KR101771281B1 - Liquid resin composition - Google Patents
Liquid resin composition Download PDFInfo
- Publication number
- KR101771281B1 KR101771281B1 KR1020137012973A KR20137012973A KR101771281B1 KR 101771281 B1 KR101771281 B1 KR 101771281B1 KR 1020137012973 A KR1020137012973 A KR 1020137012973A KR 20137012973 A KR20137012973 A KR 20137012973A KR 101771281 B1 KR101771281 B1 KR 101771281B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- liquid
- liquid resin
- mass
- component
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3462—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention aims to prevent the migration of the liquid resin composition after curing and to suppress the thickening during storage of the liquid resin composition. Therefore, it is an object of the present invention to provide a liquid resin composition which is excellent in storage characteristics and which is excellent in migration resistance after curing and which is highly reliable.
(C) is a liquid resin composition characterized by containing (A) a liquid epoxy resin, (B) a curing agent, and (C) a specific structure of xanthines, At least one selected from the group consisting of paraxanthin.
Description
The present invention relates to a liquid resin composition, and more particularly to a liquid resin composition suitable for sealing a flip chip type semiconductor element.
Flip chip bonding is used in a COF (Chip On Film) package, which is a mounting method of a semiconductor device capable of coping with higher densification and higher output such as wirings of semiconductor devices such as liquid crystal driver ICs. Generally, in flip chip bonding, a semiconductor element and a substrate are bonded to each other with a bump, and the gap between the semiconductor element and the substrate is sealed with a liquid semiconductor sealing agent called an under fill material.
2. Description of the Related Art In recent years, fine pitching of a wiring pattern on which a liquid crystal driver IC is mounted is progressing in response to demands for high density and high output of a liquid crystal driver IC. Migration between wirings is a concern due to the fine pitch and high voltage accompanying high output. Migration is a phenomenon in which a metal in a wiring pattern is eluted by an electrochemical reaction and a resistance value is lowered. Fig. 1 shows a schematic diagram for explaining the migration in the case where the electrode is Cu. In the migration, Cu is eluted by the reaction formula: Cu + 2 (OH - ) - > 2 (CuOH) in the
In order to prevent this migration, a resin composition containing at least one possible substance selected from benzotriazoles, triazines, and isocyanuric derivatives thereof has been reported as an ionic binder (Patent Document 1) .
However, when benzotriazoles or the like are dispersed in an epoxy resin, there arises a problem that a point due to the curing reaction occurs during storage, which makes it impossible to use the underfill material or the like.
The present invention aims to prevent the migration of the liquid resin composition after curing and to suppress the thickening during storage of the liquid resin composition. Therefore, it is an object of the present invention to provide a liquid resin composition which is excellent in storage characteristics and which is excellent in migration resistance after curing and which is highly reliable.
The present invention relates to a liquid resin composition which solves the above problems by having the following constitution.
[1] A resin composition comprising (A) a liquid epoxy resin,
(B) a curing agent, and
(C) a compound represented by the general formula (1):
(Wherein R 1 , R 2 and R 3 are each independently hydrogen or an alkyl group having 1 to 3 carbon atoms).
[2] The liquid resin composition according to the above [1], wherein the component (C) is at least one selected from the group consisting of caffeine, theophylline, theobromine and paraxanthin.
[3] The liquid resin composition according to [1], further comprising (D) a curing accelerator.
[4] The liquid resin composition according to [1], further comprising (E) a coupling agent.
[5] The liquid resin composition according to [1], further comprising (F) a filler.
[6] The liquid resin composition according to [1], further comprising (G) a rubber component.
[7] The cured product of the liquid resin composition according to [1], wherein the component (C) is 0.05 to 12 parts by mass relative to 100 parts by mass of the liquid resin composition.
[8] A liquid semiconductor encapsulant comprising the liquid resin composition according to the above [1].
[9] A semiconductor device having a flip chip type semiconductor element sealed using the liquid semiconductor encapsulant described in [8] above.
According to the present invention [1], it is possible to provide a liquid resin composition excellent in preservation characteristics and excellent in migration resistance after curing.
According to the present invention [8], a highly reliable semiconductor device excellent in migration resistance can be easily provided.
1 is a schematic view for explaining migration in the case where the electrode is Cu.
2 is a schematic view for explaining a method of evaluating the injectability of the resin composition.
Fig. 3 is a photograph of the resin composition of Example 1 after its migratory property evaluation. Fig.
4 is a photograph of the resin composition of Example 2 after its migratory property evaluation.
Fig. 5 is a photograph of the resin composition of Example 4 after its migratory property evaluation. Fig.
Fig. 6 is a photograph of the resin composition of Comparative Example 1 after its migratory property evaluation. Fig.
Fig. 7 is a photograph of the resin composition of Comparative Example 2 after its migratory property evaluation. Fig.
In the liquid resin composition of the present invention,
(A) a liquid epoxy resin,
(B) a curing agent, and
(C) a compound represented by the general formula (1):
(Wherein R 1 , R 2 and R 3 are each independently hydrogen or an alkyl group having 1 to 3 carbon atoms).
Examples of the component (A) include liquid bisphenol A type epoxy resins, liquid bisphenol F type epoxy resins, liquid naphthalene type epoxy resins, liquid aminophenol type epoxy resins, liquid hydrogenated bisphenol type epoxy resins, liquid phase alicyclic epoxy resins, A liquid phase cyclic aliphatic epoxy resin, a liquid fluorene epoxy resin, a liquid siloxane epoxy resin and the like, and examples thereof include a liquid bisphenol A type epoxy resin, a liquid bisphenol F type epoxy resin, a liquid aminophenol type epoxy resin Resin and liquid siloxane-based epoxy resin are preferable from the viewpoints of curability, heat resistance, adhesiveness and durability. The equivalent amount of epoxy is preferably 80 to 250 g / eq from the viewpoint of viscosity adjustment. Bisphenol F epoxy resin (product name: YDF870GS) manufactured by Shin Nittsu Chemical Co., Ltd., aminophenol type epoxy resin (grade: JER630, JER630LSD) manufactured by Mitsubishi Chemical Co., Ltd., DIC A naphthalene-type epoxy resin (trade name: HP4032D), and a siloxane-based epoxy resin (trade name: TSL9906) manufactured by Shin-Etsu Chemical Co., The component (A) may be used alone or in combination of two or more.
The component (B) may be an acid anhydride, an amine-based curing agent or a phenol-based curing agent, and an acid anhydride is preferable in view of good reactivity (curing rate) and appropriate viscosity. Examples of the acid anhydride include methyltetrahydrophthalic anhydride, methylbutentyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhydamic anhydride, succinic anhydride substituted with an alkenyl group, Hydrobromic anhydride, hydroxycarboxylic anhydride, hydroxycarboxylic anhydride, hydroxycarboxylic anhydride, hydroxycarboxylic anhydride, hydroxycarboxylic acid anhydride, and hydroxycarboxylic acid anhydride. Examples of the amine-based curing agent include chain aliphatic amines, cyclic aliphatic amines, fatty aromatic amines, and aromatic amines, and aromatic amines are preferable. Examples of commercially available products include acid anhydrides (grade: YH306, YH307) manufactured by Mitsubishi Chemical Corporation, and amine curing agents (Kayahado A-A). The component (B) may be used alone or in combination of two or more.
(C) is a compound represented by the general formula (1):
(Wherein R 1 , R 2, and R 3 are each independently hydrogen or an alkyl group having 1 to 3 carbon atoms), and it is possible to suppress the thickening during storage of the liquid resin composition, Improve my migration. As the component (C), it is preferable that R 1 , R 2 and R 3 are each independently hydrogen or an alkyl group having 1 carbon atom in the general formula (1)
Caffeine, Eating (3):
Of theophylline, equation (4):
Of theobromine and equation (5):
Of paraxanthin, and more preferably at least one species selected from the group consisting of paraxanthin.
From the viewpoint of good reactivity and reliability, the liquid resin composition preferably has an acid anhydride equivalent of the component (B) of preferably 0.6 to 1.2, more preferably 0.65 to 1.1 to be. If it is 0.6 or more, the reactivity, the moisture resistance of the liquid resin composition after curing and the migration resistance are good in the PCT test. On the other hand, if it is 1.2 or less, the viscosity increase is not excessively increased and the generation of voids is suppressed.
The amount of the component (C) is preferably 0.05 to 12 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.1 to 6 parts by mass, per 100 parts by mass of the liquid resin composition. When the amount is at least 0.1 part by mass, the corrosion resistance of the lead is good, and when it is at most 12 parts by mass, an increase in the increase rate of the liquid resin composition can be suppressed. As the component (C), for example, a reagent commercially available from Wako Pure Chemical Industries may be used.
The amount of the component (C) is preferably from 0.05 to 12 parts by mass, more preferably from 0.1 to 10 parts by mass, more preferably from 0.1 to 6 parts by mass, relative to 100 parts by mass of the cured product of the liquid resin composition More preferable. The content of the component (C) in the cured product is preferably in the range of 1: 1 to 2% by mass, and the content of the component (C) Is the same as the content in the water. Here, quantitative analysis of caffeine is carried out by mass spectrometry.
The liquid resin composition preferably contains a curing accelerator which is a component (D) because it can obtain an appropriate curing property. The curing accelerator is not particularly limited as long as it is a curing accelerator of an epoxy resin, and known ones can be used . Examples thereof include an amine-based curing accelerator and a phosphorus-based curing accelerator.
Examples of the amine curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, Imidazole compounds such as 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine, And tertiary amine compounds such as 8-diazabicyclo [5,4,0] undecene-7 (DBU), triethylenediamine, benzyldimethylamine and triethanolamine. Among them, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine and 2-phenyl-4-methylimidazole are preferable. Examples of the phosphorus hardening accelerator include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, and tri (nonylphenyl) phosphine. The curing accelerator may be used alone or in combination of two or more. When an acid anhydride-based curing agent is used as the component (B), it is preferable to use an amine-based curing accelerator in view of curability and storage stability.
The component (D) may be an adduct type adducted with an epoxy resin or the like, or a microcapsule type. However, in the production method of the present invention, the components are filtered using a filter having a mesh size of 1 m after the components of the COF sealing resin composition are compounded. Therefore, when an adduct type or microcapsule type curing accelerator is used , It is necessary to use a material having a particle diameter of less than 1 mu m.
The liquid resin composition preferably contains a coupling agent which is a component (E), from the viewpoint of adhesion, and the component (E) includes 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane , Vinyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3- (Triethoxysilylpropyl) tetrasulfide, 3-isocyanatepropyltriethoxysilane, and the like, and examples include 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, Methoxysilane is preferable from the viewpoint of adhesion. Commercially available products include KBM403, KBE903, and KBE9103 manufactured by Shin-Etsu Chemical Co., Ltd. The component (E) may be used alone or in combination of two or more.
The liquid resin composition preferably contains a filler which is a component (F). Examples of the component (F) include silica such as colloidal silica, hydrophobic silica, fine silica, and nanosilica, bentonite, acetylene black, and Ketjenblack. From the viewpoint of shape retention after application, Do. The component (F) is more preferably silica having an average particle diameter of 0.01 to 20 탆, more preferably silica having an average particle diameter of 0.02 to 1 탆, from the viewpoint of injectability of the liquid resin composition at the time of injection. (Product name: R805, average particle diameter: 20 nm), Nippon Catalyst's amphoteric silica (product name: Shihosta KE-P10, average particle size: 100 nm) manufactured by Nippon Aerosil Co., : SP03B, average particle diameter: 300 nm). Here, the average particle diameter of the nanosilica particles is measured by a dynamic light scattering type nano-track particle analyzer. The component (F) may be used alone or in combination of two or more.
The liquid resin composition preferably contains a rubber component as the component (G) from the viewpoint of stress relaxation of the liquid resin composition. Examples of the component (G) include acrylic rubber, urethane rubber, silicone rubber and butadiene rubber. have. As the component (G), a solid may be used. The form is not particularly limited and may be in the form of a particle, a powder, or a pellet. In the case of a particle, for example, an average particle size of 10 to 200 nm, preferably 30 to 100 nm, Preferably, it is 50 to 80 nm. The component (G) may be a liquid at room temperature, and examples thereof include polybutadiene, butadiene-acrylonitrile copolymer, polyisoprene, polypropylene oxide and polydiorganosiloxane having relatively low average molecular weight have. As the component (G), those having a group capable of reacting with an epoxy group at the terminal may be used, and they may be in solid or liquid form. Commercially available products include ATBN1300-16 and CTBN1008-SP manufactured by Ube Industries, Ltd. The component (G) may be used alone or in combination of two or more.
The amount of the component (D) is preferably more than 0.1 part by mass, more preferably less than 5 parts by mass, more preferably 0.2 to 4 parts by mass, further preferably 0.3 to 3.0 parts by mass, relative to 100 parts by mass of the component (A) do. When the amount is at least 0.1 part by mass, the reactivity is good, and when it is at most 5 parts by mass, the humidity resistance reliability is good and the viscosity increase ratio is further stabilized.
(E) is contained in an amount of preferably 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, per 100 parts by mass of the component (A). When it is 0.05 parts by mass or more, the adhesion is improved and the humidity resistance reliability in the PCT test becomes better, and when it is 15 parts by mass or less, foaming of the liquid resin composition is suppressed.
(F) is contained in an amount of preferably 0.1 to 90 parts by mass, more preferably 0.5 to 40 parts by mass, and still more preferably 1 to 30 parts by mass, per 100 parts by mass of the liquid resin composition. When the amount is 1 to 30 parts by mass, deterioration of injectability can be avoided while suppressing an increase in coefficient of linear expansion.
(G) is contained in an amount of preferably 0.1 to 30 parts by mass, more preferably 0.5 to 25 parts by mass, and still more preferably 1 to 20 parts by mass, per 100 parts by mass of the component (A). When the amount is at least 0.1 part by mass, the stress of the liquid resin composition is relaxed, and when it is at most 30 parts by mass, the moisture resistance reliability is not deteriorated.
A pigment, a dye, a defoaming agent, an antioxidant, a stress relieving agent, and other additives such as carbon black, etc. may be added to the liquid resin composition of the present invention within a range not impairing the object of the present invention and if necessary.
The liquid resin composition of the present invention can be obtained, for example, by stirring, melting, mixing and dispersing the components (A) to (C) and other additives simultaneously or separately, . There are no particular restrictions on the mixing, stirring and dispersing apparatuses, but a grinding machine equipped with a stirring and heating apparatus, a three-roll mill, a ball mill, a planetary mixer and a bead mill can be used . These devices may be used in appropriate combination.
The liquid resin composition of the present invention is preferable from the viewpoint of injectability if the viscosity at 25 ° C is 50 to 2000 mPa · s. Here, the viscosity is measured with an E-type viscometer (model number: TVE-22H) manufactured by DOKI INDUSTRIAL CO., LTD.
The liquid resin composition of the present invention is formed and applied at a desired position of the substrate by a dispenser, printing, or the like. Here, the liquid resin composition is formed such that at least a part of the liquid resin composition is in contact with the substrate such as the flexible wiring substrate and the semiconductor element on the wirings of the substrate.
The curing of the liquid resin composition of the present invention is preferably carried out at 80 to 300 캜 for 30 to 300 seconds, and particularly preferably within 200 seconds from the viewpoint of productivity improvement when used as an epoxy sealant.
The semiconductor element and the substrate can be any desired ones, but a combination of a semiconductor element of flip chip bonding and a substrate for a COF package is preferable.
As described above, the liquid resin composition of the present invention is very suitable for a liquid-state semiconductor encapsulant, and a semiconductor device having a flip-chip type semiconductor element sealed by using the liquid-state encapsulant has resistance to migration and resistance to corrosion And has high reliability.
Example
The present invention will be described by way of examples, but the present invention is not limited thereto. In the following examples, "parts" and "%" denote parts by mass and% by mass, respectively, unless otherwise specified.
[Examples 1 to 18, Comparative Examples 1 and 2]
A liquid resin composition (hereinafter referred to as " resin composition ") was prepared from the blend shown in Tables 1 and 2. All of the resin compositions thus prepared were liquid.
[Evaluation of viscosity]
The viscosity (initial viscosity, unit: mPa · s) of the resin composition immediately after the preparation was measured with an E-type viscometer (model number: TVE-22H) Tables 1 and 2 show the measurement results of the initial viscosity. The viscosity of the resin composition after 24 hours or 48 hours at 25 ° C and relative humidity of 50% was measured, and the (viscosity after 24 or 48 hours) / (initial viscosity) . Results are shown in Table 1 and Table 2.
[Evaluation of Absorption Rate]
The initial weight of the resin composition cured at 150 ° C. for 60 minutes was taken as W 0 (g), and the sample was placed in a PCT test bath (121 ° C. ± 2 ° C. / humidity 100% / 2 atm for 20 hours, the weight of the obtained test piece was cooled to the following formula and by W 1 (g), water absorption (unit:%) was determined.
Absorption rate = (W 1 -W 0 ) / W 0 × 100 (%)
Table 1 and Table 2 show the evaluation results of the water absorption.
[Evaluation of Flexural Modulus]
The resin composition thus prepared was sandwiched between a glass plate coated with a releasing agent and a glass plate and cured in a sheet shape of 350 mu m at 150 DEG C for 60 minutes and then subjected to curing using a universal tester (AG-I manufactured by Shimadzu Corporation) The flexural modulus at room temperature was determined. Also, n = 3 was measured, and an average value was used. The film thickness and width of the test piece were measured at five points, and an average value was used for the calculation. The flexural modulus of elasticity is preferably 2.0 to 4.0 GPa. Table 1 and Table 2 show the evaluation results of the flexural modulus.
[Evaluation of amount of extracted Cl ion]
The prepared resin composition was cured at 150 DEG C for 60 minutes, and the resulting sample was pulverized to a size of about 5 mm square. 25 cm 3 of ion-exchanged water was added to 2.5 g of the cured coating film and allowed to stand for 20 hours in a PCT test tank (121 캜 2 캜 / humidity 100% / 2 atm bath), cooled to room temperature and used as the test solution. The Cl ion concentration of the extract obtained in the above procedure was measured using an ion chromatograph. Table 1 and Table 2 show the evaluation results of the extracted Cl ion amount.
[Evaluation of injection property]
Fig. 2 is a schematic view for explaining a method of evaluating the injectability of the resin composition. First, as shown in Fig. 2A, a
[Evaluation of my migration ability]
In order to evaluate the ion migration resistance of the resin composition, a high temperature and high humidity bias test (THB test) was performed. The test method is as follows. The resin composition thus prepared was applied to a polyimide tape substrate having a tin-plated copper wire (pattern width of 10 mu m, line width of 15 mu m, pattern pitch of 25 mu m) to a thickness of 20 mu m, Lt; 0 > C for 30 minutes, and the sealant was cured to prepare a test piece. Using an ion migration evaluation system (S Peck, Ltd.) on a test piece, 110 ℃ / humidity under the conditions of 85%, and measuring the resistance change of when applying the voltage of DC 60V, and the resistance value is 1.00 × 10 7 Ω , The migration of the copper wiring was evaluated (unit: hour). With respect to the fact that the resistance value did not fall below the threshold value, the test was terminated at a point exceeding 500 hours. Table 1 and Table 2 show the evaluation results of migration resistance. Figures 3 to 7 show photographs after evaluation of migration resistance. Scale is not attached to the photograph, but it is a copper wiring with a pattern width of 10 mu m and a line width of 15 mu m as described above. Fig. 3 is a photograph of Example 1, Fig. 4 is Example 2, Fig. 5 is Example 4, Fig. 6 is Comparative Example 1, and Fig.
[Evaluation of corrosion resistance of lead]
The test piece having the above evaluation of migration resistance was observed with an objective lens of 50 times using an optical microscope Olympus (model number: STM6). &Quot; & cir & " and " x ", respectively.
As can be seen from Tables 1 and 2, in all of Examples 1 to 22, the viscosity increase rate was low, the injection property was good, the water absorption rate was low, the migration resistance and the inner lead corrosion resistance were excellent, This was the desired value. In particular, in Example 21 including the components (A) to (E) and (G), the flexural modulus was the lowest. In Example 10 in which the component (C) was added in an amount of 10 parts by mass based on 100 parts by mass of the liquid resin composition, the viscosity increasing rate was high in the examples. On the contrary, in Comparative Examples 1 and 2 including benzotriazole instead of the component (C), the rate of increase in viscosity was high and the lead corrosion resistance was also poor. Comparing FIGS. 3 to 5 of Examples 1, 2 and 4 with FIGS. 6 and 7 of Comparative Examples 1 and 2, the corrosion of the lead proceeds in FIGS. 6 and 7, and the substrate is entirely discolored.
[Industrial Availability]
The liquid resin composition of the present invention can suppress the thickening of the liquid resin composition during storage and prevent the migration of the liquid resin composition after curing, and is particularly suitable for a flip chip type semiconductor element.
Claims (9)
(B) a curing agent, and
(C) a compound represented by the general formula (1):
(Wherein R 1 , R 2 and R 3 are each independently hydrogen or an alkyl group having 1 to 3 carbon atoms)
Wherein the amount of the component (C) is 0.05 to 12 parts by mass based on 100 parts by mass of the liquid resin composition.
Wherein the component (C) is at least one member selected from the group consisting of caffeine, theophylline, theobromine and paraxanthin.
(D) a curing accelerator.
(E) a coupling agent.
(F) filler is further contained in the liquid resin composition.
(G) a rubber component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011056461A JP4906152B1 (en) | 2011-03-15 | 2011-03-15 | Liquid resin composition |
| JPJP-P-2011-056461 | 2011-03-15 | ||
| PCT/JP2011/065946 WO2012124180A1 (en) | 2011-03-15 | 2011-07-13 | Liquid resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130141538A KR20130141538A (en) | 2013-12-26 |
| KR101771281B1 true KR101771281B1 (en) | 2017-08-24 |
Family
ID=46060765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137012973A KR101771281B1 (en) | 2011-03-15 | 2011-07-13 | Liquid resin composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4906152B1 (en) |
| KR (1) | KR101771281B1 (en) |
| CN (1) | CN103221481B (en) |
| TW (1) | TWI512033B (en) |
| WO (1) | WO2012124180A1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006028258A (en) * | 2004-07-13 | 2006-02-02 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor apparatus using the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8232355B2 (en) * | 2005-11-25 | 2012-07-31 | Hitachi Chemical Co., Ltd. | Liquid resin composition for electronic components and electronic component device |
| JP2008007578A (en) * | 2006-06-27 | 2008-01-17 | Matsushita Electric Works Ltd | Liquid state epoxy resin for chip-on film and semiconductor device |
| JP5086678B2 (en) * | 2007-03-30 | 2012-11-28 | ナミックス株式会社 | Liquid semiconductor encapsulant and semiconductor device encapsulated using the same |
| JP5022755B2 (en) * | 2007-04-03 | 2012-09-12 | ナミックス株式会社 | Epoxy resin composition for semiconductor encapsulation, semiconductor device and manufacturing method thereof |
| KR101151063B1 (en) * | 2009-03-31 | 2012-06-01 | 히다치 가세고교 가부시끼가이샤 | Liquid resin composition for electronic component and electronic component device |
| JP5556133B2 (en) * | 2009-03-31 | 2014-07-23 | 日立化成株式会社 | Liquid resin composition for electronic components and electronic component device |
-
2011
- 2011-03-15 JP JP2011056461A patent/JP4906152B1/en active Active
- 2011-07-13 KR KR1020137012973A patent/KR101771281B1/en active IP Right Grant
- 2011-07-13 CN CN201180056441.8A patent/CN103221481B/en active Active
- 2011-07-13 WO PCT/JP2011/065946 patent/WO2012124180A1/en active Application Filing
- 2011-08-25 TW TW100130456A patent/TWI512033B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006028258A (en) * | 2004-07-13 | 2006-02-02 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103221481A (en) | 2013-07-24 |
| JP2012193234A (en) | 2012-10-11 |
| TW201237093A (en) | 2012-09-16 |
| CN103221481B (en) | 2015-11-25 |
| WO2012124180A1 (en) | 2012-09-20 |
| KR20130141538A (en) | 2013-12-26 |
| JP4906152B1 (en) | 2012-03-28 |
| TWI512033B (en) | 2015-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101506769B1 (en) | Liquid resin compositions for electronic components and processes for preparing the same, and electronic component devices | |
| JP6789495B2 (en) | Resin composition for underfill, electronic component device and manufacturing method of electronic component device | |
| JP6656792B2 (en) | Liquid resin composition for electronic component and electronic component device | |
| JP6894077B1 (en) | Multi-layer sheet for mold underfill sealing, mold underfill sealing method, electronic component mounting board and manufacturing method of electronic component mounting board | |
| TWI415230B (en) | Epoxy resin composition for semiconductor sealing and semiconductor device | |
| TWI512035B (en) | Liquid epoxy resin composition | |
| JP2005105243A (en) | Side filling material for flip chip mounting, and semiconductor device | |
| JP5086678B2 (en) | Liquid semiconductor encapsulant and semiconductor device encapsulated using the same | |
| KR101771281B1 (en) | Liquid resin composition | |
| WO2018198992A1 (en) | Liquid sealing resin composition, electronic component device, and method for manufacturing electronic component device | |
| JP7454906B2 (en) | Underfill material, electronic component device, and method for manufacturing electronic component device | |
| KR101927567B1 (en) | Resin composition | |
| JP5886051B2 (en) | Resin composition | |
| JP2018135447A (en) | Resin composition and structure | |
| JP2013118276A (en) | Semiconductor device | |
| JP2011207998A (en) | First-supply type liquid semiconductor sealing resin composition | |
| JP2012056979A (en) | Epoxy resin composition | |
| WO2016059980A1 (en) | Liquid epoxy resin composition | |
| JP7095724B2 (en) | Manufacturing method of resin composition for underfill, electronic component equipment and electronic component equipment | |
| JP6071612B2 (en) | Liquid resin composition, flip chip mounting body and method for producing the same | |
| JP7455017B2 (en) | Underfill material, electronic component device, and method for manufacturing electronic component device | |
| JP5723665B2 (en) | Pre-feed type liquid semiconductor encapsulating resin composition | |
| JP6766788B2 (en) | Epoxy resin composition | |
| JP2010083956A (en) | Sealing resin composition and apparatus for encapsulating semiconductor | |
| JP2011202073A (en) | First-supply type liquid semiconductor-sealing resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |