KR101751390B1 - Flexible printed circuit boards and method for manufacturing the same - Google Patents

Flexible printed circuit boards and method for manufacturing the same Download PDF

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Publication number
KR101751390B1
KR101751390B1 KR1020160007954A KR20160007954A KR101751390B1 KR 101751390 B1 KR101751390 B1 KR 101751390B1 KR 1020160007954 A KR1020160007954 A KR 1020160007954A KR 20160007954 A KR20160007954 A KR 20160007954A KR 101751390 B1 KR101751390 B1 KR 101751390B1
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KR
South Korea
Prior art keywords
protective layer
layer
region
plating layer
base film
Prior art date
Application number
KR1020160007954A
Other languages
Korean (ko)
Inventor
시게히사 토마베치
Original Assignee
스템코 주식회사
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Priority to KR1020160007954A priority Critical patent/KR101751390B1/en
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Publication of KR101751390B1 publication Critical patent/KR101751390B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A flexible circuit board and a method of manufacturing the same are provided. The flexible circuit board includes a base film including a bending region, a first region, and a second region, the bending region including a base film disposed between the first region and the second region, A first protection layer covering the plurality of wiring patterns on the bending region, the first protection layer being formed along a profile of the plurality of wiring pattern surfaces, the plurality of wiring patterns not having the first protection layer formed thereon And a second protective layer formed to cover a portion of the first plating layer adjacent to the first protective layer and the first protective layer.

Description

[0001] FLEXIBLE PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING THE SAME [0002]

The present invention relates to a flexible circuit board and a manufacturing method thereof.

BACKGROUND ART [0002] In recent years, a chip on film (COF) package technology using a flexible circuit board has been used in electronic devices in accordance with the miniaturization trend. The flexible circuit board and the COF package technology using the flexible circuit board are used for a flat panel display (FPD) such as a liquid crystal display (LCD), an organic light emitting diode do.

Since the flexible circuit board is flexible, it is folded or bent when it is used in electronic equipment. If the flexible circuit board is used folded, the durability of the flexible circuit board may be deteriorated in the bent portion.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a flexible circuit board including a protective layer formed of a thin film in a bending region, thereby improving product reliability.

Another object of the present invention is to provide a manufacturing method of a flexible circuit board including a protective layer formed of a thin film in a bending region, thereby improving the reliability of the product.

The technical objects of the present invention are not limited to the technical matters mentioned above, and other technical subjects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a flexible printed circuit board comprising a base film including a bending region, a first region and a second region, the bending region including a first region and a second region, A plurality of first wiring patterns formed on one surface of the base film, and a plurality of first wiring patterns covering the plurality of wiring patterns on the bending region, the first protection layers being formed along a profile of the plurality of wiring pattern surfaces, A first plating layer formed on the plurality of wiring patterns on which the first protective layer is not formed, and a second protective layer formed to cover a part of the first protective layer and the first plating layer.

In some embodiments of the present invention, the first protective layer includes a first resist pattern covering the first wiring pattern and a second resist pattern covering the top surface of the base film exposed between the first wiring pattern And the height of the upper surface of the first resist pattern may be higher than the height of the upper surface of the second resist pattern.

In some embodiments of the present invention, the second protective layer includes a third resist pattern covering the first resist pattern, and a fourth resist pattern covering the second resist pattern, wherein the upper surface of the third resist pattern And the height of the top surface of the fourth resist pattern may be the same.

In some embodiments of the present invention, a second plating layer is formed on the first plating layer, and the second plating layer may be formed on the first plating layer on which the second protective layer is not formed.

In some embodiments of the present invention, the second protective layer may cover the boundary between the first plating layer and the first protective layer.

In some embodiments of the present invention, the second protective layer includes a first portion covering the first plating layer and a second portion covering the first protective layer, wherein the height of the upper surface of the first portion and the height The height of the top surface of the second portion may be the same.

In some embodiments of the present invention, the base film may further include an element connection portion connected to the first wiring pattern, wherein the first protection layer and the second protection layer may not be formed on the element connection portion .

In some embodiments of the present invention, a plurality of second wiring patterns formed on the other surface of the base film opposite to the one surface, and a plurality of second wiring patterns formed on the plurality of second wiring patterns, And a second protective layer formed on the second protective layer.

In some embodiments of the present invention, a second plating layer formed on the second conductive wiring and formed on the first and second regions of the base film, and a second plating layer formed on the second plating layer and the third protective layer And a fourth protective layer formed thereon.

In some embodiments of the present invention, the first passivation layer may be formed to a thickness of about 0.1 탆 to 2 탆.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible circuit board, the method comprising: providing a base film including a bending region, a first region and a second region, Forming a plurality of first wiring patterns on one surface of the base film and forming a first protection layer so as to cover the plurality of wiring patterns on the bending region, Is formed along the surface profile of the plurality of wiring patterns, a first plating layer is formed on the plurality of wiring patterns on which the first protective layer is not formed, and the first plating layer is formed adjacent to the first protective layer and the first protective layer And forming a second protective layer to cover a part of the first plating layer.

In some embodiments of the present invention, the method further comprises forming a second plating layer on the first plating layer, wherein the second plating layer may be formed in an area where the second protective layer is not formed.

In some embodiments of the present invention, a plurality of second wiring patterns are formed on the other surface opposite to the one surface of the base film, a third protection layer is formed along the surface profile of the plurality of second wiring patterns, , The third protective layer is formed on the bending area of the base film, a third plating layer is formed on the second wiring pattern in the first and second areas, adjacent to the third protective layer, A fourth protective layer covering the upper surface of the third protective layer and a part of the upper surface of the third plating layer, and the fourth protective layer covering the third protective layer and the third plating layer, The fourth plating layer may be formed in a region where the fourth protective layer is not formed.

According to the flexible circuit board and the manufacturing method thereof according to the embodiments of the present invention, the first protective layer is formed on the wiring pattern in the bending area of the flexible circuit board instead of the plating layer, Cracks and the like which are generated can be prevented.

Further, by forming the first protective layer as a thin film along the profile of the wiring pattern, the increase in the thickness of the entire flexible circuit board can be effectively suppressed.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a top view for explaining a flexible circuit board according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line A-A 'in Fig.
FIG. 3A is a cross-sectional view taken along line B-B 'in FIG. 1; FIG.
3B is a cross-sectional view taken along line C-C 'of FIG.
4 is a cross-sectional view of a flexible circuit board according to another embodiment of the present invention.
5A and 5B are sectional views of a flexible circuit board according to another embodiment of the present invention.
6 to 9 are intermediate steps for explaining a method of manufacturing a flexible circuit board according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of the components shown in the figures may be exaggerated for clarity of description. Like reference numerals refer to like elements throughout the specification and "and / or" include each and every combination of one or more of the mentioned items.

It is to be understood that when an element or layer is referred to as being "on" or " on "of another element or layer, All included. On the other hand, a device being referred to as "directly on" or "directly above" indicates that no other device or layer is interposed in between.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Although the first, second, etc. are used to describe various elements or components, it is needless to say that these elements or components are not limited by these terms. These terms are used only to distinguish one element or component from another. Therefore, it is needless to say that the first element or the constituent element mentioned below may be the second element or constituent element within the technical spirit of the present invention.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view for explaining a flexible circuit board according to an embodiment of the present invention, and FIGS. 2, 3A and 3B are cross-sectional views taken along line A-A ', B- Fig.

1 to 3B, a flexible circuit board 1 according to an embodiment of the present invention includes a base film 10, a first wiring pattern 20, a first protection layer 30, A second plating layer 40, a first plating layer 50, and a second plating layer 60.

The base film 10 may be formed of a flexible material and may be included as a base material on the flexible circuit board 1 so that the flexible circuit board 1 may be bent or folded.

The base film 10 may include a bending region 100, a first region 101, and a second region 102. The bending region 100 may be disposed between the first region 101 and the second region 102. When the flexible circuit board 1 is mounted to an electronic apparatus, the bending region 100 may be a region to be mounted with being bent. On the other hand, the first region 101 and the second region 102 may not be bent when the flexible circuit board 1 is mounted on an electronic apparatus.

The base film 10 may be, for example, a polyimide film. Alternatively, the base film 10 may be an insulating film such as a PET (polyethylene terephthalate) film, a polyethylene naphthalate film, or a polycarbonate film, or a metal foil such as an aluminum oxide foil. In the flexible circuit board 1 according to the embodiment of the present invention, the base film 10 is described as a polyimide film.

The base film 10 may have insulating properties. That is, when the wiring patterns 20 and 120 are formed on both sides of the flexible circuit board (2 in FIG. 4) according to another embodiment of the present invention, the wiring patterns 20 and 120 are electrically connected to each other And a conductive hole may be formed in the base film 10 to electrically connect the wiring patterns 20 and 120, if necessary.

A plurality of first wiring patterns 20 may be formed on the base film 10. The first wiring pattern 20 may be, for example, a wiring pattern formed in a strip shape having a constant width. The plurality of first wiring patterns 20 may be continuously formed on one surface of the base film 10 at predetermined intervals.

The first wiring pattern 20 may include a conductive material such as a metal. Specifically, the first wiring pattern 20 may be a conductive wiring for transmitting an electric signal or a transparent conductive wiring for transmitting a capacitance according to a touch. The first wiring pattern 20 may include a conductive material such as copper, but the present invention is not limited thereto. The first wiring pattern 20 may include a material such as gold, aluminum, or the like .

As shown in FIGS. 2 to 3B, the first wiring pattern 20 of the flexible circuit board according to an embodiment of the present invention may be formed as a single layer, but the present invention is not limited thereto. The flexible circuit board 1 may include multilayer printed wiring of two or more layers.

The base film 10 may include an element placement region 12. The element placement region 12 may be a region where circuit elements electrically connected to the flexible circuit board 1 are disposed.

The first wiring pattern 20 may include an element connecting portion 15. The element connecting portion 15 can overlap with the element placement region 12 of the base film 10. [

The element connecting portion 15 may include a terminal to which a circuit element connected to the first wiring pattern 20 is electrically connected. That is, the element connecting portion 15 may be a terminal formed on the first wiring pattern 20 when a circuit element is mounted by a chip on film (COF) method or a film on glass (FOG) method. Such a circuit element may include, for example, a semiconductor chip (IC), a sensor, a light emitting diode (LED), and the like, but the present invention is not limited thereto.

The first passivation layer 30 may be formed on the plurality of first wiring patterns 20. Specifically, the first protective layer 30 may be formed on the plurality of first wiring patterns 20 in the bending region 100 of the base film 10. [ The first protective layer 30 may be formed from the bending region 100 to the boundary of the first region 101 or the second region 102. The first protective layer 30 may be formed on the inner side of the first region 101 or the second region 102 As shown in FIG. On the other hand, the first protective layer 30 may not be formed on the element connecting portion 15 of the wiring pattern 20. [

The first passivation layer 30 may include, but is not limited to, a resist ink, and the first passivation layer 30 may include a coverlay film.

The first protection layer 30 can protect the first wiring pattern 20 from external shocks or corrosive substances.

The first passivation layer 30 may be formed along the profile of the surface of the plurality of first wiring patterns 20. That is, the first passivation layer 30 may be formed along the shape of the side surfaces and the top surface of the plurality of first wiring patterns 20. The thickness of the first protective layer 30 may be constant. More specifically, the thickness of the first protective layer 30 may be uniformly set to 0.1 to 2 占 퐉. The first protective layer 30 may be formed thicker than the first plating layer 50.

The first protection layer 30 includes a first resist pattern 25 covering the first wiring pattern 20 and a second resist pattern 25 covering the upper surface of the base film 10 exposed between the first wiring pattern 20, (26). The first protection layer 30 is formed in the shape of a thin film along the profile of the first wiring pattern 20 so that the shape formed by the plurality of first wiring patterns 20 and the upper surface of the base film 10 therebetween is maintained as it is . The height of the upper surface of the first resist pattern 25 of the first passivation layer 30 may be higher than the height of the upper surface of the second resist pattern 26. [ That is, the first protection layer 30 may not completely fill the space formed by the side surfaces of the plurality of first wiring patterns 20 and the upper surface of the base film 10. Here, when the first passivation layer 30 is formed by applying the resist ink, the thickness of the second resist pattern 26 may be thicker than the first resist pattern 25.

The first protective layer 30 is formed to cover the first wiring pattern 20 in the bending region 100 so that the thickness of the flexible circuit board 1 in the bending region 100 is smaller than the thickness of the first protective layer 30. [ The thickness of the first region 101 and the second region 102 in which the first region 30 is not formed.

However, since the first protective layer 30 is formed so as to cover the first wiring pattern 20 in the form of a thin film, the thickness of the bending region 100 of the base film 10 is less than the thickness of the first region 101 and the second region It is possible to minimize the thickness of the region 102 compared with the region 102.

The first plating layer 50 may be formed on the plurality of first wiring patterns 20. Specifically, the first plating layer 50 may be formed on the plurality of first wiring patterns 20 on which the first protection layer 30 is not formed. The first plating layer 50 may be formed on the plurality of first wiring patterns 20 located in the first region 101 and the second region 102 of the base film 10. Also, as described above, the first plating layer 50 may not be formed on the plurality of first wiring patterns 20 in the bending region 100 of the base film 10.

The first plating layer 50 can prevent the plurality of first wiring patterns 20 from being corroded and improve the bonding property between the element connecting portions 15 and the circuit elements connected thereto. The first plating layer 50 may include a metal such as tin (Sn), nickel (Ni), gold (Au), palladium (Pd), aluminum (Al)

When the plating layer such as the first plating layer 50 is formed over the entire upper surface of the base film 10, the plating layer formed on the bending region 100 in the flexible circuit board allows the first wiring pattern 20 to have a desired shape A problem that distortion is prevented may occur. That is, there is a high possibility that cracks are generated on the wiring pattern or the plating layer due to tensile stress applied on the first wiring pattern 20 in the bending area 100 when the flexible circuit board 1 is deformed.

However, in the flexible circuit board 1 according to the technical idea of the present invention, the first plating layer 50 is formed on the regions of the base film which are not bent, that is, on the first and second regions 101 and 102, The deformation of the wiring pattern 20 may not be limited. Therefore, the operational reliability of the flexible circuit board 1 can be improved.

1 and 3, the first protective layer 30 is formed on the plurality of first wiring patterns 20 in the bending region 100 of the base film 10 and the first protective film 30 is formed on the first region 101 And the second region 102 are formed with a first plating layer 50. [

When the first plating layer 50 is formed on the first wiring pattern 20, an alloy layer (not shown) may be formed between the wiring pattern and the plating layer. Such an alloy layer is relatively weak in strength as compared with the first wiring pattern 20. Especially in a flexible circuit board that is mounted in a bend, the presence of an alloy layer in the bending region causes a decrease in substrate reliability.

The flexible circuit board 1 according to some embodiments of the present invention can be manufactured by forming the first protective layer 30 in place of the first plating layer 50 on the plurality of first wiring patterns 20 in the bending region 100 , Formation of an alloy layer in the bending region 100 can be prevented.

The first passivation layer 30 and the second passivation layer 40 may be formed on the first plating layer 50. Specifically, the second passivation layer 40 may be formed to cover a portion of the first plating layer 50 adjacent to the first passivation layer 30 and the first passivation layer 30. The second protective layer 50 may be formed on the bending region 100 of the base film 10 and a portion of the first region 101 and the second region 102. The second protective layer 50 may not be formed on the element connecting portion 15 of the first wiring pattern 20. The second protective layer 40 may cover the boundary between the first protective layer 30 and the first plating layer 50.

In some embodiments of the present invention, the first passivation layer 30 and the second passivation layer 40 may comprise the same material. That is, when the first protective layer 30 includes a resist ink, the second protective layer 40 may also include a resist ink, whereas when the first protective layer 30 includes a coverlay film The second protective layer 40 may also include a coverlay film. As described above, since the first and second protective layers 30 and 40 include the same material, adhesion or adhesion between the first protective layer 30 and the second protective layer 40 can be enhanced. However, the technical idea of the present invention is not limited by these examples.

The second passivation layer 40 may include a third resist pattern 45 on the first resist pattern 25 and a fourth resist pattern 46 on the second resist pattern 26. [ The height of the upper surface of the third resist pattern 45 and the height of the upper surface of the fourth resist pattern 46 may be substantially equal to each other. That is, the height of the top surface of the second protective layer 40 extending along the line A-A 'in FIG. 1 may be substantially constant.

The fact that the height of the upper surface of the third resist pattern 45 and the height of the upper surface of the fourth resist pattern 46 are substantially the same means that the third resist pattern 45 and the fourth resist pattern 46 (4) the height of the top surface of the resist pattern 46 is physically the same, as well as the case where there is a slight difference depending on the margin or the yield depending on the process. However, the difference in height between the upper surface of the third resist pattern 45 and the upper surface of the fourth resist pattern 46 may be negligible compared to the thickness of the second protective layer 40. In this case, Quot; the same ". From this point of view, the height of the top surface of the second protective layer 40 extending along the line A-A 'in FIG. 1 may be substantially constant.

The second protective layer 40 may include a first portion 47 covering the first plating layer 50 and a sixth resist pattern 48 covering the first protective layer 30. The height of the top surface of the first portion 47 and the second portion 48 may be substantially the same. That is, the height of the upper surface of the second passivation layer 40 in the longitudinal direction in which the plurality of first wiring patterns 20 extend may be substantially constant.

The height of the upper surface of the first portion 47 and the height of the upper surface of the second portion 48 are substantially equal to each other as well as the case where the heights of the upper surfaces are physically the same, Of course. Therefore, the height of the upper surface of the second protective layer 40 in the longitudinal direction in which the plurality of first wiring patterns 20 extend can be substantially constant.

That is, the first protective layer 30 is formed on the bending region 100 of the base film 10. The second portion 48 of the second passivation layer 40 covering the first passivation layer 30 may be formed so as to have a thickness equal to or greater than the thickness of the second passivation layer 40. [ The height of the upper surface of the first plating layer 50 may be higher than the height of the upper surface of the first portion 47 covering the first plating layer 50. Thus, the thickness of the bending region 100 of the base film 10 may be greater than the thickness of the first region 101 and the second region 102. [ In this case, it may be detrimental to the light and short cut of the flexible circuit board 1. [

In contrast, in the case of the flexible circuit board 1 according to the embodiment of the present invention, the first protection layer 30 is formed as a thin film along the profile of the plurality of first wiring patterns 20, The thickness of the second protective layer 40 covering the first protective layer 40 can also be kept thin.

A plurality of first wiring patterns 21 on which the first protection layer 30 is not formed and a plurality of first wiring patterns 21 formed on the first wiring patterns 21 in FIG. A plating layer 51, a second protective layer 41 and a second plating layer 61 are shown. The second protective layer 40 covering and covering the first protective layer 30 and the second protective layer 41 covering the wiring pattern 21 not having the first protective layer 30 are formed. The thickness of the flexible circuit board 1 including the second protective layers 40 and 41 may be substantially the same. This is because the first protective layer 30 is formed as a thin film along the profile of the first wiring pattern 20 so that it does not substantially affect the thickness of the flexible circuit board 1 in the second region 102 . Therefore, the lightweight and thinning of the flexible circuit board 1 can be achieved.

When the first protective layer 30 and the first plating layer 50 are formed on the plurality of first wiring patterns 20, the potential difference between the first wiring pattern 20 and the first plating layer 50 1 local cell development may occur at the boundary between the first protective layer 30 and the first plating layer 50. If a local cell phenomenon occurs, a part of the metal is ionized and eluted, so that a cavity may be formed at the boundary between the first protective layer 30 and the first plating layer 50.

However, in the flexible circuit board according to the embodiment of the present invention, the second protective layer 40 is formed so as to cover the boundary portion between the first protective layer 30 and the first plating layer 50. Therefore, even if cavities are formed in the boundary portion between the first protective layer 30 and the first plating layer 50, defective product due to corrosion caused by exposure of the cavities can be prevented.

A second plating layer 60 may be formed on the first plating layer 50. In particular, the second plating layer 60 may be formed on a region of the first plating layer 50 where the second protective layer 40 is not formed.

By forming the second plating layer 60, it is possible to secure a plating thickness sufficient for the bonding force between the flexible circuit board 1 and the circuit element or the electronic device at the element connecting portion 15. The second plating layer 60 may include a tin plating layer, but the present invention is not limited thereto and may include a nickel or gold plating layer.

4 to 5B are sectional views of a flexible circuit board according to another embodiment of the present invention.

4 to 5B, the flexible circuit board 2 according to another embodiment of the present invention includes a second wiring pattern 120 formed on the other surface of the base film 10 on which the first protection layer 30 is formed, A third plating layer 150, a fourth plating layer 160, a third protective layer 130, and a fourth protective layer 140.

The plurality of second wiring patterns 120 may be formed on the opposite side of one surface of the base film 10 on which the first wiring patterns 20 are formed. As shown in FIG. 4, the plurality of second wiring patterns 120 may be formed at positions corresponding to the plurality of first wiring patterns 20. However, the present invention is not limited thereto, and it is also possible to arrange a plurality of second wiring patterns 120 in a different shape from the plurality of first wiring patterns 20 according to a circuit design.

The plurality of second wiring patterns 120 may be continuously formed on the other surface of the base film 10 at predetermined intervals and may include a conductive material such as copper as in the first wiring pattern 20 .

The first wiring pattern 20 and the second wiring pattern 120 can be electrically insulated by the base film 10. [ Although not shown, a contact hole may be formed in the base film 10 to electrically connect the first wiring pattern 20 and the second wiring pattern 120, if necessary.

On the second wiring pattern 120, a third passivation layer 130 may be formed. The third protective layer 130 may be formed to be substantially the same as the first protective layer 30. That is, the third protective layer may be formed as a thin film along the surface profile of the second wiring pattern 120, and the upper surface of the fifth resist pattern 125 covering the second wiring pattern 120 may be formed on the base film 10, May be higher than the upper surface of the sixth resist pattern 126 covering the upper surface of the sixth resist pattern 126.

The third plating layer 150 may be formed on the second wiring pattern 120 on which the third protective layer 130 is not formed. The third protective layer 130 and the third plating layer 150 may be formed substantially the same as the first protective layer 30 and the first plating layer 50. That is, the third protective layer 130 is formed on the second wiring pattern 120 in the bending region 100 of the base film 10, and the second wiring layer 120 is formed in the first and second regions 101 and 102, A third plating layer 150 is formed on the pattern 120 to prevent the formation of an alloy layer in the bending region 100.

The fourth passivation layer 140 may be formed to cover the upper surface of the third passivation layer 130 and a portion of the upper surface of the third plating layer 150. The fourth protective layer 140 may be formed within the bending region 100 of the base film 10 and a portion of the first region 101 and the second region 102. [ The fourth protective layer 140 may cover the boundary between the third protective layer 130 and the third plating layer 150.

The fourth plating layer 160 may be formed on the third plating layer 150 where the fourth protective layer 140 is not formed. The fourth plating layer 160 may perform substantially the same function as the second plating layer 60.

6 to 9 are intermediate steps for explaining a method of manufacturing a flexible circuit board according to an embodiment of the present invention.

First, referring to FIG. 6, a plurality of first wiring patterns 20 are formed on a base film 10. The plurality of first wiring patterns 20 may be formed by, for example, forming a conductive material on one surface of the base film 10 by a sputtering method or a laminating method and then performing a patterning process, (Not shown).

In FIG. 6, a plurality of first wiring patterns 20 are formed on only one side of the base film 10, but the present invention is not limited thereto. The first and second conductive wirings 20 and 120 may be formed on both sides of the base film 10 like the flexible circuit board 2 according to another embodiment of the present invention described above.

7A and 7B, a plurality of first wiring patterns 20 in the bending region 100 of the base film 10 are formed on the first protection layer 20 along the surface profile of the first wiring pattern 20 30). The first protective layer 30 can be applied by spraying resist ink onto the first wiring pattern 20 and the base film 10. [ The first protective layer 30 may be formed by applying a predetermined thickness, but the present invention is not limited thereto.

Referring to FIG. 8, a first plating layer 50 is formed on a plurality of first wiring patterns 20 on which the first protection layer 30 is not formed. The first plating layer 50 may be formed by, for example, forming a first conductive pattern 20 using tin, nickel, gold, palladium, or aluminum on the first conductive pattern 20 by electroplating or electroless plating.

Referring to FIG. 9, a second passivation layer 40 is formed on the first passivation layer 30 and the first plating layer 50. The second protective layer 40 may be formed on the first wiring pattern 20 except for the element connecting portion 15. [ The second passivation layer 40 may be formed by applying a resist ink in the same manner as the first passivation layer 30, but the present invention is not limited thereto. The second passivation layer 40 may be formed by laminating a solder resist or a capillary film.

Referring again to FIG. 3A, a second plating layer 60 is formed on the first plating layer 50 on which the second protective layer 40 is not formed. The second plating layer 60 may be formed thicker than the first plating layer 50.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1, 2: Flexible circuit board 10: Base film
20, 120: wiring pattern 30: first protective layer
40: second protective layer

Claims (13)

A base film comprising a bending region, a first region and a second region, the bending region comprising a base film disposed between the first region and the second region;
A plurality of first wiring patterns formed on one surface of the base film;
A first wiring pattern formed on a surface of the first wiring pattern so as to cover the plurality of first wiring patterns in the bending area and formed along a profile of the plurality of first wiring pattern surfaces, ;
A first plating layer formed on the plurality of first wiring patterns on which the first protective layer is not formed; And
And a second protective layer formed to cover a portion of the first protective layer and the first plating layer. The method according to claim 1,
Wherein the first protective layer includes a first resist pattern covering the first wiring pattern and a second resist pattern covering an upper surface of the base film exposed between the first wiring pattern,
Wherein the height of the upper surface of the first resist pattern from one surface of the base film is higher than the height of the upper surface of the second resist pattern. 3. The method of claim 2,
Wherein the second protective layer includes a third resist pattern covering the first resist pattern and a fourth resist pattern covering the second resist pattern,
Wherein an upper surface of the third resist pattern and a top surface of the fourth resist pattern are the same in height from one surface of the base film. The method according to claim 1,
And a second plating layer formed on the first plating layer, wherein the second plating layer is formed on the first plating layer on which the second protective layer is not formed. The method according to claim 1,
And the second protective layer covers a boundary between the first plating layer and the first protective layer. A base film comprising a bending region, a first region and a second region, the bending region comprising a base film disposed between the first region and the second region;
A plurality of first wiring patterns formed on one surface of the base film;
A first protection layer covering the plurality of first wiring patterns in the bending area, the first protection layer being formed along a profile of the plurality of first wiring pattern surfaces;
A first plating layer formed on the plurality of first wiring patterns on which the first protective layer is not formed; And
And a second protective layer formed to cover a part of the first protective layer and the first plating layer,
Wherein the second protective layer includes a first portion covering the first plating layer and a second portion covering the first protective layer,
Wherein the height of the top surface of the first portion is the same as the height of the top surface of the second portion. The method according to claim 1,
The first wiring pattern may further include an element connection portion,
Wherein the first protective layer and the second protective layer are not formed on the device connection portion. The method according to claim 1,
A plurality of second wiring patterns formed on a second surface opposite to the one surface of the base film,
And a third protective layer formed on the plurality of second wiring patterns and formed along the profile of the second wiring pattern surface on the bending region of the base film. 9. The method of claim 8,
A third plating layer formed on the second wiring pattern and formed on the first and second regions of the base film,
And a fourth protective layer formed on the third plating layer and the third protective layer. The method according to claim 1,
Wherein the first protective layer is formed to a thickness of 0.1 탆 to 2 탆. Providing a base film comprising a bending region, a first and a second region, wherein the bending region is disposed between the first region and the second region,
Forming a plurality of first wiring patterns on one surface of the base film,
Wherein the first protection layer is formed along the surface profile of the plurality of first wiring patterns, and the first protection layer is formed in a shape corresponding to the first wiring pattern on the bending area, The first wiring pattern and the surface of the base film,
A first plating layer is formed on the plurality of first wiring patterns on which the first protective layer is not formed,
And forming a second protective layer to cover a portion of the first plating layer adjacent to the first protective layer and the first protective layer. 12. The method of claim 11,
Further comprising forming a second plating layer on the first plating layer, wherein the second plating layer is formed in a region where the second protective layer is not formed. 12. The method of claim 11,
A plurality of second wiring patterns are formed on the other surface of the base film opposite to the one surface,
Forming a third protective layer along a surface profile of the plurality of second wiring patterns, wherein the third protective layer is formed on the bending region of the base film,
A third plating layer is formed on the plurality of second wiring patterns on which the third protective layer is not formed,
A fourth protective layer covering the upper surface of the third protective layer and a part of the upper surface of the third plating layer,
Further comprising forming a fourth plating layer on the third plating layer, wherein the fourth plating layer is formed in a region where the fourth protective layer is not formed.
KR1020160007954A 2016-01-22 2016-01-22 Flexible printed circuit boards and method for manufacturing the same KR101751390B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113303036A (en) * 2019-01-14 2021-08-24 斯天克有限公司 Flexible circuit board, method of manufacturing the same, and package equipped with the flexible circuit board
CN114096074A (en) * 2021-10-29 2022-02-25 江苏迪盛智能科技有限公司 Circuit board and ink jet method for protective layer in circuit board

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2004164970A (en) * 2002-11-12 2004-06-10 Fujikura Ltd Electrode substrate and photoelectric conversion element
KR101547500B1 (en) * 2014-12-15 2015-08-26 스템코 주식회사 Flexible printed circuit boards and electronic device comprising the same and method for manufacturing the flexible printed circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004164970A (en) * 2002-11-12 2004-06-10 Fujikura Ltd Electrode substrate and photoelectric conversion element
KR101547500B1 (en) * 2014-12-15 2015-08-26 스템코 주식회사 Flexible printed circuit boards and electronic device comprising the same and method for manufacturing the flexible printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113303036A (en) * 2019-01-14 2021-08-24 斯天克有限公司 Flexible circuit board, method of manufacturing the same, and package equipped with the flexible circuit board
CN114096074A (en) * 2021-10-29 2022-02-25 江苏迪盛智能科技有限公司 Circuit board and ink jet method for protective layer in circuit board
CN114096074B (en) * 2021-10-29 2024-04-12 江苏迪盛智能科技有限公司 Circuit board and ink-jet method for protective layer in circuit board

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