinterface
CN203072310U (en) * 2012-12-30 2013-07-17 曹挺 Feeder gland structure of chip mounter
CN203503554U (en) * 2013-09-10 2014-03-26 贵州航天电器股份有限公司 Online programming sequential relay used for sequential control output
CN204882811U (en) * 2015-07-15 2015-12-16 深圳市华沃表计科技有限公司 Online quick automatic record, functional test integrated device of burning of PCBA
CN105824675A (en) * 2016-03-24 2016-08-03 深圳市科美集成电路有限公司 Circuit board burning tool, system and method

Also Published As

Publication number Publication date
CN106102437A (en) 2016-11-09

Similar Documents

Publication Publication Date Title
CN205526446U (en) Automatic conveyor belt of control
CN207358557U (en) A kind of rotor tip drilling hole machine tool
CN106102437B (en) Feeding of chip mounter device
CN204244260U (en) The low pressure boot-strap circuit of communication module
CN204286003U (en) A kind of wiring board development drying unit
CN107978464B (en) The matched automatic transport control system of aluminum hull punching machine of production capacity
CN205225870U (en) Automatic magnetize and press magnetic ring all -in -one
CN202942470U (en) Variable voltage-controlled breast pump
CN207013832U (en) A kind of tin wire conveying apparatus
CN206229938U (en) A kind of braid cutting bender
CN103986321B (en) Arc Welding Power safety starting device and method
CN106230332A (en) DC motor positive and negative rotation control method
CN202575520U (en) Soldering tin wire return device
CN204673907U (en) A kind of injection machine with stub bar reducing mechanism
CN107963467A (en) Polarizer contact pin lifting assembly
CN208977974U (en) High-speed molding device with automatic deploying and retracting material device
CN204368882U (en) A kind of magnetic force inhales iron device
CN106230324A (en) Direct current energy consumption brake control
CN206278606U (en) A kind of feeding system for automatically controlling
CN208265440U (en) A kind of self-adhesive paper production equipment
CN207897220U (en) Automated skip winding displacement board
CN104475930B (en) A kind of gas-shielded welder without control board
CN209515710U (en) The assembly line and solar cell module of solar cell module
CN208047160U (en) Chip mounter feed system
CN208954149U (en) A kind of tourist attractions admission ticket automatic identification recyclable device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant