KR101765907B1

KR101765907B1 - Optical device package and manufacturing method of the same

Info

Publication number: KR101765907B1
Application number: KR1020100085815A
Authority: KR
Inventors: 강태혁
Original assignee: 엘지이노텍 주식회사
Priority date: 2010-09-02
Filing date: 2010-09-02
Publication date: 2017-08-07
Also published as: KR20120022324A

Abstract

The present invention provides a semiconductor device comprising a metal substrate on which at least one cavity is formed, an insulating layer formed on a top surface of the metal substrate including the cavity, an optical element accommodated in the cavity, a circuit pattern layer formed on a top surface of the metal substrate on which the cavity is not formed, And a connecting portion for electrical connection between the optical element and the circuit pattern layer, and a method of manufacturing the same. Thus, by mounting an optical element on a metal substrate on which a cavity is formed, the thickness of the package can be reduced and the heat radiation effect can be increased.

Description

[0001] OPTICAL DEVICE PACKAGE AND MANUFACTURING METHOD OF THE SAME [0002]

The present invention relates to an optical device package and a method of manufacturing the same. More particularly, the present invention relates to an optical device package and a method of manufacturing the same. More specifically, And a method of manufacturing the same.

Light emitting diodes (LEDs) are used to produce a small number of injected carriers (electrons or holes) by using a pn junction structure of semiconductors, and by recombining the electrical energy into light energy, Diode. That is, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction between the anode and the cathode and recombine with each other. Since the electrons and holes are separated from each other, energy is smaller than that of electrons and holes. Release.

Such LEDs are being applied not only to a general display device but also to a backlight device of a lighting device or an LCD display device. In particular, LEDs can be driven at a relatively low voltage, have a low heat generation due to high energy efficiency, have a long life and have developed a technology capable of providing white light, which was difficult to implement in the past, at a high luminance, It is expected that it will replace the light source device.

1 is a cross-sectional view of an LED package mounted on a conventional printed circuit board. 1, a conventional LED package includes an insulating layer 20 and a copper foil layer 30 sequentially formed on a metal substrate 10. A lead frame is formed on the copper foil layer 30, The LED chip 60 is mounted on the substrate 40 and the LED body 60 and the wire 70 is bonded to the LED chip 60 for electrical connection between the LED chip 60 and the lead frame 40, And a molding part 80 for burying the wire 70 for protecting it.

In the case of such an LED package, when the chip 60 is mounted on the LED body 50 and the lead frame substrate 40 when the LED chip 60 is mounted, the overall package thickness is increased, .

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, in which a cavity is formed in a metal substrate to mount an optical element, And to provide an optical device package that increases the heat dissipation effect through reduction in thickness, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a metal substrate on which at least one cavity is formed; An insulating layer formed on an upper surface of the metal substrate including the cavity; An optical element accommodated in the cavity; A circuit pattern layer formed on a top surface of the metal substrate on which the cavity is not formed; And a connection part for electrical connection between the optical element and the circuit pattern layer, thereby reducing the thickness of the package and increasing the heat radiation effect.

Particularly, it is preferable that the optical device package further includes a plating layer for bonding formed on the circuit pattern layer.

The insulating layer may be formed on the side surfaces and the lower surface of the metal substrate.

In addition, the insulating layer is preferably an anodized insulating layer.

In addition, the metal substrate may be made of any one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb).

The optical device package may further include a molding part for burying the optical element and the connection part.

A method of manufacturing an optical device package according to the present invention includes the steps of: (a) forming at least one cavity in a metal substrate by punching or lithography; (b) forming an insulating layer on the upper surface of the metal substrate; (c) forming a circuit pattern layer on the upper surface of the metal substrate on which the cavity is not formed; (d) mounting an optical element in the cavity, and electrically connecting the optical element and the circuit pattern layer through a connection portion, thereby reducing the thickness of the package and increasing the heat dissipation characteristics.

In particular, the step (b) may further include forming an insulating layer on the side surfaces and the lower surface of the metal substrate.

Also, the step (b) is preferably a step of forming an anodized insulating layer.

The method may further include, after the step (c), forming a plating layer for bonding on the circuit pattern layer.

Further, after the step (d), (e) forming the molding part for embedding the optical element and the connection part may further include protecting the optical element and the connection part.

According to the present invention, it is possible to replace a conventional optical element body and a lead frame by forming a cavity by punching the optical element heat dissipating disk and mounting an optical element, thereby reducing the thickness of the package as a whole, By forming the insulating layer, the heat radiation characteristic can be maximized.

1 is a cross-sectional view of a conventional LED package.
2 is a cross-sectional view of an optical device package according to an embodiment of the present invention.
3 is a cross-sectional view of an optical device package manufacturing process according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention should not be construed as being limited by the above-described embodiments. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

2 is a cross-sectional view of an optical device package according to an embodiment of the present invention. 2, an optical device package according to the present invention includes a metal substrate 110 on which at least one cavity 120 is formed by punching or lithography, and an upper surface of the metal substrate 110 including the cavity 120 An optical element 160 mounted on the insulating layer 130 in the cavity 120, a circuit pattern layer 140 formed on the metal substrate 110 on which the cavity 120 is not formed, And a connection part 170 for electrically connecting the optical device 160 and the circuit pattern layer 140.

At this time, it is preferable to form a plating layer 150 for bonding on the circuit pattern layer 140. The connection part 170 may be formed by wire bonding or flip chip bonding.

The metal substrate 110 is preferably made of any one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb) 130 may be formed on the upper and lower surfaces of the metal substrate 110 including the cavity 120 as an anodized insulating layer 130 as shown in the drawing. The anodizing is a method of treating the surface of the metal by anodic treatment in the anode and the cathode. Especially, various kinds of products made of aluminum metal are weak in physical and chemical properties of aluminum metal. Therefore, when they are used as they are, they are easily deformed and corroded and their appearance and function are damaged or lost. The strength, abrasion resistance, corrosion resistance, and electrical insulation of tens to hundreds of magnets are improved by the application method. In addition, the heat dissipation efficiency can be improved by using the metal layer 110 as the anodized insulating layer 130 itself.

In addition, the present invention may further include a molding part for burying the optical element 160 and the connection part 170 to protect the optical element 160 and the connection part 170. The molding part may have a planar shape, It is also acceptable to have a certain curvature.

The thickness of the package itself can be reduced by replacing the optical element body and the lead frame by mounting the optical element 60 in the cavity 120 by forming the cavity 120 in the metal substrate 110, The heat radiation effect can be increased. The heat dissipation characteristics are increased not only by the reduction in thickness but also through the permanent anodized insulating layer 130.

3 is a cross-sectional view of an optical device package manufacturing process according to an embodiment of the present invention. Referring to FIG. 3, a metal substrate 110 is prepared (S1). In the metal substrate 110, the metal substrate 110 is formed of a metal such as aluminum (Al), magnesium (Mg), titanium (Ti) The metal substrate 110 may be formed of one of at least one of Ta, hafnium (Hf), and niobium (Nb), and at least one cavity 120 may be formed on the metal substrate 110 by punching or lithography The insulating layer 130 is formed on the upper surface of the metal substrate 110 including the cavity 120 (S3). The insulating layer 130 may be an anodized insulating layer 130 and may be formed on the upper and lower surfaces of the metal substrate 110.

Next, a circuit pattern 140 is formed on the upper surface of the metal substrate 110 on which the cavity 120 is not formed after the plating process (S4), and the circuit pattern layer 140 is formed on the upper surface of the metal substrate 110 A plating layer 150 for bonding is formed (S5). The optical element 160 is mounted on the insulating layer 130 formed in the cavity 120 and electrically connected between the optical element 160 and the bonding plating layer 150 through a connection portion. The optical element 160 and the wire 170 are electrically connected to each other through the bonding wire 170 in step S6 so as to form the molding part 180 for embedding the optical element 160 and the wire 170 in step S7, The molding part 180 may have a planar shape or a shape having a certain curvature.

The cavity 120 is formed on the metal substrate 110 by punching or lithography and the optical device 160 is mounted on the cavity 120. The overall thickness of the package is reduced and the thickness of the anodized insulating layer The heat dissipation characteristic can be increased through the heat dissipation member 130.

In the drawings and specification, there have been disclosed preferred embodiments. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10, 110: metal substrate 120: cavity
20, 130: insulating layer 140: circuit pattern layer
150: Plating layer for bonding 160: Optical element
170: connection part 180: molding part

Claims

A metal substrate on which a cavity is formed;
An insulating layer formed on an upper surface of the metal substrate including the cavity;
An optical element accommodated in the cavity;
A circuit pattern layer formed on a top surface of the metal substrate on which the cavity is not formed;
A plating layer for bonding formed on the circuit pattern layer;
A connection part for electrical connection between the optical element and the circuit pattern layer; And
And a molding part for embedding the optical element and the connection part,
Wherein the cavity includes a first cavity and a second cavity spaced apart from the first cavity,
Wherein the optical element includes a first optical element accommodated in the first cavity and a second optical element accommodated in the second cavity,
Wherein the circuit pattern layer is disposed between the first optical element and the second optical element,
Wherein the molding part is integrally formed to simultaneously surround the first optical element and the second optical element,
Wherein the first optical element and the second optical element are divided by the circuit pattern layer,
Wherein the molding portion is in direct contact with the upper surface of the bonding plating layer, the side surface of the bonding plating layer, the side surface of the circuit pattern layer, and the upper surface of the insulating layer.

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The method according to claim 1,
Wherein the insulating layer
And on the side surfaces and the lower surface of the metal substrate.

The method according to claim 1 or 3,
Wherein the insulating layer is an anodized insulating layer.

The method according to claim 1,
Wherein the metal substrate is made of any one of aluminum (Al), magnesium (Mg), titanium (Ti), tantalum (Ta), hafnium (Hf), and niobium (Nb).

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(a) forming a cavity in a metal substrate by punching or lithography;
(b) forming an insulating layer on the upper surface of the metal substrate;
(c) forming a circuit pattern layer on the upper surface of the metal substrate on which the cavity is not formed;
(d) forming a bonding plating layer for bonding on the circuit pattern layer;
(e) mounting an optical element in the cavity, and electrically connecting the optical element and the bonding plating layer through a connection portion; And
(f) forming a molding portion for embedding the optical element and the connection portion,
Wherein the cavity includes a first cavity and a second cavity spaced apart from the first cavity,
Wherein the optical element includes a first optical element accommodated in the first cavity and a second optical element accommodated in the second cavity,
Wherein the circuit pattern layer is disposed between the first optical element and the second optical element,
In the forming of the molding part, the molding part is integrally formed to simultaneously surround the first optical element and the second optical element,
Wherein the first optical element and the second optical element are divided by the circuit pattern layer,
Wherein the molding portion is in direct contact with the upper surface of the bonding plating layer, the side surface of the bonding plating layer, the side surface of the circuit pattern layer, and the upper surface of the insulating layer.

The method of claim 7,
The step (b)
Further comprising forming an insulating layer on the side surfaces and the lower surface of the metal substrate.

The method according to claim 7 or 8,
The step (b)
And forming an anodized insulating layer on the first insulating layer.

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