JP2016516295A - サブマウント組立体の一体化 - Google Patents

サブマウント組立体の一体化 Download PDF

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Publication number
JP2016516295A
JP2016516295A JP2015561438A JP2015561438A JP2016516295A JP 2016516295 A JP2016516295 A JP 2016516295A JP 2015561438 A JP2015561438 A JP 2015561438A JP 2015561438 A JP2015561438 A JP 2015561438A JP 2016516295 A JP2016516295 A JP 2016516295A
Authority
JP
Japan
Prior art keywords
submount
laser
slider
waveguide
mechanical stop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015561438A
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English (en)
Japanese (ja)
Other versions
JP2016516295A5 (enrdf_load_stackoverflow
Inventor
チョン，リジュアン
ゲイジ，エドワード・チャールズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Technology LLC
Original Assignee
Seagate Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seagate Technology LLC filed Critical Seagate Technology LLC
Publication of JP2016516295A publication Critical patent/JP2016516295A/ja
Publication of JP2016516295A5 publication Critical patent/JP2016516295A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10—Structure or manufacture of housings or shields for heads
    • G11B5/105—Mounting of head within housing or assembling of head and housing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B2005/0002—Special dispositions or recording techniques
    • G11B2005/0005—Arrangements, methods or circuits
    • G11B2005/0021—Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Semiconductor Lasers (AREA)
  • Magnetic Heads (AREA)
  • Recording Or Reproducing By Magnetic Means (AREA)
JP2015561438A 2013-03-06 2014-02-28 サブマウント組立体の一体化 Pending JP2016516295A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/787,405 US9018737B2 (en) 2013-03-06 2013-03-06 Submount assembly integration
US13/787,405 2013-03-06
PCT/US2014/019320 WO2014137788A1 (en) 2013-03-06 2014-02-28 Submount assembly integration

Publications (2)

Publication Number Publication Date
JP2016516295A true JP2016516295A (ja) 2016-06-02
JP2016516295A5 JP2016516295A5 (enrdf_load_stackoverflow) 2017-03-30

Family

ID=51486835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015561438A Pending JP2016516295A (ja) 2013-03-06 2014-02-28 サブマウント組立体の一体化

Country Status (5)

Country Link
US (1) US9018737B2 (enrdf_load_stackoverflow)
JP (1) JP2016516295A (enrdf_load_stackoverflow)
KR (1) KR101805644B1 (enrdf_load_stackoverflow)
CN (1) CN105164872A (enrdf_load_stackoverflow)
WO (1) WO2014137788A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026474A1 (ja) * 2017-08-04 2019-02-07 パナソニックＩｐマネジメント株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9013967B1 (en) * 2014-07-02 2015-04-21 HGST Netherlands B.V. Heat-dissipating stepped slider for a heat-assisted magnetic recording head
WO2025026529A1 (de) * 2023-07-28 2025-02-06 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur justierung von elektrooptischen elementen auf einem substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054205A (ja) * 2007-08-23 2009-03-12 Tdk Corp 熱アシスト磁気ヘッド、ヘッドジンバルアセンブリ及びハードディスク装置
US20110242697A1 (en) * 2010-03-31 2011-10-06 Tdk Corporation Method for manufacturing thermally-assisted magnetic recording head with light source unit
JP2012018747A (ja) * 2010-07-08 2012-01-26 Tdk Corp 熱アシスト光のモニタリングが可能な磁気記録ヘッド
JP2012069235A (ja) * 2010-09-23 2012-04-05 Tdk Corp 熱アシスト用の光源ユニットを備えたヘッドの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69632969T2 (de) 1995-03-20 2005-07-28 Unitive International Ltd. Verfahren zum Bilden von Loterhebungen und Loterhebungsstruktur
US7929248B2 (en) 2006-05-23 2011-04-19 Seagate Technology Llc Top bond pad for transducing head interconnect
US7986592B2 (en) 2008-03-10 2011-07-26 Hitachi Global Storage Technologies, Netherlands B.V. Components and assembly procedure for thermal assisted recording
JP4881989B2 (ja) 2009-10-15 2012-02-22 株式会社日立製作所 熱アシスト記録用磁気ヘッド及びそれを用いた磁気記録装置
US9065236B2 (en) 2010-04-30 2015-06-23 Seagate Technology Method and apparatus for aligning a laser diode on a slider
US8456961B1 (en) * 2011-03-22 2013-06-04 Western Digital (Fremont), Llc Systems and methods for mounting and aligning a laser in an electrically assisted magnetic recording assembly
MY161466A (en) * 2011-04-29 2017-04-14 Seagate Technology Llc Method and apparatus for aligning a laser diode on a slider
US8681594B1 (en) * 2012-09-28 2014-03-25 Western Digital (Fremont), Llc Method and system for improving laser alignment and optical transmission efficiency of an energy assisted magnetic recording head

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054205A (ja) * 2007-08-23 2009-03-12 Tdk Corp 熱アシスト磁気ヘッド、ヘッドジンバルアセンブリ及びハードディスク装置
US20110242697A1 (en) * 2010-03-31 2011-10-06 Tdk Corporation Method for manufacturing thermally-assisted magnetic recording head with light source unit
JP2012018747A (ja) * 2010-07-08 2012-01-26 Tdk Corp 熱アシスト光のモニタリングが可能な磁気記録ヘッド
JP2012069235A (ja) * 2010-09-23 2012-04-05 Tdk Corp 熱アシスト用の光源ユニットを備えたヘッドの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026474A1 (ja) * 2017-08-04 2019-02-07 パナソニックＩｐマネジメント株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置
JPWO2019026474A1 (ja) * 2017-08-04 2020-08-20 パナソニックセミコンダクターソリューションズ株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置
JP7100641B2 (ja) 2017-08-04 2022-07-13 ヌヴォトンテクノロジージャパン株式会社 サブマウント、半導体レーザ装置及び熱アシストハードディスク装置

Also Published As

Publication number Publication date
CN105164872A (zh) 2015-12-16
US9018737B2 (en) 2015-04-28
US20140252560A1 (en) 2014-09-11
WO2014137788A1 (en) 2014-09-12
KR101805644B1 (ko) 2017-12-07
KR20150128819A (ko) 2015-11-18

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