KR101810729B1 - 압력 측정기 및 압력 측정기를 구비하는 기판 처리 장치 - Google Patents
압력 측정기 및 압력 측정기를 구비하는 기판 처리 장치 Download PDFInfo
- Publication number
- KR101810729B1 KR101810729B1 KR1020140000821A KR20140000821A KR101810729B1 KR 101810729 B1 KR101810729 B1 KR 101810729B1 KR 1020140000821 A KR1020140000821 A KR 1020140000821A KR 20140000821 A KR20140000821 A KR 20140000821A KR 101810729 B1 KR101810729 B1 KR 101810729B1
- Authority
- KR
- South Korea
- Prior art keywords
- diaphragm
- pressure
- pressure chamber
- gas
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012545 processing Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 title claims description 69
- 238000005259 measurement Methods 0.000 claims abstract description 29
- 238000006073 displacement reaction Methods 0.000 claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 abstract description 31
- 239000007789 gas Substances 0.000 description 72
- 230000000052 comparative effect Effects 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 16
- 239000007795 chemical reaction product Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002052 molecular layer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0636—Protection against aggressive medium in general using particle filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Child & Adolescent Psychology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2013-005777 | 2013-01-16 | ||
| JP2013005777A JP5993312B2 (ja) | 2013-01-16 | 2013-01-16 | 圧力測定器及びその圧力測定器を備える基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140092762A KR20140092762A (ko) | 2014-07-24 |
| KR101810729B1 true KR101810729B1 (ko) | 2017-12-19 |
Family
ID=51164152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140000821A Active KR101810729B1 (ko) | 2013-01-16 | 2014-01-03 | 압력 측정기 및 압력 측정기를 구비하는 기판 처리 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9360390B2 (enExample) |
| JP (1) | JP5993312B2 (enExample) |
| KR (1) | KR101810729B1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9429110B2 (en) | 2013-01-16 | 2016-08-30 | Ford Global Technologies, Llc | Method and system for vacuum control |
| JP6727871B2 (ja) | 2016-03-18 | 2020-07-22 | 東京エレクトロン株式会社 | 排気システム及びこれを用いた基板処理装置 |
| CN106197825B (zh) * | 2016-06-28 | 2018-10-12 | 蚌埠大洋传感系统工程有限公司 | 一种用于测量压强的传感器 |
| CN106197826B (zh) * | 2016-06-28 | 2018-10-12 | 蚌埠大洋传感系统工程有限公司 | 一种高精度传感器 |
| CN106197828B (zh) * | 2016-06-28 | 2019-01-01 | 蚌埠大洋传感系统工程有限公司 | 一种准确性高的传感器 |
| CN106197827B (zh) * | 2016-06-28 | 2019-01-01 | 蚌埠大洋传感系统工程有限公司 | 一种测量准确的传感器 |
| US10310028B2 (en) * | 2017-05-26 | 2019-06-04 | Allegro Microsystems, Llc | Coil actuated pressure sensor |
| JP7002821B2 (ja) * | 2018-08-28 | 2022-01-20 | 株式会社エー・アンド・デイ | 圧力センサ |
| JP7330060B2 (ja) * | 2019-10-18 | 2023-08-21 | 東京エレクトロン株式会社 | 成膜装置、制御装置及び圧力計の調整方法 |
| CN110987282A (zh) * | 2019-11-29 | 2020-04-10 | 中国科学院微电子研究所 | 一种防沉积匀气环 |
| KR102850639B1 (ko) * | 2022-12-19 | 2025-08-26 | (주) 케이브이씨 | 방폭 진공게이지 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011525620A (ja) | 2008-06-27 | 2011-09-22 | インフィコン ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光学干渉方式の圧力センサ |
| JP4874984B2 (ja) | 2005-09-27 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5811685A (en) * | 1996-12-11 | 1998-09-22 | Mks Instruments, Inc. | Fluid pressure sensor with contaminant exclusion system |
| JP3494594B2 (ja) * | 1999-08-05 | 2004-02-09 | 忠弘 大見 | 圧力検出器の取付け構造 |
| US7252011B2 (en) * | 2002-03-11 | 2007-08-07 | Mks Instruments, Inc. | Surface area deposition trap |
| US7253107B2 (en) * | 2004-06-17 | 2007-08-07 | Asm International N.V. | Pressure control system |
| US7204150B2 (en) * | 2005-01-14 | 2007-04-17 | Mks Instruments, Inc. | Turbo sump for use with capacitive pressure sensor |
| WO2007082395A1 (de) | 2006-01-18 | 2007-07-26 | Inficon Gmbh | Vakuummesszelle mit membran |
| WO2013055882A1 (en) * | 2011-10-11 | 2013-04-18 | Mks Instruments, Inc. | Pressure sensor |
-
2013
- 2013-01-16 JP JP2013005777A patent/JP5993312B2/ja active Active
-
2014
- 2014-01-03 KR KR1020140000821A patent/KR101810729B1/ko active Active
- 2014-01-08 US US14/150,457 patent/US9360390B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4874984B2 (ja) | 2005-09-27 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置 |
| JP2011525620A (ja) | 2008-06-27 | 2011-09-22 | インフィコン ゲゼルシャフト ミット ベシュレンクテル ハフツング | 光学干渉方式の圧力センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| US9360390B2 (en) | 2016-06-07 |
| US20140196545A1 (en) | 2014-07-17 |
| JP2014137275A (ja) | 2014-07-28 |
| JP5993312B2 (ja) | 2016-09-14 |
| KR20140092762A (ko) | 2014-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101810729B1 (ko) | 압력 측정기 및 압력 측정기를 구비하는 기판 처리 장치 | |
| CN108458828B (zh) | 静电电容型压力传感器 | |
| US11079774B2 (en) | Flow rate control device | |
| JP6002016B2 (ja) | 静電容量型圧力センサ | |
| JP5524055B2 (ja) | 測定セル構造を較正する方法、および作動させる方法 | |
| KR101529791B1 (ko) | 정전 용량형 압력 센서 | |
| CN110068421B (zh) | 静电电容型压力传感器的异常检测方法及装置 | |
| EP1214573B1 (en) | Baffle for a capacitive pressure sensor | |
| KR102017300B1 (ko) | 압력 센서 | |
| US10620072B2 (en) | Capacitive pressure sensor | |
| KR20070098122A (ko) | 반도체 제조설비 | |
| CN107131996A (zh) | 压力传感器状态检测方法及系统 | |
| JP2020503615A (ja) | 熱ベースの質量流量コントローラ(mfc)の流れ検出再現性を高めるための方法及び装置 | |
| JP2015184064A (ja) | 静電容量型圧力センサ | |
| CN108389770B (zh) | 臭氧气体加热机构、基板处理装置以及基板处理方法 | |
| JPWO2009096379A1 (ja) | 圧力計測用加熱装置及び圧力計測装置 | |
| JP2017072384A (ja) | 圧力センサ | |
| JPWO2019181397A1 (ja) | ダイアフラム弁及びそれを用いた質量流量制御装置 | |
| JP2023525634A (ja) | キャパシタンスマノメータ | |
| KR19990031422U (ko) | 저압 기상 증착장비의 반응관내 대기압 조성 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20140103 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20150803 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20140103 Comment text: Patent Application |
|
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170531 Patent event code: PE09021S01D |
|
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20171130 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20171213 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20171213 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| PR1001 | Payment of annual fee |
Payment date: 20201201 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20211201 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20221121 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20231120 Start annual number: 7 End annual number: 7 |