KR101805644B1 - 서브마운트 어셈블리 통합 - Google Patents

서브마운트 어셈블리 통합 Download PDF

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Publication number
KR101805644B1
KR101805644B1 KR1020157027565A KR20157027565A KR101805644B1 KR 101805644 B1 KR101805644 B1 KR 101805644B1 KR 1020157027565 A KR1020157027565 A KR 1020157027565A KR 20157027565 A KR20157027565 A KR 20157027565A KR 101805644 B1 KR101805644 B1 KR 101805644B1
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KR
South Korea
Prior art keywords
submount
laser
slider
waveguide
mechanical stop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020157027565A
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English (en)
Korean (ko)
Other versions
KR20150128819A (ko
Inventor
리주안 총
에드워드 찰스 게이지
Original Assignee
시게이트 테크놀로지 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 시게이트 테크놀로지 엘엘씨 filed Critical 시게이트 테크놀로지 엘엘씨
Publication of KR20150128819A publication Critical patent/KR20150128819A/ko
Application granted granted Critical
Publication of KR101805644B1 publication Critical patent/KR101805644B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H01S5/02252—
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10—Structure or manufacture of housings or shields for heads
    • G11B5/105—Mounting of head within housing or assembling of head and housing
    • H01S5/02272—
    • H01S5/02276—
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B2005/0002—Special dispositions or recording techniques
    • G11B2005/0005—Arrangements, methods or circuits
    • G11B2005/0021—Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Semiconductor Lasers (AREA)
  • Magnetic Heads (AREA)
  • Recording Or Reproducing By Magnetic Means (AREA)
KR1020157027565A 2013-03-06 2014-02-28 서브마운트 어셈블리 통합 Expired - Fee Related KR101805644B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/787,405 US9018737B2 (en) 2013-03-06 2013-03-06 Submount assembly integration
US13/787,405 2013-03-06
PCT/US2014/019320 WO2014137788A1 (en) 2013-03-06 2014-02-28 Submount assembly integration

Publications (2)

Publication Number Publication Date
KR20150128819A KR20150128819A (ko) 2015-11-18
KR101805644B1 true KR101805644B1 (ko) 2017-12-07

Family

ID=51486835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157027565A Expired - Fee Related KR101805644B1 (ko) 2013-03-06 2014-02-28 서브마운트 어셈블리 통합

Country Status (5)

Country Link
US (1) US9018737B2 (enrdf_load_stackoverflow)
JP (1) JP2016516295A (enrdf_load_stackoverflow)
KR (1) KR101805644B1 (enrdf_load_stackoverflow)
CN (1) CN105164872A (enrdf_load_stackoverflow)
WO (1) WO2014137788A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013967B1 (en) * 2014-07-02 2015-04-21 HGST Netherlands B.V. Heat-dissipating stepped slider for a heat-assisted magnetic recording head
WO2019026474A1 (ja) * 2017-08-04 2019-02-07 パナソニックＩｐマネジメント株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置
WO2025026529A1 (de) * 2023-07-28 2025-02-06 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur justierung von elektrooptischen elementen auf einem substrat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054205A (ja) * 2007-08-23 2009-03-12 Tdk Corp 熱アシスト磁気ヘッド、ヘッドジンバルアセンブリ及びハードディスク装置
JP2012234615A (ja) * 2011-04-29 2012-11-29 Seagate Technology Llc レーザダイオードをスライダ上で整列させるための方法および装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69632969T2 (de) 1995-03-20 2005-07-28 Unitive International Ltd. Verfahren zum Bilden von Loterhebungen und Loterhebungsstruktur
US7929248B2 (en) 2006-05-23 2011-04-19 Seagate Technology Llc Top bond pad for transducing head interconnect
US7986592B2 (en) 2008-03-10 2011-07-26 Hitachi Global Storage Technologies, Netherlands B.V. Components and assembly procedure for thermal assisted recording
JP4881989B2 (ja) 2009-10-15 2012-02-22 株式会社日立製作所 熱アシスト記録用磁気ヘッド及びそれを用いた磁気記録装置
US8274867B2 (en) * 2010-03-31 2012-09-25 Tdk Corporation Method for aligning the light source unit and the slider of thermally-assisted magnetic recording head
US9065236B2 (en) 2010-04-30 2015-06-23 Seagate Technology Method and apparatus for aligning a laser diode on a slider
US8406091B2 (en) * 2010-07-08 2013-03-26 Tdk Corporation Thermal assisted magnetic recording head having integral mounted of photo-detector and laser diode
US8240025B2 (en) * 2010-09-23 2012-08-14 Tdk Corporation Method for manufacturing head including light source unit for thermal assist
US8456961B1 (en) * 2011-03-22 2013-06-04 Western Digital (Fremont), Llc Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly
US8681594B1 (en) * 2012-09-28 2014-03-25 Western Digital (Fremont), Llc Method and system for improving laser alignment and optical transmission efficiency of an energy assisted magnetic recording head

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054205A (ja) * 2007-08-23 2009-03-12 Tdk Corp 熱アシスト磁気ヘッド、ヘッドジンバルアセンブリ及びハードディスク装置
JP2012234615A (ja) * 2011-04-29 2012-11-29 Seagate Technology Llc レーザダイオードをスライダ上で整列させるための方法および装置

Also Published As

Publication number Publication date
CN105164872A (zh) 2015-12-16
JP2016516295A (ja) 2016-06-02
US9018737B2 (en) 2015-04-28
US20140252560A1 (en) 2014-09-11
WO2014137788A1 (en) 2014-09-12
KR20150128819A (ko) 2015-11-18

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