KR101308090B1

KR101308090B1 - method for manufacturing substrate for light emitting device and the substrate thereby

Info

Publication number: KR101308090B1
Application number: KR1020110132795A
Authority: KR
Inventors: 안범모; 박승호
Original assignee: (주)포인트엔지니어링
Priority date: 2011-12-12
Filing date: 2011-12-12
Publication date: 2013-09-12
Also published as: KR20130066106A

Abstract

The present invention not only simplifies the process by fabricating a substrate for an optical device having a vertical insulation layer by joining side surfaces of a plurality of concave blocks in which heat sinks are integrally formed on the bottom side with the insulation maintained. The present invention relates to a substrate manufacturing method for an optical device having improved heat transfer performance, and a substrate for an optical device manufactured thereby.
According to an aspect of the present invention, there is provided a method of manufacturing a substrate for an optical device, in which a plurality of concave blocks having grooves are formed, (a) and the side surfaces of the plurality of concave blocks prepared in step (a) to maintain electrical insulation. (B) bonding to form a substrate having a vertical insulating layer.
In the above-described configuration, the step (b) is characterized in that by pressing while pressing the iron jig to be joined to the groove in each groove of the concave block.
On the other hand, it may include the step (c) of forming a cavity containing the vertical insulating layer on the upper surface of the substrate manufactured in the step (b) to a predetermined depth from the upper surface.
The electrical insulation is achieved by anodizing the concave block.
The electrical insulation is characterized in that it is achieved through an insulating film between the concave block.

Description

TECHNICAL FIELD A method for manufacturing a substrate for an optical device and a substrate for an optical device manufactured thereby

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method for an optical device and an optical device substrate manufactured thereby, and in particular, side surfaces of the plurality of yaw-shaped blocks having heat sinks formed integrally thereunder with insulation maintained side by side. The present invention relates to a substrate manufacturing method for an optical device and a substrate for an optical device manufactured thereby, which not only simplifies the process but also improves heat transfer performance by manufacturing a substrate for an optical device having a vertical insulating layer by bonding.

In general, a light emitting diode (LED), which is a semiconductor light emitting diode, is attracting attention in various fields as an environmentally friendly light source that does not cause pollution. In recent years, as the use range of LEDs has expanded to various fields such as indoor and outdoor lighting, automotive headlights, and back-light units (BLU) of display devices, high efficiency and excellent heat emission characteristics of LEDs have become necessary. In order to obtain a high-efficiency LED, the material or structure of the LED must first be improved, but in addition, the structure of the LED package and the material used therein need to be improved.

Such high-efficiency LEDs generate high temperatures, and if they are not effectively emitted, the temperature of the LEDs becomes high, which deteriorates the characteristics thereof, thereby decreasing the service life. Therefore, efforts are being made to effectively dissipate the heat generated from the LED in a highly efficient LED package.

Hereinafter, various elements including LEDs are collectively referred to as "optical elements", and various products including one or more of them are referred to as "optical devices".

1A to 1D are perspective views of respective processes for explaining a conventional optical device manufacturing method. First, as shown in FIG. 1A, in order to form a substrate 10 on which a conventional optical element is mounted, for example, a conductive plate 11 such as copper having a predetermined thickness and an insulating plate 12 such as glass epoxy, for example. ) Are alternately bonded in the plane direction to form a block body 13 (see FIG. 1B). Here, the joining of the conductive plate 11 and the insulating plate 12 may be by an adhesive or by thermocompression bonding.

Subsequently, as shown in FIG. 1B, the block body 13 manufactured by FIG. 1A is cut in the direction orthogonal to the surface of the conductive plate 11, i.e., up and down by an appropriate width, as shown in FIG. 1C. The board | substrate 10 by which the electrically-conductive part 10a and the insulating part 10b of the shape were alternately arrange | positioned is obtained.

Next, as shown in FIG. 1D, the LED chips 2 are arranged in a matrix form at appropriate intervals on each of the conductive portions 10a-①, 10a-②, and 10a-③ of the element substrate 10. The wires 3 are drawn from the LED chips 2 in each row of the conductive portions 10a-①, 10a-②, and 10a-③, connected to the conductive portions of the next row, and the transparent LED molding resin is again made to the LED array thus obtained. Molding produces LED arrays in the form of platelets.

Meanwhile, in the plate-shaped LED array manufactured as described above, each column is electrically connected in parallel, and each row is connected in series, and commercialized as it is, or separated into appropriate column units or row units, or separated into units. do. In addition, when using a plate-shaped LED array, it is mounted on a metal PCB or a separate heat sink is attached to the bottom.

However, according to the conventional substrate for optical devices as described above, a step of precisely cutting the block body 13 as shown in FIG. 1A up and down in the direction orthogonal to the surface of the conductive plate 11 is required. Expensive sawing machines are not only necessary, but also take a long time, and the entire substrate manufacturing process is complicated.

In addition, in order to improve heat dissipation characteristics, a heat sink composed of a body different from the substrate should be attached to the lower portion of the substrate by using an adhesive or the like. In this case, the heat transfer performance from the substrate to the heat sink from the substrate is not only degraded. There is a problem that the overall process is complicated by the addition of the heat sink bonding process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an optical device having a vertical insulation layer by side-by-side bonding side surfaces of a plurality of yaw-shaped blocks in which heat sinks are integrally formed while maintaining insulation. It is an object of the present invention to provide a substrate manufacturing method for an optical device and a substrate for an optical device manufactured thereby, which not only simplifies the process but also improves heat transfer performance by manufacturing the substrate for the substrate.

According to an aspect of the present invention, there is provided a method of manufacturing a substrate for an optical device, in which a plurality of concave blocks having grooves are formed, (a) and the side surfaces of the plurality of concave blocks prepared in step (a) to maintain electrical insulation. (B) bonding to form a substrate having a vertical insulating layer.

In the above-described configuration, the step (b) is characterized in that by pressing while pressing the iron jig to be joined to the groove in each groove of the concave block.

After the step (b) is characterized in that it further comprises the step (c) of applying a white paint on the surface of the substrate.

On the other hand, it may include the step (d) of forming a cavity containing the vertical insulating layer on the upper surface of the substrate manufactured in step (c) to a predetermined depth from the upper surface.

The electrical insulation is achieved by anodizing the concave block.

The electrical insulation is characterized in that it is achieved through an insulating film between the concave block.

According to another feature of the invention, there is provided a substrate for an optical device manufactured by the manufacturing method according to the first aspect of the invention described above.

According to the method for manufacturing a substrate for an optical device of the present invention and the substrate for an optical device manufactured thereby, the manufacturing cost and time required for manufacturing are shortened because an elaborate cutting process is not required, and in addition, the heat sink is integrally formed with the substrate. Therefore, heat dissipation characteristics are improved.

In addition, the bonding area between the concave blocks increases, so that the durability of the substrate is remarkably improved as compared with the related art.

1A to 1D are perspective views of respective processes for explaining a conventional optical device manufacturing method.
2 is a flowchart for explaining a method for manufacturing a substrate for an optical device of the present invention.
Figure 3 is a perspective view showing a plurality of concave blocks used in the present invention.
Figure 4 is a perspective view showing a plurality of iron jig used in the present invention.
5 and 6 are respectively a perspective view and a sectional view for explaining a bonding step in the substrate manufacturing method for an optical device of the present invention.
7A to 7E are cross-sectional views for explaining the process after the bonding step in the method for manufacturing a substrate for an optical device of the present invention, respectively.
8 is a plan view of an optical device manufactured by a method according to an embodiment of the present invention.
9A and 9B are side and plan views, respectively, of an optical device manufactured by a method according to another embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to an accompanying drawing, the manufacturing method of the board | substrate for optical devices of this invention, and the preferable Example of the board | substrate for optical devices manufactured by this are demonstrated in detail.

2 is a flowchart for explaining a method for manufacturing a substrate for an optical device of the present invention. As shown in Fig. 2, according to the method for manufacturing a substrate for an optical device of the present invention, first, in step S10, a plurality of yaw type blocks, i.e., a yaw block in which a substrate component and a heat sink are integrally formed, are prepared. do.

3 is a perspective view illustrating a plurality of concave blocks in FIG. 2. As shown in FIG. 3, the concave block 100 may be formed by extrusion molding aluminum or copper having good thermal conductivity and electrical conductivity, or an alloy material including one or more thereof, and the shape of the recess 102 may be appropriately modified. Could be. Next, the concave block 100 to be used as a substrate component may be manufactured by anodizing 104 and cutting the entire surface for electrical insulation to the long concave block thus manufactured.

Next, in step S20 to prepare a plurality of iron jig 200 to be matched, that is, fitted to the groove 102 of the concave block 100, this iron jig 200 is a metal material, for example, steel And so on. 4 is a perspective view showing a plurality of iron jig used in the manufacturing method of the present invention.

2 again, in step S30, the side surfaces of the plurality of concave blocks are joined while the concave jig 200 is inserted into the concave groove 102 of each concave block 100 while the plurality of concave blocks 100 are inverted. 5 and 6A are perspective and cross-sectional views for explaining the process of step S30.

5 and 6a, in joining the side surfaces of the plurality of concave blocks 100 in an inverted state, concave through the joining jig 300 to ensure the joining between adjacent concave blocks 100. The side surface of the outermost concave block 100 is pressed while applying heat to the top and side surfaces of the block 100. In this process, the pressure is uniformly transmitted to the concave block 100 so that the concave block 100 is deformed or destroyed or the joining is uneven. In the state inserted into 102). Of course, step S30 may be performed by inserting the iron jig 200 in the groove 102 in a state in which the concave block 100 is not inverted, that is, the groove 102 faces upward.

On the other hand, in performing the step S30 in order to more secure the bonding or electrical insulation performance, the insulating film 110 made of a synthetic resin material may be bonded using a liquid binder in a state interposed between the concave block 100. There may be a roughness in the mechanical or chemical manner on the side of the concave block 100 so that the bonding is made more robust. Hereinafter, the bonding layer between each concave block 100 is referred to as a 'vertical insulating layer'. Next, when the bonding is completed, the residue remaining on the surface of the block after cooling the intermediate product is removed by a processing process or the like.

Returning to FIG. 2, in step S35, a white paint 405, for example, a white solder resist is applied to the upper surface of the substrate 400 thus formed, thereby allowing only the cavity in the plating process after the cavity processing, which is a subsequent process. By forming the plating layer, the plating area, that is, the plating cost can be reduced, and the light efficiency generated by the optical device after the packaging is completed is reflected by the white paint, rather than absorbed, thereby increasing the light efficiency. It is sectional drawing of the board | substrate of the state in which the white paint application | coating work type was completed.

Next, a cavity 410 including grooves reaching a predetermined depth (thickness) is formed on the upper surface of the substrate 400 thus formed, and FIG. 7B is a cross-sectional view of the substrate in a state in which the cavity forming process is completed. As shown in FIG. 7B and FIG. 8A, which will be described later, the cavity 410 includes a vertical insulating layer 110, and is formed of a circular recess having an upper and lower narrow shape to improve light reflection performance. desirable. Furthermore, the area where the optical device is to be seated around the vertical insulating layer 110 is relatively larger than the area to which only the wire is to be connected (hereinafter, the wire connection area is referred to as the 'relative small area' 414 and the optical device seating area is referred to as 'relatively facing'). It is preferably formed so as to occupy an 'integral portion 412'. The cavity 400 may be formed by a mechanical process such as cutting or a chemical process such as etching.

Next, in step S50, metal plating, for example, silver plating (420), is performed on the bottom surface and the main wall surface of the cavity 400 to improve reflection performance or bonding performance of light generated by the optical device. The metal plating layer 420 may be formed by an electroplating method or the like. In this case, since the metal plating layer 420 is not formed in the vertical insulating layer 110, the relative small area 414 and the relative large area 412 are electrically insulated around the vertical insulating layer 110. Will be. 7C is a cross-sectional view of the substrate in a state where the plating process is completed.

Next, in step S60, the optical device 500 is attached to the relative large area 412 of the cavity 400, and one of two electrodes of the optical device 500, that is, one of the cathode and the anode electrode, for example, the anode. The electrode connects to the relative large area 412 via wire 510 and the cathode electrode connects to the relative small area 414 through wire 510. Of course, the anode terminal (or cathode terminal) of the optical device 500 is formed so as to be exposed to the lower surface of the optical device 500 in a state in which the conductivity is maintained, for example, by facing the optical device 500 by a soldering method, etc. When bonding the enemy portion 412, only one wire, for example, a wire connecting the cathode electrode of the optical device 500 and the relative small area portion 414 will be required. 7D is a cross-sectional view of the substrate in a state where the optical device mounting process is completed.

Next, in operation S70, the encapsulant 600 is encapsulated in the cavity 410, and the encapsulant 600 may include a fluorescent material. 7E is a cross-sectional view of the substrate in a state where the encapsulant encapsulation step is completed.

8 is a plan view of an optical device manufactured by a method according to an embodiment of the present invention. As shown in FIG. 8, according to the present embodiment, a plan view of an optical device having a plurality of optical elements arranged in a matrix form of three columns and five columns is provided in which five photons arranged in a column are connected in parallel. In this case, three photons arranged in a horizontal column are connected in series.

9A and 9B are side and top views, respectively, of an optical device manufactured by a method according to another embodiment of the present invention. In the embodiment of FIG. 9, unlike the previous embodiment in which one cavity is formed per optical device, all three optical devices 500 arranged in a horizontal column are accommodated in one cavity 410 ′. To this end, in the present embodiment, the cavity 410 'is formed as a rectangular groove having a light beam narrowing shape.

The substrate for an optical device having the zener diode of the present invention is not limited to the above-described embodiment, and can be modified in various ways within the scope of the technical idea of the present invention. For example, in the above-described embodiment, only one groove is formed in the concave block, but two or more grooves may be formed. In this case, the iron jig should also have two or more convex portions to be joined to the groove. something to do.

100: concave block, 102: groove,
104: anodizing layer, 110: vertical insulating layer,
200: iron jig, 300: bonding jig,
400: substrate, 410, 410 ': cavity,
412: relative large area portion, 414: relative small area portion,
420: metal plating layer, 500: optical element,
510: wire, 600: encapsulant

Claims

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(A) preparing a plurality of concave blocks having grooves and
The side of the plurality of concave blocks prepared in the step (a) is bonded to maintain electrical insulation to produce a substrate having a vertical insulating layer, each groove of the concave block is inserted into the groove jig to be fitted to the groove (B) manufacturing a substrate having a vertical insulating layer in such a manner as to press and bond.

3. The method of claim 2,
And (c) applying a white paint on the surface of the substrate after the step (b).

The method of claim 3, wherein
And (d) forming a cavity containing the vertical insulating layer on the upper surface of the substrate manufactured in the step (c) up to a predetermined depth from the upper surface.

3. The method of claim 2,
And said electrical insulation is achieved by anodizing said concave block.

3. The method of claim 2,
And said electrical insulation is achieved through an insulating film between said concave blocks after anodizing said concave blocks.

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