KR101762835B1 - 검사장치 - Google Patents

검사장치 Download PDF

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Publication number
KR101762835B1
KR101762835B1 KR1020150029951A KR20150029951A KR101762835B1 KR 101762835 B1 KR101762835 B1 KR 101762835B1 KR 1020150029951 A KR1020150029951 A KR 1020150029951A KR 20150029951 A KR20150029951 A KR 20150029951A KR 101762835 B1 KR101762835 B1 KR 101762835B1
Authority
KR
South Korea
Prior art keywords
inspection
socket
inspected
insert
contact
Prior art date
Application number
KR1020150029951A
Other languages
English (en)
Korean (ko)
Other versions
KR20160107035A (ko
Inventor
백승하
Original Assignee
리노공업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리노공업주식회사 filed Critical 리노공업주식회사
Priority to KR1020150029951A priority Critical patent/KR101762835B1/ko
Priority to PCT/KR2016/002077 priority patent/WO2016140505A1/fr
Priority to TW105106435A priority patent/TWI605254B/zh
Publication of KR20160107035A publication Critical patent/KR20160107035A/ko
Application granted granted Critical
Publication of KR101762835B1 publication Critical patent/KR101762835B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020150029951A 2015-03-03 2015-03-03 검사장치 KR101762835B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020150029951A KR101762835B1 (ko) 2015-03-03 2015-03-03 검사장치
PCT/KR2016/002077 WO2016140505A1 (fr) 2015-03-03 2016-03-02 Dispositif de test
TW105106435A TWI605254B (zh) 2015-03-03 2016-03-03 測試裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150029951A KR101762835B1 (ko) 2015-03-03 2015-03-03 검사장치

Publications (2)

Publication Number Publication Date
KR20160107035A KR20160107035A (ko) 2016-09-13
KR101762835B1 true KR101762835B1 (ko) 2017-07-28

Family

ID=56848068

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150029951A KR101762835B1 (ko) 2015-03-03 2015-03-03 검사장치

Country Status (3)

Country Link
KR (1) KR101762835B1 (fr)
TW (1) TWI605254B (fr)
WO (1) WO2016140505A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10852321B2 (en) * 2016-08-19 2020-12-01 Delta Design, Inc. Test handler head having reverse funnel design
TWI669509B (zh) * 2016-11-03 2019-08-21 台灣福雷電子股份有限公司 晶片測試基座及晶片測試基座的靜電消散能力的判定方法
KR101981521B1 (ko) * 2018-03-05 2019-05-23 (주)티에스이 반도체 디바이스의 테스트 소켓과 소켓 가이드의 일체화 방법 및 소켓 가이드가 일체화된 반도체 디바이스의 테스트 소켓
KR102037198B1 (ko) * 2019-06-16 2019-10-28 심민섭 프로브 카드 검사 장치
KR102144806B1 (ko) * 2020-04-24 2020-08-14 티씨에스 주식회사 전자부품 검사장치용 소켓
KR102366593B1 (ko) * 2021-06-28 2022-02-23 주식회사 디케이티 셀프얼라인 검사소켓

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200356022Y1 (ko) * 2004-04-12 2004-07-12 리노공업주식회사 비지에이 소켓
US8836357B2 (en) 2011-04-23 2014-09-16 Li-Cheng Richard Zai Stackable probe system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951436B2 (ja) * 1998-04-01 2007-08-01 株式会社アドバンテスト Ｉｃ試験装置
KR100496634B1 (ko) * 2002-10-01 2005-06-20 미래산업 주식회사 테스트 소켓
KR101367926B1 (ko) * 2012-08-31 2014-02-28 리노공업주식회사 반도체 디바이스의 검사장치
KR101485779B1 (ko) * 2013-06-28 2015-01-26 황동원 반도체 소자 테스트용 소켓장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200356022Y1 (ko) * 2004-04-12 2004-07-12 리노공업주식회사 비지에이 소켓
US8836357B2 (en) 2011-04-23 2014-09-16 Li-Cheng Richard Zai Stackable probe system

Also Published As

Publication number Publication date
WO2016140505A1 (fr) 2016-09-09
TW201632889A (zh) 2016-09-16
TWI605254B (zh) 2017-11-11
KR20160107035A (ko) 2016-09-13

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A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant